JP3480227B2 - Laser processing method and laser processing apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is directed to irradiating a laser beam on an object to be processed to obtain a predetermined amount in an inkjet head.
The present invention relates to a laser processing method and a laser processing apparatus for exposing a groove in a shape , and particularly as a processing target,
The present invention relates to a flow path forming member that constitutes an inkjet head for ejecting ink droplets to perform recording on a recording medium or a method for manufacturing an inkjet head using the flow path forming member.

[0002]

2. Description of the Related Art Laser processing technology for irradiating an object to be processed with a laser beam to bring out a predetermined shape is capable of extremely high-precision processing in a plan view, and is suitable for processing a fine plane shape. Are suitable. However, it is difficult to control the laser beam with respect to the shape in the depth direction, and laser processing is mainly used for drilling that does not require control in the depth direction and groove processing with a constant depth.

On the other hand, as one example where high-precision processing is required, there is an ink jet head which ejects ink droplets to record on a recording medium. In the inkjet head, in order to meet the recent trend toward higher density, 6 per 25.4 mm
This has led to the formation of ink passages of 00 or more. In order to improve the energy efficiency as well as increase the density, the ink flow path structure is gradually becoming complicated. Therefore, a great deal of labor is required such as an increase in the number of times of processing. In recent years, a flow path forming member that forms a flow path for ink has also been formed by resin molding using a mold, and it has become possible to manufacture an inkjet head at low cost with a small number of steps.
However, the finer the structure, the lower the yield, such as the breakage of the partition walls that separate the ink flow path during die cutting. In particular, in recent years, there is a tendency for the length to increase, and there is a very high possibility that the partition wall will break during die cutting. As a result, there is a need for inspection in the subsequent process. However, this has the problem that a great deal of effort is required.

There is a movement to introduce laser processing into the manufacturing process of such an inkjet head. For example, JP-A-4-9291 and JP-A-4-33958.
In Japanese Patent Publication No. 5 and Japanese Patent Publication No. 6-24874, nozzle holes are formed by laser processing. Although US Pat. No. 5,291,226 describes that a nozzle, an ink flow path, and a vapor chamber are processed by irradiating a resin tape with excimer laser light, the nozzle is basically used. The same processing as that for drilling holes is performed. In drilling the nozzle holes, positional accuracy is required, but control of the amount of energy is not required, and movement of the workpiece is not required during processing. In the technique described in Japanese Patent Publication No. 6-24874 mentioned above, it is described that the object to be processed is swung around the axis, but only the direction in which the laser light is incident is slightly changed. Basically, it does not control the working depth.

Further, a method of manufacturing the flow path of the ink jet head by laser processing has been considered. For example, Japanese Unexamined Patent Publication (Kokai) No. 2-121845 describes that a flow path is formed at once with an ultraviolet beam (excimer laser) using a mask having openings corresponding to all the flow paths. According to this technique, processing can be performed at high speed, but all the channels can be processed only as grooves having a uniform depth. Further, Japanese Patent Laid-Open No. 1-294047 and Japanese Patent Laid-Open No. 8-118660 disclose processing while moving a mask and laser light relative to a processing target.

In recent ink jet heads, in order to achieve high density and high efficiency, the ink flow path structure has become complicated, and a shape that changes in the depth direction of the flow path is required. ing. However, the technique described in the above document is for uniformly forming a groove having a predetermined depth, and changing the depth of the groove has not been considered. In the conventional laser processing technology, the plane direction can be controlled by the mask, but the depth direction corresponds to the laser energy, so that another process is required to process different depths. In addition, at that time, it is also necessary to replace the mask, which causes an increase in the number of steps and alignment accuracy between steps.

Further, in the technique described in the above-mentioned Japanese Patent Laid-Open No. 1-294047, the groove width is changed by changing the focus position of the lens system, but when the lens system is changed, the optical axis changes. However, there is also the problem that it is difficult to create a precise shape. Further, when a means for covering with a mechanical mask or the like is used as described in Japanese Patent Application Laid-Open No. 8-118660, there is a problem that it becomes difficult to manufacture the mechanical mask itself when the processing groove becomes minute.

