JPH11330037A - Apparatus for processing substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To minimize foot print and to simplify a control mechanism, when carrying a substrate between processing parts and to arrange the mechanism in a directly in-line relation with an outer peripheral unit. SOLUTION: This device has a first processing group and a second processing group whose cleaning part and drying part are arranged in the vertical direction (in a z-direction) and has a first carrying robot TR1 and a second carrying robot TR2 as mechanisms for carrying a substrate. The first carrying robot TR1 carries a substrate W for a pod 9a arranged in a substrate storage 7 and the drying part and the substrate placing part 82 of the first processing group MP1 and the second processing group MP2. The first carrying robot TR1 makes an another access to a buffer 72, and the second carrying robot TR2 has access to a CMP unit 200 which is an outer peripheral unit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor wafer,
The present invention relates to a substrate processing apparatus that performs a predetermined process on a thin substrate (hereinafter, simply referred to as a “substrate”) such as a glass substrate for a liquid crystal display device.

[0002]

2. Description of the Related Art In the course of manufacturing a substrate, in order to remove unevenness due to the multilayer structure of the substrate surface, CMP (Chemical Polishing) is used to planarize the substrate surface by mechanically shaving the substrate surface using a chemical abrasive or a pad. Chemical Mechanical Polishing)
Is performed.

[0003] Since polishing debris generated by polishing adheres to the surface of the substrate subjected to the CMP process,
As a process for the substrate after the CMP process, a process of cleaning the substrate to remove polishing debris and the like is performed.

FIG. 13 shows a conventional substrate processing apparatus for cleaning a substrate after such CMP processing. The conventional substrate processing apparatus 410 includes a loader 310, an unloader 390, a plurality of processing units 330, 350, 370, and a plurality of transfer robots 320, 340, 360, 380.

The processing section 330 removes particles such as polishing debris adhered to the substrate by CMP by brushing both sides of the substrate using a front brush for cleaning the front surface of the substrate and a back brush for cleaning the rear surface of the substrate. Perform processing. The processing unit 350 is a processing unit that removes fine particles adhering to the substrate surface using a brush having a higher particle removal ability. In these processing units 330 and 350, a predetermined processing liquid is also discharged onto the front surface or the back surface of the substrate in order to enhance the cleaning effect by the brush. In addition, the processing unit 370
A processing unit that performs high-speed spin-dry drying of the substrate after the final rinsing of the substrate using a rinsing liquid such as pure water.

In the loader 310, a cassette in which a plurality of substrates after the CMP processing are stored is immersed in water, and when the substrates are transported to the processing unit 330, the cassette is pulled up from the water, and the transport robot 320 removes the substrates. It is configured so that it can be taken out.

[0007] The transfer robot 320 takes out the substrate from the loader 310 and transfers the substrate to the processing section 330. The transfer robot 340 takes out the substrate on which the double-side cleaning process has been completed in the processing unit 330 and transfers the substrate to the processing unit 350. The transfer robot 360 takes out the substrate after the surface cleaning processing in the processing unit 350 is completed, and transfers the substrate to the processing unit 370. Further, the transfer robot 380 takes out the substrate that has been subjected to final rinsing in the processing unit 370 and has been dried, and stores the substrate in a cassette provided in the unloader 390.

[0008]

In the conventional substrate processing apparatus 410 as described above, since a transfer robot dedicated to transfer between the processing units is provided between the processing units, three processing units for the substrate are provided. However, four transfer robots are provided. Therefore, there is a problem that the footprint of the entire apparatus becomes large. This problem becomes more prominent when the substrate processing apparatus 410 is inlined with a CMP apparatus.

FIG. 14 is a schematic diagram showing a configuration when a conventional substrate processing apparatus 410 is inlined with an actual CMP apparatus. Since the conventional substrate processing apparatus 410 cannot directly transfer a substrate to and from the CMP apparatus 200, a conveyor 420 is provided. In addition, the conventional substrate processing apparatus 4
10 is provided with only a loader for the cleaning process after the CMP process, so that an indexer 430 for taking out the substrate to the CMP apparatus 200 is further provided.
20. And the indexer 43
0 is taken out of C by conveyor 420
The substrate that has been transported to the MP apparatus 200 and that has completed the CMP processing is transported by the conveyor 420 to the loader 310 of the substrate processing apparatus 410 again.

As described above, when the conventional substrate processing apparatus 410 is inlined with the CMP apparatus, the
, The footprint becomes large.

Further, in the conventional substrate processing apparatus 410, since four transfer robots are provided, it is necessary to control each transfer robot individually, which complicates the control mechanism and increases the apparatus cost. There are also problems.

