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JP2002076543A - Printed board - Google Patents

Printed board

Info

Publication number
JP2002076543A
JP2002076543A JP2000268181A JP2000268181A JP2002076543A JP 2002076543 A JP2002076543 A JP 2002076543A JP 2000268181 A JP2000268181 A JP 2000268181A JP 2000268181 A JP2000268181 A JP 2000268181A JP 2002076543 A JP2002076543 A JP 2002076543A
Authority
JP
Japan
Prior art keywords
relay
relays
board body
board
identification mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000268181A
Other languages
Japanese (ja)
Other versions
JP3829606B2 (en
Inventor
Hiroaki Masaoka
広明 正岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2000268181A priority Critical patent/JP3829606B2/en
Publication of JP2002076543A publication Critical patent/JP2002076543A/en
Application granted granted Critical
Publication of JP3829606B2 publication Critical patent/JP3829606B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent erroneously mounting by clarifying mounting positions of a plurality of electronic components without introducing a large increase in cost. SOLUTION: A printed board mounts relays 12 and 13 of the electronic components on a board body 11. In order to clarify at which of two blocks C and D on the body 11 the relay 12 has to be mounted, identification marks 16 and 17 are respectively provided on the one relay 12 and the block C to be mounted with the relay 12 by screen printing.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は自動車用の電子・電
気回路等に使用されるプリント基板に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board used for electronic and electric circuits for automobiles.

【0002】[0002]

【従来の技術】基板本体に複数のリレーを実装する場合
を例にとって従来の技術とその問題点を説明する。
2. Description of the Related Art A conventional technique and its problems will be described by taking as an example a case where a plurality of relays are mounted on a board body.

【0003】図4において、1は基板本体で、ここでは
この基板本体1に容量や用途等の仕様が異なる二種類の
リレー2,3を実装する場合を例示している。
In FIG. 4, reference numeral 1 denotes a board main body, and here, an example is shown in which two types of relays 2 and 3 having different specifications such as capacity and application are mounted on the board main body 1.

【0004】両リレー2,3にはリード端子2a…,3
a…、基板本体1には両リレー2,3が実装される四角
形の二つの区画A,Bに端子穴4…,5…がそれぞれ設
けられ、リード端子2a…,3a…が端子穴4…,5…
に挿入されて両リレー2,3が基板本体1上に取付けら
れる。
The relays 2 and 3 have lead terminals 2a.
.., the substrate body 1 is provided with terminal holes 4... 5 in two rectangular sections A and B on which both relays 2 and 3 are mounted, and the lead terminals 2 a. , 5 ...
And the relays 2 and 3 are mounted on the board main body 1.

【0005】[0005]

【発明が解決しようとする課題】一般にリレーは、その
容量や用途等の仕様により、接点の材質を選定し設計す
るものであって、単純に外形が似ているからといって他
のリレーと置き換えることはできない。
Generally, a relay is designed by selecting the material of the contact according to the specifications such as the capacity and the purpose of use. It cannot be replaced.

【0006】ところが、両リレー2,3の色、形、サイ
ズ等が同じで外観での識別が不能乃至は困難な場合、人
手による実装作業時に両リレー2,3の実装位置を取り
違えるおそれがあった。また、機械で実装する場合で
も、実装機にセットするときに間違えるおそれがあっ
た。
However, if the colors, shapes, sizes, and the like of the two relays 2 and 3 are the same and cannot be distinguished or difficult in appearance, there is a possibility that the mounting positions of the two relays 2 and 3 may be mistaken during the mounting operation by hand. Was. In addition, even when mounting is performed by a machine, there is a possibility that a mistake may be made when setting the mounting device.