As a technique for changing the depth of the processed groove, for example, Japanese Patent Application Laid-Open No. 7-304179 discloses that a groove having a taper is processed plural times. The technique described in this document basically changes the working depth stepwise and does not reveal a smooth surface. Further, in order to perform processing while changing the processing depth step by step, the process of slightly moving the object to be processed, stopping it, irradiating the laser beam, and again moving the object to be minutely repeated. As a result, it takes time to process. Further, in this document, the groove is processed so that its cross section in the width direction has a step shape, and the depth is not changed in the extending direction of the groove.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and has an ink jet head.
Since the wavy groove is formed on the groove
It is an object to provide a laser processing method and laser processing apparatus kill. Further, by using an inkjet head or its type as an object to be processed and performing a complicated ink flow path having different depths by a laser processing method or a laser processing apparatus, a high density and high efficiency inkjet head is obtained. It is possible
It

[0010]

The present invention relates to an object to be processed.
When the inkjet head is irradiated with laser light,
A laser processing method for exposing a groove of a fixed shape,
Relatively the laser beam and the mask and the object to be processed
The laser beam while moving continuously to
Irradiate the elephant and at least according to the shape
Control to change the relative speed of the movement.
In the laser processing method, the movement is performed during the processing of the flow path part.
Minute fluctuations in the speed of to form wavy minute irregularities
It is characterized by that. In addition, the present invention is
Irradiate the elephant with laser light and place it on the inkjet head.
In a laser processing device that exposes a groove of a predetermined shape
A laser generating means for generating a laser beam, and the laser
Laser beam generated by the laser generating means
Guide the laser light to the top and collect the laser light on the object to be processed.
Optical system for bundling and laser light provided between the optical systems
The mask that determines the irradiation shape of the
Laser light guided onto the object to be processed and the object to be processed
And a moving means for moving the and relatively continuously during processing
And the laser generation means generate according to the shape
Energy of laser light and relative by the moving means
A control means for controlling the speed of movement, the control means comprising:
The speed of the relative movement is slightly changed during the processing of the flow path.
Characterized by forming fine wavy irregularities
Is.

[0011]

1 is a schematic configuration diagram showing an embodiment of a laser processing method and a laser processing apparatus of the present invention. In the figure, 1 is a laser generator, 2 to 4
Is a mirror, 5 is an aperture, 6 is a shutter, 7 is a mask, 8
Is a lens, 9 is a drive device for focus, 10 is a workpiece, 1
1 is a processing table, 12 is a processing table drive device, 13
Is a measurement camera, 14 is a focus drive device, 15 is a control unit,
Reference numeral 16 is a laser generation controller.

The laser generator 1 generates, for example, excimer laser light under the control of the laser generation controller 16. The mirrors 2 to 4 guide the excimer laser light generated by the laser generator 1 onto the object to be processed 10. In this example, the excimer laser light is guided onto the object to be processed 10 by the three mirrors 2 to 4, but the number of mirrors is not limited to three depending on the device configuration, and may be appropriately used, or may be configured without using a mirror. .

A mirror 2 is provided on the optical path of the excimer laser light.
4 to 4, an aperture 5, a shutter 6, a mask 7, a lens 8 and the like are arranged. The diaphragm 5 and the shutter 6 may be omitted if unnecessary. The mask 7 has an opening adapted to a processed shape, particularly a minimum processed shape. Further, as will be described later, the size of the opening of the mask 7 can be changed. The lens 8 collects the laser light and focuses it so that the shape of the opening of the mask 7 is imaged on the processing surface of the processing object 10. Focus drive device 9
Drives the lens 8 and adjusts its focal position.

The object to be processed 10 is placed on the processing table 11.
Is placed and fixed. The machining table 11 is rotated by the machining table drive device 12 in the left-right direction (Y direction), the up-down direction (Z direction), the Y direction, the X direction orthogonal to the Z direction, and the Z direction as a central axis. It can move in the (θ) direction. Of course, it may be rotatable in the X and Y directions.

