JPH1168398A - Method of mounting electronic component and its device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease a time required for mounting a component by controlling a position and rotation of a suction nozzle suitable for a component to be mounted. SOLUTION: A control section 7, when a component 14 is sucked to a suction nozzle 5 and mounted on a print substrate 15 through a suction controller 8, X-axis controller 9, and Y-axis controller 10, checks an existence of polarity of a component 14 absorbed to the suction nozzle 5 based on a component polarity data of an internal memory 70, detects a standard angle of the component 14 by rotating the component 14 absorbed to the suction nozzle 5 in a predetermined direction through a θ axis controller 12, and determine a rotation direction of the component 14 from the detection of the standard angle through the mounting according to the polarity of the component 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method and apparatus for mounting electronic components on a printed circuit board or the like.

[0002]

2. Description of the Related Art A so-called chip component is the most common electronic component mounted on a printed circuit board. As a mode of mounting the chip component on a printed circuit board, the component is vacuum-sucked by a suction nozzle, and the position and rotation of the suction nozzle are controlled to convey the component to a predetermined location on the printed circuit board in an appropriate arrangement state. 2. Description of the Related Art A method of mounting and mounting has been conventionally known. For example, Japanese Patent Application Laid-Open No. 6-18215
According to the publication, one of the component mounting position correction amounts in the X and Y directions along the horizontal plane is obtained in a software manner by calculation, so that extra time for actual measurement is omitted and the time required for component positioning is reduced. A method and an apparatus for improving the component mounting efficiency are disclosed.

[0003]

However, in the prior art, since the same position and rotation control of the suction nozzle is performed for any component, useless operation is required depending on the mounted component. Was something. An object of the present invention is to further reduce the time required for component mounting by controlling the position and rotation of a suction nozzle adapted to a mounted component.

[0004]

A method according to the present invention uses a suction nozzle for sucking an electronic component, controls the position and rotation of the suction nozzle, and mounts the electronic component on a predetermined portion of a substrate. The presence or absence of the polarity of the electronic component sucked by the suction nozzle is determined from a list of electronic components registered in advance, and the electronic component sucked by the suction nozzle is rotated in a predetermined direction to set the reference angle of the electronic component. Detecting the electronic component and determining the rotation direction of the electronic component until the electronic component is mounted according to the polarity of the electronic component.

The device according to the present invention is a device for mounting an electronic component, which has a suction nozzle for sucking an electronic component, and controls the position and rotation of the suction nozzle to mount the electronic component on a predetermined portion of a substrate. Storage means for registering the electronic component list information in advance; polarity determination means for determining whether the electronic component for mounting the electronic component on the substrate is polar or non-polar; Detecting means for detecting the reference angle of the electronic component by rotating the electronic component sucked to the nozzle in a predetermined direction, and determining the rotation direction of the electronic component until mounting of the electronic component according to the determination result of the polarity determining means. And a rotation direction determining means.

According to these inventions, the electronic component sucked by the suction nozzle is rotated in a predetermined direction, the reference angle of the electronic component is detected, and the rotation of the electronic component until mounting is performed according to the polarity of the electronic component. Determine the direction. Therefore, the position and rotation of the suction nozzle adapted to the component to be mounted can be controlled to reduce the time required for component mounting.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an internal structure of a component mounting apparatus according to an embodiment of the present invention. A board transport unit 1 for transporting and positioning a printed circuit board in the apparatus.
The component supply unit 2 in which a chip component (hereinafter, simply referred to as a component) to be mounted on a transported printed circuit board (not shown) is fixed to a supply unit mounting table 3. Although one component supply unit 2 is shown in the drawing, a number of component supply units corresponding to the type of component to be mounted are actually mounted. The components are vacuum-sucked by a suction nozzle 5 provided below the suction head 4. Therefore, an XY robot for moving the suction head 4 in the horizontal direction is provided, and a vertical moving means for moving the suction head 4 in the vertical direction, not shown, is provided.

FIG. 2 is a block diagram showing a system configuration of the electronic component mounting apparatus shown in FIG. The control unit 7
The suction controller 8, the X-axis controller 9, the Y-axis controller 10, the Z-axis controller 11, and the θ-axis controller 12 are controlled to drive the suction head driving unit 13 to control the position and rotation of the suction nozzle 5. Then, the component 14 of the component supply unit 2 is transported, and the component 14 is mounted on the printed board 15 transported to a predetermined position by the printed board transport unit 1. The control unit 7 also controls the laser alignment sensor controller 17 connected by the RS422 interface 16 to drive the laser unit 18.
The laser unit 18 includes a light emitting unit 18a that emits a parallel belt-shaped laser beam, and a light receiving unit 18b that receives the laser beam. Therefore, the sucked component 1
4 is located at the laser beam passage position, the light receiving portion 18b
, A projection image of the component 14 can be obtained.