【0007】この実装ミスが生じた場合、両リレー2,
3のコイル抵抗が異なっていれば検査工程で電気的に検
出できるが、コイル抵抗が同じで仕様(たとえば接点材
料)が異なる場合には、検査工程の検出が不可能で間違
ったまま市場に出てしまい、リレー2,3が負荷に適合
せずに寿命が短くなるおそれがある。
When this mounting error occurs, both relays 2,
If the coil resistance of No. 3 is different, it can be detected electrically in the inspection process. However, if the coil resistance is the same and the specifications (for example, contact materials) are different, it is impossible to detect the inspection process and it will go to the market incorrectly. As a result, there is a possibility that the life of the relays 2 and 3 is shortened because the relays 2 and 3 do not match the load.

【0008】なお、両リレー2,3について全体の色や
形を違わせてリレー全体の外観で識別できるようにする
ことが考えられるが、こうすると、素材や型を別にしな
ければならないため製造コストが高くなってしまう。
Incidentally, it is conceivable to make the two relays 2 and 3 different in overall color and shape so that they can be distinguished from each other by the appearance of the entire relay. The cost increases.

【0009】このような事情はリレーに限らず、マイク
ロコンピュータ等を含めて外観による識別が困難な各種
電子部品を実装する場合に共通してあり、この点の解決
が待たれていた。
Such a situation is not limited to the relay, but is common to the mounting of various electronic components, such as microcomputers, which are difficult to identify by appearance, and a solution to this problem has been awaited.

【0010】そこで本発明は、大幅なコストアップを招
かずに、複数の電子部品の実装位置を明示して誤実装を
防止することができるプリント基板を提供するものであ
る。
Accordingly, the present invention is to provide a printed circuit board that can prevent erroneous mounting by specifying mounting positions of a plurality of electronic components without significantly increasing the cost.

【0011】[0011]

【課題を解決するための手段】請求項1の発明は、プリ
ント配線が施された基板本体に複数の電子部品が実装さ
れて成るプリント基板において、上記各電子部品を上記
基板本体のどの位置に実装すべきかを表示するための識
別マークが、電子部品、及び基板本体における電子部品
実装部分に設けられたものである。
According to a first aspect of the present invention, there is provided a printed circuit board in which a plurality of electronic components are mounted on a board body on which printed wiring is provided. An identification mark for indicating whether or not to mount the electronic component is provided on the electronic component and the electronic component mounting portion of the board body.

【0012】請求項2の発明は、請求項1の構成におい
て、電子部品がリレーであり、このリレー、及び基板本
体におけるこのリレーの実装部分に識別マークが設けら
れたものである。
According to a second aspect of the present invention, in the configuration of the first aspect, the electronic component is a relay, and an identification mark is provided on the relay and a mounting portion of the relay on the board body.

【0013】請求項3の発明は、請求項1または2の構
成において、基板本体における電子部品実装部分の識別
マークがスクリーン印刷によって印刷されたものであ
る。
According to a third aspect of the present invention, in the configuration of the first or second aspect, the identification mark of the electronic component mounting portion on the substrate body is printed by screen printing.

【0014】上記のように、電子部品(請求項2ではリ
レー)を基板本体上のどの位置に実装すべきかを表示す
るための識別マークを電子部品と基板本体に設けている
ため、この識別マークに従って電子部品を実装すること
によって誤実装を防止することができる。
As described above, since the identification mark for indicating where the electronic component (relay in the second aspect) should be mounted on the substrate main body is provided on the electronic component and the substrate main body, the identification mark is provided. By mounting electronic components according to the above, erroneous mounting can be prevented.

【0015】しかも、部品全体の色や形を変えるなど全
体の外観で識別させるのではなく、識別マークを付する
だけでよいため、そのためのコストも最低限に安くてす
む。
In addition, since it is only necessary to attach an identification mark, instead of changing the color or shape of the entire part, such as by changing the color or shape of the whole part, the cost for this can be minimized.