The measurement camera 13 images the object 10 to be processed on the processing table 11. In addition, the focus driving device 14
Adjusts the focus of the measurement camera 13. The control unit 15
While measuring the position of the processing object 10 in the X and Y directions from the image of the processing object 10 captured by the measurement camera 13,
The object 10 to be machined from the focus position by the focus drive device 14.
The processing position is specified by measuring the position of the surface in the Z direction.
Further, the processing table drive device 12 is driven in accordance with a preset processing shape to move the processing object 10 in the X and Y directions. The moving speed at this time is controlled according to the processing depth. This control will be described later. Further, the object 10 to be processed is moved in the Z direction according to the processing width to change the irradiation area of the laser light. The laser generation control unit 16 is instructed to generate laser light while moving the processing object 10. At this time, the output energy and pulse frequency of the laser light generated by the laser generator 1 can be set and controlled as parameters according to the processed shape. The laser generation controller 16 causes the laser generator 1 to generate a laser beam according to the parameters set by the controller 15 and a laser beam generation instruction. Further, the control unit 15 controls the focus drive device 9 during processing.
To adjust the focus of the lens 8, select the optimum mask 7, control the size of the opening of the mask 7, and control the opening / closing of the shutter 6.

In the example shown in FIG. 1, the processing position and the measurement position are shown as different positions. However, for example, a half mirror is arranged in the optical path of the laser light so that an image can be taken from above the object to be processed 10. You can also do it. In this case, since the measurement can be performed during the processing, the processing speed can be improved and the feedback control can be performed in real time.

In the example shown in FIG. 1, the laser light is irradiated while moving the object 10 to be processed, but the object 10 and the laser light may be moved relative to each other. Alternatively, for example, both may move or only the laser light may move. When moving the laser light, the shutter 26, the mask 27, the lens 2
8. If necessary, the mirror 24 may be moved integrally. In the following description, the description will be given based on the configuration shown in FIG. 1, but the same applies to a configuration in which both the object 10 to be processed and the laser light move, or the laser light moves.

Next, an example of the operation will be described. The excimer laser light emitted from the laser generator 1 is reflected by the mirrors 2 and 3, passes through the diaphragm 5 and the shutter 6, and only the laser light in the irradiation area set by the mask 7 is reflected by the mirror 4 and the lens It is condensed at 8. At this time,
The lens 8 is driven by the focus driving device 9 and focused so that the laser light is focused and the opening shape of the mask 7 is imaged on the processing surface of the processing object 10 on the processing table 11.

On the processing table 11, the object 10 to be processed is placed.
The object 10 to be processed is placed and fixed such that the surface to be processed faces the lens 8 side. At the position of the measurement camera 13, the image of the processing object 10 is input. At this time, the focus of the measurement camera 13 is adjusted by the focus driving device 14. The image acquired by the measurement camera 13, information on the focus position adjusted by the focus drive device 14, and the like are stored in the control unit 15.
Entered in. The control unit 15 measures the position of the object 10 to be processed on the processing table 11 and the height of the processing surface based on these pieces of information, and controls the processing position and the focal position of the lens 8.

The processing table drive device 12 is driven in the Y direction to move the object 10 to the processing position, and the processing position is aligned by moving in the X and Y directions. The control unit 15 selects the optimum mask 7 and controls the size of the opening of the mask 7, and instructs the laser generation control unit 16 to generate laser light. The laser generation controller 16 drives the laser generator 1 to generate excimer laser light.

A machining shape including a machining depth is preset in the control unit 15. The control unit 15 instructs the processing table drive device 12 to move the object 10 according to the set processing shape. At this time, the moving speed according to the processing depth is instructed. The machining width is controlled by instructing the machining table drive device 12 to move in the Z direction. The shutter 6 is opened in a state where the processing object 10 is moved by the processing table drive device 12, the processing object 10 is irradiated with laser light, and processing of a shape corresponding to the mask 7 and the position in the Z direction is performed. At this time, since the object to be processed 10 is moving, the processing is continuously performed, and since the irradiation time of the laser beam differs depending on the moving speed, the processing depth can be controlled. Of course, the energy amount may be controlled by controlling the oscillation frequency or the like in the laser generator 1 together with the control of the moving speed.

