JPH10249571A - Laser beam machining method, its device and manufacture of ink-jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machining method and its device capable of easily machining in a desired shape even if the shape changes continuously in width, depth, gradient, etc. SOLUTION: Controlling a device 12 for driving a machining table, a controller 15 emits an excimer laser beam produced in a laser generator 1 onto a machining object 10 through a mask 7, lens 8, etc., while moving the object 10 on the machining table 11. In this case, the moving speed is changed for the object 10 depending on the machining depth. A slope or a curved surface can be created by continuously changing the moving speed. The machining object 10 can be an ink-jet head, in which a highly efficient ink passage can be machined in a highly dense arrangement.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method and a laser processing apparatus for irradiating a processing object with a laser beam to produce a predetermined shape. The present invention relates to a method of manufacturing a flow path forming member constituting an ink jet head for flying and performing recording on a recording medium or an ink jet head of the type.

[0002]

2. Description of the Related Art Laser processing technology that irradiates a processing object with a laser beam to produce a predetermined shape is capable of extremely high-precision processing in a plane. Are suitable. However, it is difficult to control the laser beam with respect to the shape in the depth direction, and laser processing is mainly used for drilling that does not require control in the depth direction and groove processing with a constant depth.

On the other hand, as one example requiring high-precision processing, there is an ink-jet head for ejecting ink droplets and recording on a recording medium. In the inkjet head, in response to the recent increase in density, 6
Thus, a flow path for the ink of 00 or more is formed. In order to improve the energy efficiency together with the high density, the flow path structure of the ink is becoming increasingly complicated. For this reason, a great deal of labor is required, such as an increase in the number of times of processing. In recent years, a flow path forming member for forming an ink flow path has been formed by resin molding using a mold, and an ink jet head can be manufactured inexpensively with a small number of steps.
However, the finer the structure, the lower the yield, such as the breakage of the partition wall separating the ink flow path during die-cutting. In particular, in recent years, there has been a tendency to be longer, and there is a very high possibility that the partition walls will be broken during die-cutting. As a result, there is a need for inspection in a later step. However, this has the problem that it requires a great deal of effort.

There has been a movement to introduce laser processing into the manufacturing process of such an ink jet head. For example, JP-A-4-9291 and JP-A-4-33958
In Japanese Patent Publication No. 5 and Japanese Patent Publication No. Hei 6-24874, a nozzle hole is formed by laser processing. Although US Pat. No. 5,291,226 describes that a resin tape is irradiated with excimer laser light to process a nozzle, an ink flow path, and a vapor chamber, the nozzle is basically formed. The same processing is performed as for drilling holes. In the drilling of the nozzle hole, positional accuracy is required, but control of the energy amount is not required, and movement of the processing target is not required during processing. According to the technique described in Japanese Patent Publication No. Hei 6-24874, the processing object is oscillated about an axis. However, only the direction in which laser light is incident is slightly changed. Basically, it does not control the processing depth.

[0005] Further, a method of producing a flow path of an ink jet head by laser processing has been considered. For example, Japanese Patent Application Laid-Open No. 2-121845 describes that a flow path is formed at once by an ultraviolet beam (excimer laser) using a mask having openings corresponding to all flow paths. According to this technique, processing can be performed at high speed, but all channels can be processed only as grooves having a uniform depth. Further, Japanese Patent Application Laid-Open Nos. 1-294047 and 8-118660 disclose that processing is performed while relatively moving a mask, a laser beam, and an object to be processed.

In recent ink jet heads, the ink flow path structure has been complicated in order to achieve higher density and higher efficiency, and a shape that changes in the depth direction of the flow path has been required. ing. However, the technique described in the above-mentioned document is for forming a groove of a predetermined depth uniformly, and changing the depth of the groove is not considered. In the conventional laser processing technology, the plane direction can be controlled by the mask, but the depth direction corresponds to the laser energy, so that a different step is required to process different depths. Further, at that time, it is necessary to replace the mask, which causes an increase in the number of steps and a problem of accuracy of alignment between the steps.