【0016】この場合、請求項3のように基板本体にお
ける電子部品実装部分の識別マークをスクリーン印刷で
付与すれば、基板本体の製造工程中でマークを付与でき
るため、より低コストに抑えることができる。
In this case, if the identification mark of the electronic component mounting portion on the board body is provided by screen printing as in claim 3, the mark can be provided during the manufacturing process of the board body, so that the cost can be further reduced. it can.

【0017】[0017]

【発明の実施の形態】以下の実施形態では、従来技術の
説明に合わせて基板本体11上の二つの区画C,Dに二
種類のリレー12,13をリード端子12a…,13a
…と端子穴14…,15…によって取付ける場合を例示
している。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following embodiment, two types of relays 12, 13 are connected to two sections C, D on a substrate body 11 in accordance with the description of the prior art.
, And terminal holes 14, 15,.

【0018】各実施形態において、基板本体11及び両
リレー12,13に、この両リレー12,13を基板本
体11上のどの位置に実装すべきかを表示するための識
別マークがスクリーン印刷(たとえばシルクスクリーン
印刷)によって設けられている。
In each embodiment, an identification mark for indicating at which position on the board body 11 the two relays 12 and 13 are to be mounted is printed on the board body 11 and both relays 12 and 13 by screen printing (for example, silk printing). Screen printing).

【0019】すなわち、図1に示す第1実施形態におい
ては、第1リレー12の上面と、同リレー12が取付け
られる第1区画Cに、それぞれ横長長方形の同一の識別
マーク16,17が設けられ、第2リレー13及び第2
区画Dには何も設けられていない。
That is, in the first embodiment shown in FIG. 1, the same identification marks 16 and 17 each having a horizontally long rectangle are provided on the upper surface of the first relay 12 and the first section C where the relay 12 is mounted. , The second relay 13 and the second
Nothing is provided in the section D.

【0020】こうすれば、第1リレー12はマーク1
6,17が有るもの同士として第1区画Cに設置され、
第2リレー13はノーマーク同士として第2区画Dに設
置されるべきことが一目で判るため、取り違えて実装さ
れるおそれがない。
In this case, the first relay 12 is connected to the mark 1
Are installed in the first section C as those having 6, 17;
At a glance, it is clear that the second relays 13 should be installed in the second section D as no-marks, so there is no risk of being mounted by mistake.

【0021】一方、図2に示す第2実施形態において
は、第1リレー12及び第1区画Cにそれぞれ「○」印
の識別マーク18,19、第2リレー13及び第2区画
Dにそれぞれ「□」印の識別マーク20,21が付与さ
れている。
On the other hand, in the second embodiment shown in FIG. 2, the first relay 12 and the first section C are marked with "O" identification marks 18 and 19, respectively, and the second relay 13 and the second section D are marked with "." The identification marks 20 and 21 marked with “□” are provided.

【0022】図3に示す第3実施形態においては、第1
リレー12と第1区画Cが左側に位置することから、こ
れらに「左側」の英文字「LEFT」の頭文字「L」の
識別マーク22,23が設けられ、第2リレー13と第
2区画Dに同「右側」の英文字「RIGHT」の頭文字
「R」の識別マーク24,25が設けられている。
In the third embodiment shown in FIG.
Since the relay 12 and the first section C are located on the left side, they are provided with the identification marks 22 and 23 of the initial letter “L” of the English letter “LEFT” of “left side”, and the second relay 13 and the second section C are provided. D is provided with identification marks 24, 25 of the initial letter "R" of the English letter "RIGHT" of the "right side".

【0023】このように両リレー12,13と基板本体
11の双方に相対応する識別マークを付与すれば、マー
クの有無だけでなくマークの異同によってリレー設置位
置をより明確に表示できるため、誤実装を防止する効果
が高いものとなる。
If the corresponding identification marks are given to both the relays 12 and 13 and the substrate body 11 as described above, the relay installation position can be displayed more clearly not only by the presence / absence of the mark but also by the difference of the mark. The effect of preventing mounting is high.

