JPH11330347A - Semiconductor ic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor IC with enhanced and multiple functions. SOLUTION: Related to a semiconductor IC wherein each of leads 7 of a lead frame 4 is connected to each of electrode terminals 6 of a semiconductor chip 2, a plurality of semiconductor chips 2 are laminated to form a laminating chip body 3, while a hollow part 5 is formed at almost center part of the lead frame 4, with the laminating chip body 3 provided at the hollow part 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor IC.

[0002]

2. Description of the Related Art As a conventional semiconductor IC, as shown in FIG. 9, two semiconductor chips 53, 53 are bonded to an upper part of an island 52 of a lead frame 51, and an electrode terminal 54 of the semiconductor chip 53 is connected to a lead. A semiconductor IC 58 in which leads 55 of a frame 51 are connected by wire bonding 56 and both upper and lower surfaces of the lead frame 51 are sealed with a resin 57 is generally known.

Further, as disclosed in, for example, Japanese Patent Application Laid-Open No. 6-188280, a pair of upper and lower semiconductor chips are arranged with their electrode faces facing each other or with their respective electrode faces back to back. In some cases, a lead of a lead frame is interposed between a pair of upper and lower semiconductor chips, and an electrode terminal of each semiconductor chip and a lead of the lead frame are connected by die bonding or wire bonding.

[0004]

However, in the conventional example shown in FIG. 9, since the semiconductor chip 53 is arranged above the island 52 of the lead frame 51, the semiconductor IC
It is difficult to reduce the size of the semiconductor IC 58, and in the manufacturing process of the semiconductor IC 58, the semiconductor chip 53 is attached to the island 52 of the lead frame 51.
Must be adhered to each other, which complicates the manufacturing process and increases the manufacturing cost.

In a semiconductor IC disclosed in Japanese Patent Application Laid-Open No. 6-188280, a pair of upper and lower semiconductor chips are connected to the leads of one lead frame, and the leads connected to the upper semiconductor chip are connected. And the leads connected to the lower semiconductor chip are arranged alternately, so the pitch of the electrode terminals of the semiconductor chip must be larger than the arrangement pitch of the leads, and it is necessary to use a dedicated semiconductor chip. This causes a problem that the cost of the semiconductor IC is increased.

[0006]

Therefore, according to the present invention, in a semiconductor IC in which each lead of a lead frame is connected to each electrode terminal of a semiconductor chip, a plurality of semiconductor chips are stacked to form a stacked chip body. On the other hand, a hollow portion is formed substantially at the center of the lead frame, and the laminated chip body is disposed in the hollow portion.

[0007] In the laminated chip body, a plurality of semiconductor chips are laminated with their electrode surfaces facing in the same direction.

Further, at least one of the semiconductor chips forming the laminated chip body is pressed against the leads of the lead frame.

In a semiconductor IC in which each lead of a lead frame is connected to each electrode terminal of a semiconductor chip, two lead frames are vertically stacked with an insulating layer interposed between base ends of the leads. The electrode terminals of a pair of upper and lower semiconductor chips are connected to the base end of each lead.

[0010] At least one of the upper and lower semiconductor chips is pressed against the leads of the lead frame.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In a semiconductor IC according to the present invention, a plurality of semiconductor chips are laminated to form a laminated chip body, while a hollow portion is formed substantially at the center of a lead frame, and the laminated chip is formed in the hollow portion. The body is arranged.

Accordingly, the structure which eliminates the island used in the conventional semiconductor IC is obtained, and the thickness of the semiconductor IC can be reduced, and the size of the semiconductor IC can be reduced.

Moreover, the manufacturing process of the semiconductor IC can be simplified, and the manufacturing cost and the manufacturing yield of the semiconductor IC with high functionality and multiple functions can be reduced.

Further, a plurality of semiconductor chips are stacked with the electrode surfaces facing in the same direction to form a stacked chip body, so that the connection between the electrode terminals of the semiconductor chip and the leads of the lead frame are all performed from the same direction. The manufacturing of semiconductor ICs can be simplified,
In this way, it is also possible to reduce the manufacturing cost and improve the manufacturing yield of a highly functional and multifunctional semiconductor IC.

