JPH10135584A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH10135584A JPH10135584A JP28808696A JP28808696A JPH10135584A JP H10135584 A JPH10135584 A JP H10135584A JP 28808696 A JP28808696 A JP 28808696A JP 28808696 A JP28808696 A JP 28808696A JP H10135584 A JPH10135584 A JP H10135584A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- connector
- board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、自動半田付け装置
等自動機に適したプリント配線板特に半田付け作業の質
向上に資するプリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board suitable for an automatic machine such as an automatic soldering apparatus, and more particularly to a printed wiring board which contributes to improving the quality of a soldering operation.
【0002】[0002]
【従来の技術】従来のプリント配線板例を図4、図5に
示す。図4において10はプリント配線板、20はプリ
ント配線板に搭載され、その本体の一部がプリント配線
板10外にはみ出した電子部品、20aは電子部品のリ
ード、50はプリント配線板10に設けられた部品取り
付け用スルーホール、80は電子部品を溶融半田より保
護するマスキングテープである。2. Description of the Related Art FIGS. 4 and 5 show examples of conventional printed wiring boards. In FIG. 4, reference numeral 10 denotes a printed wiring board, reference numeral 20 denotes an electronic component mounted on the printed wiring board, a part of the body of which protrudes outside the printed wiring board 10, reference numeral 20a denotes a lead of the electronic component, and reference numeral 50 denotes a printed wiring board. The provided through holes 80 for attaching components are masking tapes for protecting the electronic components from the molten solder.
【0003】図5は図4の上面図である。通常プリント
配線板10に電子部品20を取り付けるには、プリント
配線板10に設けられたスルーホール50に電子部品2
0の接続リード20aを挿入し、溶融した半田槽にプリ
ント配線板10を浸す半田浴等によって電子部品20が
プリント配線板10に接続固定される。ところで半田浴
時、電子部品20の本体の一部がプリント配線板10よ
りはみ出している場合は、そのはみ出した本体の一部に
直接溶融した半田やフラックスが触れることになり、電
子部品20の破損や汚れの危険性があるため、従来はマ
スキングテープ80を電子部品20のはみ出した部分に
貼りつけることにより電子部品20を保護し、その破損
や汚れを防止していた。また、手半田付けによる後付け
などで行なうこともあるがいずれも工数がかかり効率が
悪かった。FIG. 5 is a top view of FIG. Normally, to mount the electronic component 20 on the printed wiring board 10, the electronic component 2 is inserted into a through hole 50 provided in the printed wiring board 10.
The electronic component 20 is connected and fixed to the printed wiring board 10 by inserting a connection lead 20a of No. 0 and dipping the printed wiring board 10 in a molten solder bath. By the way, when a part of the main body of the electronic component 20 protrudes from the printed wiring board 10 during the solder bath, molten solder or flux directly touches the part of the protruding main body, and the electronic component 20 is damaged. Conventionally, the masking tape 80 has been applied to the protruding portion of the electronic component 20 to protect the electronic component 20 and prevent the electronic component 20 from being damaged or stained. In some cases, it is performed by hand soldering or the like, but in each case, the number of steps is increased and the efficiency is low.
【0004】また、電子部品20がプリント配線板10
からはみ出す設計になっているとチップマウント機、自
動挿入機、自動半田付け装置等(図示せず)にプリント
配線板10を装着するのに邪魔になることがあり、効率
が落ちる場合もあるし、プリント配線板10から電子部
品20がはみ出していると搬送中にはみ出した電子部品
20に自動装置の一部が接触したり、電子部品20同志
が接触したりして位置ずれを起こしたり、落下したりす
る恐れがあった。一方、面実装部品の自動挿入において
は、主基板の位置決めが必要であり、従来、位置決めの
ために捨て基板を主基板と連結して捨て基板に位置決め
手段を設け製造に供していた。そして、自動挿入による
面実装部品の位置精度はこの位置決め手段の基準位置か
ら近ければ近いほど、精度良く挿入できた。The electronic component 20 is connected to the printed wiring board 10.
If it is designed to protrude, it may hinder the mounting of the printed wiring board 10 on a chip mounter, an automatic inserter, an automatic soldering device (not shown), and the efficiency may be reduced. If the electronic component 20 protrudes from the printed wiring board 10, a part of the automatic device contacts the protruding electronic component 20 during transportation, or the electronic components 20 come into contact with each other, causing a displacement or a drop. There was a fear of doing. On the other hand, in automatic insertion of a surface mount component, positioning of a main board is necessary. Conventionally, a discarded board is connected to the main board for positioning, and positioning means is provided on the discarded board for production. The position accuracy of the surface-mounted component by automatic insertion was higher as the position was closer to the reference position of the positioning means.
