JPH11268181A - Copper-clad laminate - Google Patents
Copper-clad laminateInfo
- Publication number
- JPH11268181A JPH11268181A JP10073955A JP7395598A JPH11268181A JP H11268181 A JPH11268181 A JP H11268181A JP 10073955 A JP10073955 A JP 10073955A JP 7395598 A JP7395598 A JP 7395598A JP H11268181 A JPH11268181 A JP H11268181A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- prepreg
- copper foil
- prepregs
- outer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 59
- 239000011889 copper foil Substances 0.000 claims abstract description 50
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004745 nonwoven fabric Substances 0.000 abstract description 3
- 239000003365 glass fiber Substances 0.000 abstract description 2
- 239000012209 synthetic fiber Substances 0.000 abstract description 2
- 229920002994 synthetic fiber Polymers 0.000 abstract description 2
- 239000002759 woven fabric Substances 0.000 abstract description 2
- 239000011888 foil Substances 0.000 abstract 3
- 241001424392 Lucia limbaria Species 0.000 abstract 1
- 239000002966 varnish Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板用
として使用される銅張り積層板に関する。[0001] The present invention relates to a copper-clad laminate used for printed wiring boards.
【０００２】[0002]
【従来の技術】銅張り積層板は、通常、長尺帯状の繊維
質基材に、熱硬化性樹脂を有機溶剤で希釈した樹脂ワニ
スを含浸した後、乾燥炉で溶剤を揮発させて、熱硬化性
樹脂を半硬化状態とすることによって製造された半硬化
状のプリプレグと、銅箔とを重ね、加熱・加圧して積層
一体化して製造されている。2. Description of the Related Art Generally, a copper-clad laminate is prepared by impregnating a long strip-shaped fibrous base material with a resin varnish obtained by diluting a thermosetting resin with an organic solvent and then evaporating the solvent in a drying oven. A semi-cured prepreg produced by setting a curable resin into a semi-cured state is superimposed on a copper foil, and heated and pressed to be laminated and integrated.
【０００３】[0003]
【発明が解決しようとする課題】近年では、片面銅張り
積層板や表裏で厚さの異なる銅箔を用いた銅張り積層板
が用いられており、それらを用いた内層回路板やプリン
ト配線板に、そりが発生し、プリント配線板の製造やプ
リント配線板に部品を自動的に実装する上で障害となっ
ている。また、両面の銅箔厚さが同じ銅張り積層板を使
用しても、表裏で残銅率が著しく異なるプリント配線板
を製造する場合にも、そりが発生し、手作業によるそり
の修正や、荷重を掛けた状態で加熱するそりの修正が行
われている。In recent years, single-sided copper-clad laminates and copper-clad laminates using copper foils having different thicknesses on the front and back sides have been used, and inner-layer circuit boards and printed wiring boards using them have been used. In addition, warpage occurs, which is an obstacle in manufacturing a printed wiring board and automatically mounting components on the printed wiring board. In addition, even if a copper-clad laminate with the same copper foil thickness on both sides is used, warpage occurs even when manufacturing printed wiring boards with significantly different residual copper ratios on the front and back sides, Correction has been made to warpage in which heating is performed under a load.
【０００４】本発明は、そりの少ない銅張り積層板を提
供することを目的とする。[0004] It is an object of the present invention to provide a copper-clad laminate with less warpage.
【０００５】[0005]
【課題を解決するための手段】本発明の銅張り積層板
は、厚さ方向に異なる収縮率のプリプレグを層状に有す
ることを特徴とする。The copper-clad laminate of the present invention is characterized in that it has prepregs having different shrinkage rates in the thickness direction in layers.
【０００６】このような構造の銅張り積層板としては、
一方の外層から、銅箔／収縮率の小さいプリプレグの順
に形成され、他方の外層から、収縮率の大きいプリプレ
グが形成されているものである。As a copper-clad laminate having such a structure,
From one outer layer, a copper foil / prepreg having a small shrinkage is formed in this order, and from the other outer layer, a prepreg having a large shrinkage is formed.