Further, by pressing at least one semiconductor chip of the semiconductor chips forming the laminated chip body against the lead of the lead frame, the semiconductor chip can function as a conventional island, and the island is eliminated to reduce the thickness. Although the structure has been improved, the strength of the semiconductor IC can be maintained satisfactorily.

Further, two lead frames are vertically stacked with an insulating layer interposed between the base ends of the leads, and the electrode terminals of a pair of upper and lower semiconductor chips are respectively connected to the base ends of the leads. Accordingly, the upper and lower leads are not short-circuited, and the semiconductor chips having different functions can be connected to the upper and lower lead frames, respectively, so that the semiconductor IC can have higher functions and more functions.

Moreover, the arrangement pitch of the leads and the pitch of the electrode terminals of the semiconductor chip can be made substantially equal, so that there is no need to use a dedicated semiconductor chip, and it is possible to suppress an increase in the cost of the semiconductor IC. .

Also, by pressing at least one of the upper and lower semiconductor chips against the leads of the lead frame, the semiconductor chip can function as a conventional island, and the island is eliminated to reduce the thickness. Semiconductor I
C can maintain good strength.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 show a semiconductor IC according to the present invention.
1 shows a semiconductor IC 1 in which a semiconductor chip 1 is formed by laminating two semiconductor chips 2 to form a laminated chip body 3, while a hollow part 5 is formed substantially at the center of a lead frame 4.
The stacked chip body 3 is disposed on the semiconductor chip 2, and each lead 7 of the lead frame 4 is connected to each electrode terminal 6 of the semiconductor chip 2.
In the figure, reference numeral 11 denotes a mold resin.

The laminated chip body 3 includes a large semiconductor chip 2
A small semiconductor chip 2 to each semiconductor chip 2
The electrode surfaces 8 on which the electrode terminals 6 are formed face each other in the same direction (downward in FIG. 1), and are bonded using an adhesive 9 having an insulating property.

As shown in FIGS. 1 and 2, the lead frame 4 extends the lead 7 in four directions of front, rear, left and right in plan view, and connects the long lead 7 and the short lead 7 to each other. Arranged alternately, and approximately in the center of the lead frame 4,
A hollow portion 5 surrounded by the tip of the short lead 7 and a hollow portion 5 surrounded by the tip of the long lead 7 are formed vertically,
In addition, the distal end of the long lead 7 is located below the distal end of the short lead 7 in side view.

Then, the small semiconductor chip 2 is inserted into the upper hollow portion 5 from above, and a hemispherical bump 10 formed on the electrode terminal 6 of the small semiconductor chip 2 is formed at the tip of the long lead 7. At the same time, the electrode terminals 6 of the large-sized semiconductor chip 2 are pressed at the tips of the short leads 7.

By accommodating a plurality of semiconductor chips 2 inside the semiconductor IC 1 in this manner, the semiconductor IC 1
1 can have higher functions and more functions.

Further, the laminated chip body 3 is disposed in the hollow portion 5 formed substantially at the center of the lead frame 4, and the island 52 (see FIG. 9) of the lead frame 51 used in the conventional semiconductor IC 58 is used. Semiconductor IC1
The thickness of the semiconductor IC 1 can be reduced, the size of the semiconductor IC 1 can be reduced, the manufacturing process of the semiconductor IC 1 can be simplified, and the manufacturing cost of the highly functionalized and multifunctional semiconductor IC 1 can be reduced. The production yield can be improved.

Further, since the laminated chip body 3 is formed by laminating two semiconductor chips 2 with their respective electrode surfaces 8 facing in the same direction, the electrode terminals 6 of the semiconductor chip 2 and the lead frame are formed. 4 can be connected to the leads 7 in the same direction, and the manufacture of the semiconductor IC 1 can be simplified. This also reduces the manufacturing cost of the highly functionalized and multifunctional semiconductor IC 1. In addition, the production yield can be improved.

Further, by pressing the semiconductor chip 2 against the leads 7 of the lead frame 4, the semiconductor chip 2
Can function as a conventional island, and the strength of the semiconductor IC 1 can be maintained satisfactorily even though the structure is made thin by eliminating the island.

FIG. 3 shows a semiconductor IC 1 according to a second embodiment.
In the present embodiment, the structure is substantially upside down.

