JPH03273671A - Semiconductor vessel - Google Patents

Abstract

PURPOSE:To prevent the generation of a crack in a ceramic section, a connecting section of which with a vessel body is peeled, even when stress is applied in the vertical direction to an outer lead terminal by forming notches to side faces on both sides or a side face on one side in the vicinity of a mounting section with the vessel body for the outer lead terminal. CONSTITUTION:Four terminals 1A, peripheries of which are plated with Ni or Au and which are composed of a covar material, and a main body 2 consisting of a ceramic material are fixed by a wax material 3, and one semicircular notch 4A having a radius of approximately a quarter of terminal width is formed on terminal both side faces near each brazing section respectively in the terminals 1A. These circular notches 4A effectively absorb the stress energy when bending stress is applied to the terminals 1A, and work so as not to propagate bending stress to the connecting sections 3 with the vessel body 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to semiconductor containers, and more particularly to flat semiconductor containers.

(Prior Art) Conventionally, in this type of semiconductor container, a plurality of terminals protruding horizontally from the main body have a flat plate shape, and there is no cutout on the side surface of the external lead terminal near the container main body. ,
It was common.

FIG. 7 is a perspective view showing an example of the conventional semiconductor container mentioned above. Below the semiconductor container body made of ceramic material,
2 and 4 external lead terminals (referred to as the main body) made of a flat plate-shaped cover material with plating and plating applied to the periphery.
The IG (hereinafter referred to as a terminal) is fixed by a brazing material 3.

(Problem to be Solved by the Invention) In the conventional semiconductor container described above, when a bending force is applied to the terminal protruding horizontally from the main body in a direction perpendicular to the surface thereof, stress is concentrated at the connection between the main body and the terminal. However, it has the disadvantage that the connection part between the terminal and the main body tends to peel off, or the ceramic part near the connection part tends to crack.Also, the thicker the terminal, the less bending stress is absorbed by the terminal itself. Therefore, the above-mentioned problems tended to occur more easily.

An object of the present invention is to provide a semiconductor container in which the connection portion with the main body does not peel off or the ceramic portion does not crack even when stress is applied to the terminal in the vertical direction.

Means for Solving the Problems] The present invention provides a so-called flat type semiconductor container having a plurality of external lead terminals protruding horizontally from the main body, in which the external lead terminals are attached to the container main body in the vicinity of the main body. It has notches on both sides or one side.

[Effect]

The notch provided in the terminal absorbs a portion of the bending stress applied to the terminal by bending that portion, and acts to prevent the bending stress from being transmitted to the connection portion between the terminal and the container body.

[Example] Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is an enlarged perspective view of a semiconductor container according to a first embodiment of the present invention.

411 terminal 1A made of cover material with scolding and plating applied to the periphery, and main body 2 made of ceramic material.
The terminal 1A is fixed with a brazing material 3, and the terminal 1A has semicircular notches 4A each having a diameter of 111 and a radius of about 174 the width of the terminal on both sides of the terminal near the brazing part.

These circular notches 4A act to effectively absorb stress energy when bending stress is applied to the terminal 1A, and prevent the bending stress from being transmitted to the connecting portion 3 with the container body 2. Therefore, even if such a situation occurs, as long as the stress strength is at a level that is normally considered, the connection between the container body 2 and the terminal 1A will not be damaged.

2, 3, 4, 5, and 6 are the second embodiments of the present invention. Third. 4th. Fifth. FIG. 7 is an enlarged perspective view of a semiconductor container of a sixth embodiment.

As in the first embodiment, four terminals 1B to 1F are made of cover material whose peripheries are plated and plated,
A semiconductor container body 2 made of a ceramic material is fixed with a brazing material 3.

In the embodiment shown in FIG. 2, rectangular notches 4B each having a depth of about 1/4 of the terminal width are provided on both sides of the terminal 1B.

In the embodiment shown in FIG. 3, approximately 1 of the terminal width is provided on both sides of the terminal 1C.
One wedge-shaped notch 4C having a depth of 74 is provided in each case.

In the embodiment shown in FIG. 4, approximately 1 of the terminal width is provided on both sides of the terminal 1D.
One trapezoidal notch 4D having a depth of 74 is provided in each case.

In the embodiment shown in FIG. 5, one circular notch 4E having a depth of approximately 174 mm, which is the width of the terminal, is provided on one side of the terminal 1E.

In the embodiment shown in FIG. 6, one side of the terminal 1F has a circular notch 4" with a depth of approximately 174 mm, and the other side of the terminal 1F has a circular notch 4" with a depth of approximately 174 mm, the width of the terminal. 211 circular notches 4F are provided.

〔Effect of the invention〕

As explained above, in the present invention, each external lead terminal of a flat semiconductor container is attached to the container body on the side surface near the part.
By providing a notch of arbitrary shape, it is possible to absorb the stress applied to the terminal, and the attachment of the container body and the terminal has the effect of reducing the stress applied to the part, that is, the stress applied to the terminal in the vertical direction can be absorbed. In some cases, this has the effect of eliminating the drawbacks such as peeling of the connection portion or cracking of the ceramic portion.

[Brief explanation of drawings]

1, 2, 3, 4, 5, and 6 are the first embodiment of the present invention. Second. Third. 4th゜5th. FIG. 7 is an enlarged perspective view of the semiconductor container of the sixth embodiment, and FIG. 7 is a perspective view of a conventional example of the semiconductor container. 1A to 1F... External lead terminal, 2... Semiconductor container body, 3... Brazing metal, 4A to 4F... Notch. Patent Issuer: Memoto Electric Co., Ltd. Agent: Susumu Uchihara, Patent Attorney 1 Figure Figure Figure Figure Figure Figure

Claims (1)

[Claims] 1. In a so-called flat semiconductor container having a plurality of external lead terminals protruding horizontally from the semiconductor container body, both sides or one side near the attachment portion of the external lead terminals to the container body. A semiconductor container characterized by having a notch on its side surface.