JPH03227097A - Fluid heat exchanger for cooling elec- tronic element - Google Patents

Abstract

PURPOSE: To enhance the performance of heat exchanger for cooling electronic elements by forming two fluid passages for fins along the length of the fin. CONSTITUTION: Inflow cooling liquid flows downward to the center of a base 14 through an inflow tube 30, enters into a channel 23 between fins 22 and flows toward both end portions 28 of the fins 22. Cross sectional area of the inflow tube 30 and an outlet tube 32 is configured smaller than the cross sectional area of the base 14. For supplying the cooling fluid to the channel 23, not directly located below an outlet end portion of the inflow tube 30, a recessed portion 35 is provided on a top surface 24 of the fin 22, and the cooling fluid is supplied to all the fins 22. Also, a passage 38 from a channel 23 is located above the top surface of a plate 36 inside a housing and communicated to the outflow pipe 32. For specially cooling the high-temperature region at the center of an electronic element 16, the flow passing through the inflow tube 30 cools the high-temperature region toward the center of a housing 12 of a heat exchanger 10. As a result of this, the performance of cooling heat exchanger of an electronic element such as a chip can be enhanced.

Description

[Detailed description of the invention] Industrial applications The present invention relates to a fluid heat exchanger for cooling electronic devices.

BACKGROUND OF THE INVENTION Liquid cooling heat exchangers for cooling electronic devices are used to cool high power electronic chips. By using a finned heat exchanger surface, high heat transfer and extremely high power density are obtained.

The purpose of this invention is to improve thermal resistance and spatial temperature change.

The goal is to balance pressure drop and space requirements to improve the performance of heat exchangers for cooling electronic devices such as chips.

Another object of the invention is to enhance the performance of a heat exchanger for cooling electronic devices, such as chips, by forming two fluid passages along the length of the fins and to the fins.

The heat exchanger of the present invention balances thermal resistance, spatial temperature variation, pressure drop, and space requirements. Since the heat exchanger of the present invention provides a uniform temperature distribution from the base, it is particularly useful for electronic devices having a uniform power distribution on the surface.

SUMMARY OF THE INVENTION According to the present invention, a fluid heat exchanger for cooling electronic components is of the center-fed type and includes a housing having a base for receiving heat from the electronic components.

A plurality of parallel spaced fins are provided, each having a top surface, a bottom surface, and opposite ends, each bottom surface being connected to the base such that the fins are perpendicular to the base. Concentric inner fluid inlet tubes and outer fluid outlet tubes communicate with the housing opposite the base and have longitudinal axes perpendicular to the base. This axis runs between the ends of the fins towards the fins and the base;
Cooling fluid from the inner inflow tube is directed to the fins and the base and ends of the fins.

The longitudinal axes of both tubes are oriented toward the center of the base to facilitate heat transfer by providing cooling fluid to the center of the electronic component, which tends to be hotter than other areas. Cooling fluid is supplied to all the fins by forming a recess in the top surface of each fin that communicates with the inflow tube. A plate is provided on the top surface of the fin on each side of the inlet tube to direct incoming cooling fluid from the inlet tube to opposite ends of the fin. The housing has a passage extending from the end of the fin to the outflow tube. Additionally, the ends of each fin are sloped downwardly and outwardly from the top to the bottom to reduce pressure drop and heat transfer at the ends of the fin. An inlet tube is positioned adjacent the top surface of the fins to allow cooling fluid to impinge on the fins and base.

Also in accordance with the invention, a first fluid connection, such as a fluid inlet tube, communicates with the housing opposite the base and has a longitudinal axis perpendicular to the base. This axis is directed toward the fins between the ends of the fins, directing cooling fluid between the inlet tube and the fins and between the base and the ends of the fins. A second fluid connection, such as a fluid outlet tube, communicates with the end of the fin. A recess is formed in the upper surface of each fin and communicates with the inflow pipe, supplying fluid to all the fins. A plate is provided between the top and bottom surfaces of the fin, the plate extending substantially parallel to the base and near the end of the fin;
Cooling fluid flows through two passages along the length of the fins. Said plate is placed intermediate the top and bottom surfaces of the fins to minimize the pressure drop. The ends of the fins extend into the interior of the housing to maximize heat transfer. The inflow pipe and the outflow pipe are concentric. Additionally, the interconnect structure between the fins and the plates facilitates assembly and connection formation of the heat exchanger components.

Example Hereinafter, this invention will be explained in detail with reference to Examples.

1 and 2, reference numeral 10 designates the fluid heat exchanger of the present invention. Although any suitable cooling fluid such as gas or liquid can be used, this invention will be explained using water as an example. The housing 12 of the heat exchanger 10 is the base 1
It has 4.

The base 14 is connected to the substrate 18 by suitable electrical connections 20.
may be part of or attached to an electronic device 16, such as an electronic chip connected to the electronic device 16. In any case, the base 14 is positioned relative to the electronic element 16 and receives heat from the electronic element 16.