Furthermore, in the conventional substrate processing apparatus 410,
A chemical solution cabinet for storing a processing liquid, gas-liquid separation, or the like cannot be installed inside the apparatus, and must be placed in a different place from the substrate processing apparatus 410.
For this reason, the chemical solution cabinet has a footprint independently of the substrate processing apparatus 410.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and minimizes a footprint, simplifies a control mechanism for transporting between processing units, and further provides an external device such as a CMP apparatus. An object of the present invention is to provide a substrate processing apparatus which can be directly inlined with an apparatus.

[0014]

According to one aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate, comprising: (a) a first process for drying the substrate; A first processing unit group including a drying processing unit and a first cleaning processing unit for cleaning the substrate, wherein the first drying processing unit and the first cleaning processing unit are vertically arranged; b) the first processing unit group is disposed at a predetermined distance from the first processing unit group, and includes a second drying processing unit for drying the substrate, and a second cleaning processing unit for cleaning the substrate; A second processing unit group in which a drying processing unit and a second cleaning processing unit are vertically arranged; and (c) a substrate mounting unit disposed between the first processing unit group and the second processing unit group. (D) a substrate storage unit for arranging a container for accommodating substrates, (e) a container disposed in the substrate storage unit, a first drying unit, a second drying unit, and a substrate mounting unit. Department and And (f) a second transfer mechanism for transferring the substrate to the first processing unit group, the second processing unit group, and the substrate mounting unit. .

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the first transport mechanism includes: (e-1) a storage device disposed in the substrate storage portion and the first drying processing portion. (E-2) transporting the substrate to the storage unit and the substrate mounting unit disposed in the substrate storage unit, and a first transport unit that transports the substrate to the second drying processing unit. A second transport unit.

According to a third aspect of the present invention, there is provided the substrate processing apparatus according to the first or second aspect, further comprising: (g) temporarily storing a substrate taken out of a storage device disposed in the substrate storage portion. The first transport mechanism transports the substrate taken out of the storage device arranged in the substrate storage portion to the buffer portion.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate, comprising: (a) a first drying section for drying the substrate; and a first drying section for cleaning the substrate. A first processing unit group having a cleaning processing unit, wherein the first drying processing unit and the first cleaning processing unit are vertically arranged; and (b) the first processing unit group is separated by a predetermined interval. A second drying section for drying the substrate, and a second cleaning section for cleaning the substrate, wherein the second drying section and the second cleaning section are arranged vertically. (C) a substrate storage unit for arranging a container for accommodating substrates, (d) a container disposed in the substrate storage unit, a first drying processing unit, (E) a first transport mechanism for transporting the substrate to the second drying processing unit;
A second transport mechanism for transporting the substrate to the first processing unit group and the second processing unit group, wherein the first transport mechanism is located at a position between the first processing unit group and the second processing unit group. From the first transfer mechanism to the second transfer mechanism.

According to a fifth aspect of the present invention, in the substrate processing apparatus of the fourth aspect, the first transport mechanism comprises: (d-1) a storage device disposed in the substrate storage portion and the first drying processing portion. (D-2) transporting the substrate to the second transport mechanism and a first transport unit for transporting the substrate to the second drying processing unit; And a second conveying means for performing the operation.

According to a sixth aspect of the present invention, in the substrate processing apparatus of the fourth or fifth aspect, further (f) temporarily storing the substrate taken out of the storage device disposed in the substrate storage portion. The first transport mechanism transports the substrate taken out of the storage device arranged in the substrate storage portion to the buffer portion.

According to a seventh aspect of the present invention, there is provided a substrate processing apparatus according to any one of the first to sixth aspects, wherein
The transfer mechanism is characterized in that the transfer of the substrate with an external device is possible.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <1. Embodiment of Substrate Processing Apparatus>
1 and 2 are views showing a configuration of a substrate processing apparatus 100 according to the present embodiment. 1 is a schematic plan view, and FIG. 2 is a schematic side sectional view on a YZ plane.

Inside the substrate processing apparatus 100 of this embodiment, a first transfer robot TR1 (first transfer mechanism), a second transfer robot TR2 (second transfer mechanism), a first processing unit group MP1, a second processing unit A processing unit group MP2 and a buffer unit 72 are provided.