【0024】なお、第1、第2両実施形態の識別マーク
16,17,18,19は、マーク全体をリレーの地色
と区別できる色で塗りつぶしてもよいし、マーク周囲を
線で囲んでもよい。
The identification marks 16, 17, 18, and 19 in both the first and second embodiments may be painted in a color that can be distinguished from the ground color of the relay, or may be surrounded by a line around the mark. Good.

【0025】その他の実施形態 (1)上記実施形態では、リレー側と基板本体側に同一
の識別マークを設けたが、たとえばリレー側に製品番号
が表示されている場合に基板本体側にその下二桁の番号
を付与する等、リレー側と基板本体側に異なるマークを
付与してもよい。
Other Embodiments (1) In the above embodiment, the same identification mark is provided on the relay side and the board main body side. However, for example, when a product number is displayed on the relay side, a lower part is provided on the board main body side. Different marks may be given to the relay side and the board body side, such as giving a two-digit number.

【0026】(2)識別マークとして、両リレー12,
13の一面(たとえば上面)及び区画C,Dの全体を着
色してもよい。
(2) Both relays 12,
One surface (for example, the upper surface) of 13 and the entire sections C and D may be colored.

【0027】(3)基板本体11及びリレー12,13
に対する識別マークの付与手段として、スクリーン印刷
法以外の印刷法をとってもよいし、粘着テープを貼り付
け、あるいは薄いプレートを接着してもよい。
(3) Substrate body 11 and relays 12 and 13
A printing method other than the screen printing method may be used as a means for providing an identification mark to the image forming apparatus, an adhesive tape may be attached, or a thin plate may be attached.

【0028】(4)上記実施形態では基板本体11上に
二つのリレー12,13を実装する場合を例示したが、
本発明は三つ以上のリレーを実装する場合も、またリレ
ー以外の電子部品(たとえばマイクロコンピュータ)を
実装する場合にも上記実施形態と同様に実施することが
できる。
(4) In the above embodiment, the case where the two relays 12 and 13 are mounted on the board main body 11 is exemplified.
The present invention can be implemented in the same manner as in the above-described embodiment even when three or more relays are mounted, and when electronic components other than relays (for example, a microcomputer) are mounted.

【0029】[0029]

【発明の効果】上記のように本発明によるときは、電子
部品と基板本体に識別マークを設け、この識別マークに
よって、リレー等の電子部品を基板本体上のどの位置に
実装すべきかを明示する構成としたから、電子部品の誤
実装を防止することができる。
As described above, according to the present invention, an identification mark is provided on the electronic component and the board body, and the identification mark clearly indicates at which position on the board body the electronic component such as a relay is to be mounted. With this configuration, erroneous mounting of electronic components can be prevented.

【0030】しかも、部品全体の色や形を変えるなど全
体の外観で識別させるのではなく、識別マークを付する
だけでよいため、コストアップも最小限ですむ。
Further, the identification is not required to be made based on the overall appearance, such as by changing the color or shape of the entire part, but the identification mark only needs to be attached, thereby minimizing the cost increase.

【0031】この場合、請求項3の発明のように基板本
体における電子部品実装部分の識別マークをスクリーン
印刷で付与すれば、基板本体の製造工程中でマークを付
与できるため、より低コストに抑えることができる。
In this case, if the identification mark of the electronic component mounting portion on the board body is provided by screen printing as in the invention of claim 3, the mark can be provided during the manufacturing process of the board body, so that the cost can be further reduced. be able to.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1実施形態を示す斜視図である。FIG. 1 is a perspective view showing a first embodiment of the present invention.

【図2】本発明の第2実施形態を示す斜視図である。FIG. 2 is a perspective view showing a second embodiment of the present invention.

【図3】本発明の第3実施形態を示す斜視図である。FIG. 3 is a perspective view showing a third embodiment of the present invention.

【図4】従来例を示す斜視図である。FIG. 4 is a perspective view showing a conventional example.

