JPH11109649A - Substrate processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processor constituted so that a pipeline connected to a moving head part is prevented from being damaged, particles are prevented from being produced and safety operation and the quality of a substrate can be enhanced. SOLUTION: This substrate processor 100 is constituted so that the pipeline 30 for supplying developer is connected to the head part 10 having a nozzle 11 and the head part 10 is moved when the substrate 9 is processed. Besides, it is provided with a guide part 40 guiding the deformation of the pipeline 30 in accordance with the movement of the head part 10. Thus, the pipeline 30 is prevented from being damaged caused by being interfered with the other parts in the processor 100. Besides, the particles are prevented from being produced caused by the interference of the pipeline 30. As the result, the processor 100 can be safely operated and the quality of the substrate is enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to processing of a semiconductor substrate for manufacturing a semiconductor device and a glass substrate used for manufacturing a flat panel display such as a liquid crystal display (hereinafter, these are collectively referred to as "substrate"). The present invention relates to a substrate processing apparatus to be applied.

[0002]

2. Description of the Related Art A substrate processing apparatus for performing processes such as coating, developing, and cleaning on a substrate is provided with a large number of pipes serving as flow paths for a liquid such as a chemical solution or pure water or a gas such as air. Further, depending on the processing content, a pipe for supplying water for temperature adjustment is also provided.

Many of these pipes are connected to a moving part that moves when processing the substrate, and the processing is performed on the substrate by discharging a chemical solution toward the substrate from a nozzle provided in the moving part. It is supposed to be. In other words, the pipe connected to the moving part serves as a fluid supply path that is not affected by the movement of the moving part.

[0004] Further, similarly to the piping, the moving section is provided with many wires as a power supply path and the like, and the wires bend or expand with the movement of the moving section. Stable power supply and the like are realized.

[0005]

By the way, with the recent increase in the size of the substrate, the amount of liquid and the like used for processing the substrate is also increasing. In such a situation, when a chemical solution or the like is supplied at a conventional flow rate using a pipe having a conventional diameter, the time required for discharging the chemical solution or the like becomes longer, thereby reducing the throughput of the substrate processing apparatus or reducing the quality of the substrate. The problem of lowering it occurs. Therefore, it has become necessary to increase the diameter of the pipe used in the substrate processing apparatus.

When the diameter of the pipe is increased, the curvature of the pipe which can withstand bending naturally becomes small. In particular, in consideration of cleanliness and chemical resistance, a large number of fluororesin tubes that are difficult to bend and deform greatly are used in a substrate processing apparatus, and such pipes can be bent more freely as the pipe diameter increases. Can not be done.

As described above, although it is difficult to freely bend and deform the pipe, if a pipe having the same length as that of the conventional pipe is used, the pipe is fixed to a portion fixed to the apparatus main body such as a root of the pipe. A large force is applied, which generates particles and damages piping. Therefore, in order to increase the pipe diameter, it is necessary to design the pipe length to be long. That is, with the increase in the amount of use of a chemical solution or the like due to the increase in the size of the substrate, it is necessary to increase the diameter and length of the piping provided in the substrate processing apparatus.

When the pipe diameter and the pipe length increase, the movement of the pipe accompanying the movement of the moving section greatly affects the substrate processing apparatus. That is, there arises a problem that the pipe interferes with other members in the substrate processing apparatus and is mutually damaged, and particles are generated due to strong rubbing with other members.

[0009] Such a problem is not limited to a single pipe having a large diameter. The same applies to a case where a plurality of pipes are in a thick bundle or a plurality of wirings are in a thick bundle. Especially,
With the increasing complexity and sophistication of substrate processing equipment in recent years, there are many pipes and wires connected to moving parts such as the head, and it is difficult for the bundled pipes and wires to freely bend and deform. It is necessary to design the length of piping and wiring from the part fixed to the apparatus main body to the part connected to the moving part longer. Therefore, there arises a problem that the bundle of pipes and wires interferes with other members inside the apparatus and is damaged, and particles are generated, thereby deteriorating the quality of the substrate.

The present invention has been made in view of the above problems, and can prevent damage to pipes and wiring connected to a moving unit and generation of particles.
Accordingly, it is an object of the present invention to provide a substrate processing apparatus capable of safely driving the apparatus and improving the quality of the substrate.