Further, in the technique described in Japanese Patent Laid-Open No. 1-294047, the groove width is changed by changing the focus position of the lens system. However, when the lens system is changed, the optical axis changes. Another problem is that it is difficult to produce a precise shape. Further, when using a means for covering with a mechanical mask or the like as described in Japanese Patent Application Laid-Open No. 8-118660, there is also a problem that it becomes difficult to fabricate the mechanical mask itself if the processing groove becomes minute.

As a technique for changing the depth of a processing groove, for example, Japanese Patent Application Laid-Open No. 7-304179 discloses that a groove having a taper is processed a plurality of times. The technique described in this document basically changes the processing depth stepwise, but does not produce a smooth surface. In addition, in order to perform processing while changing the processing depth stepwise, the process of moving the processing object minutely, stopping, irradiating laser light, and moving the processing object finely again is repeated. This means that processing takes time. Further, in this document, the processing is performed so that the cross section of the groove in the width direction is stepped, and the depth is not changed in the extending direction of the groove.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and is capable of processing even a complicated shape having portions having different processing depths and having a smooth slope. It is an object of the present invention to provide a laser processing method and a laser processing apparatus capable of processing a curved surface. In addition, a high-density, high-efficiency ink-jet head can be obtained by using a laser processing method and a laser processing apparatus to process a complicated ink flow path having a different depth by using an ink-jet head or its mold as a processing object. It is an object of the present invention to provide a method for manufacturing an ink jet head that can perform the method.

[0010]

SUMMARY OF THE INVENTION According to the present invention, when processing a workpiece by irradiating the workpiece with a laser beam, the laser beam and the laser beam are moved while the mask and the workpiece are relatively continuously moved. Irradiation is performed on the object to be processed. At this time, by controlling so as to change at least the relative movement speed in accordance with the shape to be machined, the machining depth can be controlled. This is used, for example, in the manufacture of an ink jet head, and is characterized by forming ink flow paths having different shapes by laser processing.

[0011]

FIG. 1 is a schematic diagram showing an embodiment of a laser processing method and a laser processing apparatus according to the present invention. In the figure, 1 is a laser generator, 2 to 4
Is a mirror, 5 is an aperture, 6 is a shutter, 7 is a mask, 8
Denotes a lens, 9 denotes a focus driving device, 10 denotes an object to be processed, 1
1 is a working table, 12 is a working table drive, 13
Is a measurement camera, 14 is a focus driving device, 15 is a control unit,
Reference numeral 16 denotes a laser generation control unit.

The laser generator 1 generates, for example, an excimer laser beam under the control of the laser generation controller 16. The mirrors 2 to 4 guide the excimer laser light generated by the laser generator 1 onto the workpiece 10. In this example, the excimer laser light is guided onto the workpiece 10 by the three mirrors 2 to 4. However, the number of mirrors is not limited to three depending on the device configuration, and may be appropriately used, and may be configured without using a mirror. .

A mirror 2 is provided on the optical path of the excimer laser light.
4, an aperture 5, a shutter 6, a mask 7, a lens 8, and the like are arranged. The aperture 5 and the shutter 6 need not be provided if unnecessary. The mask 7 has an opening corresponding to a processing shape, particularly a minimum processing shape. As will be described later, the size of the opening of the mask 7 can be changed. The lens 8 condenses the laser light and focuses the laser light so that the shape of the opening of the mask 7 is imaged on the processing surface of the processing object 10. Focus drive 9
Drives the lens 8 and adjusts its focal position.

On the processing table 11, the object to be processed 10
Is mounted and fixed. The processing table 11 is rotated by a processing table driving device 12 in the left-right direction (Y direction) and the up-down direction (Z direction) in the drawing, the X direction orthogonal to the Y direction, the Z direction, and the rotation about the Z direction. It can move in the (θ) direction. Of course, it may be rotatable in the X and Y directions.