First processing unit group MP1 and second processing unit group MP2
Are the first transfer robot TR1 and the second transfer robot TR
2 are arranged in the X direction at a predetermined interval so that the substrate can be transported in a horizontal state. The position between the first processing unit group MP1 and the second processing unit group MP2 is determined by the first transfer robot TR1 and the second transfer robot T
This is the transfer position P1 of the substrate with respect to R2. Also, the first
The processing unit group MP1 and the second processing unit group MP2 have a symmetrical structure with respect to a straight line parallel to the Y axis at the transfer position P1, and the first processing unit group MP1 and the second processing unit group MP2 each have a CMP structure. The cleaning / drying process after the process can be performed.

The first transfer robot TR1 is provided with a substrate storage 7
9 (POD) and the first processing unit group MP
1, the second processing unit group MP2, the transfer position P1, and the buffer unit 72, and the substrate W can be transferred between them. Also, the second transfer robot T
R2 is a delivery position P1, a first processing unit group MP1,
A second processing unit group MP2 and a CMP device 20 as an external device;
0, and the substrate can be transported between them.

FIG. 3 is a schematic side view showing the first transfer robot TR1. The first transfer robot TR1 has a double arm structure including two arms in the vertical direction, that is, a first arm 11 and a second arm 12. First
The arm 11 is provided above the second arm 12. The first arm 11 or the second arm 12 performs the bending / extending operation to transfer the substrate W. The first transport robot TR1 vertically moves the substrate (Z) by elevating and lowering the elevating portion 13 provided on the base 14.
In addition to being able to be conveyed in the (axial) direction, it is also possible to perform a rotating operation about the vertical θ1 axis. Therefore, the first arm 11 and the second arm 12
Is capable of accessing a position at a different height position around the first transport robot TR1.

The first transfer robot TR1 has the first arm 11
And the second arm 12, the first arm 11 is dedicated to the transfer of the processed substrate that has been completely cleaned after the CMP process, and the second arm 12 is subject to the CMP process. The transfer of the unprocessed substrate can be exclusively performed. Also in this embodiment, the first arm 11 and the second arm 12 are implemented as described above, and the first arm 11 functions as a first transport unit, and the second arm 12 is It functions as two-transporting means. Therefore, even if particles and the like adhere to the second arm 12 from the unprocessed substrate when the second arm 12 holds the unprocessed substrate, the particles and the like do not adhere to the processed substrate. Also, the first
Since the arm 11 is provided above the second arm 12, the possibility that particles or the like will adhere is further reduced.

On the other hand, the second transfer robot TR2 has a single arm structure unlike the first transfer robot TR1. FIG. 4 is a schematic side view showing the second transport robot TR2. The second transfer robot TR2 has one arm 2
1 is provided. The arm 21 also carries the substrate W by bending and extending. And, like the first transfer robot TR1, the second transfer robot TR2 is
The substrate can be transported in the vertical (Z-axis) direction by extending and retracting the elevating portion 23 provided on the upper side, and a rotation operation about the vertical θ2 axis can be performed. I have. Therefore, the arm 21 can also access a position at a different height position around the second transfer robot TR2.

Hereinafter, the substrate processing apparatus 10 according to this embodiment will be described.
0 will be described in detail.

In the substrate processing apparatus 100 of this embodiment, a pod 9 for storing a plurality of substrates is used as a storage device, and a plurality of substrates to be subjected to the CMP processing are stored in the pod 9.
It is arranged in the substrate storage part 7 in a state sealed inside. Note that two pods 9 are arranged in the substrate storage unit 7 in the X direction, one pod 9 is a pod for a loader in which a plurality of substrates to be subjected to CMP processing are stored, and the other pod 9 is a CMP pod. It becomes a pod for an unloader that stores the substrate W that has been subjected to the cleaning processing after the processing and the CMP processing. In this embodiment, of the two pods 9, the pod 9a will be described as a pod for a loader, and the pod 9b will be described as a pod for an unloader.

The pod 9 is a sealed container for keeping the substrate in a clean atmosphere. The pod 9 is used to take out the substrate W from such a pod 9 or to store the substrate W in the pod 9. Needs to open the pod 9 from the closed state. Therefore, a pod opener 8 is provided in the substrate processing apparatus 100 so that the pod 9 in a sealed state is opened to the inside of the substrate processing apparatus 100. As shown in FIG. 2, a filter fan unit FFU is provided above the substrate processing apparatus 100, and the atmosphere inside the apparatus is kept clean by the downflow of clean air from the filter fan unit FFU. Therefore, even if the pod 9 is opened to the inside of the apparatus, the substrate W is not contaminated, and there is no problem.