Next, the above-mentioned machining operation will be further described using a specific example. FIG. 2 is a perspective view showing a specific processing example for explaining the relationship between the moving speed of the processing target and the processing depth. In FIG. 2, the moving speed of the processing object 10 is different, and the groove is formed at four kinds of moving speeds. Figure 2
In, the moving speed is increased in order from the left. In addition,
Here, processing is performed without moving in the Z direction, and all groove widths are constant. As can be seen from FIG. 2, deep grooves are formed when the moving speed is low, and shallow grooves are formed when the moving speed is high. That is, it is understood that the moving speed may be set according to the depth to be processed.

As described above, the working depth can be controlled by the moving speed of the object to be processed, but if the moving speed is changed, the working depth will change according to the moving speed. FIG. 3 is a perspective view and a cross-sectional view showing a processing example when the moving speed of the processing object is changed. In FIG. 3, the moving speed of the object to be processed is controlled to be constant, and the moving speed is controlled to be gradually increased.
It shows a case where processing is performed while moving from left to right in (B). The machining depth gradually becomes shallower as the moving speed becomes faster, and a groove having an inclined bottom surface as shown in FIG. 3 is formed. At this time, a smooth slope can be obtained by continuously changing the moving speed.

FIG. 4 is a graph showing an example of the relationship between the initial velocity and acceleration of the workpiece and the slope angle of the slope. Figure 3
The inclination angle of the bottom surface of the processed groove as shown in (1) is related to the initial velocity and acceleration of the processing object under the same laser light conditions. In FIG. 4, when the initial velocity of the processing object is 10 mm / sec, 15 mm / sec, and 20 mm / sec,
The final velocity is changed, and the relationship between the acceleration, which is the change amount at that time, and the tilt angle is shown. As the processing object 10, polysulfone is used as an example, and an excimer laser is used as a laser beam, a laser output is 300 mJ / pulse,
The frequency was 100 Hz and the energy density was 2.7 J / cm ² .

As can be seen from FIG. 4, when the initial velocity is slow, the tilt angle becomes large even if the moving velocity is increased with the same acceleration, and when the initial velocity is fast, the tilt angle becomes small. Further, even at the same initial speed, if the acceleration is large, the change in the working depth becomes large, and the inclination becomes steep. Further, it can be seen from FIG. 4 that the inclination angle changes when the acceleration is changed. A change in the tilt angle means that a curved surface is formed. In this way, the processing depth is controlled by controlling the moving speed of the object to be processed and the amount of change thereof, and even a processed shape having an inclined surface or a curved surface can be formed by laser processing. At this time, a smooth slope or curved surface can be obtained by continuously changing the moving speed.

FIG. 5 is a perspective view showing an example of processing when the position of the object to be processed in the Z direction is changed. In this example,
The moving speed of the object to be machined is constant, and the object to be machined is changed in the Z direction on the way. Z to be processed
When the direction is changed, the laser light is in a defocused state, and the irradiation area of the laser light expands. Even in the defocused state, the processing can be performed within a predetermined range of accuracy within a certain range. When the irradiation area of the laser beam is expanded due to defocusing, the processing width is expanded accordingly. Therefore, the processing width can be controlled by changing the processing target in the Z direction. In the example shown in FIG. 5, the object to be processed is moved in the Z direction on the way to widen the groove width, and then returned to the original position in the Z direction to continue the processing. This makes it possible to form a groove having a wide portion in the middle. At this time, since the moving speed of the object to be processed is constant, the depth of the groove does not change.

In the case of carrying out such processing for changing the processing width, it is preferable to use the mask 7 having an opening having a width corresponding to the minimum processing width of the processing shape. If the width of the opening is larger than this, the minimum working width cannot be formed. If it is smaller than this, it is possible to machine, but all the parts will be processed in the defocused state, and there is a possibility that the processing accuracy may be reduced in some parts.