The measurement camera 13 captures an image of the processing object 10 on the processing table 11. Further, the focus driving device 14
Adjusts the focus of the measurement camera 13. The control unit 15
While measuring the position of the processing object 10 in the X and Y directions from the image of the processing object 10 captured by the measurement camera 13,
From the focus position by the focus driving device 14,
The position of the surface in the Z direction is measured, and the processing position is specified.
Further, the processing table driving device 12 is driven according to a preset processing shape to move the processing target 10 in the X and Y directions. The moving speed at this time is controlled according to the machining depth. This control will be described later. Further, the processing object 10 is moved in the Z direction according to the processing width to change the irradiation area of the laser light. While moving the processing target 10, the laser generation control unit 16 is instructed to generate laser light. At this time, the output energy, pulse frequency, and the like of the laser light generated by the laser generator 1 can be set and controlled according to the processing shape. The laser generation controller 16 causes the laser generator 1 to generate laser light according to parameters set by the controller 15 and a laser light generation instruction. Further, the control unit 15 controls the focus driving device 9 during processing.
To adjust the focal point of the lens 8, select the optimal mask 7, control the size of the opening of the mask 7, and control the opening and closing of the shutter 6.

In the example shown in FIG. 1, the processing position and the measurement position are shown as different positions. However, for example, a half mirror is arranged in the optical path of the laser beam so that an image can be taken from above the processing object 10. You can also. In this case, since the measurement can be performed even during the processing, the processing speed can be improved and the feedback control can be performed in real time.

In the example shown in FIG. 1, the processing is performed by irradiating the laser beam while moving the processing object 10, but the processing object 10 and the laser light may be relatively moved. For example, a configuration in which both move or only the laser light moves is also possible. When moving the laser light, the shutter 26, the mask 27, the lens 2
8. If necessary, the mirror 24 may be moved integrally. In the following description, the description will be made based on the configuration shown in FIG. 1, but the same applies to a configuration in which both the workpiece 10 and the laser beam move, or a configuration in which the laser beam moves.

Next, an example of the operation will be described. The excimer laser light emitted from the laser generator 1 is reflected by mirrors 2 and 3, passes through a diaphragm 5 and a shutter 6, and reflects only the laser light in an irradiation area set by a mask 7 by a mirror 4. The light is collected at 8. At this time,
The lens 8 is driven by a focus driving device 9 to focus the laser beam so that the laser beam is focused and the opening shape of the mask 7 is imaged on the processing surface of the processing object 10 on the processing table 11.

On the processing table 11, the processing object 10
The processing object 10 is placed and fixed so that the processing surface of the object faces the lens 8 side. At the position of the measurement camera 13, an image of the processing target 10 is input. At this time, the focus of the measuring camera 13 is adjusted by the focus driving device 14. The image acquired by the measurement camera 13 and the information on the focal position adjusted by the focus driving device 14 are stored in the control unit 15.
Is input to The control unit 15 measures the position of the processing target 10 on the processing table 11, the height of the processing surface, and the like from the information, and controls the processing position, the focal position of the lens 8, and the like.

The processing table drive device 12 is driven in the Y direction to move the workpiece 10 to the processing position, and the processing position is adjusted by moving in the X and Y directions. The control unit 15 selects an optimal mask 7 and controls the size of the opening of the mask 7, and instructs the laser generation control unit 16 to generate a laser beam. The laser generation controller 16 drives the laser generator 1 and generates excimer laser light.

In the control unit 15, a processing shape including a processing depth is set in advance. The control unit 15 instructs the processing table driving device 12 to move the processing target 10 according to the set processing shape. At this time, the moving speed according to the machining depth is instructed. The processing width is controlled by instructing the processing table driving device 12 to move in the Z direction. The processing table drive unit 12 opens the shutter 6 while the processing target 10 is moving, irradiates the processing target 10 with laser light, and performs processing of a shape corresponding to the position of the mask 7 and the Z direction. At this time, since the processing object 10 is moving, the processing is performed continuously, and the processing time can be controlled because the irradiation time of the laser beam varies depending on the moving speed. Needless to say, the energy amount may be controlled by controlling the oscillation frequency and the like in the laser generator 1 together with the control of the moving speed.