【0005】[0005]
【発明が解決しようとする課題】従来のプリント配線板
では、プリント配線板外にはみ出した電子部品を半田付
けする場合、はみ出し部を半田やフラックスから保護す
るためにマスキングテープを用いる必要があり、マスキ
ングテープを装着や脱着するために半田付けの作業性を
低下させていた。また、電子部品がプリント配線板から
はみ出すとその部分が何かに当たって搬送中にセット位
置からずれたり落下する原因にもなっていた。また、自
動半田付け装置等自動装置にプリント配線板を装着する
場合の治具に変更を必要とする場合などがあった。In the conventional printed wiring board, when soldering an electronic component protruding outside the printed wiring board, it is necessary to use a masking tape to protect the protruding portion from solder or flux. The workability of soldering was reduced because the masking tape was attached and detached. Further, when the electronic component protrudes from the printed wiring board, the portion hits something and causes a shift from the set position or a drop during transportation. In some cases, it is necessary to change a jig for mounting a printed wiring board on an automatic device such as an automatic soldering device.
【0006】一方、電子部品近傍の面実装部品は実装密
度が高く、位置決め精度が他の部分よりも要求される場
合がある。例えば多極コネクタを高密度に配置した場合
である。また、コネクタには外力が加わるが、この外力
によって微妙に面実装部品に加わる応力が変動するた
め、面実装部品を最適位置に位置決め精度良く配置する
必要がある場合がある。さらに、コネクタ部分が金属シ
ャーシ等でシールドされる必要がある場合には狭い区画
内に高密度な面実装部品の高精度な位置決めが要求され
る。そして、コネクタ自体を面実装するときには他の電
子機器との接続を良好に行なうべくコネクタ自体の位置
決め精度が良くなければならない。[0006] On the other hand, surface mount components in the vicinity of electronic components have a high mounting density and may require higher positioning accuracy than other parts. For example, this is a case where multi-pole connectors are arranged at high density. In addition, although an external force is applied to the connector, the stress applied to the surface-mounted component delicately fluctuates due to the external force. Therefore, it may be necessary to arrange the surface-mounted component at an optimum position with high positioning accuracy. Further, when the connector portion needs to be shielded by a metal chassis or the like, high-precision positioning of a high-density surface mount component in a narrow section is required. When the connector itself is surface-mounted, the positioning accuracy of the connector itself must be good in order to make a good connection with other electronic devices.
【0007】[0007]
【課題を解決するための手段】本発明は上記問題を解決
するために、コネクタを備えた主基板と捨て基板とから
なるプリント配線板において、該コネクタはその一部を
該主基板から該捨て基板側にはみ出しており、該主基板
と該捨て基板とが分割用溝にて連結され、面実装部品挿
入のための自動装置用位置決め手段が該捨て基板に設け
られたプリント配線板を提供する。また、前記分割用溝
はその深さが該プリント配線板の下面側の方が上面側よ
り深いプリント配線板を提供する。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a printed wiring board comprising a main board provided with a connector and a discarded board, wherein a part of the connector is discarded from the main board. Provided is a printed wiring board which protrudes to the board side, wherein the main board and the discarded board are connected by a dividing groove, and positioning means for an automatic device for inserting a surface mount component is provided on the discarded board. . Further, the dividing groove provides a printed wiring board whose depth is lower on the lower surface side of the printed wiring board than on the upper surface side.
【0008】[0008]
【発明の実施の形態】以下本発明の一実施例を図1、図
2について説明する。図1において1はプリント配線
板、1aは主基板、2はコネクタ、2aはコネクタのリ
ード、3はプリント配線板1に設けられた捨て基板、4
a、4bはプリント配線板1と捨て基板3を容易に分割
可能にする上側分割溝と下側分割溝、5はプリント配線
板1に設けられたスルーホール、6は捨て基板に設けら
れた位置決め用孔、7はプリント配線板を固定するピ
ン、8ははんだ付け時のフラックスである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. In FIG. 1, 1 is a printed wiring board, 1a is a main board, 2 is a connector, 2a is a connector lead, 3 is a discarded board provided on the printed wiring board 1, 4
Reference numerals a and 4b denote upper and lower dividing grooves for easily dividing the printed wiring board 1 and the discarded board 3, 5 through holes provided in the printed wiring board 1, and 6 to positioning provided on the discarded board. Holes, 7 are pins for fixing the printed wiring board, and 8 is a flux at the time of soldering.