[0011]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for performing processing on a substrate, the moving unit being moved by a driving force from a predetermined driving source during a predetermined processing operation on the substrate. And a pipe connected to the moving unit and through which a fluid used in the processing operation is passed; and a position of the pipe connected to a predetermined guide portion defined in a part of the pipe and generated by movement of the moving unit. Guide means for guiding the change.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the pipe extends from the moving part in a direction substantially perpendicular to a moving direction of the moving part.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the fluid is a developing solution for performing a developing process on the substrate, and the piping is provided in the moving portion. And a developer applying section for applying the developer supplied via the substrate onto the substrate.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus for performing processing on a substrate, comprising: a moving unit that moves by a driving force from a predetermined driving source during a predetermined processing operation on the substrate; And a guide unit connected to a predetermined guide portion defined in the middle of the wiring and guiding a change in the position of the wiring caused by the movement of the moving unit.

According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fourth aspects, the guide means has a means for guiding the guide portion linearly.

According to a sixth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fourth aspects, the guiding means has means for guiding the guiding portion two-dimensionally.

According to a seventh aspect of the present invention, in the substrate processing apparatus according to any one of the first to sixth aspects, the guiding means has means for guiding rotation swing of the guiding portion.

According to an eighth aspect of the present invention, in the substrate processing apparatus according to any one of the first to seventh aspects, the motion generated by the driving source is transmitted to the guiding means, so that the motion of the guiding means is increased. The apparatus further includes a motion transmission mechanism that causes a guiding operation.

According to a ninth aspect of the present invention, there is provided the substrate processing apparatus according to any one of the first to seventh aspects, wherein a guide driving source for driving the guiding means to perform a guiding operation; Control means for controlling the guide drive source in synchronization with movement.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION

<1. First Embodiment> FIG. 1 shows a first embodiment according to the present invention.
FIG. 3 is a perspective view showing a substrate processing apparatus 100 according to an embodiment of the present invention.
Each configuration is shown when 0 is viewed from the (−Y) direction to the (+ Y) direction. In addition, in each drawing, only a configuration necessary for description is appropriately shown.

The substrate processing apparatus 100 is an apparatus for performing a developing process by applying a developing solution to the substrate 9. The head unit 10 moves upwardly of the substrate 9 when the developing solution is applied.
1 in the X direction shown in FIG. 1 (see FIG. 3), a pipe 30 which is a supply path of the developer supplied to the head section 10, and a pipe 30 corresponding to the bending deformation of the pipe 30.
And a rotating unit 50 that rotates while supporting the substrate 9 in a horizontal posture.

The head unit 10 has a nozzle 11 for discharging a developing solution toward the substrate 9,
A moving plate 12 that moves in the direction, and a head pipe 13 that is fixed to the moving plate 12 and feeds the developing solution to the nozzle 11.

One end of the head pipe 13 is fixed to the moving plate 12 and connected to the nozzle 11, and the other end is fixed to the moving plate 12 and connected to the pipe 30. Thus, the developer supplied from the pipe 30 is supplied to the nozzle 11 via the head pipe 13.

As shown in FIG. 3, the drive unit 20 includes a motor 21 as a drive source, a belt 22 hung on a pulley 25a and another pulley 25b attached to a rotation shaft of the motor 21, and a belt 22. It has an attached head support plate 23.

The belt 22 by the rotational driving force of the motor 21
The head support plate 23 moves along with the guide rail 24
The head unit 10 attached to the upper part of the head unit support plate 23 also moves in the X direction as indicated by the arrow 23S in FIG.

One end of the pipe 30 is the moving plate 1 of the head 10.
2 and is fixed so that the pipe 30 extends in a direction substantially perpendicular to the X direction which is the moving direction of the moving plate 12. One end of the pipe 30 is connected to the head pipe 13 via the moving plate 12, and the other end is connected to a developer supply port 34 inside the substrate processing apparatus 100. Note that the developing solution is supplied from a developing solution supply source (not shown) provided inside the substrate processing apparatus 100 from the developing solution supply port 34.