FIG. 6 is a sectional view showing an example of the mask 7, and FIG. 7 is a conceptual view showing one mode of opening and closing the mask 7. In the figure, 21 is a fixed mask, 22 is a fixed mask opening, and 23
Is a movable mask, 24 is a movable mask opening, 25 is a vertical mechanism, and 26 is a motor. In the example shown in FIG. 6, two masks are provided: a fixed mask 21 having a fixed mask opening 22 and a movable mask 23 having a movable mask opening 24. The movable mask 23 is a vertical mechanism unit 2.
5 and is configured to be movable by a motor 26. Fixed mask 21 and movable mask 2
3 can be formed of, for example, metal or dielectric.

The laser light reaches the object to be processed 10 through the overlapping portion (opening portion) of the fixed mask opening 22 and the movable mask opening 24. As shown in FIG. 7A, at the time of full opening, the smaller opening (here, the fixed mask opening 22) becomes the opening through which the laser light passes, and processing is performed according to the opening shape. By driving the motor 26 and moving the movable mask 23 by the up-and-down mechanism 25, for example, the opening through which the laser light passes can be narrowed as shown in FIG. 7B.

By controlling the opening portion in this manner, for example, when the processing width is in the vertical direction in FIG. 7, the minimum processing width that can be processed can be changed by adjusting the position of the movable mask 23. it can. Of course, by dynamically controlling the movable mask 23, it is possible to control the processing width with or without moving the object 10 to be processed in the Z direction.

Further, by setting the processing width in the left-right direction in FIG. 7, it is possible to change the irradiation time of the laser beam to the processing region to some extent when the moving speed of the processing object 10 is constant. For example, when the opening is made smaller as shown in FIG. 7B, the time required for the laser light irradiation region to pass through the processing surface of the processing object 10 becomes shorter and the processing depth becomes shallower. On the contrary, when it is fully opened as shown in FIG. 7A, deep machining can be performed.

In the example shown in FIGS. 6 and 7, the movable mask 2
Although 3 is for expanding or contracting the opening portion in only one direction, it is not limited to this, and it is narrowed from both sides, or another movable mask that moves in a direction orthogonal to the moving direction of the movable mask 23 in FIG. May be provided, and the opening portion may be adjusted two-dimensionally. Further, in this example, both the fixed mask opening 22 and the movable mask opening 24 are shown as rectangular shapes, but the shapes of the openings are arbitrary. The shapes of the two do not have to be similar, and for example, the movable mask 23 may be configured to have a different shape when moved. Furthermore, the movable mask 23 may be provided with a plurality of movable mask openings 24, and the movable mask 23 may be moved to change the opening shape.

As described above, with the configuration of the present invention as shown in FIG. 1, it is possible to perform laser processing corresponding to various complicated processing shapes by compositely controlling the above-mentioned various parameters. .

Some concrete examples of the case where the object 10 to be processed is an ink jet head will be described below. FIG. 8 is a partial cross-sectional perspective view showing an example of the flow channel structure of the inkjet head, FIG. 9 is a graph showing changes in the moving speed of an object to be processed when the flow channel structure shown in FIG. 8 is processed, and FIG.
Is a graph showing the time and the processing position, and FIG. 11 is a graph showing the processing position and the processing depth. In FIG. 8, 31 is a nozzle hole position, 32 is a bubble growth chamber, and 33 is a throttle part. In the inkjet head, in order to cope with the recent increase in density, the width and interval of the groove that serves as an ink flow path are narrowed. For example, in a thermal ink jet head in which bubbles are generated in the ink due to the heat generated by the heating element and the ink is ejected by the pressure when the bubbles grow, in order to efficiently eject the ink, the pressure when the bubbles grow is applied to the nozzle holes. A part of the flow path of the ink is narrowed so as to face it, so that the pressure propagation to the rear is reduced. At this time, an interval is required to narrow the width of the flow channel, so the depth of the flow channel is made smaller. In the flow channel structure shown in FIG. 8, ink flows in from the left side in the figure. The narrowed portion 33 projects to narrow the flow path, and the right side thereof becomes the bubble growth chamber 32. The narrowed portion 33 prevents the pressure of the bubble growing in the bubble growth chamber 32 from propagating to the upstream side of the ink flow. A nozzle hole is formed at the nozzle hole position 31 after processing this flow path, and ink is ejected from the nozzle hole by the pressure of the bubble growing in the bubble growth chamber 32 to perform recording.

