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JPS5447664A - Production of head for heat sensitive recording - Google Patents

Production of head for heat sensitive recording

Info

Publication number
JPS5447664A
JPS5447664A JP11385877A JP11385877A JPS5447664A JP S5447664 A JPS5447664 A JP S5447664A JP 11385877 A JP11385877 A JP 11385877A JP 11385877 A JP11385877 A JP 11385877A JP S5447664 A JPS5447664 A JP S5447664A
Authority
JP
Japan
Prior art keywords
substrate
conductors
copper
gold
copper oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11385877A
Other languages
Japanese (ja)
Other versions
JPS5547597B2 (en
Inventor
Tadayoshi Ono
Toshihide Kawashima
Shozo Takeno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11385877A priority Critical patent/JPS5447664A/en
Publication of JPS5447664A publication Critical patent/JPS5447664A/en
Publication of JPS5547597B2 publication Critical patent/JPS5547597B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electronic Switches (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Facsimile Heads (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

PURPOSE: To decrease the thickness of electrode conductors, rrduce the dispersion in the thickness and shape of resistors by their thickness and reduce the recess of the central part of the resistors by forming electrodes from the specific conductor thin-films formed on a substrate.
CONSTITUTION: Copper is evaporated or sputtered several 100 Å on a high purity alumina substrate 1 and gold several μ thereon. When the substrate 1 is heat- treated to 850 to 1100°C, copper becomes copper oxide and on the substrate 1 side of the copper, alumina and copper oxide bound to devolop a bonding strength. Since the bond layer of gold and copper oxide is formed on the gold side, gold provides a high bonding strength against the substrate 1 through copper oxide. On this conductor thin film are formed electrode conductors 3', 4' through photoetching. Next, resistors 2 are formed by a thick film in the form of being respectively connected between the conductors 3', 4' and further lead-out conductors 5, 6 are also formed by a thick film in the form of being respectively connected to the conductors 3', 4'
COPYRIGHT: (C)1979,JPO&Japio
JP11385877A 1977-09-21 1977-09-21 Production of head for heat sensitive recording Granted JPS5447664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11385877A JPS5447664A (en) 1977-09-21 1977-09-21 Production of head for heat sensitive recording

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11385877A JPS5447664A (en) 1977-09-21 1977-09-21 Production of head for heat sensitive recording

Publications (2)

Publication Number Publication Date
JPS5447664A true JPS5447664A (en) 1979-04-14
JPS5547597B2 JPS5547597B2 (en) 1980-12-01

Family

ID=14622832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11385877A Granted JPS5447664A (en) 1977-09-21 1977-09-21 Production of head for heat sensitive recording

Country Status (1)

Country Link
JP (1) JPS5447664A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150387A (en) * 1979-05-14 1980-11-22 Ricoh Co Ltd Thermosensitive recording head
EP0398364A2 (en) * 1989-05-18 1990-11-22 Kabushiki Kaisha Toshiba Thick-film element having flattened resistor layer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051521U (en) * 1991-06-28 1993-01-14 日本プラスト株式会社 Ventilation system for vehicles

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150387A (en) * 1979-05-14 1980-11-22 Ricoh Co Ltd Thermosensitive recording head
EP0398364A2 (en) * 1989-05-18 1990-11-22 Kabushiki Kaisha Toshiba Thick-film element having flattened resistor layer

Also Published As

Publication number Publication date
JPS5547597B2 (en) 1980-12-01

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