JPH0334493A - Manufacture of circuit board - Google Patents

Abstract

PURPOSE:To simultaneously form many electronic circuits by simultaneously forming conductor patterns of a plurality of electronic components on a large- sized film sheet, then mounting electronic components for forming an electronic circuit, and then individually cutting the circuits. CONSTITUTION:After reference holes 11a, 11b, 11c for positioning at the times of printing a conductor pattern on a film sheet 10 of a size having a plurality of film sheet boards 6 and cutting the boards are provided, they are cleaned. Then, a plurality of conductive patterns are printed by a first conductive material made of silver, etc., and carbon of a second conductive material. Further, insulating resist film 6e to be insulated from an exterior is printed on a part of a wiring pattern 6b except an electrode terminal 6a, an IC mount 6d and a connector connecting part 6c. Then, a controller IC 8 is placed on the mount 6d, passed through a low temperature electric furnace, treated with reflow solder, connected, and bonded with conductive adhesive, and secured to the film sheet 10. Then, the sheet 10 is cut to the shape of necessary circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a WIJ manufacturing method for circuit boards, in particular to conventional technology relating to a method for manufacturing circuit boards using film sheets for connection to electrical equipment such as gaming computers, etc. As an operating device for electronic equipment, the real RKI63-1363
There is an apparatus described in Japanese Patent No. 91. This 111 is used as a remote controller, and various switch buttons are arranged on the top surface of the housing. A printed circuit board made of epoxy resin is held inside this housing.
An electrode terminal facing the switch button is formed on the printed circuit board. A conductive pattern extending from the electrode terminal is formed on the printed circuit board, and a connection cord connected to an electronic device is soldered to the terminal of the conductive pattern. When the switch button on the remote controller was pressed, conduction was established between the electrode terminals on the printed circuit board at the end of the switch button, a signal was sent to the electronic device via the connection cord, and the electronic Is operated according to the switch button. .

The circuit board built into the operating device for controlling such an electronic 831 device is an epoxy resin printed circuit board on which a conductive pattern has been formed in advance, and electronic components such as ICs (integrated circuits) are mounted thereon.

Problems to be Solved by the Invention However, conventionally, the circuit board built into the operating device for controlling this type of electronic equipment is an epoxy resin printed circuit board on which a conductive pattern is formed in advance and cut into individual circuit boards. Since electronic components such as ICs were mounted on the circuit board, the electronic components had to be mounted on each individual circuit board, which resulted in poor manufacturing efficiency. form several circuit boards at once,
Even if an attempt is made to cut the epoxy resin substrate later, there are problems in that it is difficult to remove the epoxy resin substrate because it is hard.

The present invention has been made in view of the above points, and allows a large number of circuit blocking boards to be installed efficiently and efficiently at low cost. ! The purpose of the present invention is to provide a method for manufacturing a circuit board that can be easily manufactured.

Means for Solving the Problems The present invention provides a method for manufacturing a circuit board in which a conductive pattern and an electronic circuit including an electronic component are formed on a film sheet. - a first step of forming the electronic circuits at once, and a second step of mounting the electronic components constituting the electronic circuits on the conductive patterns of the plurality of electronic circuits formed on the film sheet after the first step; and a third step of cutting the plurality of electronic circuits into individual electronic circuits after the second step.

After first forming a conductive pattern on a large film sheet, 13 conductive patterns of multiple electronic circuits are formed at once.
Mount the electronic components that make up the electronic circuit, and then
It is cut into individual electronic circuits. Therefore, a large number of electronic circuits can be formed at once.

Embodiment FIG. 1 is a diagram for explaining steps of a manufacturing method according to an embodiment of the present invention. The film sheet substrate manufactured by the method of this embodiment is built into an operating device for remotely controlling an electronic device such as a game console. I will explain about it.

The operating device 1 is connected to an electronic device (not shown) such as a game computer via a connection cord 2, and is used as a remote controller.

Then, when the operation switch buttons 3a to 3e disposed on the operation surface 1a are pressed, the operation device 1 outputs the signal via the connection cord 2. This operating device 1 generally includes an upper case 4 to which operation switch buttons 3a to 3e are attached, a lower case 5 fixed to the upper case 4 by tightening screws (not shown), and an upper case 4 and a lower case 5. It consists of a film sheet substrate 6 that is housed between the two, and a support plate 7 on which the film sheet substrate 6 is placed.