Next, the above-mentioned processing operation will be further described with reference to a specific example. FIG. 2 is a perspective view showing a specific processing example for explaining a relationship between a moving speed of a processing target and a processing depth. In FIG. 2, grooves are formed at four types of moving speeds by changing the moving speed of the processing object 10. FIG.
, The moving speed is increased in order from the left. In addition,
Here, processing is performed without moving in the Z direction, and all groove widths are constant. As can be seen from FIG. 2, when the moving speed is low, a deep groove is formed, and when the moving speed is high, the groove is formed shallow. That is, it is understood that the moving speed may be set according to the depth to be processed.

As described above, the processing depth can be controlled by the moving speed of the processing object. However, if the moving speed is changed, the processing depth changes according to the moving speed. FIG. 3 is a perspective view and a cross-sectional view illustrating a processing example when the moving speed of the processing target is changed. In FIG. 3, the moving speed of the processing object is controlled to be constant while the moving acceleration is constant, and the moving speed is gradually increased from the near side of FIG.
(B) shows a case where processing is performed while moving from left to right. As the moving speed increases, the processing depth gradually decreases, and a groove having a bottom surface inclined as shown in FIG. 3 is formed. At this time, a smooth slope can be obtained by continuously changing the moving speed.

FIG. 4 is a graph showing an example of the relationship between the initial speed and acceleration of the workpiece and the inclination angle of the slope. FIG.
The inclination angle of the bottom surface of the processed groove is related to the initial velocity and the acceleration of the processing object when the conditions of the laser beam are the same. In FIG. 4, when the initial speed of the object to be processed is 10 mm / sec, 15 mm / sec, and 20 mm / sec,
The relationship between the acceleration, which is the amount of change at that time, and the inclination angle is shown by changing the final speed. The processing object 10 uses polysulfone as an example, and uses an excimer laser as a laser beam, and has a laser output of 300 mJ / pulse.
The frequency was 100 Hz and the energy density was 2.7 J / cm ² .

As can be seen from FIG. 4, if the initial speed is low, the inclination angle increases even if the moving speed is increased at the same acceleration, and if the initial speed is high, the inclination angle decreases. Even at the same initial speed, if the acceleration is large, the change in the machining depth becomes large, and the inclination becomes steep. FIG. 4 shows that the inclination angle changes when the acceleration is changed. The change in the inclination angle indicates that a curved surface is formed. As described above, the processing depth is controlled by controlling the moving speed and the amount of change of the processing object, and even a processing shape having a slope, a curved surface, or the like can be formed by laser processing. At this time, a smooth slope or curved surface can be obtained by continuously changing the moving speed.

FIG. 5 is a perspective view showing an example of processing when the position of the processing object in the Z direction is changed. In this example,
The figure shows a case where the moving speed of the processing object is constant and the processing object is changed in the Z direction on the way. Workpiece Z
When it is changed in the direction, the laser light is in a defocused state, and the irradiation area of the laser light is increased. Even in the defocused state, processing can be performed within a certain range and within a range of a predetermined accuracy. When the irradiation area of the laser beam increases due to the defocus, the processing width increases accordingly. Therefore, the processing width can be controlled by changing the processing target in the Z direction. In the example shown in FIG. 5, the processing object is moved in the Z direction on the way, the groove width is widened, and thereafter, the processing is continued by returning to the original position in the Z direction. Thereby, a groove having a wide portion in the middle can be formed. At this time, since the moving speed of the object to be processed is kept constant, the depth of the groove does not change.

In the case of performing such processing for changing the processing width, it is preferable to use a mask having an opening having a width corresponding to the minimum processing width of the processing shape. If the width of the opening is larger than this, a minimum processing width cannot be formed. If it is smaller than this, although processing is possible, all parts are processed in a defocused state, and there is a possibility that processing accuracy may be reduced in some parts.