In order to form the flow path having such a structure,
For example, the flow path forming member of the ink jet head that forms the flow path is moved at a speed as shown in FIG. By moving the flow path forming member at such a speed, the processing position irradiated with the laser light moves as shown in FIG. As a result, it is possible to perform processing in a shape in which the processing depth changes as shown in FIG. In addition, a to e in the drawing indicate processing timings common to FIGS. 9 to 11.

First, in the section a, the flow path forming member is moved at a low speed in FIG. That is, the machining position hardly moves in the section a as shown in FIG. 10, and the machining depth becomes deep as shown in FIG. Since the movement speed has not changed in this section a, the bottom portion becomes flat as shown in FIG.

In section b, the moving speed is temporarily increased as shown in FIG. As a result, the processing position is moved as shown in FIG. 10, and a portion having a small processing depth is formed as shown in FIG. After that, in the section c, the flow path forming member is moved at a constant speed, which is faster than the section a and slower than the section b in the section c, so that a flat portion shallower than the section a as shown in FIG. Is formed.

In the section d, the speed is gradually reduced as shown in FIG. 9, and a slope is formed as shown in FIG. In the section e, the flow path forming member is moved again at a constant speed. Since the speed at this time is the speed between the sections a and c, as shown in FIG. 11, the processing depth is also the sections a and c. Formed as a depth between.

In the flow path structure thus formed, the section a corresponds to the bubble growth chamber 32 including the nozzle hole position 31 in FIG. 8, and the section b corresponds to the narrowed portion 33. In this way, the flow channel structure shown in FIG. 8 can be processed as a whole.

FIG. 12 is a partial perspective view and a partial plan view showing another example of the flow path structure of the ink jet head.
In order to cope with high density, it is necessary to narrow the ink ejection position as much as possible, but if the width of the flow path and the ejection position are the same as in the configuration shown in FIG. There is. The flow channel structure shown in FIG. 12 shows an example in which the positions of the nozzle holes are alternately shifted and the bubble growth chamber 32 is enlarged. According to such a structure, the flow path portion is shallower than the bubble growth chamber 32 and has a narrow width. Therefore, like the structure having the throttle portion 33 in the structure shown in FIG. It becomes a good inkjet head.

In order to form a flow path having such a shape, it is necessary to form the bubble growth chamber 32 deeper and wider than the flow path portion. In the depth direction processing, the processing depth can be increased by slowing the moving speed as described above. Further, in the width direction, the processing table may be moved in the Z direction to perform processing in the defocused state. That is,
At the time of processing the portion to be the bubble growth chamber 32, the moving speed is slowed and the processing table is moved in the Z direction for processing. Further, at the time of processing the flow path portion, the moving speed may be set relatively high and the Z direction may be processed at a predetermined position.

In the structure shown in FIG. 12, there are two structures in which the lengths of the flow path parts are different, but it is possible to form a flow path suitable for each structure. For example, since the fluid resistance increases when the flow path portion is long, it is possible to form the flow path deeper or wider than the flow path portion having a short flow path portion. Further, similarly to the flow channel structure shown in FIG. 8, a narrowed portion in the depth direction may be provided. At that time, a narrowed portion may be formed according to the length of the flow path.

FIG. 13 is a plan view showing an example of a specific shape of the mask. 14 and 15 are a plan view and a sectional view showing still another example of the flow path structure of the inkjet head. When forming the flow path of the ink jet head as shown in FIG. 8 and FIG.
Processing may be performed using a mask having an opening having a width corresponding to the minimum channel width as shown in FIG. Here, a mask having a simple rectangular opening is shown. Even with a mask having such a simple opening, the mask shown in FIG.
It is possible to form a flow path having a complicated shape as shown in FIG.

