JPH1131717A - Semiconductor chip and display device equipped with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the area of a frame part surrounding a display region when directly loading a semiconductor chip, constituted of an LSI chip for driving a display panel on the substrate of the display panel. SOLUTION: Plural input side terminals 5 are provided at the lower side, and plural output side terminals 6 are provided at the upper side of a width directional central part in a rectangular semiconductor chip mount area 4 on the upper face of a protruding part 2a which protrudes from an upper side transparent substrate 3 of a lower side transparent substrate 2 of a liquid crystal display panel 1. In this case, a rectangular semiconductor chip is constituted, so that plural input side bump electrode can be provided at the lower side, and plural output side bump electrodes can be provided at the upper side of the width directional central part on the lower face. As a result, an input side wiring 8 and an output side wiring 9 can be arranged in the semiconductor chip mount area 4, and protruding length L of the projecting part 2a can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rectangular semiconductor chip and a display device having the semiconductor chip mounted directly on a substrate.

[0002]

2. Description of the Related Art For example, there is a liquid crystal display device in which a semiconductor chip such as an LSI chip for driving a liquid crystal display panel is directly mounted on a transparent substrate made of glass or the like of the liquid crystal display panel. FIG. 7 shows a plan view of an example of such a conventional liquid crystal display device, and FIG. 8 shows the liquid crystal display panel. This liquid crystal display device includes a liquid crystal display panel 1 and a semiconductor chip 11. The liquid crystal display panel 1 has a liquid crystal (not shown) sealed between two transparent substrates 2 and 3 made of glass or the like. In this case, the lower side of the lower transparent substrate 2 in the drawing protrudes from the lower side of the upper transparent substrate 3. A predetermined portion on the upper surface of the protruding portion 2a is a rectangular semiconductor chip mounting area 4 as shown by a dashed line in FIG. That is, a COG (chip on glass) mounting method in which the semiconductor chip 11 is directly mounted on the lower transparent substrate 2 is adopted. A plurality of input connection terminals 5 are provided at the lower end in the width direction in the semiconductor chip mounting area 4, and a plurality of output connection terminals 6 are provided at the upper end in the width direction and both ends in the longitudinal direction. On the upper surface of the protruding end of the protruding portion 2 a of the lower transparent substrate 2, a plurality of external connection terminals 7 are located at positions closer to both sides of the substrate than the semiconductor chip mounting area 4.
Is provided. A plurality of input-side lead wires 8 and output-side connection terminals 6 for connecting the input-side connection terminals 5 and the external connection terminals 7 are provided at predetermined positions on the upper surface of the protruding portion 2 a outside the semiconductor chip mounting area 4. A plurality of output-side lead-out lines 9 (partially not shown) are provided.

The semiconductor chip 11 is generally called a slim chip. As shown in FIG. 9, a plurality of input-side bump electrodes 13 are provided at the lower end in the width direction of the lower surface of a rectangular semiconductor chip body 12. A plurality of output-side bump electrodes 14 are provided at the upper end in the width direction and both ends in the longitudinal direction. Then, the input-side bump electrode 13 and the output-side bump electrode 14 of the semiconductor chip 11 are connected to the input-side connection terminal 5 and the output-side connection terminal 6 of the protruding portion 2 a of the lower transparent substrate 2 via the anisotropic conductive adhesive 21. As a result, the semiconductor chip 11 is mounted on the semiconductor chip mounting area 4 of the protrusion 2a.

[0004]

However, in such a conventional liquid crystal display device, a plurality of input-side bump electrodes 13 are provided at the lower end in the width direction of the lower surface of the semiconductor chip body 12, so that A plurality of input-side connection terminals 5 are provided at the lower end in the width direction in the semiconductor chip mounting area 4, and a plurality of output-side bump electrodes 14 are provided at both ends in the longitudinal direction of the lower surface of the semiconductor chip body 12. Since the plurality of output-side connection terminals 6 are provided at both ends in the longitudinal direction in the semiconductor chip mounting area 4, the width of the semiconductor chip mounting area 4 is required to route the plurality of input-side wiring lines 8 without causing a short circuit. A plurality of input-side routing lines 8 are arranged between the lower end edge in the direction and the protruding end edge of the protruding portion 2a, so that the protruding length L of the protruding portion 2a increases. Further, in response to the provision of the plurality of output-side bump electrodes 14 at the upper end in the width direction of the lower surface of the semiconductor chip body 12, the plurality of output-side connection terminals 6 are provided at the upper end in the width direction within the semiconductor chip mounting area 4. In consideration of the arrangement space of the plurality of output-side lead-out lines 9, the distance between the upper edge of the semiconductor chip mounting area 4 in the width direction and the base edge of the protrusion 2 a (the lower side of the upper transparent substrate 3) is considered. Requires a certain amount of space, which also increases the protruding length L of the protruding portion 2a. Thus, the protrusion length L of the protrusion 2a
Means that the area of the peripheral non-display area surrounding the display area, that is, the so-called frame area, increases, and the ratio of the display area to the entire liquid crystal display panel 1 decreases, and as a result, the liquid crystal display panel However, there is a problem that the size of the device 1 is increased. An object of the present invention is to reduce the area of a frame portion of a display panel.