【０００７】また、一方の外層から、第１の銅箔／収縮
率の小さいプリプレグの順に形成され、他方の外層か
ら、第２の銅箔／収縮率の大きいプリプレグの順に形成
され、第１の銅箔の厚さが第２の銅箔の厚さより厚い構
造であってもよい。Further, one of the outer layers is formed in the order of the first copper foil / prepreg having a small shrinkage, and the other outer layer is formed in the order of the second copper foil / prepreg having a large shrinkage. The structure may be such that the thickness of the copper foil is greater than the thickness of the second copper foil.
【０００８】また、一方の外層から、第１の銅箔／収縮
率の小さいプリプレグの順に形成され、他方の外層か
ら、第２の銅箔／収縮率の大きいプリプレグの順に形成
され、第１の銅箔と第２の銅箔の厚さはほぼ同じである
が、それぞれの銅箔の不要な箇所をエッチング除去して
回路を形成したときに、第１の銅箔による回路導体の残
り面積が第２の銅箔による回路導体の残り面積より大き
くなるように使用されるものであってもい。Further, one of the outer layers is formed in the order of first copper foil / prepreg having a small shrinkage, and the other outer layer is formed in the order of second copper foil / prepreg having a large shrinkage. Although the thicknesses of the copper foil and the second copper foil are almost the same, when the unnecessary portions of each copper foil are removed by etching to form a circuit, the remaining area of the circuit conductor of the first copper foil is reduced. The second copper foil may be used so as to be larger than the remaining area of the circuit conductor.
【０００９】すなわち、本発明の銅張り積層板は、銅箔
量の少ない面あるいは、銅箔の無い面に、銅箔量の多い
面に配置するプリプレグより収縮率の大きなプリプレグ
を配置することであるということもできる。That is, the copper-clad laminate of the present invention can be obtained by arranging a prepreg having a larger shrinkage rate than a prepreg arranged on a surface having a large amount of copper foil on a surface having a small amount of copper foil or a surface having no copper foil. It can be said that there is.
【００１０】[0010]
【発明の実施の形態】本発明のプリプレグに使用する樹
脂には、エポキシ樹脂、フェノール樹脂、ポリエステル
樹脂等の一般的に積層板に使用する樹脂が使用できる。
この樹脂を、ガラス繊維、合成繊維等の織布あるいは、
不織布に含浸乾燥してプリプレグとし、このプリプレグ
を２枚以上重ね合わせその片側あるいは、両側に銅箔を
配置し加熱加圧して銅張積層板を作製する。この時に、
薄い銅箔を使用する面、あるいは銅箔厚が同じでもプリ
ント配線板に加工後、残銅率が小さくなる面の最外層
に、収縮率の大きなプリプレグを配置する。BEST MODE FOR CARRYING OUT THE INVENTION As the resin used for the prepreg of the present invention, epoxy resins, phenol resins, polyester resins, and other resins generally used for laminated boards can be used.
This resin, woven fabric such as glass fiber, synthetic fiber, or
A non-woven fabric is impregnated and dried to form a prepreg, and two or more prepregs are laminated, and a copper foil is placed on one or both sides thereof and heated and pressed to produce a copper-clad laminate. At this time,
A prepreg having a large shrinkage ratio is disposed on the outermost layer on the surface where a thin copper foil is used or on the surface where the residual copper ratio is reduced after processing into a printed wiring board even if the copper foil thickness is the same.
【００１１】プリプレグの収縮率は、樹脂分、基材の織
り密度、繊維径、あるいは基材の種類等により差をつけ
ることができる。The contraction rate of the prepreg can be varied depending on the resin content, the woven density of the substrate, the fiber diameter, the type of the substrate, and the like.
