JPH09129798A - Electronic component and fabrication thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface mount wire bondingless electronic component which has an improved reliability in electric connection between bump electrodes and lead terminals without wire bonding. SOLUTION: The electronic component comprises an electronic component chip 4 having a plurality of bump electrodes 4a and 4b provided on its one surface, leads 2, 3 and 1 electrically connected to the plurality of bump electrodes and to the other of the electronic component chip 4, and a package 7 for covering the electronic component chip 4. The end of the lead 1 connected to the other surface of the electronic component chip 4 is subjected to a large forming work.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component suitable for surface mounting in which a tip of a lead is directly connected to a bump electrode of an electronic component chip without wire bonding, and a manufacturing method thereof. More specifically, the present invention relates to an electronic component having a reliable connection between the lead and the bump electrode and improved reliability even when there are a plurality of leads connected to the bump electrode, and a method for manufacturing the same.

Here, the bump electrode means an electrode formed in a projection shape so that the lead can be directly connected with an electrode connected to another lead.

[0003]

2. Description of the Related Art In a semiconductor device such as a diode, the tip of the lead is directly electrically connected to a bump electrode or the like without wire bonding, and the lead led out to the outside of the package is formed on substantially the same surface. The Wybonless surface mount semiconductor device is manufactured, for example, as follows.

For example, in a three-terminal type diode, as shown in the sectional view of FIG. 4 or FIG. 5 (a), the lead frame in which the die pad portion 1a is formed to be the same as the surface A of the lead frame or slightly higher than it. The semiconductor chip 4 is die-bonded to the die pad portion 1a of the above, then the lead end portion 2a connected to the bump electrode 4a is subjected to a forming process, and the lead end portion 2a is laterally shifted and electrically connected by soldering or the like. A package 7 is formed by molding with a mold such as the above, and the leads 1 and 2 are separated from the lead frame to form a semiconductor device.

In the semiconductor device having the structure shown in FIG. 4, after separating the leads 1 and 2 from each other, the leads 1 and 2 are formed as shown in FIG. 4 so that they can be surface-mounted. Or various forming processes such as inserting the leads into the through holes of the substrate and extending the leads so that they can be soldered. 4 to 5, 5 is a preform material for die-bonding a semiconductor chip, and 6 is a solder for electrically connecting the bump electrode 4a and the lead end portion 2a.

In the semiconductor device having the structure shown in FIG. 4 or FIG. 5A, the tips of the leads 1 and 2 led out of the resin are substantially flush with the bottom surface of the package 7, and printing is performed as it is. It can be surface-mounted on a board or the like. In the semiconductor device having the structure shown in FIG. 5A, the die pad portion 1a is slightly lifted up in the state of the lead frame, but the lower side of the die pad portion 1a is also covered with the resin for the package 7 to prevent moisture. It prevents intrusion, and this height is about 0.1 to 0.2 mm. Therefore, even if the lead frame is wound in a roll shape, the lead frame is not crushed and is simultaneously formed when the lead frame is formed.

On the other hand, the lead on the side connected to the bump electrode 4a is further lifted by the thickness of the semiconductor chip and the height of the bump electrode, and is die-bonded so as to be stacked side by side on the semiconductor chip side. Later, the semiconductor chip is lifted up by a height equal to or more than the thickness of the semiconductor chip, and then the forming process is performed by pushing it down.

[0008]

In the case of an electronic component chip having a plurality of bump electrodes formed on one surface of the semiconductor chip 4, when it is manufactured by the above method, the number of leads to be lifted becomes plural. Therefore, as shown in FIG. 5B, there is a problem that the height of the lifted lead ends 2a and 3a with respect to the electronic component chip (semiconductor chip) 4 varies. When such height variations occur, lead end portions 3a that do not contact the bump electrodes are generated,
There is a problem that reliability is reduced.

The present invention solves such a problem, and even an electronic component which is suitable for surface mounting without a wipe-on, has improved reliability of electrical connection between the bump electrode and the end of the lead, and the electronic component. The purpose is to provide a manufacturing method.

[0010]

An electronic component according to the present invention is an electronic component chip having a plurality of bump electrodes on one surface, and electrically connected to the plurality of bump electrodes and the other surface of the electronic component chip, respectively. And a package that covers the periphery of the electronic component chip, and a large forming process is performed on an end portion of the lead that is connected to the other surface of the electronic component chip.