When the pod 9 is placed in the substrate storage 7,
As in the state 1a shown in FIG. 2, the pod opener 8 extends the arm to unlock the lid of the pod 9. And
As in the state 1b, the arm moves in the Y direction while holding the lid of the pod 9, and releases the pod 9 from the closed state. Since the substrate W cannot be transported in the state 1b, the pod opener 8 lowers the arm holding the lid as in the state 1c. With such an operation, the closed state of the pod 9 is released, and the first transport robot TR1 can access the pod 9.

Then, by the first transfer robot TR1,
The substrates W stored in the pod 9a are sequentially carried out, and the substrates that have been subjected to the CMP process and the cleaning and drying processes after the CMP process are sequentially stored in the pod 9b.

The first transfer robot TR1 includes the second arm 1
2 is made to access the pod 9a, and after taking out one substrate W, the substrate W is placed at the transfer position P1 between the first processing unit group MP1 and the second processing unit group MP2. The substrate W is placed on the section 82. Then, the second transport robot TR2 receives the substrate W placed on the substrate platform 82 and transports this substrate to the CMP apparatus 200.

FIG. 5 is a diagram for explaining the transfer of the substrate between the first and second transfer robots TR1 and TR2 in the substrate mounting portion 82. As shown in FIG. 5, the second arm 12 of the first transfer robot TR1 places the substrate W on the substrate placement section 82 provided at the transfer position P1. Accordingly, the substrate W is held by the substrate mounting unit 82, and the first transport robot TR1 can shift to the next transport operation. After that, the second transfer robot TR2
The substrate W can be received by allowing the arm 21 to access the substrate mounting portion 82 as shown by the dotted line in FIG. If the transfer of the substrate between the first transfer robot TR1 and the second transfer robot TR2 is performed via the substrate mounting portion 82 in this manner, the transfer operation of the two transfer robots need not be synchronized, which is useful. is there.

The first transfer robot TR1 is provided with a substrate
The substrates W stored in the pod 9a are sequentially transported to the buffer unit 72 until the substrate W placed on the second 2 is taken out by the second transport robot TR2. In addition,
Also at this time, the second arm 12 as the second transfer means also takes out the substrate in the pod 9a and transfers it to the buffer unit 72.

FIG. 6 is a schematic diagram showing the configuration of the buffer section 72. A plurality of shelves 73 are formed inside the buffer section 72, and one shelf 73 is configured to be able to store one substrate W. Then, the first transfer robot TR1 sequentially stores the substrates W from the pod 9a one by one in the buffer unit 72.

The second transfer robot TR2 moves the substrate placing section 82
Out of the substrate W placed on the
Side, the first transfer robot TR1 suspends the transfer of the substrate from the pod 9a to the buffer unit 72,
An operation of mounting the next substrate W on the substrate mounting portion 82 is performed.

Then, the first transfer robot TR1 continues to transfer the substrate from the pod 9a to the buffer section 72 again.

As described above, the first transfer robot TR1 transfers the substrate from the pod 9a to the buffer unit 72, so that the CMP process for each substrate W, the cleaning process after the CMP process, and the like proceed. All the substrates W to be subjected to the CMP processing stored in the pod 9a can be transferred to the buffer unit 72. Therefore, the inside of the pod 9a becomes empty shortly after the start of the substrate processing, and can be replaced with a pod containing a plurality of next substrates W. Then, during the replacement of the pod for the loader, the first transfer robot TR1 sequentially places the substrates W stored in the buffer unit 72 on the substrate mounting unit 82. , And the substrate processing can be continued.

That is, the provision of the buffer section 72 can reduce the operation rate of the substrate processing apparatus 100 even when the number of the pods 9 set in the substrate storage section 7 is two. Absent. Conversely, the buffer unit 7
By providing two, the number of pods 9 to be set in the substrate storage part 7 can be set to two for the loader and for the unloader, and when an indexer for which many pods 9 need to be set is provided. It can be said that there is an effect that the footprint is smaller than that. In the configuration shown in FIG. 1, two buffer units 72 are provided.
Needless to say, the number may be one and may be one, or three or more.

In the CMP apparatus 200, the substrate W transferred by the second transfer robot TR2 is
The MP processing is performed, and the substrate W after the CMP processing is transferred to the second transfer robot TR2 again.

Then, the second transfer robot TR2 transfers the substrate W to one of the first processing unit group MP1 and the second processing unit group MP2.

First processing unit group MP1 and second processing unit group M
P2 has a cleaning processing unit that performs brush cleaning on both surfaces of the substrate W after the CMP processing, and a drying processing unit that performs high-speed spin dry drying after performing brush cleaning and rinsing cleaning on the surface of the substrate. I have.