【００１２】[0012]
【実施例】・プリプレグＡの調整 ブロム化エポキシ樹脂（エポキシ当量４８０）１００重
量部、ジシアンジアミド３重量部、２−エチル−４−メ
チルイミダゾール０．１７重量部、エチレングリコール
モノメチルエーテル２５重量部、およびＮ，Ｎジメチル
ホルムアミド２５重量部を混合し、ワニスを調整し、ガ
ラスクロス（２１１６タイプ、厚さ０．１ｍｍ）に樹脂
分５０重量％になるように含浸、乾燥し、半硬化状とし
た。 ・プリプレグＢの調整 プリプレグＡに使用した樹脂ワニスを、プリプレグＡと
同じガラスクロスに樹脂分４２重量％になるように含
浸、乾燥し、半硬化状とした。 ・プリプレグＣの調整 プリプレグＡに使用した樹脂ワニスを、ガラスクロス
（７６２８タイプ、厚さ０．２ｍｍ）に樹脂分４２重量
％になるように含浸、乾燥し、半硬化状とした。 ・プリプレグＤの調整 プリプレグＡに使用した樹脂ワニスに水酸化アルミニウ
ム（平均粒径１０μｍ）９０重量部、を混合しワニスを
調整し、坪量５０ｇ／ｍ2のガラス不織布に樹脂分８５
重量％になるように含浸、乾燥し、半硬化状とした。こ
の結果、プリプレグ単体では、収縮率が、小さい方か
ら、プリプレグＣ＜プリプレグＢ＜プリプレグＡ＜プリ
プレグＤの順となっていた。EXAMPLES Preparation of Prepreg A 100 parts by weight of a brominated epoxy resin (epoxy equivalent: 480), 3 parts by weight of dicyandiamide, 0.17 parts by weight of 2-ethyl-4-methylimidazole, 25 parts by weight of ethylene glycol monomethyl ether, and A varnish was prepared by mixing 25 parts by weight of N, N dimethylformamide, and impregnated in a glass cloth (2116 type, 0.1 mm in thickness) so that the resin content was 50% by weight, dried, and semi-cured. Preparation of prepreg B The resin varnish used for prepreg A was impregnated into the same glass cloth as prepreg A so as to have a resin content of 42% by weight, and dried to obtain a semi-cured state. -Adjustment of prepreg C The resin varnish used for prepreg A was impregnated into a glass cloth (7628 type, 0.2 mm in thickness) so that the resin content was 42% by weight, and dried to obtain a semi-cured state. Preparation of prepreg D 90 parts by weight of aluminum hydroxide (average particle size: 10 μm) was mixed with the resin varnish used for prepreg A to prepare a varnish, and a resin content of 85 g / m 2 in a glass nonwoven fabric was obtained.
It was impregnated to a weight percent and dried to obtain a semi-cured state. As a result, in the case of the prepreg alone, the shrinkage ratio was in the order of prepreg C <prepreg B <prepreg A <prepreg D from the smaller one.
【００１３】実施例１ 厚さ１８μｍの電解銅箔、プリプレグＡ、プリプレグ
Ｂ、プリプレグＣ、厚さ１７５μｍの電解銅箔の順に配
置し、１７０℃、９０分、４ＭＰａでプレス成形し、基
材厚さ０．４ｍｍの変則両面銅張積層板を作製した。Example 1 An electrolytic copper foil having a thickness of 18 μm, a prepreg A, a prepreg B, a prepreg C, and an electrolytic copper foil having a thickness of 175 μm were arranged in this order, and pressed at 170 ° C. for 90 minutes at 4 MPa to obtain a base material. An irregular double-sided copper-clad laminate having a thickness of 0.4 mm was produced.
【００１４】実施例２ 厚さ１８μｍの電解銅箔、プリプレグＤ、プリプレグ
Ａ、厚さ１７５μｍの電解銅箔の順に配置し、１７０
℃、９０分、４ＭＰａでプレス成形し、基材厚さ０．４
ｍｍの変則両面銅張積層板を作製した。Example 2 An electrolytic copper foil having a thickness of 18 μm, a prepreg D, a prepreg A, and an electrolytic copper foil having a thickness of 175 μm were arranged in this order.