A plurality of parallel spaced fins 22 are provided, each fin having a top surface 24, a bottom surface 26, and an end 28.

The bottom surface 26 of each fin 22 is connected to or integral with the base 14, and each fin is disposed in a plane perpendicular to the base 14. A concentric inner fluid inlet tube 30 and an outer fluid outlet tube 32 are located on the opposite side of the housing 1 from the base 14.
2 and between the ends 28 of the fins 22
It has a longitudinal axis 34 directed toward. The incoming cooling liquid thus flows downwardly in the inlet tube 30, preferably into the center of the base 14, into the channels 23 between the fins 22, and then towards the ends 28 of the fins 22. Because the cooling fluid flow supplied to the center is divided in this manner, the pressure drop across the fins 22 is kept low.

The cross-sectional area of the inflow pipe 30 and the outflow pipe 32 is smaller than the cross-sectional area of the base 14. Cooling fluid is provided to all fins 22 by providing recesses 35 in the upper surface 24 of the fins 22 to supply cooling fluid to channels 23 between the fins 22 that are not directly below the outlet end of the inlet tube 30. It can be done.

Preferably, a plate 36 surrounding the inlet tube 30 is provided on the top surface 24 of the fin 22 to direct a fluid flow of cooling liquid from the center of the fin 22 to the ends of the fin 22 to enhance the cooling effect. Passage 38 from channel 23
is provided within the housing above the top surface of the plate 36 and communicates with the outflow tube 32.

The center of electronic device 16 is typically a high temperature region. The flow through the inlet pipe 30 then cools this high temperature area towards the center of the housing 12 of the heat exchanger 0. Also, by arranging the inlet tube 30 as described above, the liquid velocity at the center of the housing 12 is higher than elsewhere. According to this invention, the shape and size of the recess 35 are adjusted to allow the electronic element 16 to
By controlling the spatial temperature changes over the surface, one can increase the fluid flow in the center and adjust the flow elsewhere to keep the temperature generally uniform. Although a generally rectangular recess is shown, other shapes, such as triangular, can be used and the dimensions can be determined to provide optimum temperature characteristics and low pressure drop.

Furthermore, since the inflow pipe 30 is disposed adjacent to the upper surface 24 of the fins 22, the inflow cooling fluid impinges on the fins 22 and the base 14. When the cooling fluid impinges on the base 14 in the vertical direction, an unsteady flow phenomenon occurs against the sides of the base 14 and the fins 22, which can increase the heat transfer coefficient at the center of the housing 12 and the electronic device 16.

Preferably, the ends 28 of the fins 22 are sloped downwardly and outwardly from the top surface 24 to the bottom surface 24 to increase the pressure drop at the ends of the fins and reduce heat transfer at the ends of the fins. Heat transfer in the fins 22 is a function of the width of the channels 23 between the fins, the fin thickness, and the fin height. The preferred embodiment, applied to chips with power densities of 50 to 100 wands/a+f, has a height of 2.54 cm (0,1 inch) and a thickness of 0.254 to 0.580 cm (0,0
10-0.020 inch) copper fins from 0.254-0.
．． Channel spacings of 580 cm (0.010 to 0.020 inches) could be used.

According to measurements, in this invention approximately 0,2 K/W
The heat exchanger resistance of cut, the space temperature change of IOK at 100 W/cut, and approximately 6.281 kg/c+1
(approximately 4 psi) pressure drop and approximately 3,675 cm (1,
A mounting height of 5 inches) can be obtained.

The embodiment of FIG. 1 may provide a manifold 40 having an inflow fluid manifold 42 and an outflow fluid manifold 44, which is particularly advantageous for multi-chip packaging applications. However, the inlet tube 30 and outlet tube 32 can be attached directly to a hose or other fluid passageway.

Another embodiment of the present invention is shown in FIG. 3, and parts similar to those shown in FIGS. 1 and 2 are designated by the same numbers as FaJ. In this embodiment, the top plate 36 is omitted to facilitate impingement of the incoming cooling liquid at the center of the base 14a of the housing 12a of the heat exchanger 10a.

Moreover, according to the structure shown in FIG.
The upper portion of the fin 22a can be crossed when flowing towards the fin 22a. This flow pattern functions as a two-pass heat exchanger that tends to equalize spatial temperature changes.

FIGS. 4 and 5 show still another embodiment of the present invention,
Components that are similar to those in FIGS. 1 and 2 are given the same numbers with a "b" added. In this embodiment, the upper surface 24 of the fin 22b
A plate 36b is provided between the base +4b and the bottom surface 28b, and the plate 36b extends approximately parallel to the base +4b to near the end of the fin 22b. This plate 36b allows two cooling liquid passages to be provided to the fins 22b.
formed along the length of. That is, the inflow fluid from the inflow pipe 30b flows toward the center of the housing 12b of the heat exchanger 10b, through the recess 35b, and into all the channels 23b between the fins 22b.