【符号の説明】[Explanation of symbols]

11 基板本体 14,15 端子穴 12,13 電子部品としてのリレー 12a…,13a… リード端子 16,18,20,22,24 リレー側の識別マーク 17,19,21,23,25 基板本体側の識別マー
11 Board body 14,15 Terminal hole 12,13 Relay 12a ..., 13a ... Lead terminal 16,18,20,22,24 Identification mark on relay side 17,19,21,23,25 On board body side Identifying mark

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 プリント配線が施された基板本体に複数
の電子部品が実装されて成るプリント基板において、上
記各電子部品を上記基板本体のどの位置に実装すべきか
を表示するための識別マークが、電子部品、及び基板本
体における電子部品実装部分に設けられたことを特徴と
するプリント基板。
In a printed circuit board in which a plurality of electronic components are mounted on a board body on which printed wiring is provided, an identification mark for indicating a position on the board body at which each of the electronic components is to be mounted is provided. And a printed circuit board provided on an electronic component mounting portion of the board body.
【請求項2】 電子部品がリレーであり、このリレー、
及び基板本体におけるこのリレーの実装部分に識別マー
クが設けられたことを特徴とする請求項1記載のプリン
ト基板。
2. The electronic component is a relay.
2. The printed circuit board according to claim 1, wherein an identification mark is provided on a mounting portion of the relay on the board body.
【請求項3】 基板本体における電子部品実装部分の識
別マークがスクリーン印刷によって印刷されたことを特
徴とする請求項1または2記載のプリント基板。
3. The printed board according to claim 1, wherein the identification mark of the electronic component mounting portion on the board body is printed by screen printing.
JP2000268181A 2000-09-05 2000-09-05 Printed board Expired - Fee Related JP3829606B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000268181A JP3829606B2 (en) 2000-09-05 2000-09-05 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000268181A JP3829606B2 (en) 2000-09-05 2000-09-05 Printed board

Publications (2)

Publication Number Publication Date
JP2002076543A true JP2002076543A (en) 2002-03-15
JP3829606B2 JP3829606B2 (en) 2006-10-04

Family

ID=18754989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000268181A Expired - Fee Related JP3829606B2 (en) 2000-09-05 2000-09-05 Printed board

Country Status (1)

Country Link
JP (1) JP3829606B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008155866A1 (en) * 2007-06-18 2008-12-24 Sumitomo Wiring Systems, Ltd. In-vehicle electrical instrument and in-vehicle electrical instruments
JP2009188156A (en) * 2008-02-06 2009-08-20 Canon Inc Printed wiring board
JP2012099670A (en) * 2010-11-02 2012-05-24 Sumitomo Wiring Syst Ltd Mounting substrate
JP2012116478A (en) * 2011-12-27 2012-06-21 Sumitomo Wiring Syst Ltd Onboard electric equipment group
JP2012160530A (en) * 2011-01-31 2012-08-23 Kyocera Document Solutions Inc Board device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008155866A1 (en) * 2007-06-18 2008-12-24 Sumitomo Wiring Systems, Ltd. In-vehicle electrical instrument and in-vehicle electrical instruments
JP2008308132A (en) * 2007-06-18 2008-12-25 Sumitomo Wiring Syst Ltd On-vehicle electric equipment, and on-vehicle electric equipment group
JP2009188156A (en) * 2008-02-06 2009-08-20 Canon Inc Printed wiring board
JP2012099670A (en) * 2010-11-02 2012-05-24 Sumitomo Wiring Syst Ltd Mounting substrate
JP2012160530A (en) * 2011-01-31 2012-08-23 Kyocera Document Solutions Inc Board device
JP2012116478A (en) * 2011-12-27 2012-06-21 Sumitomo Wiring Syst Ltd Onboard electric equipment group

Also Published As

Publication number Publication date
JP3829606B2 (en) 2006-10-04

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