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JPS5474248A - Clad solder - Google Patents

Clad solder

Info

Publication number
JPS5474248A
JPS5474248A JP14104877A JP14104877A JPS5474248A JP S5474248 A JPS5474248 A JP S5474248A JP 14104877 A JP14104877 A JP 14104877A JP 14104877 A JP14104877 A JP 14104877A JP S5474248 A JPS5474248 A JP S5474248A
Authority
JP
Japan
Prior art keywords
alloy
sides
rich
clad solder
clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14104877A
Other languages
Japanese (ja)
Other versions
JPS6125471B2 (en
Inventor
Sadahiko Sanki
Deiitoritsuhi.Eerushiyureegeru
Kenji Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP14104877A priority Critical patent/JPS5474248A/en
Publication of JPS5474248A publication Critical patent/JPS5474248A/en
Publication of JPS6125471B2 publication Critical patent/JPS6125471B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:A clad solder having excellent adhesion, prepared by harmonizing wettability and reactivity with base plate by making it into a three-layered structure in which Pb or a Pb-Sn alloy is arranged in between and a fixed thickness of Sn, etc., is arranged on both sides. CONSTITUTION:A clad solder is made into a three-layered structure in which pure Pb or a Pb-rich Pb-Sn alloy is arranged in between and a 1 to 6 micron thickness of pure Sn or a Sn-rich Sn-Pb alloy is arranged on both sides. In this case, the Sn content is less than 20% of the total component. In heating the clad solder, the Sn or Sn-Pb alloy having a low melting point on the both sides is first melted, but the Sn-rich melt sufficiently wets a base plate of Cu, Ni, Fe, etc., because of its high wettability and fluidity, thus assuring good adhesion.
JP14104877A 1977-11-24 1977-11-24 Clad solder Granted JPS5474248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14104877A JPS5474248A (en) 1977-11-24 1977-11-24 Clad solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14104877A JPS5474248A (en) 1977-11-24 1977-11-24 Clad solder

Publications (2)

Publication Number Publication Date
JPS5474248A true JPS5474248A (en) 1979-06-14
JPS6125471B2 JPS6125471B2 (en) 1986-06-16

Family

ID=15283028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14104877A Granted JPS5474248A (en) 1977-11-24 1977-11-24 Clad solder

Country Status (1)

Country Link
JP (1) JPS5474248A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59209500A (en) * 1983-05-12 1984-11-28 Hitachi Cable Ltd Copper-solder clad material
JPS6471591A (en) * 1987-09-09 1989-03-16 Sumitomo Spec Metals Joining method for metal or alloy piece
US5045410A (en) * 1985-12-13 1991-09-03 Karl Neumayer, Erzeugung Und Vertrieb Von Kabeln, Drahten Isolierten Leitungen Ur Elektromaterial Gesellschaft Mit Beschrankter Haftung Low phosphorus containing band-shaped and/or filamentary material
JPH04270092A (en) * 1991-01-21 1992-09-25 Mitsubishi Electric Corp Solder material and joining method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59209500A (en) * 1983-05-12 1984-11-28 Hitachi Cable Ltd Copper-solder clad material
JPH0339798B2 (en) * 1983-05-12 1991-06-14 Hitachi Cable
US5045410A (en) * 1985-12-13 1991-09-03 Karl Neumayer, Erzeugung Und Vertrieb Von Kabeln, Drahten Isolierten Leitungen Ur Elektromaterial Gesellschaft Mit Beschrankter Haftung Low phosphorus containing band-shaped and/or filamentary material
JPS6471591A (en) * 1987-09-09 1989-03-16 Sumitomo Spec Metals Joining method for metal or alloy piece
JPH04270092A (en) * 1991-01-21 1992-09-25 Mitsubishi Electric Corp Solder material and joining method

Also Published As

Publication number Publication date
JPS6125471B2 (en) 1986-06-16

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