JPH10229296A - Method of mounting electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable an electronic part to be mounted corresponding to its characteristic rank by a method wherein a characteristic mark corresponding to the characteristic rank of the electronic part is attached to the electronic part, and NC data as to the mounting of the part are formed changing peripheral electronic parts corresponding to its characteristic rank, and the characteristic mark is recognized. SOLUTION: A mounting operation is carried out in accordance with a following sequence that a specific electronic part 9 is mounted first because peripheral electronic parts 14 are mounted as replaced corresponding to the characteristic rank of the specific electronic part 9, the characteristic mark 11 attached to the specific electronic part 9 is recognized by a characteristic detection device, and the peripheral electronic parts 14 selected through NC data corresponding to the characteristic rank recognized by the characteristic detection device are mounted. The characteristic mark 11 can be attached as a seal where a characteristic mark 11 is printed to the specific electronic part. The characteristic mark 11 can be represented by a bar code, letters, or figures.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for mounting an electronic component on a printed circuit board, and more particularly, to a method of corresponding to a characteristic rank of an electronic component having a characteristic rank (hereinafter referred to as a characteristic electronic component). The present invention relates to an electronic component mounting method in which electronic components of a peripheral circuit (hereinafter, referred to as peripheral electronic components) are changed and mounted. By the way, an electronic component having a characteristic rank corresponds to a semiconductor element or the like having a variation in its characteristics, such as a transistor such as an FET.
In particular, in an analog electronic circuit, it is necessary to configure a peripheral electronic circuit in accordance with variations in characteristics of a central semiconductor element.

[0002]

2. Description of the Related Art When an electronic circuit is constructed using characteristic electronic components, peripheral electronic components arranged around the characteristic electronic components are changed in accordance with the variation in the characteristics of the characteristic electronic components. As a result, a predetermined function can be obtained as an electronic circuit. For example, when the peripheral electronic component is a resistor, it is necessary that the peripheral electronic component has a resistance value corresponding to the characteristic. Will use. Therefore, when mounting the characteristic electronic component on the printed circuit board, a mounting program (NC data) for changing and mounting the peripheral electronic component according to the characteristic rank of the characteristic electronic component is required.

Therefore, as shown in FIG. 6, characteristic electronic components are classified according to characteristics in an electronic component characteristic detecting step, and are taped according to the characteristics An to n to prepare an electronic component supply reel, and the characteristics An to n NC data for changing and mounting the peripheral electronic components for each time is created.

In the mounting process using the electronic component supply reel, as shown in FIG. 7, when the electronic component supply reel is mounted on the electronic component mounter, the characteristic electronic component supply reel stored in the electronic component mounter is used. From each NC data,
The NC data corresponding to the characteristic rank of the mounted characteristic electronic component is selected, and the electronic component mounting step is executed. When the electronic component supply reel of the characteristic electronic component runs out of components, it is switched to a new electronic component supply reel, and when the characteristic rank of the characteristic electronic component taped on this electronic component supply reel differs from the previous one, the corresponding response is taken. The task of switching to NC data is executed.

[0005]

In the above-mentioned prior art, the operation of switching the NC data every time the characteristic rank of the characteristic electronic component changes is performed manually. Also, in the case of a multi-panel board, when a characteristic electronic component is cut out during mounting of one printed circuit board and the electronic component supply reel is switched, when the characteristic rank changes, the NC data is switched at the same time. In order to make the peripheral electronic components correspond to the characteristic electronic components, it is necessary to manually set operation steps for restarting the mounting operation.

As described above, in the prior art, in order to execute the mounting operation corresponding to the characteristic electronic component, the operator is required to perform the operation of surely switching the NC data and setting the operation steps by confirming the characteristic rank. I was For this reason, there is a problem that the burden on the worker is large and erroneous recognition and mistakes are inevitable.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and enables peripheral electronic components to be mounted in correspondence with the characteristic rank of the characteristic electronic component by automatically recognizing the characteristic rank of the characteristic electronic component. It is an object of the present invention to provide an electronic component mounting method.

[0008]

According to a first aspect of the present invention, a printed circuit board is positioned at a predetermined position by recognizing a board mark provided on the printed circuit board, and the printed circuit board has a characteristic electronic device having a characteristic rank. In an electronic component mounting method of mounting by changing peripheral electronic components arranged around the component in correspondence with the characteristic rank of the component, a characteristic mark corresponding to the characteristic rank of the characteristic electronic component is attached to the characteristic electronic component, and NC data of component mounting for changing and mounting the peripheral electronic component in accordance with the rank is created, and the characteristic mark is recognized, whereby mounting is performed using the NC data corresponding to the recognized characteristic rank. I do.