Further, for example, when the moving speed is slightly changed during processing, the shape of the edge of the opening of the mask appears on the processed surface. When the mask having the rectangular opening shown in FIG. 13A is used and the moving speed is slightly changed during the processing of the flow path portion, as shown in FIG. Fine irregularities can be formed. Such minute irregularities improve the wettability of the ink in the flow channel, and can reduce bubbles and the like that accumulate in the flow channel. Further, for example, a mask having an opening as shown in FIG. 13B is used, and the moving speed is minutely changed during the processing of the flow path portion to form an uneven shape as shown in FIG. 15 in the flow path portion. can do. With such a concavo-convex shape, the ink can easily flow toward the bubble growth chamber 32 and can be made difficult to flow in the opposite direction. Note that FIG.
In FIG. 5, the bubble growth chamber 32 is formed using the mask shown in FIG.

FIG. 16 is a plan view showing another example of the specific shape of the mask. In the above-mentioned example, an example in which a large number of flow paths in which the inkjet head is formed is formed one by one, but the present invention is not limited to this, and it is also possible to form a plurality of flow paths by one process. Is. One method is to use a mask with a single aperture as shown in FIG. 13 and divide by an optical system such as a lens system. Further, as another method, there is a method using a mask having a large number of openings as shown in FIG. If the mask is provided with openings corresponding to the number of channels formed in the inkjet head, all the channels can be formed by one-time processing. If the flow channel structure as shown in FIG. 12 is to be formed, half the openings of all the flow channels are provided in the mask, and the long and short flow channel portions are formed by two processings. do it.

In the above-described specific example, the flow path forming member forming the flow path of the injet head is the object to be processed, but the present invention is not limited to this, and the mold for molding the flow path forming member is the object to be processed. The inversion structure of each of the above-described flow channel structures can be processed as a processed shape, or the normal replica for making the mold can be processed as a processing target based on each of the above flow path structures. When the mold is processed, the flow path forming member having each flow path structure as described above can be manufactured by molding using the mold. Further, when the normal replica is processed, a mold may be manufactured by, for example, electroforming, and the flow path forming member may be manufactured by, for example, molding using the mold.

[0047]

As is apparent from the above description, according to the present invention, a predetermined shape of an ink jet head can be obtained.
The groove can be easily exposed. In particular, since the processing width, processing depth, gradient, etc. can be continuously changed and the processing can be performed in the same process, the number of processes can be reduced and the accuracy can be improved. At this time, since mask replacement is not required, precise alignment is not required, and the number of steps can be reduced and high processing accuracy can be stably obtained. Furthermore, the flow
During machining of the road part, the speed of the movement is slightly changed to
-Shaped minute unevenness can be formed, and ink in the flow path
The wettability of the liquid is improved and air bubbles that accumulate in the flow path are reduced.
It is possible to obtain an inkjet head that can
Wear.

By processing the flow path of the ink jet head using such a laser machining method and laser machining apparatus, a high performance ink jet head can be manufactured at low cost. Moreover, since the width, depth, and inclination of the flow passage can be continuously changed, a three-dimensional flow passage structure can be easily realized, and the degree of freedom in designing the flow passage structure is dramatically increased. improves. Furthermore, even if the flow path has a complicated structure, it is possible to process a plurality of flow paths by simply providing a plurality of openings in the mask, and conversely, use the same mask to make the flow paths of different structures the same. It can be processed in the process. Therefore, there is an effect that a high-density, high-efficiency inkjet head can be manufactured at high speed and at low cost.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of a laser processing method and a laser processing apparatus of the present invention.

FIG. 2 is a perspective view showing a specific processing example for explaining the relationship between the moving speed of the processing target and the processing depth.

3A and 3B are a perspective view and a cross-sectional view showing a processing example when the moving speed of the processing target is changed.

FIG. 4 is a graph showing an example of the relationship between the initial velocity and acceleration of the workpiece and the inclination angle of the slope.

FIG. 5 is a perspective view showing a processing example when the position of the processing target in the Z direction is changed.

FIG. 6 is a cross-sectional view showing an example of a mask 7.

FIG. 7 is a conceptual diagram showing one aspect when the mask 7 is opened and closed.

FIG. 8 is a partial cross-sectional perspective view showing an example of the flow path structure of the inkjet head.