【0009】図2は図1の側断面図である。プリント配
線板1にコネクタ2を取り付けるに÷、先ず、主基板1
aに延設して設けられた捨て基板3の位置決め用孔6を
電子部品自動挿入装置のプリント配線板固定治具のピン
7にセットしプリント配線板1を固定する。そして、主
基板1aに設けられたスルーホール5にコネクタ2の接
続リード2aを挿入し、部品挿入を終える。この際、面
実装部品は位置決め用孔6の近くであればあるほど精度
良く位置決めができるので、多極コネクタを高密度に配
置した場合などの面実装部品の位置決め精度を高くする
ことが可能である。FIG. 2 is a side sectional view of FIG. To attach the connector 2 to the printed wiring board 1, first, the main board 1
The positioning hole 6 of the discarded board 3 provided to extend to a is set to the pin 7 of the printed wiring board fixing jig of the electronic component automatic insertion device, and the printed wiring board 1 is fixed. Then, the connection lead 2a of the connector 2 is inserted into the through hole 5 provided in the main board 1a, and the component insertion is completed. At this time, the closer the positioning hole 6 is to the surface mounting component, the more accurate the positioning can be. Therefore, it is possible to increase the positioning accuracy of the surface mounting component when the multi-pole connector is arranged at a high density. is there.
【0010】また、位置決め精度良く設計値通りに配置
してあればコネクタ2に外力が加わっても他の面実装部
品に応力が加わって性能を害なうことがないし、シール
ド効果も設計値通りに期待できる。また、コネクタ自体
も精度良く配置されていれば他の電子機器との接続もス
ムーズにおこなえることになる。次にコネクタを搭載し
たプリント配線板1を固定治具ごと次工程の自動半田装
置にかけるが主基板1aよりはみ出したコネクタ2も捨
て基板3の内側に位置するので搬送中に何かに当たって
ずれたり落下したりはしない。In addition, if the connector 2 is arranged with good positioning accuracy according to the design value, even if an external force is applied to the connector 2, stress is not applied to other surface-mounted components and the performance is not impaired, and the shielding effect is also as designed. Can be expected. In addition, if the connectors themselves are arranged with high precision, the connection with other electronic devices can be performed smoothly. Next, the printed wiring board 1 on which the connector is mounted is mounted on the automatic soldering device of the next process together with the fixing jig, but the connector 2 protruding from the main board 1a is also located inside the discarded board 3 so that it may be misaligned by something during transportation. Do not fall.
【0011】次に、溶融したフラックス槽にプリント配
線板1の裏面を浸し、コネクタ2のリード2a等にフラ
ックス8を付着させる。この時、フラックス8が飛び跳
ねても捨て基板3に遮られてコネクタ2には付着しな
い。次に溶融した半田槽にプリント配線板1の裏面を浸
す。プリント配線板1からコネクタ2の本体の一部がは
み出しているが、この時もプリント配線板1に延設して
設けられた捨て基板3により直接溶融半田に触れること
はないしフラックス8が飛び跳ねてコネクタ2に付着す
ることもない。また、捨て基板3によってフラックス8
や半田の熱輻射でコネクタ2が特性を劣化させることも
ない。Next, the back surface of the printed wiring board 1 is immersed in a molten flux bath, and the flux 8 is adhered to the leads 2a and the like of the connector 2. At this time, even if the flux 8 jumps, it is blocked by the discard substrate 3 and does not adhere to the connector 2. Next, the back surface of the printed wiring board 1 is immersed in the molten solder bath. Although a part of the body of the connector 2 protrudes from the printed wiring board 1, the molten solder does not directly come into contact with the waste board 3 provided on the printed wiring board 1 and the flux 8 jumps. It does not adhere to the connector 2. In addition, the flux 8
Also, the connector 2 does not deteriorate its characteristics due to heat radiation of solder or the like.
【0012】このようにしてコネクタ2はプリント配線
板1に接続され半田固定される。半田付け工程が終了し
たのち、洗浄工程を経て、次工程に送られプリント配線
板1を治具に搭載したまま、あるいは治具より外して、
捨て基板3を主基板1aとの間に設けられた上側分割溝
4a及び下側分割溝4bを利用して、主基板1aより分
割し工程を完了する。分割用溝は下側分割溝4bが上側
分割溝4aより深く幅広に形成されているので捨て基板
3をコネクタ2のない下側に折り曲げるときに梃子の原
理で簡単に分割することができる。In this way, the connector 2 is connected to the printed wiring board 1 and fixed by soldering. After the soldering process is completed, a cleaning process is performed, and the process is sent to the next process, and the printed wiring board 1 is mounted on a jig or removed from the jig.
The discarded substrate 3 is divided from the main substrate 1a using the upper division groove 4a and the lower division groove 4b provided between the disposal substrate 3 and the main substrate 1a, and the process is completed. Since the lower dividing groove 4b is formed deeper and wider than the upper dividing groove 4a, the dividing groove can be easily divided by the principle of leverage when the discarded substrate 3 is bent downward without the connector 2.