According to the electronic component mounting method, the characteristic mark for identifying the characteristic rank is attached to the characteristic electronic component. By recognizing the characteristic mark, NC data corresponding to the characteristic rank is selected, and the characteristic electronic component is selected. The mounting of the peripheral electronic component corresponding to the characteristic rank is performed.
Therefore, the change in the characteristic rank of the characteristic electronic component is automatically recognized, and the NC data is switched in response to the change.
The change to the peripheral electronic component corresponding to the characteristic rank is automatically executed without the need for manual operation and also for the change in the characteristic rank of the characteristic electronic component in the multiple board.

In the above configuration, the recognition of the characteristic mark can be performed also by the means for recognizing the substrate mark, and the cost can be reduced without providing any means for recognizing the characteristic mark.

The characteristic mark can be formed by a bar code, a character, or a symbol, and can be arbitrarily selected according to the number of characteristic rank divisions.

According to a second aspect of the present invention, a peripheral electronic component disposed around the characteristic electronic component is changed in accordance with the characteristic rank of the characteristic electronic component having the characteristic rank on the printed circuit board carried into the mounting position. In the electronic component mounting method, the identification mark corresponding to the characteristic rank is attached to electronic component supply means for mounting the characteristic electronic component for each characteristic rank, and the peripheral electronic component is changed according to the characteristic rank. NC data of the component mounting to be mounted is created, and the NC data corresponding to the recognized characteristic rank is selected and mounted by recognizing the identification mark.

According to the electronic component mounting method, since the identification mark is attached to the electronic component supply means for supplying the characteristic electronic component, the NC mark corresponding to the characteristic rank of the characteristic electronic component is selected by recognizing the identification mark. In addition, the mounting of the peripheral electronic component is executed in accordance with the characteristic rank of the characteristic electronic component. Therefore, the change in the characteristic rank of the characteristic electronic component is automatically recognized, and the NC data is switched in response to the change. Therefore, it is possible to cope with the change in the characteristic electronic component without manual operation.

The recognition of the identification mark is performed when the power of the electronic component mounting machine is turned on, when the model of the printed circuit board to be manufactured is changed, and when the electronic component supply means is replaced. The NC data corresponding to the characteristic rank of the characteristic electronic component is automatically switched by the electronic component supply means mounted on the electronic component mounter.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention.
The embodiment described below is an example embodying the present invention, and does not limit the technical scope of the present invention.

FIG. 1 is a flowchart showing a procedure of an electronic component mounting method according to a first embodiment of the present invention. FIG. 2 is a perspective view showing a configuration of an electronic component mounting machine to which the present electronic component mounting method is applied. FIG. 4 is a plan view showing an example of a multi-panel board on which characteristic electronic components having different characteristic ranks are mounted.

First, a configuration of an electronic component mounting machine to which the present electronic component mounting method is applied will be described with reference to FIGS.

In FIG. 2, an electronic component mounter A is configured as a mounter using a rotary head, and a printed board 1 supplied on an XY table 2 is
As shown in (1), first, the characteristic electronic component 9 is mounted, and peripheral electronic components 14 corresponding to the characteristic rank of each characteristic electronic component 9 are mounted therearound. The printed board 1 is provided with a board mark 3. The board mark 3 is recognized by a board mark recognition device 4, and is positioned at a predetermined position by moving the XY table 2. The plurality of mounting heads 5 suck and hold characteristic electronic components 9 or peripheral electronic components 14 from an electronic component supply reel (electronic component supply means) 8 of a parts cassette 7 mounted on a component supply unit 6. The suction posture of the component by the mounting head 5 is determined by the component recognition device 10.
The mounting is performed at a predetermined position on the printed circuit board 1 by the operation of correcting the position and orientation of the XY table 2 and the mounting head 5.

The order of mounting is such that the peripheral electronic components 14 corresponding to the characteristic ranks of the characteristic electronic components 9 are changed and mounted. Therefore, first, the characteristic electronic components 9 are mounted, and the characteristic marks 11 attached to the characteristic electronic components 9 are marked. The peripheral electronic component 14 is mounted on the basis of the NC data corresponding to the recognized characteristic rank recognized by the characteristic detecting device 12. As shown in FIG. 3, the characteristic mark 11 can be attached to the characteristic electronic component 9 as a seal having the characteristic mark 11 corresponding to the characteristic rank. The characteristic mark 11 can be formed by a barcode, a character, or a mark as shown in the figure.

As the printed circuit board 1, a multi-panel board as shown in FIG. 3 can be applied, and the characteristic electronic parts 9 of the individual boards of the multi-pane are replaced with the characteristic electronic parts 9 as shown in FIG.
a, 9b, each characteristic electronic component 9a, 9b
b by recognizing the characteristic marks 11 attached to the peripheral electronic components 14a, 14b
Can be implemented separately.