FIG. 6 is a cross-sectional view showing an example of the mask 7, and FIG. 7 is a conceptual diagram showing an aspect when the mask 7 is opened and closed. In the figure, 21 is a fixed mask, 22 is a fixed mask opening, 23
Is a movable mask, 24 is a movable mask opening, 25 is a vertical mechanism, and 26 is a motor. In the example shown in FIG. 6, two masks, a fixed mask 21 provided with a fixed mask opening 22 and a movable mask 23 provided with a movable mask opening 24, are provided. The movable mask 23 is the vertical mechanism 2
5 and is configured to be movable by a motor 26. Fixed mask 21 and movable mask 2
3 can be formed of, for example, a metal or a dielectric.

The laser beam reaches the workpiece 10 through the overlapping portion (opening portion) of the fixed mask opening 22 and the movable mask opening 24. As shown in FIG. 7A, when fully opened, the smaller opening (here, the fixed mask opening 22) becomes an opening through which the laser beam passes, and is processed according to the opening shape. By driving the motor 26 and moving the movable mask 23 by the up-down mechanism 25, the opening through which the laser beam passes can be narrowed, for example, as shown in FIG. 7B.

By controlling the opening in this manner, for example, if the vertical direction in FIG. 7 is the processing width, the minimum processing width that can be processed can be changed by adjusting the position of the movable mask 23. it can. Of course, by dynamically controlling the driving of the movable mask 23, it is possible to control the processing width with or without moving the processing target 10 in the Z direction.

If the processing width is set in the left-right direction in FIG. 7, the irradiation time of the laser beam to the processing area can be changed to some extent when the moving speed of the processing object 10 is fixed. For example, when the opening is made small as shown in FIG. 7B, the time required for the irradiation area of the laser beam to pass through the processing surface of the processing object 10 becomes short, and the processing depth becomes shallow. Conversely, when fully opened as shown in FIG. 7A, deep machining can be performed.

In the example shown in FIGS. 6 and 7, the movable mask 2
Numeral 3 is for enlarging or reducing the opening in only one direction. However, the present invention is not limited to this. Another movable mask that is narrowed from both sides or moves in a direction orthogonal to the moving direction of the movable mask 23 in FIG. May be provided to adjust the opening portion two-dimensionally. In this example, both the fixed mask opening 22 and the movable mask opening 24 are shown as rectangular, but the shape of the openings is arbitrary. The shapes of both do not need to be similar. For example, when the movable mask 23 is moved, the mask may have a different shape. Furthermore, a plurality of movable mask openings 24 may be provided in the movable mask 23, and the movable mask 23 may be moved to change the opening shape.

As described above, according to the configuration of the present invention as shown in FIG. 1, the laser processing corresponding to various complicated processing shapes can be performed by controlling the above-described various parameters in a complex manner. .

Hereinafter, several specific examples will be described for the case where the workpiece 10 is an ink jet head. FIG. 8 is a partial cross-sectional perspective view showing an example of the flow path structure of the inkjet head. FIG. 9 is a graph showing a change in the moving speed of the processing target when processing the flow path structure shown in FIG.
Is a graph similarly showing time and processing position, and FIG. 11 is a graph similarly showing processing position and processing depth. In FIG. 8, reference numeral 31 denotes a nozzle hole position, 32 denotes a bubble growth chamber, and 33 denotes a throttle. In the inkjet head, in order to cope with the recent increase in density, the width and interval of a groove serving as an ink flow path are reduced. For example, in a thermal inkjet head that generates bubbles in the ink by the heat generated by the heating element and flies the ink by the pressure at the time of the growth of the bubbles, the pressure at the time of the bubble growth is applied to the nozzle holes to efficiently fly the ink. A configuration is adopted in which a part of the ink flow path is narrowed so as to be directed to reduce pressure propagation to the rear. At this time, since an interval is required to reduce the width of the flow channel, the depth of the flow channel is reduced. In the channel structure shown in FIG. 8, the ink flows from the left side in the figure. The throttle section 33 projects to narrow the flow path, and the right side thereof becomes the bubble growth chamber 32. The throttle unit 33 suppresses the pressure of the bubbles growing in the bubble growth chamber 32 from propagating to the upstream side of the ink flow. A nozzle hole is formed at the nozzle hole position 31 after the processing of this flow path, and ink is ejected from the nozzle hole by the pressure of the bubble growing in the bubble growth chamber 32 to perform recording.