The control unit 7 has an internal memory 70 which is one of the main features of the present embodiment.
0 stores component list information such as polarity data indicating the presence / absence of the polarity of the mounted component, and controls the rotation of the suction nozzle 5 suitable for the mounted component based on the polarity data. FIG.
FIG. 9 is a diagram illustrating a state in which the component 14 sucked by the suction nozzle 5 is raised by the Z-axis controller to a position where the laser beam of the laser unit 18 passes, and is rotated along the θ axis around the Z axis. By this rotation, the minimum value of the length of the projection image of the component 14 in a predetermined direction (horizontal direction) is detected, and the position and the rotation angle at that time are measured, whereby the X-axis direction and the Y-axis direction of the component 14 are measured. And the deviation in the θ-axis direction are detected.

Next, a processing procedure of the control unit 7 in the electronic component mounting method according to the embodiment will be described with reference to flowcharts shown in FIGS. The mounting angle of the component 14 in this embodiment is 0 °. In FIG.
The control unit 7 performs a component suction control process of the suction nozzle 5 (Step S1). More specifically, first, the Z-axis controller 11 is instructed to lower the suction head 4 from the home position along the Z-axis. When the tip of the suction nozzle 5 reaches the suction position, the Z-axis descent is stopped. 8 is instructed to suck the component 14.

After the components are sucked, the Z-axis controller 11 is instructed to raise the Z-axis (step S2). Then, the position of the sucked components 14 in the Z-axis direction reaches the detection area of the laser unit 18 by the laser beam. It is determined whether or not it has been performed (step S3). If the detection area has not been reached, the suction head 4 continues to be lifted, and if the detection area has been reached, an instruction is issued to the Z-axis controller 11 to stop the Z-axis movement (step S4).

Next, the controller 7 resets a register (θ) for storing the value of the rotation angle of the suction nozzle 5 (step S5), and rotates the suction nozzle 5 around the θ axis with respect to the θ axis controller 12. (Step S6). The value of θ is controlled to change according to the rotation angle of the suction nozzle 5. The rotation in step S6 is performed in the direction corresponding to the reverse rotation, that is, in the direction in which the value of θ becomes negative, and is continued until the value of θ reaches −30 ° (step S7). When θ = −30 °, the control unit 7 instructs the θ-axis controller 12 to stop the rotation of the suction nozzle 5 around the θ-axis (step S8).

Thereafter, the control unit 7 controls the laser unit 18
Detection of the width w of the component 14 is started (step S
9) Then, the θ-axis controller 12 is instructed to rotate the suction head 5 in the positive direction around the θ-axis, that is, in the direction in which the value of θ becomes positive (step S10). In FIG. 5, the control unit 7 performs the positive rotation of the suction nozzle 5 around the θ axis and the first minimum value and the second minimum value of the detection width w.
The minimum value is determined (Steps S11 and S12), and the positive rotation of the suction nozzle 5 around the θ axis is continued until the value of θ becomes 120 ° (Step S13). When the value of θ becomes 120 °, the rotation is stopped (step S14), and the detection width w
Is detected (step S15), and the deviation angle (angle deviation) of the component 14 when the component 14 is sucked with respect to the reference direction, that is, the angle of the component 14 to be corrected (hereinafter referred to as a correction amount α) is finally determined. It is determined (step S16).

FIGS. 6 and 7 show how the first minimum value and the second minimum value are determined and how the correction amount α is calculated.
This will be described in detail with reference to FIG. First, when the correction amount α is 0 °, that is, when the component 14 is sucked by the suction nozzle 5 in a state in which it matches the reference angle, FIG.
(A), the component 14 is arranged in the detection area in a state parallel to the laser beam bm as shown by a solid line. In this example, the direction in which the laser beam passes is the reference angle direction, the clockwise direction in FIG. 6 is normal rotation, and the counterclockwise direction is reverse rotation. From this state, the part 14
Is determined by the above steps S6 to S8 as shown by an arrow.
The rotation is reversed by 30 °, as shown by the solid line in FIG.