When the tip of the lead, which is connected to the bump electrode and the other surface and is led out to the outside of the package, is formed on the same plane as the bottom surface of the package, the tip of the lead is formed. In particular, the large forming process is easily performed, so that the effect is particularly large.

Here, "substantially the same surface" means that the tips of the leads led out from the mold package are formed in a surface substantially parallel to the bottom surface of the package, and the printing can be easily performed without further special lead forming. It means that it can be surface-mounted on a board.

According to the method of manufacturing an electronic component of the present invention, (a) the die pad for bonding the electronic component chip in the lead frame is pushed down from the surface of the lead frame, (b)
Bonding an electronic component chip to the die pad,
(C) The die pad portion of the lead frame and the lead connected to the bump electrode of the electronic component chip are relatively laterally displaced and aligned, and (d) each electrode of the electronic component chip and the lead. Each of them is electrically connected and then molded with a resin for packaging.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an electronic component of the present invention and a manufacturing method thereof will be described with reference to the drawings.

FIG. 1A is a sectional explanatory view of a three-terminal type diode which is an embodiment of an electronic component of the present invention, and FIG.
(B) and FIG. 1 (c) are respectively BB of FIG. 1 (a).
2 is a cross-sectional explanatory view and a bottom view, FIG. 2 is a cross-sectional explanatory view of a three-terminal diode having another structure, and FIG. 3 is a diagram illustrating a manufacturing process of the three-terminal diode of FIG.

In the three-terminal type diode of this embodiment shown in FIGS. 1 and 2, a semiconductor chip 4 which is an electronic component chip contains two series diodes, and terminals at both ends are one surface of the semiconductor chip 4. Two bump electrodes 4a and 4b are formed on the front surface, terminals at the connection points of the two diodes are formed on the back surface which is the other surface of the semiconductor chip 4, and two are formed on the front surface.
One 3-terminal diode is formed on the back surface. The ends 2a and 3a of the leads 2 and 3 of the lead frame are electrically connected to the two bump electrodes 4a and 4b, respectively, and the other surface side of the semiconductor chip 4 is electrically connected to the die pad 1a of the lead frame. Has been done.

That is, in the so-called Wybonless type in which each electrode terminal of the semiconductor chip 4 and the lead are not connected by wire bonding such as a gold wire, in the present invention, the other surface which is the one-terminal side of the semiconductor chip 4 is used. It is characterized in that the ends (die pad 1a) of the leads connected to the side are largely formed. The reference numerals indicate the same parts as those in FIGS. 4 to 5, and the description thereof will be omitted.

In this type of Wybonless type electronic component, the thickness of the electronic component chip is equal to the thickness of the electronic component chip because it is electrically connected to the electrode terminals (bump electrodes) of the electronic component chip and the leads are laid side by side. It is necessary to lift one lead of the lead frame or the intermediary lead connected to the lead about twice, and then to perform a large forming process in which the lead is vertically returned.

In the present invention, since the electronic component chip is connected,
The processing of the lead that is moved up and down is called large forming processing, and the lead to which this large forming processing is performed is the lead side that is connected to one terminal side of the electronic component chip. By doing this, it is not necessary to form a large number of leads at the same time,
There is no variation in height between the leads, a defective connection between the electrode terminals of the electronic component chip and the leads does not occur, and a highly reliable electronic component can be obtained.

In the example shown in FIG. 1, the steps 2a and 3a of the leads 2 and 3 on the multi-terminal side are also provided with slight steps, which are bonded to the bump electrodes 4a and 4b of the semiconductor chip 4. This is for completely covering the lead end portions 2a, 3a to be formed with the resin for packaging, and is not a process for disposing the leads on both sides of the electronic component chip. Therefore, the height of the step is about 0.1 to 0.2 mm, and it is formed at the same time when the lead frame is manufactured, and the height is constant without variation. On the other hand, the lead on the side of one terminal is subjected to a large forming process by the total of this height, the thickness of the electronic component chip and the height of the bump electrode, and the height which is lifted up for shifting and stacking.

In the present invention, a large forming process means that one lead of the lead frame is connected to both sides of the electronic component chip when electrically connected to the electronic component chip. The above dimensions mean that the electronic component chip is processed on one surface side or the other surface side.

Next, a method of manufacturing the three-terminal type diode shown in FIG. 1 will be described with reference to FIG.

