JPH10275701A - Electronic component and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To separate an electronic component with lead terminals from a tape and mount the electronic component on a circuit board, by forming flat portions at the tips of the lead terminals on the electronic component, and forming flat portions also on the lead terminals between the main body and the taping section of the electronic component. SOLUTION: Lead terminals 12 are extended from both the ends of the main body of an electronic component 10, such as a resistor, to tapes 14, 16, respectively. The lead terminals 12 are secured on the tapes 14, 16 at equal intervals with adhesive tapes 18, 20. To be poise, a flat portion 22 is formed at the tip of each of the lead terminals 12, and adhesive tapes 18, 20 are stuck to the flat portions 22. The lead terminals 12 are fixed on the adhesive tapes 14, 16 at equal intervals. A flat portion 24 is formed in the middle part of each of the lead terminals 12 on the same plane as the flat portions 22 at the tips. As a result, the main body of an electronic component 10 can be separated from the tapes 14, 16 and mounted on a circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having lead terminals extending from an electronic component main body and a method of manufacturing the same.

[0002]

2. Description of the Related Art In general, a taping electronic component having lead terminals is one in which lead terminals are simply attached on a tape at regular intervals with an adhesive tape. Then, this is sent to an assembling machine by an automatic machine, and the above-described taped terminal is cut at a predetermined position, and the terminal is inserted into a circuit board and soldered.

[0003] As disclosed in Japanese Utility Model Publication No. 56-25280, the tip of a terminal to be taped with an adhesive tape is flattened, and the flattened portion is taped.
In the case of taping, there has been proposed a device in which an error is less likely to occur in a mounting pitch or the like between electronic components.

[0004]

In the case of the above-mentioned conventional technique, an electronic component having a lead terminal has to be inserted by soldering the terminal into a terminal hole of a circuit board, and soldered by surface mounting. There was a problem that can not be.

An object of the present invention is to provide an electronic component with lead terminals that can be surface-mounted and a method of manufacturing the same, in view of the above-mentioned conventional technology.

[0006]

SUMMARY OF THE INVENTION According to the present invention, a flat portion is formed at the tip of a lead terminal of an electronic component mounted on a tape at equal intervals, and a lead terminal between an electronic component main body and a taping portion is formed. Is an electronic component having a flat portion. The flat portion is formed by pressing a columnar lead terminal. A plurality of lead terminals extending from the electronic component are pressed at the same time.

Further, according to the present invention, in a method of manufacturing an electronic component in which an electronic component main body is mounted on a tape at regular intervals via a lead terminal, a flat portion is formed at the tip end of the lead terminal by pressing and simultaneously taping. This is a method of manufacturing an electronic component in which a flat portion is formed by pressing the lead terminal between the portion and the electronic component body on the same plane as the flat portion. Further, the lead terminals extend from both ends of the electronic component, respectively, and the flat portions are simultaneously formed at a tip portion and a part of the middle of each lead terminal, respectively.

[0008]

According to the electronic component of the present invention, the flat part provided on the lead terminal allows the electronic component with the lead terminal to be surface-mounted.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 to 5 show an embodiment of the present invention. In an electronic component of this embodiment, lead terminals 12 extend from both ends of an electronic component main body 10 such as a resistor. Are taped on the tapes 14, 16 at regular intervals by adhesive tapes 18, 20, respectively.
Each of the lead terminals 12 has a flat portion 22 formed at the tip, and adhesive tapes 18 and 20 are attached to the flat portion 22,
The lead terminals 12 are fixed to the tapes 14 and 16 at equal intervals.

Further, in the middle of each of the lead terminals 12, a flat portion 24 formed flat on the same plane as the flat portion 22 at the tip is formed. The flat portions 22, 24 may be formed by pressing both lead terminals 12 simultaneously by a press machine before taping.

As shown in FIGS. 2 and 3, this electronic component is used by separating the electronic component main body 10 from the tapes 14 and 16 and connecting the lead terminals 12 in the middle so that the flat portion 24 is located outside. Each flat portion 24 is formed in a hook shape in parallel with the circuit board 26. Then, the flat portion 24 is surface-mounted on a predetermined soldering portion of the circuit board 26.

Also, as shown in FIG.
May be bent toward the electronic component body 10 side in a U-shape, and may be surface-mounted on the circuit board 26 by the flat portion 24. Thus, the area of the electronic component occupying the circuit board 26 can be reduced.

Further, as shown in FIG. 5, the lead end 12 is bent into an L-shape, and
Alternatively, the lead terminal 12 may be inserted into the through hole of No. 6 and the tip may be soldered. In this case, the flat portion 24 has a function of holding the electronic component main body 10 at a predetermined height with respect to the circuit board 26, and mounts the electronic component main body 10 in an accurately positioned state even in automatic mounting. be able to.

According to this embodiment, the electronic component body 10 having the lead terminals 12 can be mounted on the circuit board 26 by surface mounting.
It is also possible to solder the terminal holes of the circuit board.
Also, at the time of taping, the position of the flat portion 24 to be soldered does not rotate due to the flat portion 22 at the tip of the lead terminal 12, and the flat portion 24 may be mounted by automatic mounting.
Can be accurately mounted facing the circuit board 26.

The electronic component of the present invention is not limited to the above embodiment, and the shape of the flat portion may be a flat shape other than a circle, as long as the flat portion is flat enough to be surface mountable. Good. Further, a plurality of flat portions for surface mounting may be provided in the middle of the lead terminal, and flat portions for other functions such as soldering and bonding may be formed.

[0016]

According to the electronic component of the present invention, a flat portion is formed at the tip of the lead terminal of the electronic component mounted on the tape at regular intervals and the tape is formed. Since the flat portion is also formed on the lead terminal, the electronic component with the lead terminal can be separated from the tape and surface-mounted on the circuit board. Moreover, the taping portions of the lead terminals are also formed flat, and the entire electronic component body is accurately taped in the same direction, and can be accurately mounted on the circuit board during automatic mounting.

Further, according to the method of manufacturing an electronic component of the present invention, since the flat portion is formed simultaneously by pressing, it is easy to manufacture and it is possible to provide a surface-mounted electronic component at low cost.

[Brief description of the drawings]

FIG. 1 is a plan view of a taping electronic component according to a first embodiment of the present invention.

FIG. 2 is a front view showing a usage state of the taping electronic component of the embodiment.

FIG. 3 is a plan view of the electronic component of FIG. 2;

FIG. 4 is a front view showing another usage state of the taping electronic component of the embodiment.

FIG. 5 is a front view showing still another use state of the taping electronic component of this embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Electronic component main body 12 Lead terminal 14, 16 Tape 22, 24 Flat part

Claims (3)

[Claims] An electronic component in which an electronic component main body is mounted on a tape at regular intervals via a lead terminal, wherein a flat portion for taping is formed at a tip of the lead terminal extending from the electronic component main body. A flat portion formed on the same plane as the flat portion also on a lead terminal between the lead portion and the taping portion. 2. A method of manufacturing an electronic component in which an electronic component body is mounted on a tape at regular intervals via lead terminals, wherein a flat portion is formed at a tip end of the lead terminal by pressing, and at the same time, a taping portion and an electronic component are formed. A method for manufacturing an electronic component, wherein a flat portion is formed on a lead terminal between the component body and the flat portion by pressing on the same plane as the flat portion. 3. The method of manufacturing an electronic component according to claim 2, wherein the lead terminals extend from both ends of the electronic component, respectively, and the flat portions are simultaneously formed at a tip portion and a part of the middle of each lead terminal. .