After the start of the detection of the width w in step S8, the parts 14 rotate forward as shown by arrows in FIGS. 6B, 6C and 6D in steps S9 to S13, and θ Reaches 120 °, and the state shown in FIG. FIG. 7 shows the relationship between the width w and θ of the component 14 obtained in the light receiving unit 18b in association with each state of the component 14 in FIGS. 6A to 6F, and the correction amount α = In this case of 0 °, first, θ is reset in step S5 described above (θ in FIG. 6A).
= 0), w becomes the first minimum value wa. And FIG.
In the state (B) (θ = −30 °), w becomes larger than the minimum value wa, and in the state shown in FIG. 6C, w again becomes the first minimum value wa. Further, in the state of FIG. 6D, w reaches near the maximum value, and in the state of FIG. 6E, w becomes the second minimum value wb. Then, w is the minimum value w in the state of FIG.
greater than b.

As can be seen from the above description, when the component 14 is sucked by the suction nozzle 5 in a state of being aligned with the reference direction, the first minimum value w during the normal rotation of the component 14.
θ should assume 0 ° when a is detected. Therefore, the value of θ at the time when the first minimum value is detected in step S11 can be calculated as the correction amount α (that is, 0 ° in this case). In this case, the value of θ corresponding to the second minimum value should be 90 °, and the value of θ at the time when the second minimum value was detected in step S12 is 90 °, so that the correction amount α is 0 °. You can reconfirm that it corresponds to ゜.

On the other hand, when the correction amount α is a value other than 0 °, for example, when the component 14 is sucked by the suction nozzle 5 while being deviated by a predetermined angle in the counterclockwise direction from the reference direction, 6A, the component 14 is arranged in the detection area of the laser unit 18 in a state where the component 14 is inclined with respect to the laser beam, as indicated by a dashed line.
From this state, the part 14 proceeds to steps S6 to S8.
As shown by the arrow in FIG. 6B, the rotation is reversed by -30 °, as shown by the dashed line in FIG. 6 (B), (C), and FIG.
The component 14 rotates forward as indicated by the arrow (D), the value of θ reaches 120 °, and the state as shown in FIG. In this case, the component 14 obtained in the light receiving unit 18b is associated with each state of the component 14 in FIGS. 6A to 6F.
FIG. 8 shows the relationship between the width w and θ of the correction amount α.
In this case of {0} (α <0}), first, in step S
5, the state of FIG. 6A in which θ is reset (θ =
0 °), w becomes a value larger than the first minimum value wa by the deviation angle of the component 14. Then, from this value, FIG.
In the state (θ = −30 °), w becomes a larger value,
W gradually decreases due to the forward rotation, and when the state shown in FIG. 6C is reached, w again becomes the first minimum value wa. Further FIG.
In the state (D), w reaches near the maximum value, and FIG.
In the state (E), w becomes the second minimum value wb. Then, in the state of FIG. 6F, w becomes a value larger than the minimum value wb.

As can be seen from the above, when the component 14 is sucked by the suction nozzle 5 while being inclined from the reference direction, θ is set to 0 when the first minimum value wa is detected.
It should show a value corresponding to the inclination angle of the part without showing ゜. Therefore, the value of θ at the time when the first minimum value is detected in step S11 can be calculated as the correction amount α. In this case, the value of θ corresponding to the second minimum value is α
+ 90 °, and the second
The correction amount α can be confirmed again by subtracting 90 ° from the value of θ at the time when the minimum value is detected. The first and second
If θ at the time when the minimum value is detected is set as the reference angle, the deviation of the component 14 when the component 14 is sucked can be measured by detecting the reference angle.

When α> 0 °, the value of α can be obtained in the same manner as in the principle described with reference to FIG.

The first and second minimum values are determined by the light receiving unit 18.
The determination can be made by observing the change in the sample value of the light receiving output of b. Before and after the detection of the first and second minimum values, the component 14 is rotated until θ = −30 ° or θ = 1
It is the part 14 that is rotated until it becomes 20 °.
It is known from empirical rules that the range of the unbalanced angle is less than ± 30 °, so that the rotation in the angle range of −30 ° to 120 ° can reliably detect the first and second minimum values. is there.

Returning to the flowchart of FIG. 5, when the correction amount α is obtained as described above, the control unit 7
With reference to the component data (step S17), the polarity of the component 14 currently being sucked by the suction nozzle 5 is determined (step S18).

