JP3784935B2 - Electronic component mounting method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method and apparatus for mounting an electronic component on a printed circuit board or the like.
[0002]
[Prior art]
The so-called chip component is the most common electronic component mounted on the printed circuit board. As an aspect of mounting this chip component on a printed circuit board, the component is vacuum-sucked by a suction nozzle, and the suction nozzle position and rotation are controlled so that the component is transported to a predetermined location on the printed circuit board in an appropriate arrangement state. The method of mounting is known from the prior art. For example, in Japanese Patent Laid-Open No. 6-18215, either one of the component mounting position correction amounts in the X and Y directions along the horizontal plane is calculated by software, and extra time for actual measurement is omitted. A method and an apparatus are disclosed in which the time required for positioning is shortened to increase the component mounting efficiency.
[0003]
[Problems to be solved by the invention]
However, in such a conventional technique, the same position and rotation control of the suction nozzle is performed for any component, and therefore, depending on the component to be mounted, a wasteful operation is involved.
An object of the present invention is to further reduce the time required for component mounting by controlling the position and rotation of the suction nozzle suitable for the mounted component.
[0004]
[Means for Solving the Problems]
The method according to the present invention is a mounting method of an electronic component that uses a suction nozzle that sucks an electronic component, controls the position and rotation of the suction nozzle, and mounts the electronic component at a predetermined location on the substrate. In addition, the presence or absence of the polarity of the electronic component is judged from a list of electronic components registered in advance, the electronic component sucked by the suction nozzle is rotated in a predetermined direction, the reference angle of the electronic component is detected, and the polarity of the electronic component is set. Accordingly, the rotation direction of the electronic component until the mounting is determined is determined.
[0005]
An apparatus according to the present invention is a mounting device for an electronic component that has a suction nozzle that sucks an electronic component, controls the position and rotation of the suction nozzle, and places the electronic component at a predetermined location on a substrate. Storage means for registering the component list information, polarity determination means for determining whether the electronic component for mounting the electronic component on the board is polar or nonpolar by the storage means, and suction to the suction nozzle Rotating direction that determines the rotating direction of the electronic component until the electronic component is mounted according to the determination result of the polarity determining unit and the detecting unit that detects the reference angle of the electronic component by rotating the electronic component in a predetermined direction And determining means.
[0006]
According to these inventions, the electronic component sucked by the suction nozzle is rotated in a predetermined direction to detect the reference angle of the electronic component, and the rotation direction of the electronic component until the mounting is determined according to the polarity of the electronic component To do. Therefore, the time required for component mounting can be reduced by controlling the position and rotation of the suction nozzle suitable for the mounted component.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 shows the internal structure of a component mounting apparatus according to an embodiment of the present invention. In the apparatus, there is provided a substrate transport unit 1 for transporting and positioning a printed circuit board, and a component in which chip components (hereinafter simply referred to as components) to be mounted on the transported printed circuit board (not shown) are stored. The supply unit 2 is fixed to the supply unit mounting base 3. Although one component supply unit 2 is shown in the figure, the number of component supply units corresponding to the type of component to be mounted is actually attached. The components are vacuum-sucked by a suction nozzle 5 provided at the lower part of the suction head 4. For this reason, an XY robot for moving the suction head 4 in the horizontal direction is provided, and although not shown in the drawing, a vertical moving means for moving the suction head 4 in the vertical direction is provided.
[0008]
FIG. 2 is a block diagram showing a system configuration of the electronic component mounting apparatus shown in FIG. The control unit 7 controls the suction controller 8, the X-axis controller 9, the Y-axis controller 10, the Z-axis controller 11, and the θ-axis controller 12 to drive the suction head drive unit 13 to control the position and rotation of the suction nozzle 5. I do. Then, the component 14 of the component supply unit 2 is transported and the component 14 is mounted on the printed circuit board 15 transported to a predetermined position by the printed circuit board transport unit 1. The controller 7 also controls the laser alignment sensor controller 17 connected by the RS422 interface 16 to drive the laser unit 18. The laser unit 18 includes a light emitting unit 18a that emits parallel belt-shaped laser beams and a light receiving unit 18b that receives the laser beams. Therefore, when the sucked component 14 is at the position where the laser beam passes, a projection image of the component 14 can be obtained in the light receiving unit 18b.