In order to form a channel having such a structure,
For example, the flow path forming member of the ink jet head that forms the flow path at a speed as shown in FIG. 9 is moved. By moving the flow path forming member at such a speed, the processing position to be irradiated with the laser light moves as shown in FIG. As a result, it is possible to perform processing of a shape in which the processing depth changes as shown in FIG. Note that a to e in the drawings indicate processing timings common to FIGS. 9 to 11.

First, in the section a, the flow path forming member is moved at a low speed in FIG. That is, the processing position hardly moves in the section a as shown in FIG. 10, and the processing depth becomes deep as shown in FIG. In this section a, since the moving speed has not changed, the bottom becomes flat as shown in FIG.

In the section b, the moving speed is temporarily increased as shown in FIG. As a result, the processing position is moved as shown in FIG. 10, and a shallow portion is formed as shown in FIG. Thereafter, in the section c, the flow path forming member is moved at a constant speed faster than the section a as shown in FIG. 9 and slower than the section b, so that a flat portion shallower than the section a as shown in FIG. Is formed.

In section d, the speed is gradually reduced as shown in FIG. 9, and a slope is formed as shown in FIG. In the section e, the flow path forming member is moved again at a constant speed. Since the speed at this time is the speed between the sections a and c, as shown in FIG. Is formed as the depth between.

In the flow path structure thus formed, the section a corresponds to the bubble growth chamber 32 including the nozzle hole position 31 in FIG. 8, and the section b corresponds to the throttle 33. In this way, the flow channel structure shown in FIG. 8 can be processed as a whole.

FIG. 12 is a partial perspective view and a partial plan view showing another example of the flow path structure of the ink jet head.
In order to cope with high density, it is necessary to narrow the ink discharge position as much as possible. However, as shown in FIG. 8, if the width of the flow path and the discharge position is the same, the bubble growth chamber 32 cannot be made large. There is. The flow channel structure shown in FIG. 12 shows an example in which the positions of the nozzle holes are alternately shifted to enlarge the bubble growth chamber 32. According to such a structure, since the flow path portion is shallower and narrower than the bubble growth chamber 32, the escape of the pressure is prevented and the efficiency is reduced as in the structure having the throttle portion 33 in the structure shown in FIG. It becomes a good inkjet head.

In order to form a channel having such a shape, it is necessary to form the bubble growth chamber 32 deeper and wider than the channel. In the processing in the depth direction, the processing depth can be increased by reducing the moving speed as described above. In the width direction, the processing table may be moved in the Z direction, and processing may be performed in a defocused state. That is,
At the time of processing the part to be the bubble growth chamber 32, the moving speed is reduced and the processing table is moved in the Z direction to perform processing. Further, at the time of processing the channel portion, the moving speed may be relatively high, and the Z direction may be processed at a predetermined position.

In the structure shown in FIG. 12, there are two structures having different lengths of the flow path portion, but a flow path suitable for each structure can be formed. For example, if the flow path portion is long, the fluid resistance increases, so that the flow path can be formed deeper or wider than the flow path portion having a shorter flow path portion. Further, similarly to the flow channel structure shown in FIG. 8, a throttle portion in the depth direction may be provided. At this time, a throttle portion may be formed according to the length of the flow path.

FIG. 13 is a plan view showing an example of a specific shape of the mask. 14 and 15 are a plan view and a sectional view showing still another example of the flow path structure of the inkjet head. When forming the flow path of the ink jet head as shown in FIG. 8 and FIG.
The processing may be performed using a mask in which an opening having a width corresponding to the minimum flow path width as shown in FIG. Here, a mask having a simple rectangular opening is shown. Even with a mask having such a simple opening, FIGS.
It is possible to form a channel having a complicated shape as shown in FIG.