Press molding at 4MPa for 90 minutes at 4 ℃, base material thickness 0.4
mm double-sided copper-clad laminates were prepared.
【００１５】実施例３ 厚さ３５μｍの電解銅箔、プリプレグＣ、プリプレグ
Ｂ、プリプレグＡ、厚さ３５μｍの電解銅箔の順に配置
し、１７０℃、９０分、４ＭＰａでプレス成形し、基材
厚さ０．４ｍｍの両面銅張積層板を作製した。この両面
銅張積層板について、プリプレグＡの側を残銅率２０
％、プリプレグＢの側を残銅率７０％になるように格子
状にエッチング加工し、模擬配線板を作製した。Example 3 An electrolytic copper foil having a thickness of 35 μm, a prepreg C, a prepreg B, a prepreg A, and an electrolytic copper foil having a thickness of 35 μm were arranged in this order, and pressed at 170 ° C. for 90 minutes at 4 MPa to form a base material. A double-sided copper-clad laminate having a thickness of 0.4 mm was produced. In this double-sided copper-clad laminate, the prepreg A side has a residual copper ratio of 20.
%, And the prepreg B side was etched in a lattice so as to have a residual copper ratio of 70%, thereby producing a simulated wiring board.
【００１６】比較例１ 厚さ１７５μｍの電解銅箔、プリプレグＡ、プリプレグ
Ｃ、プリプレグＡ、厚さ１８μｍの電解銅箔の順に配置
し、１７０℃、９０分、４ＭＰａでプレス成形し、基材
厚さ０．４ｍｍの変則両面銅張積層板を作製した。Comparative Example 1 An electrolytic copper foil having a thickness of 175 μm, a prepreg A, a prepreg C, a prepreg A, and an electrolytic copper foil having a thickness of 18 μm were arranged in this order, and pressed at 170 ° C. for 90 minutes at 4 MPa to obtain a base material. An irregular double-sided copper-clad laminate having a thickness of 0.4 mm was produced.
【００１７】比較例２ 厚さ３５μｍの電解銅箔、プリプレグＡ、プリプレグ
Ｃ、プリプレグＡ、厚さ３５μｍの電解銅箔の順に配置
し、１７０℃、９０分、４ＭＰａでプレス成形し、基材
厚さ０．４ｍｍの両面銅張積層板を作製した。この両面
銅張積層板について、片側の残銅率を７０％、もう一方
の側の残銅率を２０％になるよう格子状にエッチング加
工し、模擬配線板を作製した。Comparative Example 2 An electrolytic copper foil having a thickness of 35 μm, a prepreg A, a prepreg C, a prepreg A, an electrolytic copper foil having a thickness of 35 μm were arranged in this order, and pressed at 170 ° C. for 90 minutes at 4 MPa. A double-sided copper-clad laminate having a thickness of 0.4 mm was produced. This double-sided copper-clad laminate was etched in a grid pattern so that the residual copper ratio on one side was 70% and the residual copper ratio on the other side was 20%, to produce a simulated wiring board.
【００１８】得られた銅張積層板及び模擬配線板につい
て、そりを測定した。そりは、試料を定盤に静置し、４
辺の最大はねあがり量をダイヤルゲージで測定した。測
定結果を表１に示す。The warpage of the obtained copper-clad laminate and the simulated wiring board was measured. The sled is placed on a platen,
The maximum splashing amount of the side was measured with a dial gauge. Table 1 shows the measurement results.
【００１９】[0019]
【表１】 試料サイズ ５００ｍｍ×２５０ｍｍ ｎ数 １２枚[Table 1] Sample size 500mm x 250mm n number 12
【００２０】以上の結果から明らかように、表裏で銅箔
厚さが異なる変則両面銅張り積層板や、表裏で残銅率の
異なるプリント配線板において、片面に収縮率の大きな
プリプレグを配置することで、そりを低減できることが
わかった。As is apparent from the above results, in the case of an irregular double-sided copper-clad laminate having different thicknesses of copper foil on the front and back, or a printed wiring board having a different residual copper ratio on the front and back, a prepreg having a large shrinkage is disposed on one side. It was found that the warpage could be reduced.