[0009]
The control unit 7 has an internal memory 70 that is one of the main features of the present embodiment, and the internal memory 70 stores component list information such as polarity data indicating the presence / absence of polarity of a mounted component. Based on the polarity data, rotation control of the suction nozzle 5 suitable for the mounted part is performed.
FIG. 3 is a diagram showing a state in which the component 14 sucked by the suction nozzle 5 is raised to a position where the laser beam of the laser unit 18 passes by the Z-axis controller and rotated along the θ axis around the Z axis. By this rotation, the minimum value of the length in the predetermined direction (horizontal direction) of the projection image of the component 14 is detected, and the position and rotation angle at that time are measured, whereby the X-axis direction and Y-axis direction of the component 14 are detected. And a deviation in the θ-axis direction is detected.
[0010]
Next, regarding the electronic component mounting method of the embodiment, the processing procedure of the control unit 7 will be described with reference to the flowcharts shown in FIGS. 4 and 5. Note that the mounting angle of the component 14 in this embodiment is 0 °.
In FIG. 4, the control unit 7 performs a component suction control process of the suction nozzle 5 (step S1). More specifically, first, the Z-axis controller 11 is instructed to lower the suction head 4 from the home position along the Z-axis. When the tip of the suction nozzle 5 reaches the suction position, the Z-axis lowering is stopped, and the suction controller is stopped. 8 is instructed to suck the component 14.
[0011]
After the component suction, the Z-axis controller 11 is instructed to raise the Z-axis (step S2), and then whether or not the position of the sucked component 14 in the Z-axis direction has reached the detection area of the laser unit 18 by the laser beam. Is determined (step S3). When it does not reach the detection area, the suction head 4 continues to rise, and when it reaches the detection area, it instructs the Z-axis controller 11 to stop the Z-axis rise (step S4).
[0012]
Next, the control unit 7 resets the register (θ) that stores the value of the rotation angle of the suction nozzle 5 (step S5), and instructs the θ-axis controller 12 to rotate the suction nozzle 5 around the θ axis. (Step S6). The value of θ is controlled so as to change according to the rotation angle of the suction nozzle 5. The rotation in step S6 is performed in the direction corresponding to the reverse rotation, that is, in the direction in which the value of θ becomes negative, and is continued until the value of θ reaches −30 ° (step S7). When θ = −30 °, the controller 7 instructs the θ-axis controller 12 to stop the rotation of the suction nozzle 5 about the θ-axis (step S8).
[0013]
Thereafter, the control unit 7 starts detection of the width w of the component 14 by the laser unit 18 (step S9), and this time the suction head 5 rotates forward around the θ axis with respect to the θ axis controller 12, that is, the value of θ. Is instructed to perform rotation in the direction in which becomes positive (step S10). In FIG. 5, the control unit 7 determines the first minimum value and the second minimum value of the detection width w while performing the positive rotation around the θ axis of the suction nozzle 5 (steps S <b> 11 and S <b> 12). The forward rotation of the suction nozzle 5 around the θ axis is continued until the value reaches 120 ° (step S13). When the value of θ reaches 120 °, the rotation is stopped (step S14), the detection of the detection width w is ended (step S15), and the chair angle (angular deviation) of the component 14 when sucked with respect to the reference direction is finished. That is, the angle of the component 14 to be corrected (hereinafter referred to as a correction amount α) is finally obtained (step S16).
[0014]
Here, the manner of determining the first minimum value and the second minimum value and the manner of calculating the correction amount α will be described in detail with reference to FIGS. 6, 7, and 8.
First, when the correction amount α is 0 °, that is, when the component 14 is sucked by the suction nozzle 5 in a state that matches the reference angle, the laser beam is generated as shown by the solid line in FIG. 6A. The component 14 is arranged in the detection area in a state parallel to the light beam bm. In this example, the passing direction of the laser beam is the reference angle direction, the clockwise direction in FIG. 6 is forward rotation, and the counterclockwise direction is reverse rotation. From this state, the component 14 is reversely rotated by −30 ° as shown by the arrow in steps S6 to S8, and is shown by a solid line in FIG. 6B.
[0015]
After the detection of the width w in step S8, the component 14 rotates forward as indicated by the arrows in FIGS. 6B, 6C, and 6D in steps S9 to S13, and the value of θ is increased. The angle reaches 120 °, resulting in a state as shown in FIG.