A plurality of positioning pins 4a and screw threading portions 4b for positioning the mounting positions of the film sheet substrate 6 and the support plate 7 protrude from the inner wall of the upper case 4. Further, a screw insertion portion 5a and a support portion 5b are formed to protrude from the inner wall of the lower case 5. Therefore, by screwing the upper case 4 and the lower case 5, the film sheet substrate 6 and the support plate 7 are held between the screw threading part 4b and the screw insertion part 5a, and the positioning pin 4a, it is locked in a predetermined mounting position.

As shown in FIG. 3, the film sheet substrate 6 is a flexible synthetic resin film sheet with indestructible properties, and is used as the operating switch of the upper case 4. ] Electrode terminal 6 facing 3a to 3e
a and the wiring pattern (third
6b (shown by a broken line in the figure) is printed. Further, the film sheet substrate 6 is formed of a semi-transparent or transparent collected material so that the wiring pattern 6b can be seen. In addition, the electrode terminal 6a of the film sheet substrate 6 and the connector connection part 6C
, a resist film 6e is coated on the surface except for the IC mounting portion 6d. Further, at appropriate locations on the film sheet substrate 6, there are holes 6f for inserting screws for screwing the upper and lower cases 4.5, and holes 6 into which the positioning pins 4a of the upper case 4 are inserted.
q is drilled.

8 is a controller IC, which is connected to the I of the film sheet substrate 6.
A low-temperature electric furnace (not shown) is placed on the C mounting part 6d.
After passing through and undergoing reflow soldering, it is bonded with an insulating adhesive and is connected and fixed to the IC mounting portion 6d.

The material of the film sheet substrate 6 is cheaper than the conventional one-box printed circuit board, and the electrode terminals 5a and wiring patterns 6b can be printed in a short time, making it easy to mass-produce. Manufacturing costs have been significantly reduced.

Therefore, by using the film sheet substrate 6,
The Li+ cost of the operating device 11 can also be reduced.

As shown in FIG. 4(A), <8), the support plate 7 is a plate-like member formed in a shape corresponding to the film sheet substrate 6, and is used to support the film sheet substrate 6 of IF1@. It has sufficient strength. The support plate 7 has a small hole 7a for screw insertion and a hole 7b for positioning pin insertion, and guide portions 7c, 7 for guiding the connection cord 2 are provided on the lower surface of the support plate 7.
d stands out.

Contact pieces (not shown) made of a conductive material are provided at the lower ends of the operation switch buttons 38 to 3e arranged on the upper case 4, and when each operation switch button 3a to 3e is pressed, each contact piece opens into a film. It contacts the electrode terminal 6a of the sheet substrate 6 to close the electrode terminal 6a. At that time, the operation switch buttons 3a~
The film sheet substrate 6 pressed to the position 3e does not bend because it is placed on the support plate 7, and the electrode terminals 6a can reliably come into contact with the contact pieces of the operation switch buttons 3a to 3e. In this way, the support plate 7 allows the use of an inexpensive film sheet substrate 6.

Further, as described above, the film sheet substrate 6 and the support plate 7 are attached to the upper case 4. When stored inside the lower case 5, the connector 9 is connected to the connector connection portion 6C of the film sheet substrate 6.

Therefore, since the operating device 1 uses the film sheet board 6, the connection cords 2 are simply connected via the connectors 9, and the troublesome work of soldering the cords one by one as with conventional printed circuit boards, for example, is difficult. is no longer necessary,
Workability in the assembly process is further improved. As shown in FIGS. 6 and 7, the connection cord 2 extending from the connector 9 is folded back to the lower surface side of the support plate 7 through the cutout 6h of the film sheet substrate 6 and the cutout 7e of the support plate 7, and then 7 and the lower case 5. In this way, the mounted connection cord 2 is inserted between the guide portions 7C and 7d of the support plate 7 via the positioning pin 48 protruding from the hole 7b as shown in FIG. It is inserted into the support plate 7
The mounting position is regulated. Furthermore, the connection cord 2 is wound around a plurality of protruding pins (not shown) that protrude from the upper case 4 and is pulled out. Therefore, the support plate 7 not only supports the film sheet substrate 6 but also
It also has the role of guiding the connection cord 2 as described above. Therefore, the connection cord 2 is held so that it does not become unnecessarily slack inside the device 1, or even if the connection cord 2 is pulled outside, no force is applied to pull out the connector 9.

Next, a method for manufacturing the film sheet substrate 6 will be explained.