The pipe 30 has a double structure having an inner pipe 31 and an outer pipe 32 as shown in FIG. 2, and a developing solution flows through an inner area 31a inside the inner pipe 31. Outer region 3 which is a space between inner tube 31 and outer tube 32
Temperature-controlled water for controlling the temperature of the developer flows through 2a. The temperature-regulated water flowing to the head unit 10 like the developing solution is sent back from the head unit 10 by a separately provided pipe (not shown).

The guide section 40 guides a part of the movement of the pipe 30 which is deformed as the head section 10 moves.
1, a guide rail 41 extending in the X direction, a guide plate 42 guided along the guide rail 41 in the X direction as indicated by an arrow 42S, and a guide plate 4.
2, a bearing 43 linearly guided in the Y direction as indicated by an arrow 43S along a guide groove 42a extending in the Y direction (more precisely, the bearing 43 is mounted on a block that moves along the guide groove 42a). Is attached), and,
Y is attached to the bearing 43 as shown by an arrow 44R.
It has a clamp portion 44 that rotates about an axis facing the direction.

With the structure of the guide portion 40 described above, a part of the pipe 30 held by the clamp portion 44 (hereinafter, referred to as a "guide portion 33") along the path parallel to the XZ plane is a part of the pipe 30. It can be guided freely in a three-dimensional manner, and is held by the clamp portion 44 in a state where it is freely rotated and guided around an axis directed in the Y direction.

The rotating part 50 is a chuck 5 for holding the substrate 9.
1. A motor 52 for rotating the chuck 51 is provided, and the substrate 9 is also rotated in a horizontal plane when the chuck 51 rotates. Further, the developing process is performed by discharging the developing solution from the nozzle 11 toward the rotating substrate 9, and the substrate 9 is used to receive the discharged developing solution scattered from the substrate 9. There is also provided a cup 53 for covering the side periphery of.

Next, the movement of the moving plate 12 in the substrate processing apparatus 100, that is, the piping 3
0 will be described with reference to FIGS.

FIG. 3 is a view showing a state in which the head section 10 has moved in the (-X) direction, and the pipe 30 is entirely curved with a relatively small curvature. FIG. 4 shows the head unit 10.
Is a diagram showing a state in which the pipe 30 has moved in the (+ X) direction, and the pipe 30 is largely curved near the center and substantially linear near both ends.

Here, the guide portion 4 shown in FIGS.
Compared with 0, the clamp portion 44 rotates along the inclination of the pipe 30 at the guide portion 33 with the deformation that is the change in the position of the pipe 30, and the rotation of the clamp portion 44 with the movement of the guide portion 33. The bearing 43 located at the center of the
It is moving along a plane parallel to the plane.

As described above, the guide portion 40 can guide the guide portion 33 in a plane parallel to the XZ plane without opposing the displacement of the position and posture of the guide portion 33 due to the deformation of the pipe 30. It has become. Thus, even if the movable plate 12 moves in the (± X) direction, the pipe 30 does not deform while being greatly warped or twisted in the (± Y) direction. That is, even if the pipe 30 is deformed as the moving plate 12 moves, the pipe 30 is deformed in a plane parallel to the XZ plane. As a result, it is possible to prevent the pipe 30 from being damaged by interfering with other parts inside the substrate processing apparatus 100,
Further, generation of particles due to interference of the pipe 30 can be prevented. Thereby, safe operation of the substrate processing apparatus 100 and improvement of the quality of the substrate 9 can be achieved.

In particular, in the present embodiment, the pipe 30 has a double structure as shown in FIG. 2 and the inner pipe 31 is formed of a fluororesin which is unlikely to cause a chemical reaction with the developing solution. The pipe 30 itself has poor flexibility. Therefore, it is essential to lengthen the entire length of the pipe 30, but even in such a case, the pipe 30 is stably guided without warping from a plane parallel to the XZ plane.

<2. Second Embodiment> FIGS. 5 and 6 show the structure of a substrate processing apparatus 101 according to a second embodiment of the present invention. In addition, the substrate processing apparatus 1
Reference numeral 01 denotes a configuration in which another configuration is added to the driving unit 20 of the substrate processing apparatus 100 according to the first embodiment, and is otherwise the same as the first embodiment. FIGS. 5 and 6 correspond to FIGS. 3 and 4, respectively, and the same components as those in the first embodiment are denoted by the same reference numerals.