There are components having no polarity such as a resistor and a ceramic capacitor, and components having a polarity such as a transistor and a diode. The control unit 7
If it is determined in step S18 that the component 14 has the above-described polarity, the suction nozzle 5 is sent to the θ-axis controller 12 from the state of FIG.
Is instructed to rotate around the θ axis in reverse (step S1).
9) In order to set the component 14 to the mounting angle (0 ° in this case) according to the correction amount α obtained in step S16, the reverse rotation is continued until θ = −120 ° + α (step S20). ), When the rotation reaches θ = −120 ° + α, the rotation is stopped (step S21).

On the other hand, if the controller 7 determines in step S18 that the component 14 does not have the above-mentioned polarity, the controller 7 changes the state of the θ axis controller 12 from the state of FIG. The suction nozzle 5 is instructed to rotate forward around the θ axis (step S22), and the component 14 is set to the mounting angle in accordance with the correction amount α obtained in step S16 until θ = 60 ° −α. The normal rotation is continued (Step S23), and when θ = 60 ° −α is reached, the rotation is stopped (Step S21).

After step S21, although not shown in the flow, the controller 7 instructs the Z-axis controller 11 to lower the Z-axis. When the component 14 reaches a predetermined mounting position, the controller 7 performs the lowering of the Z-axis. Stop and complete the mounting of parts.

As described above, when the control unit 7 determines that the component 14 has no polarity, the component 14 is returned to the direction at the time of the first suction by rotating the component 14 forward instead of rotating in the reverse direction. . This is because, as described above, a component having no polarity can be arranged and mounted on the printed circuit board in exactly the same manner even when rotated by 180 ° from the original state. From the state of ゜, 1
Instead of rotating back by 20 ° to return to the original state, it is further rotated forward by 60 ° to obtain a state equivalent to the original state. Therefore, in the present embodiment, it is possible to rotate the component 14 to be mounted on the printed circuit board with only a small rotation angle.

Thus, in the present embodiment, the control unit 7
A polarity determining means for determining whether the component 14 mounted on the printed circuit board 15 is polar or non-polar; and rotating the component 14 sucked by the suction nozzle 5 in a predetermined direction to set the reference angle of the component 14. And rotation direction determining means for determining the direction of rotation of the component 14 up to the mounting of the component 14 according to the result of the determination by the polarity determining means. Since proper rotation control of the nozzles is performed, useless operation can be omitted, thereby improving the mounting efficiency of the components 14 and reducing the time required for mounting on the printed circuit board 15 as much as possible. be able to.

In the above embodiment, components such as a resistor, a capacitor, a transistor, and a diode have been described as an example. However, the present invention can be applied to a case where a flat package IC type component is mounted. In FIG.
Examples of different types of components are shown, one component 141 having each anode arranged on the same one side of the component package and each cathode arranged on the same other side of the component package. Four diodes led out of the component package are embedded. The other type of component 142 also embeds four diodes, but the arrangement form is different from the chip component 141 at the center of the component package. In the plan view, two diodes located in the upper half of the package are arranged such that each anode is disposed on the right side of the package and each cathode is disposed on the left side, while two diodes located in the lower half of the package are disposed in each anode Are arranged on the left side of the package and the respective cathodes are arranged on the right side.

As described above, the chip component 142 has equivalent external connection terminals (each anode terminal A and each cathode terminal K).
Has the point symmetry with respect to the center of the component package, whereas the chip component 141 does not have the point symmetry with respect to the center of the component package in the equivalent arrangement of the external connection terminals. That is, in this example, in the component 142,
The external connection terminals of pin numbers 1 and 2 can be equivalently used as the same cathode as the external connection terminals of pin numbers 5 and 6, and the external connection terminals of pin numbers 3 and 4 are used as pin numbers 7 and 8. Can be used equivalently as the same anode as the external connection terminal of the external connection terminal, and the arrangement relationship between the external connection terminals of the pin numbers 1 and 2 and the external connection terminals of the pin numbers 5 and 6 and the external connection terminal of the pin numbers 3 and 4 The positional relationship between the pin numbers 7 and 8 and the external connection terminals is point symmetric in the package. Then, such a point-symmetric arrangement relationship is determined by the component 141.
There is no. Therefore, in the case of a component such as the component 142, the external connection terminals of the pin numbers 1 and 2 are replaced with the external connection terminals of the pin numbers 5 and 6, and the external connection terminals of the pin numbers 3 and 4 are replaced with the pin numbers. Instead of the external connection terminals 7 and 8, they can be arranged and mounted on a printed circuit board. In other words, the component 142 can be used in the original state even if it is mounted by rotating it 180 °, whereas the component 142 can be used in the original state when it is mounted 180 ° rotated. Can not.