First, as shown in FIG. 1(A), a film sheet 10 of a size that can accommodate a plurality of film sheet substrates 6 (described later) is prepared. After providing reference holes 11a, 11b, and 11c in this film sheet 10 for positioning when printing a conductive pattern or cutting a substrate, as shown in FIG. 1(B),
．． Clean to remove dirt on the fill sheet 10.

Next, as shown in FIG. 1(C), I! Print several minutes of conductive pattern 12 (first step). The conductive pattern 12 has a pattern shape as shown in FIG. 2(A), and is made of a first conductive material 13a such as silver. Figure 2 (A)
The part of the conductive pattern 12 made of the first conductive material 13a as shown in FIG. Carbon, which is the second conductive material 13b, is printed on the contacting portion of the electrode terminal 6a as shown in FIG. 2(8) to prevent soldering during the mounting of the controller IC 8 in a later step.

Furthermore, the second! ! As shown in 1(C), the electrode terminal 6a,
In order to insulate from the outside, an insulating resist film 6e is printed on portions of the wiring pattern 6M) that are not connected to the outside, except for the IC mounting portion 6d and the connector connection portion 6C.

Next, as shown in FIG. 1(D), the controller IC 8 is mounted on the 10 mounting portion 6d, passed through a low-temperature electric furnace, and subjected to reflow soldering treatment to perform connection.

After the controller IC 8 is connected to the IC mounting part 6d on the film sheet 1, it is bonded with an insulating adhesive and fixed to the film sheet 10 (second step 1).
11).

Next, as shown in FIG. 1(E), the film sheet 1o is cut into the required circuit board shape to obtain individual film sheet substrates 6 as shown in FIG. )
.

In this way, after forming a plurality of conductive patterns 12 and mounting electronic components such as ICs, the circuit boards are cut into various circuit boards, so that the conductive patterns are formed with dust attached to the boards during cutting, resulting in conductivity. This eliminates defects and makes it possible to obtain a good conductive pattern.

In addition, the film sheet 10 is soft and thin, so it is easy to cut, and even if the conductive patterns of individual circuit boards are placed close to each other, each circuit board can be reliably cut. You can use 10 without wasting it.

In the above embodiment, the remote controller connected to a game computer is used as an example, but the present invention is not limited to the above embodiment, and can be applied to other electronic devices such as personal computers. Of course, it can also be used to manufacture circuit boards for devices that are connected to equipment.

Effects of the Invention As described above, according to the present invention, after forming conductive patterns for a plurality of electronic circuits on a film sheet, cutting is performed in order to mount electronic components and then cut into individual electronic circuits. The dust generated during the process is not generated until the end, so there is no chance of dust adhering to the film sheet and deteriorating the conductive pattern when forming the conductive pattern. It is easy to perform processing, and individual electronic circuits that are adjacent to each other can be placed close to each other, so there is no waste, and it is possible to obtain a circuit board on which a large number of electronic circuits are formed all at once, increasing efficiency. It has features such as enabling good manufacturing.

[Brief explanation of drawings]

Fig. 1 is a diagram for explaining the In method according to an embodiment of the present invention, Fig. 2 is a diagram for explaining the method up to WJ of the main part of an embodiment of the present invention, and Fig. 3 is a diagram for explaining the method up to WJ of an embodiment of the present invention. 4 is a plan view and a front view of the support plate, FIG. 5 is an exploded perspective view of the operating device, FIG. 6 is a plan view of the operating device, and FIG. 7 is a sectional view of the operating device. . 6... Film sheet substrate, 6a... Electrode terminal, 6
b-...Wiring pattern, 6cm...Connector connection part,
6 d-I C mounting part, 6e... resist film, 8...
・Controller IC, 9-... Connector, 10...
film sheet. Figure ('f 1) (A) (B) Figure 1 (Sof) 2) 1C (E) Knee) Raw Figure (A) Figure 5 Figure 6 b C d e Figure 5 button q

Claims (1)

[Claims] A method for manufacturing a circuit board in which a conductive pattern and an electronic circuit made of electronic components are formed on a film sheet, comprising forming conductive patterns corresponding to a plurality of circuit boards at once on the film sheet. a first step; a second step of mounting the electronic components constituting the electronic circuit on the plurality of circuit boards formed on the film sheet after the first step; and the second step. A method of manufacturing a circuit board, comprising: a third step of cutting the plurality of circuit boards into individual circuit boards after the step of cutting the plurality of circuit boards into individual circuit boards.