FIG. 7 shows the relationship between the width w and θ of the component 14 obtained in the light receiving portion 18b in association with each state of the component 14 in FIGS. 6A to 6F, and the correction amount α = In this case of 0 °, w becomes the first minimum value wa in the state shown in FIG. 6A (θ = 0 °) where θ is reset in step S5. In the state of FIG. 6B (θ = −30 °), w becomes larger than the minimum value wa, and in the state of FIG. 6C, w again becomes the first minimum value wa. Further, in the state of FIG. 6D, w reaches the vicinity of the maximum value, and in the state of FIG. 6E, w becomes the second minimum value wb. In the state of FIG. 6F, w becomes larger than the minimum value wb.
[0016]
As can be seen from the above, when the component 14 is attracted by the suction nozzle 5 in a state matching the reference direction, θ is 0 ° when the first minimum value wa is detected during the forward rotation of the component 14. It is a habit of presenting. Therefore, the value of θ at the time when the first minimum value is detected in step S11 can be calculated as the correction amount α (that is, 0 ° in this case). In this case, the value of θ corresponding to the second minimum value should be 90 °, and the correction amount α is 0 when the value of θ at the time when the second minimum value is detected in step S12 is 90 °. It can be reconfirmed that it corresponds to °.
[0017]
On the other hand, when the correction amount α is a value other than 0 °, for example, when the component 14 is sucked by the suction nozzle 5 while being deviated by a predetermined angle in the counterclockwise direction from the reference direction, FIG. The component 14 is disposed in the detection area of the laser unit 18 in a state inclined with respect to the laser beam, as indicated by a one-dot chain line in A). From this state, the component 14 is reversely rotated by −30 ° as indicated by the arrow in steps S6 to S8, and is indicated by a one-dot chain line in FIG. 6B. Similarly, through steps S9 to S13, the component 14 rotates forward as indicated by the arrows in FIGS. 6B, 6C, and 6D, and the value of θ reaches 120 °, and FIG. It becomes a state as shown in.
FIG. 8 shows the relationship between the width w and θ of the component 14 obtained in the light receiving portion 18b in association with the states of the component 14 in FIGS. 6A to 6F in this case, and the correction amount. In this case of α ≠ 0 ° (α <0 °), first, in the state of FIG. 6A where θ is reset in the above step S5 (θ = 0 °), w is a component smaller than the first minimum value wa. The value is increased by 14 deviation angles. From this value, w becomes a larger value in the state of FIG. 6B (θ = −30 °), w gradually decreases due to the forward rotation, and in the state of FIG. 6C, w becomes the first value again. The minimum value wa of. Further, in the state of FIG. 6D, w reaches the vicinity of the maximum value, and in the state of FIG. 6E, w becomes the second minimum value wb. In the state shown in FIG. 6F, w is larger than the minimum value wb.
[0018]
As can be seen from the above, when the component 14 is sucked by the suction nozzle 5 while being tilted from the reference direction, θ is not 0 ° when the first minimum value wa is detected, and the tilt of the component is not detected. It should exhibit a value corresponding to the angle. Therefore, the value of θ at the time when the first minimum value is detected in step S11 can be calculated as the correction amount α. In this case, the value of θ corresponding to the second minimum value should be α + 90 °, and the correction amount α is reconfirmed by subtracting 90 ° from the value of θ when the second minimum value is detected in step S12. You can also
When θ at the time when the first and second minimum values are detected is a reference angle, the deviation of the component 14 when sucked can be measured by detecting the reference angle.
[0019]
Even when α> 0 °, the value of α can be obtained in the same manner as the principle described with reference to FIG.
[0020]
The first and second minimum values can be determined by looking at changes in the sample value of the light reception output of the light receiving unit 18b. Before and after the detection of the first and second minimum values, the component 14 is rotated until θ = −30 °, or rotated until θ = 120 °. This is because the empirical rule indicates that the range is less than ± 30 °, and thus the first and second minimum values can be reliably detected by rotation in the angle range of −30 ° to 120 °.
[0021]
Returning to the flowchart of FIG. 5 again, when the correction amount α is obtained as described above, the control unit 7 refers to the component data in the internal memory 70 (step S17), and the component 14 that the suction nozzle 5 is currently sucking is referred to. Is determined (step S18).