That is, in this embodiment, the electrode terminals 6 are formed on the periphery of the upper surface of the large and small semiconductor chips 2, 2, respectively, and the electrode surfaces 8, 8 of both the semiconductor chips 2, 2 are directed upward. The large and small semiconductor chips 2 and 2 are adhered with an adhesive 9, while the tips of the long leads 7 are positioned above the tips of the short leads 7, and the electrode terminals 6 of the semiconductor chip 2 are attached to the leads 7. Is pressed through the bump 10.

FIG. 4 shows a semiconductor IC 1 according to a third embodiment.
In this embodiment, four semiconductor chips 2 are stacked to form a stacked chip body 3.

As described above, by stacking a plurality of semiconductor chips 2 to form a stacked chip body 3, the semiconductor I
C1 can be further enhanced in function and multifunctional.

FIG. 5 shows a semiconductor IC 1 according to a fourth embodiment.
In this embodiment, electrode terminals 6 are formed on the periphery of the upper surfaces of the large and small semiconductor chips 2, 2, respectively, and the electrode surfaces 8, 8 of both semiconductor chips 2, 2 are directed upward. In this state, the large and small semiconductor chips 2 and 2 are adhered to each other, and the small semiconductor chip 2 is inserted from above into a hollow portion 5 formed substantially in the center of the lead frame 4, and the electrode terminals 6 and the lead frame 4 And the electrode terminal 6 of the small semiconductor chip 2 is pressed into contact with the lead 7 via the bump 10.
And the lead 7 of the lead frame 4 are connected by wire bonding. In the figure, 12 is a wire.

In this case, the leads 7 connected to the large semiconductor chip 2 and the leads 7 connected to the small semiconductor chip 2
And are alternately arranged.

Also in this case, the semiconductor chip 2 is
To make the semiconductor chip 2 function as a conventional island.

FIG. 6 shows a semiconductor IC 1 according to a fifth embodiment.
This embodiment is substantially the same as the fourth embodiment, except that three stacked chip bodies 3 in which two semiconductor chips 2 are stacked are housed inside a semiconductor IC 1. .

FIGS. 7 and 8 show a semiconductor IC 21 according to a sixth embodiment. The semiconductor IC 21 has two lead frames 24 and an insulating layer 29 between the base ends of the leads 27. The laminated lead frame body 23 is formed by vertically stacking with the interposition therebetween, and each lead frame 24 of the laminated lead frame body 23 is formed.
The electrode terminals of a pair of upper and lower semiconductor chips 22
26 is pressed. In the figure, 30 is a hemispherical bump, and 31 is a mold resin.

The laminated lead frame body 23 includes upper and lower leads.
The upper and lower leads 27, 27 are alternately arranged by bending the upper and lower leads 27, 27 in the middle part in the right and left opposite directions.

Also in this case, the semiconductor chip 22 is
The semiconductor chip 22 is made to function as a conventional island by press-contacting the semiconductor chip 22.

As described above, the two lead frames 24 are
Since the insulating layers 29 are interposed between the base ends of the leads 27, the leads 27 are vertically stacked, and the electrode terminals 26 of the semiconductor chip 22 are connected to the leads 27 of each lead frame 24, respectively.
The semiconductor chips 22 having different functions can be respectively connected to the upper and lower lead frames without short-circuiting of the semiconductor ICs 27, 27, so that the semiconductor IC 21 can have higher functions and more functions.

Further, the arrangement pitch of the leads 27 and the pitch of the electrode terminals 26 of the semiconductor chip 22 can be made substantially equal, so that a general-purpose semiconductor chip 22 can be used, and an increase in the cost of the semiconductor IC 21 can be suppressed. it can.

The upper and lower semiconductor chips 22 may have substantially the same size or the same size. For example, the same memory element may be used to increase the memory capacity, or the same CPU may be used. Accordingly, it is possible to easily achieve high functionality such as parallel processing.

[0042]

The present invention is embodied in the form described above and has the following effects.

(1) According to the present invention, a plurality of semiconductor chips are stacked to form a laminated chip body, while a hollow portion is formed substantially at the center of a lead frame, and the laminated chip is formed in the hollow portion. Because the body is arranged, the conventional semiconductor IC
It became a structure that lost the island used for
The thickness of the semiconductor IC can be reduced, and the size of the semiconductor IC can be reduced.