[0005]

According to a first aspect of the present invention, there is provided a semiconductor chip in which a plurality of bump electrodes are provided on a predetermined surface of a rectangular semiconductor chip body except at least one end in a width direction. is there. According to a fourth aspect of the present invention, in the display device, a semiconductor chip provided with a plurality of bump electrodes on a predetermined surface of a rectangular semiconductor chip body except at least one end in a width direction is directly mounted on a substrate of a display panel. It was done.

According to the first or fourth aspect of the present invention, at least one end in the width direction and both ends in the longitudinal direction of the predetermined surface of the rectangular semiconductor chip main body (provided that at least the center portion in the width direction of both ends in the longitudinal direction is removed). Since no bump electrode is provided, a wiring line can be arranged in the semiconductor chip mounting area of the display panel corresponding to a portion where the bump electrode is not provided, and as a result, a frame portion surrounding the display area can be formed. The area can be reduced and the size of the display panel can be reduced.

[0007]

FIG. 1 is a plan view of a liquid crystal display device according to a first embodiment of the present invention, FIG. 2 is a plan view of the liquid crystal display panel, and FIG. 3 is a plan view of the semiconductor chip. It is shown. In these figures, FIGS.
The same parts as those in FIG. 9 are denoted by the same reference numerals, and description thereof will be omitted as appropriate. First, as shown in FIG. 3, the semiconductor chip 11 has bump electrodes 13, 14 on the lower surface of the rectangular semiconductor chip body 12 except at least one end in the width direction.
Is provided. Here, the width direction end portion of the semiconductor chip body 12 refers to a region in which the width of one bump electrode enters from the width direction end. The present embodiment has a structure in which a plurality of input-side bump electrodes 13 are provided below the widthwise central portion of the lower surface of the semiconductor chip body 12, and a plurality of output-side bump electrodes 14 are provided above. .

[0010] Next, as shown in FIG. 2, the upper part of the protruding portion 2 a of the transparent substrate 2 below the liquid crystal display panel 1 is located below the center in the width direction in the rectangular semiconductor chip mounting area 4. A plurality of input side connection terminals 5 are provided, and a plurality of output side connection terminals 6 are provided on the upper side. A plurality of external connection terminals 7 are provided on the upper surface of the protruding end of the protruding portion 2 a on both outer sides in the longitudinal direction of the semiconductor chip mounting area 4. A plurality of input-side lead wires 8 and an output-side connection terminal 6 for connecting the input-side connection terminal 5 and the external connection terminal 7 are provided at predetermined positions inside and outside the semiconductor chip mounting area 4 on the upper surface of the protrusion 2a. Are provided.

That is, the input-side lead-out line 8 extending from the input-side connection terminal 5 is routed in substantially the lower half of the semiconductor-chip mounting area 4 and then, from both ends in the longitudinal direction of the semiconductor-chip mounting area 4, to the semiconductor chip mounting area. Area 4
It is routed outside and connected to the external connection terminal 7. On the other hand, an output-side lead wire 9 extending from the output-side connection terminal 6
Is drawn around substantially the upper half of the semiconductor chip mounting area 4, and then from the semiconductor chip mounting area 4 to both ends in the longitudinal direction and the upper end in the width direction.
It is routed outside.

As shown in FIG. 1, an input bump electrode 13 and an output bump electrode 14 of the semiconductor chip 11 are formed.
Are bonded to the input side connection terminals 5 and the output side connection terminals 6 of the protruding portion 2a of the lower transparent substrate 2 via the anisotropic conductive adhesive 21, so that the semiconductor chip 11
a directly mounted on the semiconductor chip mounting area 4, ie, CO
G is installed. In this case, the plurality of input-side bump electrodes 13 and the plurality of output-side bump electrodes 14 are provided in two rows at the center of the lower surface of the semiconductor chip body 12 in the width direction.
The width of the anisotropic conductive adhesive 21 is smaller than the width of the semiconductor chip 11, and the length is larger than the length of the semiconductor chip 11.