【0013】また、個々に分割されたプリント配線板は
シャーシに固定されるときにシャーシ筐体からの半田付
け用舌片とプリント基板端部のアースパターンとが半田
付けされるが、上側分割溝が浅いためにシャーシ筐体と
プリント基板のアースパターンとの距離が近くなり半田
の橋絡が容易になり力のかかるコネクタ側の固定が強固
なものになる。なお、本発明中コネクタとは電気的接続
を目的とするものに限らず、光接続のごときものも含ま
れる。When the individually divided printed wiring board is fixed to the chassis, the tongue for soldering from the chassis and the ground pattern at the end of the printed circuit board are soldered. Due to the shallowness, the distance between the chassis case and the ground pattern of the printed circuit board becomes short, bridging of the solder becomes easy, and the fixing on the connector side where the force is applied becomes strong. In the present invention, the term "connector" is not limited to a connector for electrical connection, but also includes a connector for optical connection.
【0014】[0014]
【発明の効果】以上のように本発明によれば、プリント
配線板に主基板と捨て基板を設け、連続して繋がる分割
用溝にて連結し、この捨て基板に自動装置用位置決め手
段を設けたので、それを利用して正確な位置決めができ
部品挿入が効率良く行なわれる。また、主基板から延在
する捨て基板によって半田付け工程でフラックスや半田
がコネクタに付着することもなく、また輻射熱でコネク
タの特性を劣化させることもない、また、溝深さと溝幅
とを上下で違え、下側分割溝を深く幅広にすることによ
り捨て基板を下に折り曲げるときに簡単に分割ができる
しシャーシとの固定を強固なものにできる。As described above, according to the present invention, the main board and the discarded board are provided on the printed wiring board, connected by the continuous dividing groove, and the discarded board is provided with the positioning means for the automatic device. As a result, accurate positioning can be performed by utilizing this, and component insertion can be performed efficiently. In addition, flux and solder do not adhere to the connector during the soldering process due to the discarded board extending from the main board, and the characteristics of the connector are not deteriorated by radiant heat. By making the lower dividing groove deeper and wider, the substrate can be easily divided when the discarded substrate is bent downward, and the fixing to the chassis can be strengthened.
【図1】 本発明のプリント配線板の斜視図。FIG. 1 is a perspective view of a printed wiring board according to the present invention.
【図2】 図1の側断面図。FIG. 2 is a side sectional view of FIG.
【図3】 分割用溝の断面図。FIG. 3 is a sectional view of a dividing groove.
【図4】 従来のプリント配線板の側面図。FIG. 4 is a side view of a conventional printed wiring board.
【図5】 図4の上面図。FIG. 5 is a top view of FIG. 4;
1 プリント配線板 1a 主基板 2 コネクタ 3 捨て基板 4a 上側分割用溝 4b 下側分割用溝 6 位置決め手段 DESCRIPTION OF SYMBOLS 1 Printed wiring board 1a Main board 2 Connector 3 Discard board 4a Upper division groove 4b Lower division groove 6 Positioning means
Claims (2)
なるプリント配線板において、該コネクタはその一部を
該主基板から該捨て基板側にはみ出しており、該主基板
と該捨て基板とが分割用溝にて連結され、面実装部品挿
入のための自動装置用位置決め手段が該捨て基板に設け
られたことを特徴とするプリント配線板。1. A printed wiring board comprising a main board provided with a connector and a discarded board, wherein said connector has a part thereof protruding from said main board to said discarded board side. Are connected by dividing grooves, and positioning means for an automatic device for inserting a surface mount component is provided on the discarded substrate.
板の上面側より下面側の方が深く溝幅は上面側より下面
側の方が広いことを特徴とする請求項1記載のプリント
配線板。2. The printed wiring board according to claim 1, wherein the depth of the dividing groove is deeper on the lower surface side than on the upper surface side of the printed wiring board, and the groove width is wider on the lower surface side than on the upper surface side. Printed wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28808696A JPH10135584A (en) | 1996-10-30 | 1996-10-30 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28808696A JPH10135584A (en) | 1996-10-30 | 1996-10-30 | Printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10135584A true JPH10135584A (en) | 1998-05-22 |
Family
ID=17725616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28808696A Pending JPH10135584A (en) | 1996-10-30 | 1996-10-30 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10135584A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110430681A (en) * | 2019-07-26 | 2019-11-08 | 重庆伟鼎电子科技有限公司 | A kind of pin positioning method in PCB circuit board procedure for producing |
-
1996
- 1996-10-30 JP JP28808696A patent/JPH10135584A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110430681A (en) * | 2019-07-26 | 2019-11-08 | 重庆伟鼎电子科技有限公司 | A kind of pin positioning method in PCB circuit board procedure for producing |
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