Further, for example, when the moving speed is slightly changed during the processing, the shape of the edge of the opening of the mask appears on the processed surface. When a mask having a rectangular opening shown in FIG. 13A is used and the moving speed is slightly fluctuated during the processing of the channel portion, as shown in FIG. Fine irregularities can be formed. Such fine irregularities improve the wettability of the ink in the flow path, and can reduce bubbles and the like staying in the flow path. Also, for example, by using a mask having an opening as shown in FIG. 13B and by slightly changing the moving speed during the processing of the flow path portion, an uneven shape as shown in FIG. can do. With such an uneven shape, the ink can easily flow toward the bubble growth chamber 32 and can hardly flow in the opposite direction. FIG.
In FIG. 5, the bubble growth chamber 32 is formed using the mask shown in FIG.

FIG. 16 is a plan view showing another example of the specific shape of the mask. In the above-described example, an example is described in which a large number of flow paths in the inkjet head are formed one by one. However, the present invention is not limited to this, and a plurality of flow paths can be formed by one processing. It is. One method is to use a mask having a single opening as shown in FIG. 13 and separate the masks by an optical system such as a lens system. As another method, there is a method using a mask having a large number of openings as shown in FIG. If openings are provided in the mask by the number of channels formed in the inkjet head, all the channels can be formed by one processing. If a flow path structure as shown in FIG. 12 is to be formed, half of the openings of all the flow paths are provided in the mask, and the long and short flow path portions are formed by two processes. do it.

In the above-described specific example, the flow path forming member for forming the flow path of the ink jet head is set as the object to be processed. However, the present invention is not limited to this. In addition, it is possible to process the inverted structure of each of the above-described flow channel structures as a processing shape, or to process a normal rotation replica for forming the mold as a processing target based on the above-described respective flow channel structures. When processing is performed on the mold, the flow path forming member having each of the flow path structures as described above can be manufactured by molding using the mold. When a normal replica is processed, a mold may be manufactured by, for example, electroforming, and the channel forming member may be manufactured by using the mold, for example, by molding.

[0047]

As is clear from the above description, according to the present invention, a desired shape can be easily processed. In particular, since the processing width, processing depth, gradient, etc. can be continuously changed and can be processed in the same process,
The number of steps can be reduced and the accuracy can be improved. At this time, since no mask replacement is required, precise alignment is not required, and a reduction in the number of steps and high processing accuracy can be stably obtained. In addition, by performing continuous processing, the vicinity where the shape changes becomes smooth, and a stable shape can be obtained. Furthermore, it is possible to design the machining shape three-dimensionally, and the design flexibility is dramatically improved.
The present invention has various effects.

By processing the flow path of the ink jet head using such a laser processing method and laser processing apparatus, a high performance ink jet head can be manufactured at low cost. In addition, since the width, depth, and inclination of the flow path can be continuously changed, a three-dimensional flow path structure can be easily realized, and the degree of freedom in designing the flow path structure is dramatically increased. improves. Further, even for a flow path having a complicated structure, it is possible to process a plurality of flow paths only by providing a plurality of openings of the mask, and conversely, a flow path having a different structure is formed using the same mask. It can be processed in the process. Therefore, there is an effect that a high-density, high-efficiency inkjet head can be manufactured at high speed and at low cost.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of a laser processing method and a laser processing apparatus according to the present invention.

FIG. 2 is a perspective view showing a specific processing example for explaining a relationship between a moving speed of a processing target and a processing depth.

3A and 3B are a perspective view and a cross-sectional view illustrating a processing example when a moving speed of a processing target is changed.

FIG. 4 is a graph showing an example of a relationship between an initial velocity and an acceleration of a processing object and an inclination angle of a slope.

FIG. 5 is a perspective view showing a processing example when the position of the processing target in the Z direction is changed.

FIG. 6 is a cross-sectional view illustrating an example of a mask 7.

FIG. 7 is a conceptual diagram showing one mode when the mask 7 is opened and closed.

FIG. 8 is a partial cross-sectional perspective view illustrating an example of a flow path structure of the inkjet head.

9 is a graph showing a change in a moving speed of a processing object when processing the flow channel structure shown in FIG. 8;

FIG. 10 is a graph graph showing time and processing positions when processing the flow channel structure shown in FIG. 8;

FIG. 11 is a graph showing a processing position and a processing depth when processing the flow channel structure shown in FIG. 8;

FIG. 12 is a partial perspective view and a partial plan view showing another example of the flow channel structure of the inkjet head.