9 is a graph showing a change in moving speed of a processing object when processing the flow channel structure shown in FIG.

10 is a graph graph showing time and processing position when processing the flow channel structure shown in FIG.

11 is a graph showing a processing position and a processing depth when processing the flow channel structure shown in FIG.

FIG. 12 is a partial perspective view and a partial plan view showing another example of the flow path structure of the inkjet head.

FIG. 13 is a plan view showing an example of a specific shape of a mask.

FIG. 14 is a plan view and a cross-sectional view showing still another example of the flow path structure of the inkjet head.

FIG. 15 is a plan view and a cross-sectional view showing still another example of the flow path structure of the inkjet head.

FIG. 16 is a plan view showing another example of the specific shape of the mask.

[Explanation of symbols]

1 ... Laser generator, 2-4 ... Mirror, 5 ... Aperture, 6
... Shutter, 7 ... Mask, 8 ... Lens, 9 ... Focus drive device, 10 ... Processing object, 11 ... Processing table, 12
... processing table drive device, 13 ... measurement camera, 14 ... focus drive device, 15 ... control unit, 16 ... laser generation control unit, 21 ... fixed mask, 22 ... fixed mask opening, 23
... Movable mask, 24 ... Movable mask opening, 25 ... Vertical mechanism part, 26 ... Motor, 31 ... Nozzle hole position, 32 ... Bubble growth chamber, 33 ... Throttling part.

Front page continuation (72) Inventor Masaki Kataoka 2274 Hongo, Ebina City, Kanagawa Prefecture, Fuji Zelocks Co., Ltd. (72) Inventor Yukihisa Koizumi 2274, Hongo, Ebina City, Kanagawa Prefecture (72) Inventor, Suga Motoyasu 2274 Hongo, Ebina-shi, Kanagawa Fuji Xerox Co., Ltd. (56) Reference JP-A-8-318386 (JP, A) JP-A-8-127125 (JP, A) JP-A-8-206866 (JP , A) JP-A-7-304179 (JP, A) JP-A-5-318744 (JP, A) JP-A-5-77425 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB) Name) B23K 26/00-26/42 B41J 2/16

Claims (6)

(57) [Claims] 1. A in by irradiating a laser beam to the workpiece
A laser processing method for exposing a groove having a predetermined shape in a cuddle head , irradiating the laser light to the object while moving the laser light and the mask and the object relatively continuously. Along with
A laser processing method for controlling at least a relative speed of the movement according to the shape ,
By slightly changing the speed of movement while processing the flow path
A laser processing method characterized by forming fine wavy irregularities . 2. The processing object can be relatively moved in the incident axis direction of the laser light, and the processing width can be continuously changed by using the same mask. The laser processing method according to claim 1. 3. The laser processing method according to claim 1, further comprising controlling the size of the opening of the mask to change the irradiation area of the laser light on the object to be processed. 4. in by irradiating a laser beam to the workpiece
In a laser processing apparatus for exposing a groove of a predetermined shape in a jet jet head, a laser generating unit for generating a laser beam, and a laser beam generated by the laser generating unit are guided onto the processing target and on the processing target. An optical system for converging the laser light, and a mask provided between the optical systems for determining the irradiation shape of the laser light,
Moving means for moving the laser beam guided onto the object to be processed by the optical system and the object to be processed relatively and continuously during processing, and laser light generated by the laser generating means according to the shape. the energy and have a control means for controlling the speed of the relative movement by said moving means, said control means, the relative movement during processing of the flow path portion
A laser processing apparatus, characterized in that a minute wavy unevenness is formed by minutely changing the speed of . 5. The opening of the mask is formed in a size corresponding to a minimum processing shape, and the moving means is capable of relatively moving the object to be processed in an incident axis direction of the laser beam, 5. The laser processing apparatus according to claim 4, wherein the control means causes the moving means to perform relative movement in the incident axis direction of the laser light according to the processing width in the shape. 6. The mask according to claim 4, wherein the opening area of the mask is controllable, and the control means changes the opening area of the mask according to the shape. The laser processing apparatus according to item 5.