In the first embodiment, each member of the guide section 40 moves using the deforming force of the pipe 30. However, the substrate processing apparatus 101 of the second embodiment is used.
In the guide section 40, the guide plate 42 moves by transmitting a force from the motor 21 as a driving source. That is, in the first embodiment, the entire guide 40 moves passively in accordance with the deformation of the pipe 30, but in the second embodiment, a part of the guide 40 actively moves. It has become.

As in the case of the first embodiment, a belt 22 is hung on a pulley 25a attached to a motor 21 as a drive source and another pulley 25b, as in the first embodiment. It is attached to this belt 22. Therefore, while the head 21 is being guided by the guide rail 24 in accordance with the rotation of the motor 21, X
It moves in the direction.

In the present embodiment, another pulley 25
c and a pulley 25a on the motor 21 side, a belt 26 is hung, and also between a pulley 25d fixed to the rotation shaft of the pulley 25c and a pulley 25e provided on the X direction side of the pulley 25d. A belt 27 is hung. The guide plate 42 of the guide section 40 is attached to the belt 27. The diameter of the pulley 25c is larger than the diameter of the pulley 25d, so that the rotational motion of the motor 21 is transmitted to the belt 27 at a reduced speed. That is, the four pulleys 25a, 25c, 2
5d, 25e, and the two belts 26, 27 constitute a motion transmission mechanism 20T that mechanically transmits the rotational motion of the motor 21 to the guide plate 42.

By providing the motion transmitting mechanism 20T as described above, in the substrate processing apparatus 101, the guide plate is synchronized with the movement of the head support plate 23 by the rotation of the motor 21, that is, the movement of the head 10. 4
2 also moves in the X direction. Further, since the diameter of the pulley 25c is larger than the diameter of the pulley 25d, the moving amount of the guide plate 42 is smaller than the moving amount of the head portion supporting plate 23. As a result, the guide plate 42 of the guide section 40 actively guides the displacement of the guide portion 33 of the pipe 30 in the X direction according to the deformation of the pipe 30.

In addition, by actively guiding the pipe 30 in this manner, the pipe 30 can be guided reliably and extremely smoothly, and unnecessary internal stress generated in the pipe 30 can be reduced while the piping in the apparatus is reduced. 30 damage and plumbing 3
Generation of particles due to zero interference can be prevented. Thereby, the safe operation of the substrate processing apparatus 101,
In addition, the quality of the substrate 9 can be improved.

<3. Third Embodiment> FIG. 7 is a perspective view showing a substrate processing apparatus 200 according to a third embodiment of the present invention.

The substrate processing apparatus 200 includes an indexer section 281 for placing the substrate 209 in a state accommodated in the carrier 291, a spin coater 282 for performing a coating process on the substrate 209, a spin developer 283 for performing a developing process on the substrate 209, A plurality of heat treatment units 284 for heating and cooling the substrate 209 and a transfer robot 200R for transferring the substrate 209 to and from various processing units and interfaces separately provided outside the apparatus are provided.

The indexer unit 281 has an in / out robot 285 for taking in / out the substrate 209 from / into the carrier 291, and the substrate 209 taken out from the in / out robot 285.
Is transferred to the transfer robot 200R and then transferred to the transfer robot 2R.
The predetermined operation is performed via a necessary processing unit by the 00R transport operation. Then, the processed substrate 209 is transferred to the entry / exit robot 285 and stored in the carrier 291.

In the transfer robot 200R of the substrate processing apparatus 200, the portion near the hand is indicated by an arrow 200S in FIG.
As shown by, it largely moves in the X direction. Also, the two hands 211a, 2
11b performs a sliding motion or a rotating motion to transfer the substrate 209 to and from various processing units and the like.

FIG. 8 is a perspective view showing the structure of the transfer robot 200R. The transfer robot 200R is a hand base 2
12, two hands 211a, 2
11b, the hand base 212 is rotated by a motor 213 about an axis 210C oriented in the Z direction. Further, the bracket 214 to which the motor 213 is attached is composed of the motor 217 and the ball screw 2.
The mechanism 16 moves up and down in the Z direction along the guide rail 215. Further, the motor 217
Is fixedly connected to the ball screw 224 by a nut part 223a.
When is rotated, the moving table 223 moves in the X direction.

The rotating shaft of the motor 221 as a driving source and the ball screw 224 are connected to pulleys 225a,
25b are attached to these pulleys 225.
The driving force of the motor 221 is transmitted to the ball screw 224 by hanging the belt 222 on the belts a and 225b.

The mechanical configuration of the transfer robot 200R has been described above. In order to realize the movement of such a complicated mechanism of the transfer robot 200R, a cable serving as a current supply path to various motors and the transfer robot 200R are provided. A wiring 230, which is a bundle of signal lines from various sensors for detecting an operation, extends from the nut portion 223 a of the movable base 223.

The guide part 23 which is a part of the wiring 230
3 is held and guided by a guide portion 240 provided below the moving table 223. That is,
The clamp portion 244 is supported by a bearing 243 so as to be able to rotate and swing about an axis directed in the Y direction as indicated by an arrow 244R.
2 can slide linearly in the X direction as indicated by an arrow 243S.
Is slidable along the two guide rails 241 in the Z direction as indicated by an arrow 242S.

With the configuration of the guide portion 240 described above, the clamp portion 244 can freely move two-dimensionally in a plane parallel to the XZ plane and can rotate. Therefore, when the movable base 223 moves in the X direction, the position of the wiring 230 changes, that is, the wiring 230 is deformed.
The zero guide portion 233 is smoothly guided two-dimensionally and rotatably in a plane parallel to the XZ plane without applying unnecessary force. FIGS. 9 and 10 show the state of this guidance when viewed in the (+ Y) direction from the (-Y) direction shown in FIG. FIG. 9 shows a state where the nut portion 223a of the movable base 223 moves in the (−X) direction, and FIG. 10 shows a state where the nut portion 223a moves in the (+ X) direction.

As shown in FIGS. 9 and 10, in the substrate processing apparatus 200, a guide part 233, which is a part of the route of the wiring 230 connected to the moving part of the transfer robot 200R, is moved by the guide part 240 to the X-axis. Since the guide is guided along a plane parallel to the Z plane, the curved portion of the wiring 230 is
The wiring 230 is not warped from the plane or twisted. As a result, there is no problem that the wiring 230 interferes with other parts inside the substrate processing apparatus 200 and is damaged, and that particles do not occur due to the interference of the wiring 230. Thus, safe operation of the substrate processing apparatus 200 and improvement of the quality of the substrate 209 can be achieved.

<4. Fourth Embodiment> FIG. 11 is a perspective view showing a transfer robot 300R used for transferring a substrate in a substrate processing apparatus according to a fourth embodiment of the present invention. The transfer robot 300R transfers the substrate to and from each processing unit in the substrate processing apparatus, similarly to the transfer robot 200R in the third embodiment.

The transfer robot 300R has two hands 311a and 311b for holding a substrate, and these hands are configured to slide horizontally as indicated by an arrow 311S. Hands 311a, 3
The hand base 312 supporting the base 11b moves up and down with respect to the moving base 323 as indicated by an arrow 312S. This elevating movement is caused by the movement of a nut 313c attached to a ball screw 313b driven by a motor 313a. Is converted into a lifting motion by the pantograph mechanism 313d.

The moving table 323 is connected to the ball screw 324 by a nut portion 323a. When the ball screw 324 is rotated by a motor 321 mounted on the base 352, the moving table 323 moves along the guide rod 322 as indicated by an arrow 323S. Ascend and descend as shown.

Further, in the transfer robot 300R, the motor 3
A base 352 on which the guide 21 and the guide rod 322 are attached
Are driven by the motor 351, and arrows 352F, 352B
As shown by, it is designed to rotate around an axis directed in the Z direction.

With the above-described configuration, the transfer robot 300R can vertically move the substrate and slide the substrate in any horizontal direction.

As described above, in the transfer robot 300R, a complicated mechanism is provided above the moving table 323. In order to realize the movement of this complicated mechanism, a cable serving as a power supply path to various driving sources is provided. And signal lines from the sensors are bundled to form a wiring 330. That is, the wiring 330 serves as a current passage that plays various roles. The wiring 330 extends from the movable table 323 so as to be substantially perpendicular to the direction of vertical movement of the movable table 323.

The moving table 323 has an arrow 323S as described above.
And rises and falls as shown by arrows 352F and 352B. Therefore, the wiring 330 extending from the moving table 323 is deformed with the movement of the moving table 323.
In the figure, a guide 340 for guiding the deformation of the wiring 330 is provided. This prevents the wiring 330 from being caught and damaged by the ball screw 324 due to the vertical movement or the rotational movement of the movable base 323.
It is also prevented that the wiring 330 is loosened and interferes with other parts to generate particles.

FIGS. 12 and 13 are diagrams showing the operation of the guide section 340 which keeps the deformation state, which is the change in the position of the wiring 330, within a certain range by guiding the wiring 330. FIG. Note that these figures show (+) from (−Y) direction in FIG.
Y) shows the case where it is turned to the direction, and also shows only the outline of the configuration necessary for explanation.

As shown in FIG. 12, the guide portion 340 holds a clamp portion 344 for holding a guide portion 333 which is a part of the wiring 330, and the clamp portion 344 is centered on an axis oriented in the Y direction as indicated by an arrow 344R. The bearing 343 has a guide rail 342 for slidably supporting the bearing 343, the bearing 343, and the clamp 344 in a Z direction indicated by an arrow 343S. The bearing 343 and the clamp 344 are rotated by a motor 341. (Not shown) forcibly move up and down. The guide rail 342 is provided so as to be fixed to a support plate 353 fixed on a base 352 shown in FIG.

As shown in FIG. 12, a signal from an encoder inside the motor 321 for raising and lowering the movable base 323 is input to the guide control means 360. The guide control means 360 controls the motor 341 of the guide section 340. The rotation of is controlled. That is, the clamp portion 34
4 is controlled so as to synchronize with the lifting / lowering movement of the moving table 323, so that the guide portion 333 is reliably and smoothly guided.

With the structure of the guide portion 340 as described above, the guide portion 333 of the wiring 330 can be smoothly and linearly guided so as to be freely rotatable without exerting an excessive force. As a result, the wiring 33 due to the movement of the moving base 323
Thus, it is possible to effectively prevent a fatigue fracture caused by the zero deformation, damage to the wiring 330 due to interference with other parts, generation of particles due to interference with other parts of the wiring 330, and the like. Thereby, safe operation of the substrate processing apparatus and improvement of the quality of the substrate can be achieved.

In FIGS. 12 and 13, the moving table 32 is used.
Although the guide motion of the guide portion 340 is synchronized only with the vertical motion of the guide 3, the pivot motion of the base 352 shown in FIG. You may make it also synchronize with rotation of the motor 351.

<5. Modifications> Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-discussed preferred embodiments, but allows various changes in design.

For example, in the above-described embodiment, a case has been described in which a part of a pipe or a wiring which is a flexible line connected to a moving part in a substrate processing apparatus is guided. Any material may be used as long as it serves as a passage for a fluid or the like, and may be a passage for air or processing gas. Further, the wiring is not limited to a path for electric power or a signal, that is, a path for a current, but may be an optical fiber which is a path for an optical signal or the like. In particular, when the optical fiber is deformed with a large curvature, the transmission efficiency of an optical signal is reduced, so that the entire length must be increased, and the present invention can be effectively used.

In the above-described embodiment, the guide portion of the pipe or the wiring is guided linearly, two-dimensionally or rotatably. However, the guide portion may be a curved or curved guide. Alternatively, the guide may be guided by a hinge that can swing in any direction.

Further, in the above-described embodiment, the linear motion guide mechanism which is a combination of the guide rail and the member which slides on the rail is shown. However, any detailed structure thereof may be used. There are a guide mechanism that smoothly slides by inserting a ball between the rail and the rail, an accuracile mechanism in which rollers are arranged on the guide rail, and a guide mechanism that uses a linear ball bush.

The mechanism for actively guiding the guide section is not limited to a combination of a guide and a drive system, but may be a mechanism in which the guide and the drive system are integrated as in a rodless cylinder. May be.

[0069]

According to the first to ninth aspects of the present invention, the pipes and wires connected to the moving section are guided at the guide portion, so that the pipes and wires interfere with other portions of the substrate processing apparatus and are damaged. And generation of particles due to interference can be prevented. Thereby, safe operation of the substrate processing apparatus and improvement of the quality of the substrate can be achieved.

According to the eighth and ninth aspects of the present invention, the movement of the moving part and the guiding operation of the guiding means can be synchronized, so that the guiding of the guiding part can be performed reliably and smoothly.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a section of a pipe.

FIG. 3 is a side view showing the inside of the substrate processing apparatus shown in FIG.

FIG. 4 is a side view showing the inside of the substrate processing apparatus shown in FIG.

FIG. 5 is a side view showing the inside of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 6 is a side view showing the inside of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 7 is a perspective view showing a substrate processing apparatus according to a third embodiment of the present invention.

8 is a perspective view showing a configuration of a transfer robot included in the substrate processing apparatus shown in FIG.

FIG. 9 is a diagram illustrating a state of guidance of wiring provided in the transfer robot illustrated in FIG. 8;

FIG. 10 is a diagram showing a state of guiding a wiring of the transport robot shown in FIG. 8;

FIG. 11 is a perspective view illustrating a configuration of a transfer robot included in a substrate processing apparatus according to a third embodiment of the present invention.

FIG. 12 is a diagram showing a state of guidance of wiring provided in the transfer robot shown in FIG. 11;

FIG. 13 is a diagram illustrating a state of guidance of wiring provided in the transfer robot illustrated in FIG. 11;

[Explanation of symbols]

 9, 209 Substrate 10 Head part 11 Nozzle 12 Moving plate 21, 221, 321 Motor 20T Motion transmission mechanism 30 Piping 33, 233, 333 Guide part 40, 240, 340 Guide part 41, 241, 242, 342 Guide rail 42 Guide plate 43, 243, 342 Bearing 44, 244, 344 Clamping part 100, 101, 200 Substrate processing device 223, 323 Moving table 230, 330 Wiring 341 Motor 360 Guidance control means

Claims (9)

[Claims] 1. A substrate processing apparatus for performing processing on a substrate, comprising: a moving unit that is moved by a driving force from a predetermined driving source during a predetermined processing operation on the substrate; A pipe through which a fluid used in operation is passed; and a guide unit connected to a predetermined guide portion defined in a part of the pipe and guiding a change in position of the pipe caused by movement of the moving unit. A substrate processing apparatus characterized by the above-mentioned. 2. The substrate processing apparatus according to claim 1, wherein the pipe extends from the moving part in a direction substantially perpendicular to a moving direction of the moving part. 3. The substrate processing apparatus according to claim 1, wherein the fluid is a developer for performing a developing process on the substrate, and the fluid is supplied to the moving unit via the pipe. A developing solution applying unit for applying the developing solution onto the substrate. 4. A substrate processing apparatus for performing processing on a substrate, comprising: a moving unit that is moved by a driving force from a predetermined driving source during a predetermined processing operation on the substrate; and a wiring connected to the moving unit. A substrate processing apparatus, comprising: a guide unit that is connected to a predetermined guide portion defined in the middle of the wiring and guides a change in the position of the wiring caused by the movement of the moving unit. 5. The substrate processing apparatus according to claim 1, wherein the guide unit includes a unit that guides the guide portion linearly. 6. The substrate processing apparatus according to claim 1, wherein said guide means includes means for guiding said guide portion two-dimensionally. . 7. The substrate processing apparatus according to claim 1, wherein said guide means includes means for guiding rotation swing of said guide portion. . 8. The substrate processing apparatus according to claim 1, wherein a motion generated by the driving source is transmitted to the guiding means, thereby causing a guiding operation by the guiding means. A substrate processing apparatus, further comprising a motion transmission mechanism. 9. The substrate processing apparatus according to claim 1, wherein a guide drive source that drives the guide unit to generate a guide operation, and that is synchronized with the movement of the moving unit. A substrate processing apparatus, further comprising control means for controlling the guide driving source.