FIG. 7 is a schematic diagram showing a side cross section of the first processing unit group MP1. As shown in FIG. 7, a cleaning processing unit 30 and a drying processing unit 40 are provided vertically. Here, the drying processing unit 40 is disposed above the cleaning processing unit 30, but since the drying processing unit 40 is a post-process of the cleaning processing unit 30, polishing debris and the like generated from the cleaning processing unit 30 are removed. This is in consideration of reducing the possibility of intrusion into the drying processing unit 40 in the subsequent process.

In the cleaning section 30, particles such as polishing debris adhered to both surfaces of the substrate W by the CMP process are removed by the front brush 31 for cleaning the front surface of the substrate W and the back brush 32 for cleaning the rear surface. At this time, in order to enhance the cleaning effect by the front brush 31 and the back brush 32 as necessary, a predetermined processing liquid may be discharged to the front surface or the back surface of the substrate W.

FIG. 8 is a schematic plan view showing the cleaning processing unit 30 of the first processing unit group MP1. A loading / unloading port 38 for loading / unloading the substrate W to / from the second transport robot TR2 is formed in the cleaning processing unit 30.
Is provided with an opening / closing shutter 38a. The substrate W is
The second transfer robot TR2 transfers the surface brush 31 from the loading / unloading port 38 to a predetermined position inside the cleaning unit 30.
The brush cleaning of both surfaces of the substrate W is performed by the above method. Then, when the cleaning processing in the cleaning processing unit 30 is completed, the substrate W is unloaded again from the loading / unloading port 38 by the second transport robot TR2.

On the other hand, in the drying section 40, first,
Fine particles adhering to the substrate surface are removed using a brush 41 having a higher particle removal ability than the surface brush 31 or the like of the cleaning unit 30. Then, a rinsing liquid such as pure water is supplied from the nozzle 42 to the surface of the substrate W to perform the final rinsing of the substrate W, and then the spin chuck 45 holding the substrate W is rotated at a high speed, whereby the substrate W High speed spin dry drying is performed. That is, in the drying processing unit 40, the brush cleaning and the final rinsing / drying of the substrate surface are realized by one processing unit.

FIG. 9 is a schematic plan view showing the drying processing section 40 of the first processing section group MP1. In the drying section 40, a loading port 48 for loading the substrate W into the second transport robot TR2 is formed, while the first transport robot TR2 is provided.
An outlet 49 for unloading the substrate W is formed on one side. Opening / closing shutters 48a and 49a are provided at the carry-in port 48 and the carry-out port 49, respectively. Then, the cleaning processing unit 30 arranged below the drying processing unit 40
The substrate W having undergone the predetermined cleaning process in the drying process unit 40 from the entrance 48 by the second transfer robot TR2.
The cleaning by the brush 41, the final rinsing, and the high-speed spin-drying are performed while rotating the spin chuck 45 holding the substrate W while being transported to a predetermined position inside. And
When all the processes on the substrate W are completed in the drying processing unit 40, the substrate W is carried out from the carry-out port 49 by the first transfer robot TR1.

As described above, the first processing unit group MP1 has the cleaning processing unit 30 and the drying processing unit 40 inside. FIG. 10 is a schematic perspective view of the first processing unit group MP1. As described above, the second transfer robot T at the position where the cleaning processing unit 30, which is the lower side of the first processing unit group MP1, is provided.
The carry-in / out port 38 is formed only on the R2 side. In addition, at the position where the drying section 40 on the upper side is provided,
A carry-out port 49 and a carry-in port 48 are formed on the transfer robot TR1 side and the second transfer robot TR2 side. Therefore,
The second transfer robot TR2 can access the cleaning unit 30, but the first transfer robot TR1 cannot access the cleaning unit 30.
This is because the second transport robot TR2 is in charge of transporting the substrate in the wet state, so that the first transport robot TR2
This is to prevent the cleaning liquid or the like from adhering to 1. That is, in this embodiment, the second transfer robot TR2 is in charge of transferring a substrate in a wet state, and the first transfer robot TR1 is in charge of transferring a substrate in a dry state.

As described above, the second processing unit group MP2 is connected to the first processing unit group MP1 at the transfer position P1.
It only has a symmetrical structure with respect to a straight line parallel to the axis. Therefore, the internal structure of the second processing unit group MP2 is the same as that of the first processing unit group MP1, and a description thereof will be omitted.

The second transfer robot TR2 is a CMP
By alternately transporting the substrate subjected to the CMP processing by the apparatus 200 to the cleaning processing units of the first processing unit group MP1 and the second processing unit group MP2, the cleaning process after the CMP process can be efficiently performed. It becomes possible.

