JPH02148710A - Method of inserting and mounting circuit component with lead terminal - Google Patents

Abstract

PURPOSE:To utilize the wiring pattern surface of a circuit board efficiently and realize high density mounting of components by a method wherein lead terminals of the component are inserted into the circuit board and bite deformations are formed on the parts of the lead terminals protruding from the circuit board. CONSTITUTION:A circuit component 1 is mounted on a circuit board 3 and the parts of its lead terminals 2a and 2b protruding from insertion holes 3a are cut off at a dotted line. At that time, bite deformations 5 are formed on the terminals 2a and 2b. By forming the bite deformations 5, the component 1 is protected from coming out of the board 1 and fixed to the board 3 temporarily and mounted on the board 3 by soldering. At the time of solder dipping, the component 3 is protected from floating up caused by the pushing force of wave solder and secure solder dipping can be performed. Thus, by forming the bite deformations before soldering, spaces can be saved and high density component mounting can be realized compared to a conventional clinch-cut method which forms bent parts.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for inserting and assembling a circuit component having a lead terminal that is automatically inserted into a circuit board as an electronic circuit component.

[Conventional technology]

Conventionally, when a circuit component with a lead terminal is inserted into a circuit board and assembled using an automatic machine, the assembly shown in FIG. 3, for example, has been performed.

The following will be explained based on the drawings. FIG. 3 is a sectional view of a main part showing a state of conventional insertion and assembly.

In the figure, 1 is a circuit component such as a ceramic capacitor,
2 a % 2 b is its lead terminal, 3 is the circuit board,
3a is an insertion hole through which the lead terminals 2a and 2b are inserted;
are the bent portions of the lead terminals 2a, 2b.

Next, to describe the state of insertion and assembly, a plurality of circuit components 1 are sequentially stored in a cassette called a magazine, and the circuit components 1 are loaded into an automatic insertion machine as they are in the magazine. Then, the circuit board 3 is inserted by an automatic insertion machine.
Lead terminals 2a and 2b are inserted in the state shown by dotted lines in the figure. Next, the circuit component 1 inserted into the circuit board 3 has its lead terminals 2a, 2b in a state called clinch cut, that is, the excess lead terminals 2a, 2b protruding from the circuit board 3 are cut off at the same time. A bent portion 4 is formed by being bent along the board surface of the circuit board 3.

This is to hold the circuit component l in a temporarily fixed state so that it will not be lifted up by the solder during solder dipping.

Subsequently, with this bent portion 4 formed, the circuit component l is
The circuit component 1 is soldered to the circuit board 3 by solder-dipping the lead terminals 2a and 2b.

[Problem to be solved by the invention]

However, in the insertion structure of the conventional circuit components with lead terminals described above, since the lead terminals 2a and 2b are clinch-cut, the bent portions of the lead terminals 2a and 2b are formed on the wiring pattern surface of the circuit board 1. 4 will be formed. A space is required on the wiring pattern surface to form this bent portion 4 (space W in the figure).
For this reason, when the circuit components 1 are mounted on the circuit board 3 at high density, restrictions arise on the electrode portions of the wiring pattern, etc. In addition, there are restrictions on the placement and fixation of chi/knob components as surface mount types, and there is a limit to the component mounting density on the circuit board 1, creating the problem that there is a limit to miniaturization of the circuit board and high-density mounting. Ta.

The present invention was created to solve the above-mentioned problems.

[Means and operations for solving the problems] As a means for solving the above-mentioned problems, the present invention provides that temporary circuit assembly of circuit parts having lead terminals is performed during insertion, and the insertion of the inserted lead terminals. A bite is formed on the protruding portion of the circuit board to prevent the circuit components from being removed and to temporarily hold them on the circuit board.

By forming a bite on the lead terminal, the circuit component is temporarily held on the circuit board at the bite without forming a bend, which requires extra space on the wiring pattern surface for bending. Wiring patterns can be efficiently arranged without having to do so.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 are sectional views of essential parts showing an insertion process for assembling a circuit component with lead terminals according to an embodiment of the present invention.

Note that the same parts in FIGS. 1 and 2 as those shown in FIG. 3 will be described with the same reference numerals.

First, as shown in FIG. 1, a circuit component 1 having lead terminals 2a, 2b is assembled in an upright state by inserting the lead terminals 2a, 2b into the insertion holes 3a of a circuit board 3 by an automatic mounting machine.

Next, as shown in FIG. 2, the lead terminals 2a and 2b protruding from the insertion hole 3a of the circuit board 3 of the circuit component 1 assembled on the circuit board 3 are cut and removed at the part indicated by the dotted line in the figure. Ru. At the same time as this cutting, the lead terminal 2a
, 2b, a bite 5 is formed in the vicinity of the circuit board 3 of the protruding lead terminals 2a, 2b at the same time as cutting.

Subsequently, by forming this bite 5, the circuit component 1 is held and temporarily fixed to the circuit board 3 in a state where it cannot be removed, and from this state, soldering is performed using the solder dab 7, and the circuit board 3 is fixed. This will be assembled into 3.

During this soldering process, the bits 5 formed on the lead terminals 2 a s 2 b of the circuit component 1 prevent the circuit component 1 from lifting up due to the pushing up force generated by the solder jet during the soldering process, thereby ensuring reliable operation. Solder dip will be performed.

〔Effect of the invention〕

As described above, according to the present invention, after a circuit component having lead terminals is inserted and assembled into a circuit board, the insertion assembly is performed in which the excess lead terminals protruding from the circuit board are cut off while forming a bit. Since this method is used, circuit components can be reliably soldered without causing any floating during solder dipping. In addition, compared to the conventional clinch-cut method that forms bent parts, the circuit parts are inserted and assembled by forming a slit, which eliminates the need for extra space on the wiring pattern surface and eliminates the need for wiring. Pattern constraints are relaxed, making it possible to effectively utilize the wiring pattern surface of the circuit board for high-density circuit component mounting, and automatic insertion even with high-density component mounting. It has the following features.

[Brief explanation of the drawing]

Figures 1 and 2 are cross-sectional views of main parts showing the process of inserting and assembling a circuit component with lead terminals according to an embodiment of the present invention, and Figure 3 is a diagram showing the state of conventional circuit component insertion and assembly. FIG. 1...Circuit components, 2a, 2b...Lead terminals, 3.
...Circuit board, 3a...Insertion hole, 4...Bending part, 5
...chew.

Claims (1)

[Claims] An insertion assembly for a circuit component with a lead terminal, characterized in that, in inserting a circuit component having a lead terminal, a bite is formed on a protruding portion of the lead terminal after the lead terminal of the circuit component is inserted into a circuit board. How to attach.