In addition, the manufacturing process of the semiconductor IC can be simplified, and the manufacturing cost and the manufacturing yield of the semiconductor IC with high functionality and multifunction can be reduced.

(2) According to the second aspect of the present invention, since the laminated chip body is formed by laminating a plurality of semiconductor chips with the electrode surfaces facing in the same direction, the electrode terminals of the semiconductor chip and the lead frame are formed. Can be made from the same direction, and the manufacture of the semiconductor IC can be simplified. This also reduces the manufacturing cost and manufacture of a highly functional and multifunctional semiconductor IC. The yield can be improved.

(3) According to the third aspect of the present invention, since at least one of the semiconductor chips forming the laminated chip body is pressed against the lead of the lead frame, the semiconductor chip is used as a conventional island. The semiconductor IC can be made to function, and the strength of the semiconductor IC can be maintained satisfactorily, even though the structure is reduced in thickness without islands.

(4) According to the fourth aspect of the present invention, two lead frames are vertically stacked with an insulating layer interposed between the base ends of the leads, and a pair of upper and lower parts is provided at the base end of each lead. Since the electrode terminals of the semiconductor chip are connected to each other, the upper and lower leads are not short-circuited, and semiconductor chips having different functions can be connected to the upper and lower lead frames, respectively. Functionalization can be achieved.

Further, the arrangement pitch of the leads and the pitch of the electrode terminals of the semiconductor chip can be made substantially equal, so that it is not necessary to use a dedicated semiconductor chip, and it is possible to suppress an increase in the cost of the semiconductor IC.

(5) According to the present invention, at least one of the upper and lower semiconductor chips is pressed against the leads of the lead frame.
This also allows the semiconductor chip to function as a conventional island, and can maintain the strength of the semiconductor IC satisfactorily while having a structure in which the island is eliminated and the thickness is reduced.

[Brief description of the drawings]

FIG. 1 is a side view showing a semiconductor IC according to the present invention.

FIG. 2 is a plan view of the same.

FIG. 3 is a side view showing a semiconductor IC as a second embodiment.

FIG. 4 is a side view showing a semiconductor IC as a third embodiment.

FIG. 5 is a side view showing a semiconductor IC as a fourth embodiment.

FIG. 6 is a side view showing a semiconductor IC according to a fifth embodiment.

FIG. 7 is a side view showing a semiconductor IC as a sixth embodiment.

FIG. 8 is an enlarged view of the same part.

FIG. 9 is a side view showing a conventional semiconductor IC.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor IC 2 Semiconductor chip 3 Laminated chip body 4 Lead frame 5 Hollow part 6 Electrode terminal 7 Lead 8 Electrode surface 10 Bump 21 Semiconductor IC 22 Semiconductor chip 23 Laminated lead frame body 24 Lead frame 26 Electrode terminal 27 Lead 29 Insulating layer

Claims (5)

[Claims] 1. A semiconductor IC comprising a semiconductor chip (2) and electrode leads (6) connected to respective leads (7) of a lead frame (4). While forming the chip body (3), a hollow part is formed approximately in the center of the lead frame (4).
(5) A semiconductor IC wherein the laminated chip body (3) is disposed in the hollow part (5). 2. The semiconductor IC according to claim 1, wherein the laminated chip body (3) is formed by laminating a plurality of semiconductor chips (2) with their electrode surfaces (8) facing in the same direction. 3. The semiconductor device according to claim 1, wherein at least one of the semiconductor chips forming the laminated chip body is pressed against a lead of a lead frame. 3. The semiconductor IC according to claim 1 or 2. 4. In a semiconductor IC having each lead (27) of a lead frame (24) connected to each electrode terminal (26) of a semiconductor chip (22), two lead frames (24) are connected to the leads (24). An insulating layer (29) was interposed between the base ends of (27) and vertically stacked, and the electrode terminals (26) of a pair of upper and lower semiconductor chips (22) were connected to the base end of each lead (27), respectively. A semiconductor IC characterized by the above-mentioned. 5. The semiconductor device according to claim 4, wherein at least one of the pair of upper and lower semiconductor chips is in pressure contact with a lead of a lead frame. Semiconductor IC.