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JPS5447580A - Dislodging device of plate form objects - Google Patents

Dislodging device of plate form objects

Info

Publication number
JPS5447580A
JPS5447580A JP11337477A JP11337477A JPS5447580A JP S5447580 A JPS5447580 A JP S5447580A JP 11337477 A JP11337477 A JP 11337477A JP 11337477 A JP11337477 A JP 11337477A JP S5447580 A JPS5447580 A JP S5447580A
Authority
JP
Japan
Prior art keywords
wafer
support plate
recess
dislodging
feed port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11337477A
Other languages
Japanese (ja)
Other versions
JPS6118334B2 (en
Inventor
Tsutomu Mimata
Akira Kabashima
Tamio Otani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Via Mechanics Ltd
Original Assignee
Hitachi Ltd
Hitachi Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Seiko Ltd filed Critical Hitachi Ltd
Priority to JP11337477A priority Critical patent/JPS5447580A/en
Publication of JPS5447580A publication Critical patent/JPS5447580A/en
Publication of JPS6118334B2 publication Critical patent/JPS6118334B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To facilitate dislodging of a wafer from a table by burying a porous support plate in the central part of the table on which semicnductor wafer is placed, placing the wafer on the table with this support plat as a center, performing specified fabriaction treatment then force feeding a gas into the holes of thesupport plate.
CONSTITUTION: The top of a table 11 constituted by a metal, insulating material or other ismade flat and a stepped recess 12 is proveded in the central part thereof. A gas feed port 14 is bored from the bottom of the recess 12 down to the back of the table 11. Next, a porous support plate 13 composed of a sintered metal or other is buried in the uper part layer part of the recess 12, by being made flush to the top surface of the table 11. A semiconductor wafer 15 is placed across the table 11 from above of the support plat. Thereafter, the wafer 15 is subjected to required treatment such as dicing, etc. in this state, after which air or the like is force-fed through the feed port 14 to float the wafer 15 through the pores of the support plate 13. Then, dislodging of the wafer 15 from the table 11 becomes extremely easy
COPYRIGHT: (C)1979,JPO&Japio
JP11337477A 1977-09-22 1977-09-22 Dislodging device of plate form objects Granted JPS5447580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11337477A JPS5447580A (en) 1977-09-22 1977-09-22 Dislodging device of plate form objects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11337477A JPS5447580A (en) 1977-09-22 1977-09-22 Dislodging device of plate form objects

Publications (2)

Publication Number Publication Date
JPS5447580A true JPS5447580A (en) 1979-04-14
JPS6118334B2 JPS6118334B2 (en) 1986-05-12

Family

ID=14610658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11337477A Granted JPS5447580A (en) 1977-09-22 1977-09-22 Dislodging device of plate form objects

Country Status (1)

Country Link
JP (1) JPS5447580A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032661A (en) * 2004-07-16 2006-02-02 Disco Abrasive Syst Ltd Cutting apparatus
CN100412696C (en) * 2002-10-09 2008-08-20 优志旺电机株式会社 Band workpiece transporter

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS478053U (en) * 1971-02-20 1972-09-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS478053U (en) * 1971-02-20 1972-09-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100412696C (en) * 2002-10-09 2008-08-20 优志旺电机株式会社 Band workpiece transporter
JP2006032661A (en) * 2004-07-16 2006-02-02 Disco Abrasive Syst Ltd Cutting apparatus

Also Published As

Publication number Publication date
JPS6118334B2 (en) 1986-05-12

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