As described above, the component 1 without such point symmetry
The reference numeral 41 indicates that there is polarity in the arrangement when mounted on the printed circuit board, and the component 142 having point symmetry can be regarded as having no polarity in the arrangement when mounted on the printed circuit board.
Therefore, by applying the present invention as a non-polar component to the component 142 having the point symmetry as in the case of the resistor and the capacitor, useless operation can be omitted, so that the mounting efficiency of the component is improved and the component is mounted on the printed circuit board. Can be reduced as much as possible.

[0030]

As described in detail above, according to the present invention,
By controlling the position and rotation of the suction nozzle adapted to the component to be mounted, the time required for component mounting can be further reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the internal structure of a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a system configuration of the mounting device shown in FIG. 1;

FIG. 3 is an enlarged perspective view of a suction nozzle and a laser unit on which components are sucked.

FIG. 4 is a first half flowchart showing a processing procedure by a control unit of the mounting apparatus shown in FIG. 1 in an electronic component mounting method according to one embodiment of the present invention;

FIG. 5 is a second half flowchart showing a processing procedure by the control unit of the mounting device shown in FIG. 1 in the electronic component mounting method according to one embodiment of the present invention.

FIG. 6 is a plan view showing a rotation mode of a mounted component in a detection area.

FIG. 7 is a graph showing a relationship between a width w of a mounted component and a rotation angle θ obtained in a light receiving unit when a correction amount α = 0 °.

FIG. 8 is a graph showing the relationship between the width w of the mounted component and the rotation angle θ obtained in the light receiving unit when the correction amount α {0}.

FIG. 9 is a plan view schematically showing an arrangement of external connection terminals of a component having polarity and a component having no polarity.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate conveyance part 2 Component supply part 3 Supply part mounting stand 4 Suction head 4 5 Suction nozzle 5 6 XY robot 7 Control part 8 Suction controller 9 X axis controller 10 Y axis controller 11 Z axis controller 12 θ axis controller 13 Suction head drive Unit 14 Parts 15 Printed circuit board 16 RS422 interface 17 Laser alignment sensor controller 18 Laser unit 18a Light emitting unit 18b Light receiving unit

Claims (4)

[Claims] 1. A suction nozzle for sucking an electronic component,
An electronic component mounting method for mounting the electronic component on a predetermined portion of a substrate by controlling the position and rotation of the suction nozzle, wherein the presence or absence of the polarity of the electronic component sucked by the suction nozzle is registered in advance. Judging from the electronic component list, the electronic component sucked by the suction nozzle is rotated in a predetermined direction to detect a reference angle of the electronic component, and the electronic component is mounted until it is mounted according to the polarity of the electronic component. A method for mounting an electronic component, comprising determining a rotation direction of the component. 2. The rotation direction is a direction in which the angle difference between the current angle and the mounting angle is smaller when the electronic component is polar, and when the electronic component is non-polar. 2. The electronic device according to claim 1, wherein the direction is the smallest one of an angle difference between the current angle and the mounting angle and an angle difference between the current angle and an angle of 180 degrees with respect to the mounting angle. 3. How to mount parts. 3. It has a suction nozzle for sucking an electronic component,
An electronic component mounting apparatus for controlling the position and rotation of the suction nozzle to mount the electronic component on a predetermined portion of a board, wherein a storage unit in which list information of the electronic component is registered in advance; A polarity determining means for determining whether the electronic component on which the electronic component is mounted on the substrate is polar or non-polar, and rotating the electronic component sucked by the suction nozzle in a predetermined direction, Detecting means for detecting a reference angle of the electronic component; and rotating direction determining means for determining a rotating direction of the electronic component until mounting of the electronic component according to a result of the determination by the polarity determining means. Characteristic electronic component mounting device. 4. The rotation direction determining means determines, when the electronic component is polar, a direction of an angle where an angle difference between the current angle and the mounting angle is smaller as a rotation direction. When it is non-polar, the direction of the smallest angle among the angle difference between the current angle and the mounting angle and the angle difference between the current angle and the angle of 180 degrees with respect to the mounting angle is determined as the rotation direction. The electronic component mounting device according to claim 3, wherein: