JPH10311676A - Vacuum drying apparatus - Google Patents
Vacuum drying apparatusInfo
- Publication number
- JPH10311676A JPH10311676A JP12414797A JP12414797A JPH10311676A JP H10311676 A JPH10311676 A JP H10311676A JP 12414797 A JP12414797 A JP 12414797A JP 12414797 A JP12414797 A JP 12414797A JP H10311676 A JPH10311676 A JP H10311676A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heater
- box
- vacuum
- vacuum drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001291 vacuum drying Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000001035 drying Methods 0.000 claims abstract description 13
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000011810 insulating material Substances 0.000 claims description 11
- 238000002791 soaking Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は真空乾燥処理装置に
関し、特に液晶基板の製造工程のカラーフィルタ製造に
伴う乾燥工程に用いられる真空乾燥処理装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum drying apparatus, and more particularly, to a vacuum drying apparatus used in a drying process accompanying a color filter in a liquid crystal substrate manufacturing process.
【0002】[0002]
【従来の技術】従来、例えば半導体製品の製造工程にお
いて前工程で所定の加工が行なわれた試料(ウェハ又は
ホトマスクなど)を受け入れて真空中で乾燥処理する真
空乾燥処理装置としては、図3に示すものが知られてい
る。2. Description of the Related Art FIG. 3 shows a conventional vacuum drying apparatus for receiving a sample (wafer or photomask) which has been subjected to a predetermined process in a previous step in a semiconductor product manufacturing process and drying it in a vacuum. What is known is known.
【0003】図中の付番31はステージである。このステ
ージ31の上面の適宜な箇所には、試料32を支持する受け
部33が設けられている。前記ステージ31の上面周囲に
は、シール材34を介して真空チャンバ35が設けられてい
る。この真空チャンバ35は、前記ステージの周囲にて試
料32の全体を覆い内部を真空状態に保つもので、適宜の
箱状に形成されるとともに上下方向に開閉可能になって
いる。前記真空チャンバ35の一側壁には透孔が穿設され
ており、この透孔にパイプ36を介して真空ポンプ37が連
結されている。ここで、真空ポンプ37を運転して真空チ
ャンバ35内の空気を吸引することにより、真空チャンバ
35内を真空状態とすることができる。前記試料32の真上
に対応する真空チャンバ35の内壁には、発熱ランプ38が
設けられている。なお、付番39は、試料32に塗布された
溶媒を示す。[0003] Reference numeral 31 in the figure denotes a stage. At an appropriate location on the upper surface of the stage 31, a receiving portion 33 for supporting the sample 32 is provided. A vacuum chamber 35 is provided around the upper surface of the stage 31 with a seal member 34 interposed therebetween. The vacuum chamber 35 covers the entirety of the sample 32 around the stage and keeps the inside thereof in a vacuum state. The vacuum chamber 35 is formed in an appropriate box shape and can be opened and closed in the vertical direction. A through hole is formed in one side wall of the vacuum chamber 35, and a vacuum pump 37 is connected to the through hole via a pipe. Here, by operating the vacuum pump 37 and sucking air in the vacuum chamber 35, the vacuum chamber
The inside of 35 can be made vacuum. A heating lamp 38 is provided on the inner wall of the vacuum chamber 35 corresponding to a position directly above the sample 32. The number 39 indicates the solvent applied to the sample 32.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、従来の
真空乾燥処理装置においては、試料32を上方の発熱ラン
プ38により加熱しているため、発熱ランプ38が試料32に
転写され、基板を均一に加熱できないという問題があっ
た。また、真空チャンバ35の一側壁から該真空チャンバ
35内の空気を吸引するため、試料32に塗布した溶媒が吸
引側で速く乾燥しその反対側で乾燥しにくく、塗布した
溶媒に乾燥ムラが生じるという問題があった。However, in the conventional vacuum drying apparatus, since the sample 32 is heated by the upper heating lamp 38, the heating lamp 38 is transferred to the sample 32 and the substrate is uniformly heated. There was a problem that it was not possible. Also, the vacuum chamber 35 is connected to one side wall of the vacuum chamber 35.
Since the air in the sample 35 is sucked, the solvent applied to the sample 32 dries quickly on the suction side and hardly dries on the opposite side, and there is a problem in that the applied solvent has uneven drying.
【0005】また、図示しないが、液晶基板の製造工程
のカラーフィルタ製造に伴う乾燥工程に用いられる真空
乾燥処理装置においては、加熱プレート上に基板を置
き、順次異温度の加熱プレートへ送り、基板を所定の温
度に加熱し、乾燥させることが行なわれていた。しか
し、こうした装置においても、基板の加熱不均一性や乾
燥ムラといった問題があるとともに、加熱面の反対側の
断熱が十分でなく、安全性や装置保護の点で問題があっ
た。Although not shown, in a vacuum drying apparatus used in a drying process associated with the production of a color filter in a liquid crystal substrate production process, a substrate is placed on a heating plate and sequentially sent to a heating plate at a different temperature. Was heated to a predetermined temperature and dried. However, even in such an apparatus, there are problems such as non-uniform heating of the substrate and uneven drying, and insufficient heat insulation on the side opposite to the heated surface, which has problems in safety and protection of the apparatus.
【0006】本発明はこうした事情を考慮してなされた
もので、基板に対する加熱手段、筐体内の排気手段に改
良を施すことにより、基板を均一に加熱できるととも
に、乾燥ムラが生じるのを抑制し、更に基板を効率よく
加熱しえる真空乾燥処理装置を提供することを目的とす
る。The present invention has been made in view of such circumstances, and by improving the heating means for the substrate and the exhaust means in the housing, the substrate can be uniformly heated and the occurrence of uneven drying can be suppressed. It is another object of the present invention to provide a vacuum drying apparatus capable of efficiently heating a substrate.
【0007】[0007]
【課題を解決するための手段】本発明は、基板に塗布し
た溶媒を真空中で乾燥させる真空乾燥処理装置におい
て、上部が開口された箱状下部チャンバと、この箱状下
部チャンバに冠着されて該箱状下部チャンバととともに
筐体の少なくとも一部を構成する、下部が開口された箱
状上部チャンバと、上部に前記基板を支持する支持ピン
を立設した均熱板と、この均熱板の下部に配置されたヒ
ータとを具備し、前記均熱板及びヒータと筐体内壁間に
通路を形成して真空排気を行なうことを特徴とする真空
乾燥処理装置である。According to the present invention, there is provided a vacuum drying apparatus for drying a solvent applied to a substrate in a vacuum, comprising: a box-shaped lower chamber having an open upper portion; And a box-shaped upper chamber having an opening at the bottom, which constitutes at least a part of the housing together with the box-shaped lower chamber, a heat equalizing plate having an upper portion provided with support pins for supporting the substrate, A vacuum drying processing apparatus, comprising: a heater disposed at a lower portion of a plate; and forming a passage between the heat equalizing plate and the heater and an inner wall of the housing to perform vacuum exhaust.
【0008】本発明においては、前記(第1の)ヒータ
の下部に該ヒータからの熱が下方に伝わるのを抑制する
断熱材を設けることが好ましい。これにより、ヒータか
らの熱が下方に分散するのを抑制され、多くの熱が均熱
板,支持ピンを介して基板に伝達するようになる。ま
た、本装置を作業者が取り扱う上で安全であり、装置保
護の点でも好ましい。In the present invention, it is preferable that a heat insulating material is provided below the (first) heater so as to prevent heat from the heater from being transmitted downward. This suppresses the heat from the heater from dispersing downward, and transfers a large amount of heat to the substrate via the heat equalizing plate and the support pins. In addition, this apparatus is safe for an operator to handle, and is preferable in terms of protection of the apparatus.
【0009】本発明においては、箱状上部チャンバの上
部に断熱材で覆われた第2のヒータを設けることが好ま
しい。これにより、第1のヒータとともに上下から効率
良く基板を加熱することができ、また第2のヒータの上
部の断熱材により第2のヒータの熱が上方に分散するの
を抑制できる。[0009] In the present invention, it is preferable to provide a second heater covered with a heat insulating material above the box-shaped upper chamber. Thus, the substrate can be efficiently heated from above and below together with the first heater, and the heat dissipating material on the upper portion of the second heater can suppress the heat of the second heater from being dispersed upward.
【0010】本発明においては、前記筐体の下部側に前
記通路に連通した排気口を設けることが好ましい。これ
により、基板の乾燥ムラを抑制できるとともに、本装置
の取り扱いが容易となる。なお、排気口を筐体の上部側
に設ける事も可能であるが、排気口と排気ポンプを通常
蛇腹状の連結部材で接続するので、本装置の取り扱いの
点で好ましくない。In the present invention, it is preferable to provide an exhaust port communicating with the passage at a lower side of the housing. Thereby, drying unevenness of the substrate can be suppressed, and handling of the present apparatus becomes easy. Although the exhaust port can be provided on the upper side of the housing, the exhaust port and the exhaust pump are usually connected by a bellows-like connecting member, which is not preferable in terms of handling of the present apparatus.
【0011】本発明において、前記支持ピンの径は約1
mm程度で、先端は針状になっていることが好ましい。
また、支持ピンは、大きさや数が異なる基板をロットご
とに対応できるように取り外しができるようになってい
ることが好ましい。更に、支持ピンは、ヒータからの熱
が製品となる基板に直接影響しないような位置に立設さ
れていることが好ましい。In the present invention, the diameter of the support pin is about 1
It is preferable that the tip is needle-shaped at about mm.
Further, it is preferable that the support pins be detachable so that substrates having different sizes and numbers can be handled for each lot. Further, it is preferable that the support pins are erected at a position where the heat from the heater does not directly affect the product substrate.
【0012】[0012]
【発明の実施の形態】以下、本発明の一実施例を図1及
び図2を参照して説明する。ここで、図1は本発明の一
実施例に係る真空乾燥処理装置の断面図であり、図2は
図1の真空乾燥処理装置の概略的な展開図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. Here, FIG. 1 is a sectional view of a vacuum drying apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic development view of the vacuum drying apparatus of FIG.
【0013】図中の付番1は、上部が開口された箱状下
部チャンバである。この箱状下部チャンバ1には、後述
する均熱板9の一部を介して下部が開口された箱状上部
チャンバ2が冠着されている。この箱状上部チャンバ2
の側壁には、後述する上下機構部材を係止するための突
起2aが設けられている。前記箱状下部チャンバ1、均
熱板9の一部及び箱状上部チャンバ2により筐体3が構
成されている。前記箱状下部チャンバ1と均熱板9間、
均熱板9と箱状上部チャンバ2間は、それぞれ耐熱性の
Oリング4a,4bによりシール性を保持される。Reference numeral 1 in the figure denotes a box-shaped lower chamber whose upper part is opened. The box-shaped lower chamber 1 has a box-shaped upper chamber 2 whose lower part is opened through a part of a heat equalizing plate 9 described later. This box-shaped upper chamber 2
Is provided with a projection 2a for locking a vertical mechanism member described later. The box-shaped lower chamber 1, a part of the heat equalizing plate 9 and the box-shaped upper chamber 2 constitute a housing 3. Between the box-shaped lower chamber 1 and the soaking plate 9;
The sealing between the heat equalizing plate 9 and the box-shaped upper chamber 2 is maintained by heat-resistant O-rings 4a and 4b, respectively.
【0014】前記筐体3の一部を構成する箱状下部チャ
ンバ1の底部には、上部が開口した収納部材5を支持す
る支柱6が立設している。前記収納部材5には、テフロ
ンからなる断熱材7を介してフィルム状の第1のヒータ
8が設けられている。前記収納部材5及びヒータ8上に
は、均熱板9が載置されている。ここで、前記均熱板9
と接する前記収納部材5の表面には、耐熱性のOリング
10が埋設されている。前記均熱板9の表面の外周縁部に
は排気口12が設けられている。前記均熱板9上には、略
均等の間隔で配置された多数の支持ピン(プロキシピ
ン)13を介して基板14が支持されている。前記支持ピン
13は交換可能で、径が約1mm,先端が針状となってい
る。At the bottom of the box-shaped lower chamber 1 constituting a part of the housing 3, a column 6 for supporting a storage member 5 having an open top is provided upright. The storage member 5 is provided with a film-shaped first heater 8 via a heat insulating material 7 made of Teflon. A heat equalizing plate 9 is mounted on the housing member 5 and the heater 8. Here, the heat equalizing plate 9
A heat-resistant O-ring is provided on the surface of the
10 are buried. An exhaust port 12 is provided on the outer peripheral edge of the surface of the heat equalizing plate 9. A substrate 14 is supported on the heat equalizing plate 9 via a large number of support pins (proxy pins) 13 arranged at substantially equal intervals. The support pin
13 is replaceable and has a diameter of about 1 mm and a needle-like tip.
【0015】前記収納部材5、断熱材7、ヒータ8及び
均熱板9が夫々積層され、これらと筐体3の内壁面間に
は、通路(マニホルド)15が構成されている。この通路
15は前記均熱板9の排気口12と連通している。また、通
路15は、蛇腹状の配管16を介して排気ポンプに連結され
ている。前記箱状上部チャンバ2の上部には第2のヒー
タ17が設けられ、このヒータ17はテフロンからなる断熱
材18により覆われている。なお、図中の付番19は、前記
箱状上部チャンバ2の突起2aと係止する切り欠け部19
aを有した上下機構部材である。The storage member 5, the heat insulating material 7, the heater 8 and the heat equalizing plate 9 are respectively laminated, and a passage (manifold) 15 is formed between them and the inner wall surface of the housing 3. This passage
Reference numeral 15 communicates with the exhaust port 12 of the heat equalizing plate 9. The passage 15 is connected to an exhaust pump via a bellows-like pipe 16. A second heater 17 is provided above the box-shaped upper chamber 2, and the heater 17 is covered with a heat insulating material 18 made of Teflon. It should be noted that reference numeral 19 in the drawing denotes a notch 19 which is engaged with the projection 2a of the box-shaped upper chamber 2.
a vertical mechanism member having a.
【0016】こうした構成の真空乾燥処理装置において
は、真空乾燥処理の前に、まず箱状上部チャンバ2を開
け、溶剤を塗布した基板14を支持ピン13の上に置く。更
に、箱状上部チャンバ2を閉じてから、蛇腹状の配管16
を介して図示しない排気ポンプいより筐体3内を排気す
る。In the vacuum drying apparatus having such a configuration, the box-shaped upper chamber 2 is first opened, and the substrate 14 coated with the solvent is placed on the support pins 13 before the vacuum drying processing. Further, after closing the box-shaped upper chamber 2, the bellows-shaped pipe 16 is closed.
The inside of the housing 3 is evacuated through an exhaust pump (not shown) via the.
【0017】上記構成の真空乾燥処理装置によれば、以
下に述べる効果を有する。 (1) 第1のヒータ8からの熱を均熱板9、均等な間隔で
配置された多数の支持ピン13を介して基板14に伝達する
構成となっているため、従来のような基板14への転写が
なく、基板14を均一に加熱することができる。According to the vacuum drying apparatus having the above configuration, the following effects can be obtained. (1) Since the heat from the first heater 8 is transmitted to the substrate 14 via the heat equalizing plate 9 and a large number of support pins 13 arranged at equal intervals, the conventional substrate 14 There is no transfer to the substrate 14, and the substrate 14 can be heated uniformly.
【0018】(2) 均熱板9の表面の外周縁部に複数の排
気口12を設けるとともに、収納部材5、断熱材7、ヒー
タ8及び均熱板9が夫々積層され、これらと筐体3の内
壁面間に通路15を設け、しかもこの通路15を前記排気口
12と連通させた構成となっているため、基板14周辺の排
気を基板全面にわたって平均的に行なうことができ、も
って基板の乾燥ムラを抑制することができる。(2) A plurality of exhaust ports 12 are provided on the outer peripheral edge of the surface of the heat equalizing plate 9, and the storage member 5, the heat insulating material 7, the heater 8 and the heat equalizing plate 9 are respectively laminated, and A passage 15 is provided between the inner wall surfaces of the exhaust port 3, and the passage 15 is connected to the exhaust port
Since it is configured to communicate with the substrate 12, exhaust around the substrate 14 can be performed evenly over the entire surface of the substrate, thereby suppressing drying unevenness of the substrate.
【0019】(3) 基板14を加熱するための第1のヒータ
8の裏面に断熱材7を設けて、ヒータ8からの熱が下方
に伝達されるのを抑制するとともに、基板14を加熱する
ための他方の第2のヒータ17の上部を断熱材18で覆い、
ヒータ17からの熱が上方に伝達されるのを抑制するた
め、基板14を効率よく加熱できる。また、同様な理由に
より、本装置を取り扱う作業者の安全性を確保できると
ともに、本装置の保護の点でも好ましい。(3) A heat insulating material 7 is provided on the back surface of the first heater 8 for heating the substrate 14, so that the heat from the heater 8 is prevented from being transmitted downward and the substrate 14 is heated. Cover the upper part of the other second heater 17 with a heat insulating material 18,
Since the heat from the heater 17 is suppressed from being transmitted upward, the substrate 14 can be efficiently heated. In addition, for the same reason, the safety of an operator who handles the present apparatus can be ensured, and it is preferable in terms of protection of the present apparatus.
【0020】(4) 筐体3の下部側に排気口を設け、この
排気口に蛇腹状の配管16を介して排気ポンプにより排気
を行なう構成となっているため、作業性がよい。なお、
上記実施例では、断熱材にテフロンを用いた場合につい
て述べたが、これに限らず、断熱性を有し発電の少ない
材料であれば何でもよい。また、上記実施例では、筐体
の排気口を下部に設けた場合について述べたが、筐体の
上部に設けることも可能である。(4) An exhaust port is provided on the lower side of the housing 3 and the exhaust port is exhausted by an exhaust pump through a bellows-like pipe 16, so that workability is good. In addition,
In the above embodiment, the case where Teflon is used as the heat insulating material is described. However, the present invention is not limited to this, and any material having heat insulating properties and low power generation may be used. Further, in the above-described embodiment, the case where the exhaust port of the housing is provided at the lower portion has been described. However, the exhaust port may be provided at the upper portion of the housing.
【0021】また、上記実施例では、均熱板の一部を筐
体の一部として用いた場合について述べたが、筐体が箱
状下部チャンバと箱状上部チャンバから構成され、均熱
板が筐体内に完全に収納された状態でもよい。In the above embodiment, the case where a part of the heat equalizing plate is used as a part of the housing has been described. However, the housing is composed of a box-shaped lower chamber and a box-shaped upper chamber. May be completely stored in the housing.
【0022】[0022]
【発明の効果】以上詳述した如く本発明によれば、基板
に対する加熱手段、筐体内の排気手段に改良を施すこと
により、基板の平滑性を損なうことがないとともに、乾
燥ムラが生じるのを抑制し、更に基板を効率よく加熱し
える真空乾燥処理装置を提供できる。As described above in detail, according to the present invention, by improving the heating means for the substrate and the exhaust means in the housing, the smoothness of the substrate is not impaired and the occurrence of drying unevenness is prevented. It is possible to provide a vacuum drying apparatus capable of suppressing the temperature and heating the substrate efficiently.
【図1】本発明の一実施例に係る真空乾燥処理装置の断
面図。FIG. 1 is a sectional view of a vacuum drying apparatus according to one embodiment of the present invention.
【図2】図1の真空乾燥処理装置の概略的な展開図。FIG. 2 is a schematic development view of the vacuum drying processing apparatus of FIG.
【図3】従来の真空処理装置の断面図。FIG. 3 is a sectional view of a conventional vacuum processing apparatus.
1…箱状下部チャンバ、 2…箱状上部チャンバ、 3…筐体、 4…Oリング、 5…収納部材、 7,18…断熱材、 8,17…ヒータ、 9…均熱板、 12…排気口、 14…基板、 15…通路、 16…配管。 DESCRIPTION OF SYMBOLS 1 ... Box-shaped lower chamber, 2 ... Box-shaped upper chamber, 3 ... Housing, 4 ... O-ring, 5 ... Storage member, 7, 18 ... Insulation material, 8, 17 ... Heater, 9 ... Heat equalizing plate, 12 ... Exhaust port, 14… substrate, 15… passage, 16… piping.
Claims (4)
る真空乾燥処理装置において、上部が開口された箱状下
部チャンバと、この箱状下部チャンバに冠着されて該箱
状下部チャンバととともに筐体の少なくとも一部を構成
する、下部が開口された箱状上部チャンバと、上部に前
記基板を支持する支持ピンを立設した均熱板と、この均
熱板の下部に配置されたヒータとを具備し、前記均熱板
及びヒータと筐体内壁間に通路を形成して真空排気を行
なうことを特徴とする真空乾燥処理装置。1. A vacuum drying apparatus for drying a solvent applied to a substrate in a vacuum, comprising: a box-shaped lower chamber having an open top; and a box-shaped lower chamber mounted on the box-shaped lower chamber. A box-shaped upper chamber having an opening at the bottom, constituting a part of the housing, a heat equalizing plate having an upper portion provided with support pins for supporting the substrate, and a heater disposed below the heat equalizing plate A vacuum drying apparatus, wherein a vacuum passage is formed by forming a passage between the heat equalizing plate and the heater and the inner wall of the housing.
下方に伝わるのを抑制する断熱材が設けられていること
を特徴とする請求項1記載の真空乾燥処理装置。2. The vacuum drying apparatus according to claim 1, wherein a heat insulating material is provided below the heater to prevent heat from the heater from being transmitted downward.
覆われたヒータが設けられていることを特徴とする請求
項1記載の真空乾燥処理装置。3. The vacuum drying apparatus according to claim 1, wherein a heater covered with a heat insulating material is provided above the box-shaped upper chamber.
排気口が設けられていることを特徴とする請求項1又は
2記載の真空乾燥処理装置。4. The vacuum drying apparatus according to claim 1, wherein an exhaust port communicating with the passage is provided at a lower side of the housing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12414797A JP3831478B2 (en) | 1997-05-14 | 1997-05-14 | Vacuum drying processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12414797A JP3831478B2 (en) | 1997-05-14 | 1997-05-14 | Vacuum drying processing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10311676A true JPH10311676A (en) | 1998-11-24 |
JP3831478B2 JP3831478B2 (en) | 2006-10-11 |
Family
ID=14878105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12414797A Expired - Fee Related JP3831478B2 (en) | 1997-05-14 | 1997-05-14 | Vacuum drying processing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3831478B2 (en) |
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JP2010207739A (en) * | 2009-03-11 | 2010-09-24 | Toray Eng Co Ltd | Reduced pressure drier |
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