[0022]
Some parts have no polarity like resistors and ceramic capacitors, and others have polarity like transistors and diodes. If the control unit 7 determines in step S18 that the component 14 has the above-described polarity, the controller 7 moves the suction nozzle 5 to the θ-axis controller 12 from the state of FIG. Instruct to rotate backward (step S19), and θ = −120 ° + α in order to set the component 14 to the mounting angle (0 ° in this case) according to the correction amount α obtained in step S16. The reverse rotation is continued until it reaches θ = −120 ° + α (step S21).
[0023]
On the other hand, if the control unit 7 determines in step S18 that the component 14 does not have the polarity described above, the suction nozzle 5 is moved from the state of FIG. Is rotated forward around the θ axis (step S22), and the component 14 is rotated in the positive direction until θ = 60 ° −α in order to obtain the mounting angle in accordance with the correction amount α obtained in step S16. (Step S23), and when θ = 60 ° −α is reached, the rotation is stopped (step S21).
[0024]
After step S21, although not shown in the flow, the control unit 7 instructs the Z-axis controller 11 to lower the Z-axis, and when the component 14 reaches a predetermined mounting position, the controller 14 stops the lowering of the Z-axis. Complete the installation.
[0025]
As described above, when the control unit 7 determines that the component 14 has no polarity, the component 14 is rotated in the forward direction without rotating in reverse, so that the component 14 is returned to the direction of the first suction. This is because, as described above, non-polar parts can be arranged and mounted on the printed circuit board in the same way even if they are rotated 180 ° from the original state. In this embodiment, θ = 120. From the state of °, it is not rotated back by 120 ° to return to the original state, but is further rotated forward by 60 ° to be equivalent to the original state. Therefore, in the present embodiment, only a small rotation angle can be used to rotate the component 14 to be mounted on the printed board.
[0026]
Thus, in the present embodiment, the control unit 7 determines whether the component 14 to be mounted on the printed circuit board 15 is polar or nonpolar, and the component 14 sucked by the suction nozzle 5 is predetermined. Detecting means for detecting the reference angle of the component 14 by rotating in the direction, and rotating direction determining means for determining the rotating direction of the component 14 until the component 14 is mounted according to the determination result of the polarity determining means In addition, since appropriate rotation control of the suction nozzle is performed according to the polarity of the component 14, useless operation can be omitted, so that the mounting efficiency of the component 14 is improved and the mounting time on the printed circuit board 15 is improved. Can be reduced as much as possible.
[0027]
In the above embodiment, components such as a resistor, a capacitor, a transistor, and a diode have been described as examples. However, the present invention can also be applied when a flat package IC type component is mounted.
FIG. 9 shows an example of two types of parts. One of the parts 141 is arranged such that each anode is arranged on the same one side of the part package, and each cathode is the same other side of the part package. The four diodes respectively led out to the outside of the component package are embedded. The other type of component 142 also has four diodes embedded therein, but the arrangement form differs from the chip component 141 with the center of the component package as a boundary. On the plan view, the two diodes located in the upper half of the package have each anode arranged on the right side of the package and each cathode on the left side, whereas the two diodes located in the lower half of the package have each anode Are arranged on the left side of the package and the cathodes on the right side.
[0028]
As described above, the chip component 142 has a point symmetry with respect to the center of the component package in the arrangement of the equivalent external connection terminals (each anode terminal A and each cathode terminal K), whereas the chip component 141 has such an equivalent. The arrangement of the external connection terminals has no point symmetry with respect to the center of the component package. In other words, in this example, in the component 142, the external connection terminals of the pin numbers 1 and 2 can be used as the same cathode as the external connection terminals of the pin numbers 5 and 6, The external connection terminal can be used equivalently as the same anode as the external connection terminals of the pin numbers 7 and 8, and the arrangement relationship between the external connection terminals of the pin numbers 1 and 2 and the external connection terminals of the pin numbers 5 and 6 and The arrangement relationship between the external connection terminals of pin numbers 3 and 4 and the external connection terminals of pin numbers 7 and 8 is point-symmetric in the package. The component 141 does not have such a point-symmetric arrangement relationship. Accordingly, in the type of component such as the component 142, the external connection terminals of the pin numbers 1 and 2 are replaced with the external connection terminals of the pin numbers 5 and 6, and the external connection terminals of the pin numbers 3 and 4 are the pin numbers. Instead of the external connection terminals 7 and 8, they can be arranged and mounted on the printed circuit board. In other words, the component 142 can be used in the same state as the original state even if the component 142 is rotated by 180 °, while the component 142 can be used in the same state as the original state after being rotated by 180 °. I can't.