As described above, in this liquid crystal display device, the semiconductor chip mounting area 4 corresponds to the provision of the plurality of input-side bump electrodes 13 below the center of the lower surface of the semiconductor chip body 12 in the width direction. A plurality of input-side connection terminals 5 are provided below the central portion in the width direction, and the lower end portion in the width direction and both ends in the longitudinal direction in the semiconductor chip mounting area 4 (excluding the central portions in the width direction at both ends in the longitudinal direction). .), No input terminal is provided, so that the input-side lead-out line 8 can be arranged substantially in the lower half of the semiconductor chip mounting area 4. That is, as described above, after the input-side lead wire 8 extending from the input-side connection terminal 5 is routed in substantially the lower half of the semiconductor chip mounting area 4, the semiconductor chip mounting line 4 is extended from both longitudinal edges of the semiconductor chip mounting area 4. It can be routed outside the area 4 and connected to the external connection terminal 7.
As a result, it is not necessary to arrange the input-side lead-out line 8 between the widthwise lower edge of the semiconductor chip mounting area 4 and the protruding edge of the protruding portion 2a, and the interval therebetween can be made as small as possible. Therefore, the protruding length L of the protruding portion 2a can be reduced by that much, and the area of the frame portion can be reduced, and the miniaturization of the liquid crystal display panel 1 can be promoted.

In response to the provision of the plurality of output-side bump electrodes 14 above the widthwise central portion of the lower surface of the semiconductor chip main body 12, the upper portion of the semiconductor chip mounting area 4 above the widthwise central portion is provided. A plurality of output side connection terminals 6 on the side,
Since connection terminals are not provided at the upper end in the width direction and both ends in the longitudinal direction (except for the center portion in the width direction of both ends in the longitudinal direction) in the semiconductor chip mounting area 4, the upper end in the semiconductor chip mounting area 4 is almost completely disposed. An output-side lead wire 9 can be arranged in half. That is, as described above, after the output-side lead-out line 9 extending from the output-side connection terminal 6 is routed in substantially the upper half of the semiconductor chip mounting area 4, both ends in the longitudinal direction and the upper end in the width direction of the semiconductor chip mounting area 4 are set. Can be routed outside the semiconductor chip mounting area 4. As a result, the semiconductor chip mounting area 4 can be set even in consideration of the arrangement space of the plurality of output-side lead wires 9.
The distance between the upper edge of the projection 2a in the width direction and the base edge of the projection 2a (the lower side of the upper transparent substrate 3) can be made as small as possible, so that the projection length L of the projection 2a is reduced accordingly. The size of the frame portion can be reduced by reducing the size of the frame portion, and the size of the liquid crystal display panel 1 can be further reduced.

In addition, in this liquid crystal display device, a bump electrode 13 is provided at the center of the lower surface of the semiconductor chip body 12 in the width direction.
The provision of 14 makes it relatively less susceptible to external noise. In addition, a bump electrode 13 is provided at the center of the lower surface of the semiconductor chip body 12 in the width direction.
14, the bump electrodes 13, 1
When 4 is formed by electroplating of gold or the like, it is possible to make the deposition of gold plating less likely to vary,
As a result, it is possible to make it difficult for the height of the bump electrodes 13 and 14 to vary. In addition, the semiconductor chip 1
When the semiconductor chip 11 is mounted (bonded) on the semiconductor chip mounting area 4, the semiconductor chip 11 is mounted on the upper surface of the protruding portion 2 a of the lower transparent substrate 2 via the anisotropic conductive adhesive 21 as shown in FIG. The semiconductor chip main body 12 is placed and then subjected to thermocompression bonding. However, since the bump electrodes 13 and 14 are provided only at the center of the lower surface of the semiconductor chip body 12 in the width direction, the thermocompression bonding of the thermocompression head 22 is performed. Even if the parallelism of the surface 22a is somewhat poor, good bonding can be achieved.
Further, the width of the anisotropic conductive adhesive 21 is
Is smaller than the width, the bump electrodes 13 and 14 can be connected to the connection terminals 5 and 6, so that the amount of the anisotropic conductive adhesive 21 used can be reduced.