The procedure of component mounting by the electronic component mounting machine configured as described above will be described with reference to the flowchart of FIG. Note that S1, S2,... Shown in the figure are step numbers indicating the mounting procedure, and coincide with the numbers added to the text.

When the printed board 1 is loaded onto the XY table 2 of the electronic component mounting machine A (S1), the board mark recognition device 4 recognizes the board mark 3 on the printed board 1, and the position and orientation of the printed board 1 Is recognized (S2).
Since the component mounting is first executed from the characteristic electronic component 9, the mounting head 5 is moved from the electronic component supply reel 8 to the characteristic electronic component 9.
Is sucked and held (S3), and the suction posture is recognized by the component recognition device 10 (S4). The mounting position is determined by the operation of correcting the position and orientation of the XY table 2 and the mounting head 5 from the data obtained by recognizing the position of the printed circuit board 1 and the posture of the characteristic electronic component 9 (S5), and the characteristic electronic component 9 is mounted. (S6).

The characteristic mark 11 attached to the mounted characteristic electronic component 9 is recognized by the characteristic detecting device 12 (S7). If the characteristic mark 11 has the characteristic rank a by the characteristic rank recognition, the characteristic rank a (S8), and mounting of the peripheral electronic component 14a corresponding to the characteristic electronic component 9a having the characteristic rank a is executed in the same manner as the characteristic electronic component 9a (S9). By recognizing the characteristic mark 11, the characteristic electronic component 9b having the characteristic rank b is obtained.
Is determined, the corresponding peripheral electronic component 14b is mounted. This mounting procedure is repeated until a predetermined number of mountings on the printed circuit board 1 are completed.

According to the above mounting method, when the mounting on one printed circuit board 1 is carried out by a plurality of electronic component mounters, the characteristic electronic component 9 is used in the previous mounting process.
Even if the printed circuit board on which is mounted is carried in, the characteristic electronic component 9 is recognized by the recognition of the characteristic mark 11.
Can be mounted.

The characteristic detecting device 12 can be constructed as a recognition camera for recognizing a mark, and the substrate mark recognizing device 4 can also be constructed as a recognition camera. Alternatively, the substrate mark recognizing device 4 can also perform the recognition operation.

Next, an electronic component mounting method according to a second embodiment of the present invention will be described. FIG. 4 is a perspective view showing a configuration of an electronic component mounting machine to which the present electronic component mounting method is applied, and FIG. 5 is a flowchart showing a procedure of the present electronic component mounting method. Note that the same reference numerals are given to the same components as those in the configuration of the above embodiment, and the description thereof will be omitted.

In FIG. 4, the electronic component mounting machine B has an identification memory (identification mark) 13 for identifying a characteristic rank attached to an electronic component supply reel 15. Electronic components 9 having the above characteristics are taped and loaded. The identification memory 1
3 is recognized by the component supply reel detecting device 16 when the power of the electronic component mounting machine B is turned on, when the electronic component supply reel 15 is replaced, or when the type of the printed circuit board to be manufactured is switched. This component supply reel detection device 16 replaces the characteristic detection device 12 in the configuration of the previous embodiment, and the other configuration is common.

The procedure of the electronic component mounting method by the electronic component mounting machine B having the above configuration will be described with reference to the flowchart shown in FIG.

When the power of the electronic component mounting machine B is turned on, the identification memory 13 of the electronic component supply reel 15 is recognized by the component supply reel detecting device 16 (S11), and based on the recognition data, the NC data of the corresponding characteristic electronic component is obtained. This is selected, and the mounting operation is started (S12). First, when the printed circuit board 1 is loaded on the XY table 2 (S13),
The position and orientation of the printed board are recognized by the board mark recognition device 4 (S14). Next, the mounting head 5 sucks and holds the characteristic electronic component 9 from the electronic component supply reel 15 (S1).
5), the suction posture is recognized by the component recognition device 10 (S16). The mounting position is determined by the positioning operation of the XY table 2 and the mounting head 5 from the data obtained by recognizing the position of the printed circuit board 1 and the posture of the characteristic electronic component 9 (S17), and the components are mounted (S18). The above-described component mounting process is similarly performed for the peripheral electronic component 14.

In the above-mentioned component mounting step, when the supply component has run out of components (S19), the replacement operation of the electronic component supply reel 15 for the corresponding electronic component is performed (S2).
0).

The replacement of the electronic component supply reel 15 is performed by placing the replacement electronic component supply reel 15 on the component supply unit 6.
Is prepared, the reel is switched to a new electronic component supply reel 15 when the component runs out. When the electronic component in which the component has run out is the characteristic electronic component 9 (S21), the identification memory 13 is recognized by the component supply reel detecting device 16 when the electronic component supply reel 15 is switched, so that the recognized characteristic is obtained at the time of restart. N corresponding to rank
The C data is set (S22), and the operation of picking up components from step S15 is started. This mounting operation is repeated until a predetermined number of mountings on the printed circuit board 1 are completed.