The first processing unit group MP1 or the second processing unit group MP
Substrates W that have been processed in the drying unit 2 are sequentially taken out by the first transport robot TR1 and transported to the unloader pod 9b. At this time, the first transport robot TR1 moves the first arm 1 as a first transport unit.
In step 1, the substrate W is transferred between the drying unit and the pod 9b. Therefore, particles and the like do not adhere to the substrate processed in the first processing unit group MP1 or the second processing unit group.

As described above, the substrate processing apparatus 10 according to this embodiment
0, the first processing unit group MP1 and the second processing unit group MP
2 can perform the cleaning process and the drying process after the CMP process in parallel, so that the processing efficiency is improved as compared with the conventional substrate processing apparatus, and the substrate transport is performed by the first transport robot TR1 and the second transport. Since the transfer is performed by two transfer robots with the robot TR2, the control mechanism for transferring the substrate can be simplified, and the cost of the apparatus can be reduced. Further, the first processing unit group MP1 and the second processing unit group MP
2, a cleaning processing unit and a drying processing unit are disposed in the up-down direction, and the first transport robot TR1 is configured such that the pod 9 disposed in the substrate storage unit 7 and the drying processing unit of the first processing unit group MP1 ( The first drying processing unit), the drying processing unit (second drying processing unit) of the second processing unit group MP2, and the substrate mounting unit 82 are arranged so as to carry the substrate W, The two-transport robot TR2 includes a first processing unit group MP1 and a second processing unit group MP
Since the substrate W is disposed so as to transfer the substrate W to the substrate mounting portion 82, the footprint of the substrate processing apparatus 100 can be reduced. Furthermore, the fact that the second transfer robot TR2 is configured to be able to directly transfer the substrate W to the CMP apparatus 200, which is an external device, is also effective in reducing the footprint.

As shown in FIG. 1, the substrate processing apparatus 1
00, the + X direction side of the second transfer robot TR2 and -X
An empty space is formed on the direction side and the chemical solution cabinet CB can be arranged in the empty space. Therefore, the chemical solution cabinet CB, which had to be placed separately in the past, can be housed inside the substrate processing apparatus 100, so that the footprint can be further effectively reduced.

<2. Modification> In the above embodiment, the first
When transferring the substrate W between the transfer robot TR1 and the second transfer robot TR2, the substrate W
Has been described, but the transfer of the substrate W is possible without providing the substrate mounting portion 82.

FIG. 11 is a diagram for explaining a case where a substrate is transferred between the first and second transfer robots TR1 and TR2 without providing a substrate mounting portion. As shown in FIG.
The second arm 12 of the first transfer robot TR1 extends with respect to the transfer position P1 while holding the substrate W. In this state, the first transfer robot TR1 waits until the second transfer robot TR2 picks up the substrate W. Then, the second transfer robot TR2 moves the arm 2 below the second arm 12 at the transfer position P1 as shown by a dotted line in FIG.
1 is extended and the arm 21 is raised in that state, so that the second transport robot TR2 becomes the first transport robot TR2.
The substrate W can be directly received from the first arm 13. However, in this case, it is necessary to synchronize the substrate transfer operation between the first transfer robot TR1 and the second transfer robot TR2.

In the above embodiment, the transfer position P1 is determined by the first processing unit group MP1 and the second processing unit group M
Although it is set between P1 and P2, if the transfer position is provided at a height position that does not affect the first processing unit group MP1 and the second processing unit group MP2, the first processing unit group MP1 and the second The distance in the X direction from the processing unit group MP2 can be further reduced, and the footprint of the substrate processing apparatus 100 in the X direction can be reduced. FIG. 12 is a view showing the transfer position in such a case, and the first transfer robot TR
FIG. 4 is a side view of a first processing unit group MP1 and a second processing unit group MP2 viewed from the first side. As shown in FIG. 12, by setting the transfer position to a height position other than the height required by the first processing unit group MP1 and the second processing unit group MP2, for example, an upper position P2 or a lower position P3 , The first processing unit group MP1
It is possible to further reduce the distance d in the X direction between the first processing unit group MP2 and the second processing unit group MP2. As a result, the dimension of the substrate processing apparatus 100 shown in FIG. 1 in the X direction can be further reduced. However, in this case, the first transfer robot TR1 and the second transfer robot TR2 are in a vertical direction (Z) that can access the upper position P2 or the lower position P3.
Direction).