【００２１】[0021]
【発明の効果】以上に説明したように、本発明によっ
て、そりの少ない銅張り積層板を提供することができ
る。As described above, according to the present invention, it is possible to provide a copper-clad laminate with less warpage.
Claims (4)
状に有することを特徴とする銅張り積層板。1. A copper-clad laminate having prepregs having different shrinkage ratios in a thickness direction in a layered manner.
リプレグの順に形成され、他方の外層から、収縮率の大
きいプリプレグが形成されたことを特徴とする請求項１
に記載の銅張り積層板。2. A prepreg having a large shrinkage is formed from one outer layer in the order of copper foil / prepreg having a small shrinkage, and a prepreg having a large shrinkage is formed from the other outer layer.
The copper-clad laminate according to the above.
さいプリプレグの順に形成され、他方の外層から、第２
の銅箔／収縮率の大きいプリプレグの順に形成され、第
１の銅箔の厚さが第２の銅箔の厚さより厚いことを特徴
とする請求項１に記載の銅張り積層板。3. A first copper foil / prepreg having a small shrinkage rate is formed in order from one outer layer, and a second copper foil / prepreg having a smaller shrinkage ratio is formed from the other outer layer.
2. The copper-clad laminate according to claim 1, wherein the copper foil / a prepreg having a large shrinkage ratio is formed in that order, and a thickness of the first copper foil is larger than a thickness of the second copper foil.
さいプリプレグの順に形成され、他方の外層から、第２
の銅箔／収縮率の大きいプリプレグの順に形成され、第
１の銅箔と第２の銅箔の厚さはほぼ同じであるが、それ
ぞれの銅箔の不要な箇所をエッチング除去して回路を形
成したときに、第１の銅箔による回路導体の残り面積が
第２の銅箔による回路導体の残り面積より大きくなるよ
うに使用されることを特徴とする請求項１に記載の銅張
り積層板。4. An outer layer is formed in the order of a first copper foil / a prepreg having a small shrinkage, and a second copper
Is formed in the order of copper foil / prepreg having a large shrinkage ratio. The thicknesses of the first copper foil and the second copper foil are almost the same, but unnecessary portions of each copper foil are removed by etching to form a circuit. 2. The copper-clad laminate according to claim 1, wherein when formed, the remaining area of the circuit conductor made of the first copper foil is used so as to be larger than the remaining area of the circuit conductor made of the second copper foil. Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10073955A JPH11268181A (en) | 1998-03-23 | 1998-03-23 | Copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10073955A JPH11268181A (en) | 1998-03-23 | 1998-03-23 | Copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11268181A true JPH11268181A (en) | 1999-10-05 |
Family
ID=13533021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10073955A Pending JPH11268181A (en) | 1998-03-23 | 1998-03-23 | Copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11268181A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003053835A (en) * | 2001-08-22 | 2003-02-26 | Nikkiso Co Ltd | Method for producing composite material product |
| CN112004964A (en) * | 2018-04-25 | 2020-11-27 | 古河电气工业株式会社 | Surface-treated copper foil, copper-clad plate and printed circuit board |
-
1998
- 1998-03-23 JP JP10073955A patent/JPH11268181A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003053835A (en) * | 2001-08-22 | 2003-02-26 | Nikkiso Co Ltd | Method for producing composite material product |
| CN112004964A (en) * | 2018-04-25 | 2020-11-27 | 古河电气工业株式会社 | Surface-treated copper foil, copper-clad plate and printed circuit board |
| CN112004964B (en) * | 2018-04-25 | 2022-03-18 | 古河电气工业株式会社 | Surface-treated copper foil, copper-clad plate and printed circuit board |
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