JPS5684432A - Gold brazing material - Google Patents
Gold brazing materialInfo
- Publication number
- JPS5684432A JPS5684432A JP16046679A JP16046679A JPS5684432A JP S5684432 A JPS5684432 A JP S5684432A JP 16046679 A JP16046679 A JP 16046679A JP 16046679 A JP16046679 A JP 16046679A JP S5684432 A JPS5684432 A JP S5684432A
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- gold brazing
- brazing
- strength
- corrosion resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Products (AREA)
Abstract
PURPOSE: To provide a gold brazing material having a low fusion temperature and excellent corrosion resistance and strength by alloying a specific amount of Sn and In into Au base.
CONSTITUTION: An alloy consisting of Au; 50W77%, Sn; 5.5W32%, and In 10W 24% provides a gold brazing material having a low melting point of 230W320°C and excellent corrosion resistance and strength. This is suited to brazing of low melting metal such as Al or Zn, semiconductor bonding, or brazing of plated products liable to discoloring due to oxidation.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16046679A JPS5684432A (en) | 1979-12-11 | 1979-12-11 | Gold brazing material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16046679A JPS5684432A (en) | 1979-12-11 | 1979-12-11 | Gold brazing material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5684432A true JPS5684432A (en) | 1981-07-09 |
Family
ID=15715547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16046679A Pending JPS5684432A (en) | 1979-12-11 | 1979-12-11 | Gold brazing material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5684432A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4492842A (en) * | 1983-08-08 | 1985-01-08 | International Business Machines Corporation | Process of brazing using low temperature braze alloy of gold-indium tin |
JPS6133789A (en) * | 1984-07-24 | 1986-02-17 | Fujitsu Ltd | Solder alloy for connector contacts |
EP2300195A2 (en) * | 2008-06-23 | 2011-03-30 | Williams Advanced Materials Inc. | Gold-tin-indium solder for processing compatibility with lead-free tin-based solder |
-
1979
- 1979-12-11 JP JP16046679A patent/JPS5684432A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4492842A (en) * | 1983-08-08 | 1985-01-08 | International Business Machines Corporation | Process of brazing using low temperature braze alloy of gold-indium tin |
JPS6044196A (en) * | 1983-08-08 | 1985-03-09 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Alloy for brazing |
JPS6133789A (en) * | 1984-07-24 | 1986-02-17 | Fujitsu Ltd | Solder alloy for connector contacts |
EP2300195A2 (en) * | 2008-06-23 | 2011-03-30 | Williams Advanced Materials Inc. | Gold-tin-indium solder for processing compatibility with lead-free tin-based solder |
JP2011526838A (en) * | 2008-06-23 | 2011-10-20 | マテリオン アドバンスト マテリアルズ テクノロジーズ アンド サービシーズ インコーポレイティド | Gold-tin-indium solder for processing compatible with lead-free tin solder |
EP2300195A4 (en) * | 2008-06-23 | 2012-07-18 | Materion Advanced Materials Technologies And Services Inc | Gold-tin-indium solder for processing compatibility with lead-free tin-based solder |
US8294271B2 (en) | 2008-06-23 | 2012-10-23 | Materion Advanced Materials Technologies And Services Inc. | Gold-tin-indium solder for processing compatibility with lead-free tin-based solder |
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