In the above description, the buffer unit 7
2 describes storing the substrate to be subjected to the CMP processing from the pod 9a, but the present invention is not limited to this. For example, the first transport robot TR1 stores the processed substrates obtained from the drying processing units of the first processing unit group MP1 and the second processing unit group MP2 in the unloader pod 9b. When the processed substrates are fully loaded in 9b, it is necessary to replace the pod 9b. The buffer unit 72 may be used as a temporary storage for processed substrates when such a pod 9b is replaced. However, even in this case, it is preferable that the buffer unit for temporarily storing the substrate to be subjected to the CMP process and the buffer unit for temporarily storing the processed substrate be strictly distinguished from the viewpoint of reducing particle adhesion and the like.

Further, in the above description, the second transfer robot TR2 has been described as having a single-arm structure. However, the present invention is not limited to this, and it goes without saying that the second transfer robot TR2 may have a double-arm structure. In this case, 2
It is conceivable that, of the two arms, the arm arranged on the upper side is responsible for transporting the substrate after the CMP processing, and the arm arranged on the lower side is responsible for transporting the substrate before the CMP processing.

[0060]

As described above, according to the first aspect of the present invention, the first drying section and the first drying section are included in the first processing section group.
And a second drying section and a second cleaning section in the second processing section group, and a first transport mechanism in the substrate storage section. The first storage unit, the first drying processing unit, the second drying processing unit, and the substrate mounting unit are arranged so as to transfer the substrate, and the second transfer mechanism is connected to the first processing unit group and the second processing unit group. Since the configuration is such that the substrate is transported to the processing unit group and the substrate mounting unit, the footprint of the substrate processing apparatus can be minimized. Further, since the substrate is transported by the first transport mechanism and the second transport mechanism, the control mechanism for transporting the substrate can be simplified.

According to the second aspect of the present invention, the first transport mechanism transports the substrate to the storage device disposed in the substrate storage portion, the first drying processing portion, and the second drying processing portion. And a second transporting means for transporting the substrate to the storage device and the substrate mounting part disposed in the substrate storage part, so that the substrate transported by the second transporting means First
The possibility that particles or the like will adhere to the substrate transported by the transport unit is reduced.

According to the third aspect of the present invention, since the first transport mechanism transports the substrate taken out of the storage device arranged in the substrate storage portion to the buffer portion, the operation rate of the substrate processing apparatus is reduced. Therefore, the number of storage units arranged in the substrate storage unit can be reduced, and the footprint can be reduced.

According to the fourth aspect of the present invention, the first drying processing section and the first cleaning processing section are vertically arranged in the first processing section group, and the second drying processing section and the second cleaning processing section are arranged in the second processing section group. The drying processing section and the second cleaning processing section are arranged in the vertical direction, and the first transport mechanism is moved to the storage device disposed in the substrate storage section and to the first drying processing section and the second drying processing section. The second transport mechanism is arranged to transport the substrate to the first processing unit group and the second processing unit group, and the first processing unit group and the second Since the transfer of the substrate from the first transfer mechanism to the second transfer mechanism is performed at a position between the processing units, the footprint of the substrate processing apparatus can be minimized.

According to the fifth aspect of the present invention, the first transport mechanism transports the substrate to the storage device disposed in the substrate storage portion, the first drying processing portion, and the second drying processing portion. And a second transport unit for transporting the substrate to the storage unit and the second transport mechanism disposed in the substrate storage unit, so that the substrate transported by the second transport unit is The possibility that particles or the like will adhere to the substrate transported by the first transport unit is reduced.

According to the sixth aspect of the present invention, since the first transport mechanism transports the substrate taken out of the storage device disposed in the substrate storage portion to the buffer portion, the operation rate of the substrate processing apparatus is reduced. Therefore, the number of storage units arranged in the substrate storage unit can be reduced, and the footprint can be reduced.

According to the seventh aspect of the present invention, since the second transfer mechanism can transfer the substrate to and from the external device, the external device can be directly inlined into the substrate processing apparatus, and Footprint can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic side sectional view showing a configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 3 is a schematic side view showing a first transfer robot.

FIG. 4 is a schematic side view showing a second transfer robot.

FIG. 5 is a diagram illustrating the transfer of a substrate between first and second transfer robots in a substrate mounting unit.

FIG. 6 is a schematic diagram showing a configuration of a buffer unit 72.

FIG. 7 is a schematic diagram illustrating a side cross section of a first processing unit group.

FIG. 8 is a schematic plan view showing a cleaning processing unit of the first processing unit group.

FIG. 9 is a schematic plan view illustrating a drying processing unit of a first processing unit group.