First, the lead frame 10 as shown in FIG. 3A is supplied along its longitudinal direction. As described above, the lead frame 10 has a thickness of 0.1 to 0.2 so that the ends 2a of the leads 2 and 3 connected to the bump electrodes of the semiconductor chip are covered with the packaging resin.
Forming processing is performed so that it is lower than the surface of the lead frame 10 by about mm, but this is formed when the lead frame 10 is manufactured. In this state, it is wound into a roll shape and is not deformed. Supplied.
In FIG. 3A, 11 is a section bar,
Reference numerals 12 and 13 denote frame frames, which are members that absorb the deformation when the leads 1 and the leads 2 and 3 are displaced and overlapped.

Next, after the semiconductor chip 4 is die-bonded to the die pad 1a for bonding the semiconductor chip 4 by a usual method, or the die pad 1a is partially pushed down, the semiconductor chip 4 is die-bonded, and the die pad 1a is further pushed down. Forming process. The overall height of the push-down is the thickness of the semiconductor chip 4, the height of the bump electrode 4a, and the end portions 2 of the leads 2 and 3.
The sum of the steps a, 3a and the steps for shifting and overlapping is, for example, about 0.4 to 0.6 mm (see FIG. 3B).

Next, as shown in FIG. 3C, the frame frames 12 and 13 of the lead frame 10 are moved relative to each other so that the bump electrodes 4a and 4b of the semiconductor chip 4 and the lead end portions 2a and 3a are separated from each other. Align it, put it back up and down,
The bump electrodes 4a, 4b and the lead end portions 2a, 3a are soldered. Then, molding is performed with a synthetic resin such as an epoxy resin, and the leads 1, 2, and 3 are separated from the lead frame, and a semiconductor device as shown in a sectional view in FIG. 3D is formed. The other reference numerals indicate the same parts as in FIG.

Although the lead shape of each of the above-described embodiments is a shape suitable for the surface mounting structure, in the case of the surface mounting structure, a large lead forming process is often performed, which is preferable for applying the present invention. However, the present invention is not limited to the surface mounting structure, and the shape of the external lead derived from the package may be subjected to any forming process.

In the above embodiment, the example of the three-terminal type diode has been described, but the present invention is not limited to three terminals and can be applied to a case of multiple terminals of four terminals or more, and further semiconductor devices such as transistors other than diodes, It can be applied to an electronic component such as a capacitor in which one side has one terminal and the other side has multiple terminals and is directly connected by a lead.

[0028]

As described above, according to the present invention,
After bonding the electronic component chip, the forming process of the lead for electrical connection with the lead is connected not on the lead side that connects to the bump electrode provided on the one side of the electronic component chip, but on the other side of the electronic component chip. Since the lead is made by a common lead, stable connection can be obtained without variations in the height of the lead on the multi-terminal side, and a highly reliable electronic component can be obtained.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of an embodiment of an electronic component of the present invention.

FIG. 2 is an explanatory diagram of another structure of the embodiment of the electronic component of the present invention.

FIG. 3 is an explanatory diagram of a method for manufacturing the electronic component of FIG.

FIG. 4 is a cross-sectional explanatory view of a conventional 3-terminal diode.

FIG. 5 is a cross-sectional explanatory view of a conventional 3-terminal diode.

[Explanation of symbols]

 1 Lead 1a Die Pad (Lead End) 2, 3 Leads 2a, 3a Lead End 4 Semiconductor Chips 4a, 4b Bump Electrode 7 Package

Claims (3)

[Claims] 1. An electronic component chip having a plurality of bump electrodes on one surface, leads electrically connected to the plurality of bump electrodes and the other surface of the electronic component chip, and a periphery of the electronic component chip. An electronic component, which is formed of a package that covers the surface of the electronic component chip and is subjected to a large forming process at an end of the lead connected to the other surface of the electronic component chip. 2. The tip of the lead, which is respectively connected to the bump electrode and the other surface and is led out from the package, is formed on the same surface as the bottom surface of the package. Electronic components. 3. A die pad for bonding an electronic component chip in a lead frame is pressed down from the surface of the lead frame, (b) an electronic component chip is bonded to the die pad, and (c) a die pad portion of the lead frame. After the bump electrodes of the electronic component chip and the leads connected to each other are laterally displaced and aligned, (d) each electrode of the electronic component chip and each of the leads are electrically connected. A method of manufacturing electronic parts, characterized by molding with a packaging resin.