FIG. 13 is a plan view showing an example of a specific shape of a mask.

14A and 14B are a plan view and a cross-sectional view illustrating still another example of the flow path structure of the inkjet head.

FIG. 15 is a plan view and a cross-sectional view illustrating still another example of the flow path structure of the inkjet head.

FIG. 16 is a plan view showing another example of the specific shape of the mask.

[Explanation of symbols]

1 laser generator, 2-4 mirror, 5 diaphragm, 6
… Shutter, 7… Mask, 8… Lens, 9… Focus driving device, 10… Processing object, 11… Processing table, 12
... Processing table drive unit, 13 Measurement camera, 14 Focus drive unit, 15 Control unit, 16 Laser generation control unit, 21 Fixed mask, 22 Fixed mask opening, 23
.. Movable mask, 24 movable mask opening, 25 vertical mechanism, 26 motor 31 nozzle position, 32 bubble growth chamber, 33 throttle.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masaki Kataoka 2274 Hongo, Fuji Xerox Co., Ltd., Ebina City, Kanagawa Prefecture (72) Inventor Yukihisa Koizumi 2274 Hongo, Ebina City, Kanagawa Prefecture, Fuji Xerox Co., Ltd. (72) Inventor Motoyasu Suga 2274 Hongo, Ebina City, Kanagawa Prefecture Inside Fuji Xerox Co., Ltd.

Claims (8)

[Claims] 1. A laser processing method for irradiating a processing object with a laser beam to produce a predetermined shape, wherein the laser beam is moved while the laser beam and a mask and the processing object are relatively continuously moved. A laser processing method, comprising irradiating the processing target with light and controlling at least a relative speed of the movement according to the shape. 2. The method according to claim 1, wherein the processing target is relatively moved in the direction of the incident axis of the laser beam, and the processing width can be continuously changed using the same mask. The laser processing method according to claim 1. 3. The laser processing method according to claim 1, further comprising controlling an opening size of the mask to change an irradiation area of the laser beam on the processing target. 4. A laser processing apparatus for irradiating a laser beam onto a workpiece to reveal a predetermined shape, a laser generating means for generating a laser beam, and a laser beam generated by the laser generating means, An optical system that guides the laser light on the object and converges the laser light on the object, a mask that is provided between the optical systems and determines an irradiation shape of the laser light, and that is formed on the object by the optical system. Moving means for moving the guided laser light and the processing object relatively and continuously during the processing, energy of the laser light generated by the laser generating means according to the shape and relative movement by the moving means; A laser processing apparatus having control means for controlling a speed. 5. An opening of the mask is formed in a size corresponding to a minimum processing shape, and the moving means is capable of relatively moving the processing object in an incident axis direction of the laser beam. 5. The laser processing apparatus according to claim 4, wherein the control unit causes the moving unit to relatively move in a direction of an incident axis of the laser light according to a processing width in the shape. 6. The mask according to claim 4, wherein the mask is configured to control an opening area formed therein, and the control unit changes the opening area of the mask according to the shape. 6. The laser processing apparatus according to 5. 7. In a method of manufacturing an ink jet head having a flow path forming member having a flow path groove formed therein, the flow path groove relatively continuously moves a laser beam and a mask and the flow path forming member. Irradiating the flow path forming member with the laser light while controlling the moving speed of the flow path forming member and the energy of the laser light in accordance with the shape of the flow path groove, thereby causing the flow path groove to appear. A method for manufacturing an ink jet head, comprising: 8. In a method for manufacturing an ink jet head having a flow path forming member having a flow path groove, a mold for molding the flow path forming member, a laser beam and a mask are relatively continuously moved. While irradiating the laser light to the mold while controlling the moving speed of the mold and the energy of the laser light according to the shape of the flow channel, the shape of the flow channel or the inverted shape appears on the mold. And forming the flow path forming member through an inversion mold or directly using the mold.