[0029]
As described above, the component 141 having no point symmetry is regarded as having a polarity in the arrangement when being mounted on the printed board, and the component 142 having the point symmetry is polar in the arrangement when being mounted on the printed board. It can be considered that there is no. Therefore, by applying the present invention as a non-polar component 142 to the component 142 having point symmetry, a wasteful operation can be omitted, and the mounting efficiency of the component can be improved and the printed circuit board can be obtained. It is possible to reduce as much as possible the time required for mounting.
[0030]
【The invention's effect】
As described above in detail, according to the present invention, the position and rotation control of the suction nozzle suitable for the mounted component can be performed to further reduce the time required for mounting the component.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an internal structure of a component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a block diagram showing a system configuration of the mounting apparatus shown in FIG.
FIG. 3 is an enlarged perspective view of an adsorption nozzle and a laser unit that adsorb components.
4 is a first half flowchart showing a processing procedure by a control unit of the mounting apparatus shown in FIG. 1 for an electronic component mounting method according to an embodiment of the present invention.
FIG. 5 is a second half flowchart showing a processing procedure by the control unit of the mounting apparatus shown in FIG. 1 for an electronic component mounting method according to an embodiment of the present invention;
FIG. 6 is a plan view showing a rotation mode in a detection area of a mounted part.
FIG. 7 shows a width w and a rotation angle θ of a mounted part obtained in the light receiving unit when the correction amount α = 0 °.
The graph which shows the relationship.
FIG. 8 shows a width w and a rotation angle θ of a mounted part obtained in the light receiving unit when the correction amount α ≠ 0 °.
The graph which shows the relationship.
FIG. 9 is a plan view schematically showing an arrangement mode of external connection terminals of parts having polarity and parts having no polarity;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate conveyance part 2 Component supply part 3 Supply part mounting stand 4 Suction head 4
5 Suction nozzle 5
6 XY Robot 7 Control Unit 8 Suction Controller 9 X-axis Controller 10 Y-axis Controller 11 Z-axis Controller 12 θ-axis Controller 13 Suction Head Drive Unit 14 Component 15 Printed Circuit Board 16 RS422 Interface 17 Laser Alignment Sensor Controller 18 Laser Unit 18a Light Emitting Unit 18b Light receiving section

Claims (4)

A mounting method for an electronic component that uses a suction nozzle that sucks an electronic component, controls the position and rotation of the suction nozzle, and mounts the electronic component at a predetermined location on a substrate,
Judging the presence or absence of the polarity of the electronic component sucked by the suction nozzle from the pre-registered electronic component list,
Rotating the electronic component sucked by the suction nozzle in a predetermined direction to detect a reference angle of the electronic component and determining a rotation direction of the electronic component until mounting according to the polarity of the electronic component An electronic component mounting method characterized by the above.   The rotation direction is opposite to the predetermined direction when the electronic component is polar, and is the same direction as the predetermined direction when the electronic component is nonpolar. 1. A method for mounting an electronic component according to 1. An electronic component mounting apparatus that includes a suction nozzle that sucks an electronic component, controls the position and rotation of the suction nozzle, and mounts the electronic component on a predetermined position of a substrate,
Storage means for registering the electronic component list information in advance;
Polarity determining means for determining whether the electronic component for mounting the electronic component on the substrate is polar or nonpolar by the storage means;
Detecting means for detecting a reference angle of the electronic component by rotating the electronic component sucked by the suction nozzle in a predetermined direction;
Rotation direction determination means for determining the rotation direction of the electronic component until the electronic component is mounted according to the determination result of the polarity determination means;
An electronic component mounting apparatus comprising:   The rotation direction determining means determines the direction opposite to the predetermined direction as the rotation direction when the electronic component is polar, and sets the same direction as the predetermined direction when the electronic component is nonpolar. 4. The electronic component mounting apparatus according to claim 3, wherein the rotation direction is determined.

Images