FIG. 10 is a schematic perspective view of a first processing unit group.

FIG. 11 is a diagram illustrating a case in which a substrate is transferred between first and second transfer robots.

FIG. 12 shows a first processing unit group and a second processing unit group from the first transfer robot side.
It is a side view which shows an example of the delivery position which saw the processing part group.

FIG. 13 is a schematic view showing a conventional substrate processing apparatus.

FIG. 14 is a schematic diagram showing a configuration when a conventional substrate processing apparatus is inlined with a CMP apparatus.

[Explanation of symbols]

 7 Substrate storage unit 9 (9a, 9b) Pod (storage device) 11 First arm (first transfer unit) 12 Second arm (second transfer unit) 30 Cleaning unit 40 Drying unit 72 Buffer unit 82 Substrate placement Unit 100 Substrate processing apparatus 200 CMP apparatus MP1 First processing unit group MP2 Second processing unit group P1, P2, P3 Delivery position TR1 First transfer robot (first transfer mechanism) TR2 Second transfer robot (second transfer mechanism) W substrate

Claims (7)

[Claims] 1. A substrate processing apparatus for performing predetermined processing on a substrate, comprising: (a) a first drying processing unit for drying a substrate; and a first cleaning processing unit for cleaning the substrate. A first drying processing unit and a first cleaning processing unit, wherein the first drying processing unit and the first cleaning processing unit are vertically arranged.
A processing unit group, (b) the first processing unit group is arranged at a predetermined interval, and a second drying processing unit for drying the substrate, and a second cleaning processing unit for cleaning the substrate Wherein the second drying processing unit and the second cleaning processing unit are vertically arranged.
A processing unit group; (c) a substrate mounting unit disposed between the first processing unit group and the second processing unit group; and (d) a substrate storage for arranging a storage device for storing a substrate. And (e) a first transfer for transferring a substrate to the storage device disposed in the substrate storage unit, the first drying processing unit, the second drying processing unit, and the substrate mounting unit. And (f) a second transport mechanism for transporting the substrate to the first processing unit group, the second processing unit group, and the substrate mounting unit. apparatus. 2. The substrate processing apparatus according to claim 1, wherein the first transport mechanism includes: (e-1) a storage device disposed in the substrate storage portion, the first drying processing portion, and the second drying device. (E-2) a first transfer unit that transfers the substrate to the storage unit disposed in the substrate storage unit and the substrate mounting unit; A substrate processing apparatus, comprising: two transfer units. 3. The substrate processing apparatus according to claim 1, further comprising: (g) a buffer unit for temporarily storing a substrate taken out of a storage device arranged in the substrate storage unit. The substrate processing apparatus, wherein the first transport mechanism transports a substrate taken out of a storage device arranged in the substrate storage unit to the buffer unit. 4. A substrate processing apparatus for performing a predetermined processing on a substrate, comprising: (a) a first drying processing unit for drying a substrate; and a first cleaning processing unit for cleaning the substrate. A first drying processing unit and a first cleaning processing unit, wherein the first drying processing unit and the first cleaning processing unit are vertically arranged.
A processing unit group, (b) the first processing unit group is arranged at a predetermined interval, and a second drying processing unit for drying the substrate, and a second cleaning processing unit for cleaning the substrate Wherein the second drying processing unit and the second cleaning processing unit are vertically arranged.
A processing unit group, (c) a substrate storage unit for arranging a storage container for storing a substrate, (d) a storage unit disposed in the substrate storage unit, the first drying processing unit, and the second A first transport mechanism that transports the substrate to the drying processing unit; and (e) a second transport mechanism that transports the substrate to the first processing unit group and the second processing unit group. A substrate processing apparatus, comprising: transporting a substrate from the first transport mechanism to the second transport mechanism at a position between the first processing unit group and the second processing unit group. 5. The substrate processing apparatus according to claim 4, wherein the first transport mechanism includes: (d-1) a container disposed in the substrate container, the first drying unit, and the second drying unit. (D-2) a first transfer unit that transfers a substrate to the storage unit disposed in the substrate storage unit and the second transfer mechanism. A substrate processing apparatus, comprising: two transfer units. 6. The substrate processing apparatus according to claim 4, further comprising: (f) a buffer unit for temporarily storing a substrate taken out of a storage device disposed in the substrate storage unit. The substrate processing apparatus, wherein the first transport mechanism transports a substrate taken out of a storage device arranged in the substrate storage unit to the buffer unit. 7. The substrate processing apparatus according to claim 1, wherein the second transport mechanism is capable of transporting the substrate to and from an external device.