In each of the embodiments described above, examples of the electronic component mounters A and B using a rotary head have been described. However, the present invention can be similarly applied to electronic component mounters having other configurations.

[0033]

As described above, according to the first aspect of the present invention, since the characteristic mark for identifying the characteristic rank is attached to the characteristic electronic component, the NC data corresponding to the characteristic rank is recognized by recognizing the characteristic mark. Is selected, and the mounting of the peripheral electronic component corresponding to the characteristic rank of the characteristic electronic component is executed. Therefore, the change in the characteristic rank of the characteristic electronic component is automatically recognized, and the NC data is switched in response to the change. Therefore, it is possible to change the characteristic electronic component without the need for manual operation and during the mounting of the multi-surface board. It can be easily handled.

In the above configuration, the recognition of the identification mark can be executed by the recognition means of the substrate position mark. In particular, the cost can be reduced without providing the recognition means of the identification mark. letter,
It can be formed by symbols and can be arbitrarily selected according to the number of sections of the characteristic rank.

According to the second aspect of the present invention, since the identification mark is attached to the electronic component supply means for supplying the characteristic electronic component, the NC mark corresponding to the characteristic rank of the characteristic electronic component can be recognized by recognizing the identification mark. The selected peripheral component is mounted corresponding to the characteristic rank of the characteristic electronic component. Therefore, the change of the characteristic electronic component is automatically recognized, and the NC data is switched correspondingly.
It is possible to cope with a change in the characteristic electronic component without manual intervention.

The identification mark is recognized when the power of the electronic component mounting machine is turned on, when the model of the printed circuit board to be manufactured is changed, and when the electronic component supply means is replaced. The corresponding NC data is automatically switched by the electronic component supply means mounted on the electronic component mounter.

[Brief description of the drawings]

FIG. 1 is an exemplary flowchart showing the procedure of an electronic component mounting method according to a first embodiment;

FIG. 2 is a perspective view showing a configuration of the electronic component mounter according to the first embodiment.

FIG. 3 is a plan view showing an example of a multiple board to which the electronic component mounting method is applied.

FIG. 4 is an exemplary perspective view showing a configuration of an electronic component mounter according to a second embodiment;

FIG. 5 is an exemplary flowchart showing the procedure of the electronic component mounting method according to the second embodiment;

FIG. 6 is a block diagram illustrating characteristic rank division of characteristic electronic components according to the related art.

FIG. 7 is a flowchart illustrating an electronic component mounting method according to the related art.

[Explanation of symbols]

 Reference Signs List 1 printed board 3 board mark 4 board mark recognition device 5 mounting head 8, 15 electronic component supply reel (electronic component supply means) 9, 9a, 9b characteristic electronic component 11 characteristic mark 12 characteristic detection device 13 identification memory (identification mark) 14 , 14a, 14b Peripheral electronic components 16 Component supply reel detection device

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yasutaka Tsuboi 1006 Kazuma Kadoma, Kadoma City, Osaka Inside Matsushita Electric Industrial Co., Ltd.

Claims (5)

[Claims] The printed circuit board is positioned at a predetermined position by recognizing a substrate mark provided on the printed circuit board. An electronic component mounting method for mounting by changing a peripheral electronic component to be provided, wherein a characteristic mark for identifying a characteristic rank of the characteristic electronic component is attached to the characteristic electronic component, and the peripheral electronic component is changed in accordance with the characteristic rank. An electronic component comprising: creating NC data of component mounting to be mounted by mounting the peripheral electronic component by selecting the NC data corresponding to the recognized characteristic rank by recognizing the characteristic mark. Implementation method. 2. The electronic component mounting method according to claim 1, wherein the recognition of the characteristic mark is performed by also using the recognition means of the substrate mark. 3. The electronic component mounting method according to claim 1, wherein the characteristic mark is formed by a bar code, a character, or a symbol. 4. An electronic component mounted by changing peripheral electronic components arranged around the characteristic electronic component corresponding to the characteristic rank of the characteristic electronic component having the characteristic rank on the printed circuit board carried into the mounting position. In the mounting method, an identification mark for identifying the characteristic rank of the characteristic electronic component is attached to an electronic component supply unit that supplies the characteristic electronic component for each characteristic rank, and the peripheral electronic component is changed and mounted according to the characteristic rank. An electronic component mounting method, wherein NC data for component mounting is created and the NC data corresponding to the recognized characteristic rank is selected and mounted by recognizing the identification mark. 5. The electronic device according to claim 4, wherein the recognition of the identification mark is performed when the power of the electronic component mounting machine is turned on, when the model of the printed circuit board to be manufactured is switched, and when the electronic component supply means is replaced. Component mounting method.