FIG. 5 is a plan view of a liquid crystal display device according to a second embodiment of the present invention. In this figure, the same parts as those in FIG.
The description is omitted as appropriate. The second embodiment differs from the first embodiment in that the input-side bump electrodes 13 of the semiconductor chip 11 are provided at the lower end in the width direction of the lower surface of the semiconductor chip body 12 and the input-side connection terminals of the liquid crystal display panel 1 are provided. 5 is provided at the lower end in the width direction in the semiconductor chip mounting area 4. Also in this case, after the input-side lead-out line 8 extending from the input-side connection terminal 5 is routed in substantially the lower half of the semiconductor chip mounting area 4, the semiconductor chip mounting area 4 is extended from both longitudinal edges of the semiconductor chip mounting area 4. 4 and can be connected to the external connection terminal 7 by being routed outside. Therefore, also in this case, it is not necessary to arrange the input-side lead-out line 8 between the widthwise lower edge of the semiconductor chip mounting area 4 and the protruding edge of the protruding portion 2a, and the interval therebetween is made as small as possible. Therefore, the projection length L of the protruding portion 2a can be reduced by that amount, and the frame portion can be reduced, and the liquid crystal display panel 1
Can be reduced in size.

The bump electrode 1 of the semiconductor chip 11
When the number of the electrodes 3 and 14 is small, as in the third embodiment shown in FIG. 6, the bump electrodes 13 and 14 are arranged in a line at the center of the lower surface of the semiconductor chip body 12 in the width direction.
The connection terminals 5 and 6 may be arranged in a line at the center in the width direction in the semiconductor chip mounting area 4. in this case,
For example, the input-side bump electrodes 13 may be arranged on both sides in the longitudinal direction of the lower surface of the semiconductor chip body 12, and the output-side bump electrodes 14 may be arranged at the center.

[0016]

As described above, according to the first or fourth aspect,
According to the invention described above, bump electrodes are provided on at least one end in the width direction and both ends in the longitudinal direction (excluding at least the center in the width direction of both ends in the longitudinal direction) on the predetermined surface of the rectangular semiconductor chip body. Therefore, a routing line can be arranged in the semiconductor chip mounting area of the display panel corresponding to the portion where the bump electrode is not provided,
As a result, the frame portion of the display panel can be made smaller and the size of the display panel can be reduced. According to the third or sixth aspect of the present invention, the other end in the width direction and both ends in the longitudinal direction of the predetermined surface of the rectangular semiconductor chip body (however,
Excluding the center in the width direction at both ends in the longitudinal direction. Since the bump electrodes are not provided in (1), the routing lines can be arranged in the semiconductor chip mounting area of the display panel corresponding to the portion where the bump electrodes are not provided, and as a result, the display panel can be downsized. .

[Brief description of the drawings]

FIG. 1 is a plan view of a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a plan view of the liquid crystal display panel shown in FIG.

FIG. 3 is a plan view of the semiconductor chip shown in FIG. 1;

4 is a cross-sectional view for explaining a case where a semiconductor chip is mounted on a liquid crystal display panel in the liquid crystal display device shown in FIG.

FIG. 5 is a plan view of a liquid crystal display device according to a second embodiment of the present invention.

FIG. 6 is a plan view of a liquid crystal display device according to a third embodiment of the present invention.

FIG. 7 is a plan view of an example of a conventional liquid crystal display device.

8 is a plan view of the liquid crystal display panel shown in FIG.

FIG. 9 is a plan view of the semiconductor chip shown in FIG. 7;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 4 Semiconductor chip mounting area 5 Input side connection terminal 6 Output side connection terminal 7 External connection terminal 8 Input side lead wire 9 Output side lead wire 11 Semiconductor chip 12 Semiconductor chip body 13 Input side bump electrode 14 Output side bump electrode 21 Anisotropic conductive adhesive

Claims (6)

[Claims] 1. A semiconductor chip, wherein a plurality of bump electrodes are provided on at least a portion of a predetermined surface of a rectangular semiconductor chip body except one end in a width direction. 2. The semiconductor chip according to claim 1, wherein the plurality of bump electrodes are arranged in one or two rows at a central portion in a width direction of a predetermined surface of the semiconductor chip body. . 3. The semiconductor device according to claim 1, wherein the plurality of bump electrodes are provided at a predetermined one end portion in a width direction of a predetermined surface of the semiconductor chip body and a center portion in the width direction. Semiconductor chip. 4. A semiconductor chip having a plurality of bump electrodes provided at least on a predetermined surface of a rectangular semiconductor chip main body except at least one end in the width direction is directly mounted on a substrate of a display panel. Display device. 5. The display device according to claim 4, wherein the plurality of bump electrodes are arranged in one or two rows at a central portion in a width direction of a predetermined surface of the semiconductor chip body. . 6. The invention according to claim 4, wherein the plurality of bump electrodes are provided at a predetermined one end portion in a width direction of a predetermined surface of the semiconductor chip body and a center portion in the width direction. Display device.