Next, the fluid flows to both ends of the fin 22b and the fin 2
One passageway is formed along the length of the bottom surface 26b of 2b.

It then flows around the ends of plate 36b. moreover,
The cooling liquid flows inwardly from the end of the fin 22b to form another passageway across the fin 22b portion above the plate 36b and then exits through the fluid outlet tube 32b.

Of course, if desired, the direction of fluid flow can be reversed by allowing fluid to flow in through tube 32b and fluid to flow out through tube 30b.

When the power distribution over the area of the electronic element 16b is uniform,
Heat exchanger 10b is particularly advantageous. According to this invention,
The uniformity of temperature distribution from the base 14b can be improved. That is, the cooling fluid from the inlet tube 30b is initially cold as it descends into the center of the base 14b, but warms as it flows toward the ends 28b of the fins 22b, forming a second passageway across the top portion of the fins 22b. Sometimes it gets even warmer, and after reaching the maximum temperature near the center, the tube 32
flows out through b. In this way, each fin 22b improves the uniformity of heat release from the base 14b.

Preferably, the plate 36b is attached to the top surface 24 of the fin 22b.
b and bottom surface 26b to even out the pressure drop along the fluid flow path.

Also preferably, the ends 28b of the fins 22b extend into the interior of the housing 12b to maximize the fin area for heat transfer. Heat transfer in the fins 22b is a function of the width of the channels 23b between the fins 22b, the thickness of the fins 22b, and the height of the fins 22b. In a preferred embodiment, the height is 2,54 cm (0,1 inch) and the thickness is 0,010 to 0,02 cm (0,254 to 0,580 cm).
0 inch) copper fins to 0.254~0.580 cm (
Can be used with channel spacings of 0.010 to 0.020 inches).

Preferably, the ends 28b of the fins 22b are extended until they contact the inside of the wall of the housing 12b so that the base 14
Make the heat transfer from b as large as possible by 4 degrees.

In the above embodiment, ease of assembly and fin 22b
For forming an interconnection between the fins and the plate 36b, it is preferred to provide cooperating engagement members on the fins and the plate. Therefore, each fin 22b has a plurality of upward protrusions 25b separated by recesses 27b. And plate 36
b has a plurality of spaced apart openings 37b for receiving the protrusions 25b.
form.

By inserting projections 25b into apertures 37b, the heat exchanger can be easily and quickly assembled to connect fins 22b to plate 36b and provide structural support therebetween.

Thus, the present invention achieves the aforementioned chain objectives and inherent advantages. The above-described embodiments of the invention have been used for illustrative purposes; numerous variations in details of construction and arrangement of parts thereof may be practiced by those skilled in the art within the scope of the claims of the invention. .

[Brief explanation of drawings]

Fig. 1 is a front sectional view of one embodiment of the present invention, Fig. 2 is an enlarged perspective view showing the fin structure inside the device of Fig. 1, and Fig. 3 is a front view of main parts showing another embodiment of the invention. 4 is a front sectional view showing still another embodiment of the present invention, and FIG. 5 is an enlarged perspective view showing the fin structure in the apparatus of FIG. 4. 10, 10a, 10b - fluid heat exchanger 12, 12a,
12b-housing 14, 14a, 14b--B-7, 16, 16a,
16b...-Electronic element 22, 22a, 22b-Fin 24.24a, 24b-Top surface 26, 26a, 26
b---Bottom surface 28.28a, 28b one end 30,
30a, 30b - fluid inflow pipe (first fluid pipe) 32, 3
2a, 32b...fluid outflow pipe (second fluid pipe) 34,
34a, 34b-longitudinal axis 35, 35a, 35b---recess 36.36a,
36t+Mountain Plate Technology Cooperation Fuku 1 Figure Heron 4 Figure Gate 3≠b Ngi b /60 /lD Atsushi 5 Box

Claims (7)

[Claims] 1. a housing having a base for receiving heat from the electronic component; and a plurality of parallel spaced fins each having a top surface, a bottom surface and opposite ends, the bottom surface connected to the base, and each fin connected to the base. a plurality of fins perpendicular to the base, with the ends of each fin sloping downwardly and outwardly from the top surface to the bottom surface to reduce pressure drop and heat transfer to the ends of the fins; a fluid inlet tube communicating with the housing opposite the fin and having a longitudinal axis perpendicular to the base, the axis pointing toward the fin between the ends of the fin and directing cooling fluid from the inlet tube to the fin and the base; , both ends of the fin, and the fluid is directed to a fluid outflow pipe communicating with both ends of the fin, and the fluid inflow pipe communicates with a recess formed in the upper surface of the fin to supply cooling fluid to all the fins. an inflow pipe; and a plate extending from the inflow pipe and provided on the top surface of the fin that slopes downward at both ends of the fin to direct the cooling fluid from the inflow pipe to both ends of the fin while minimizing the pressure drop at both ends. A fluid heat exchanger for cooling electronic devices. 2. 2. A fluid heat exchanger for cooling electronic devices according to claim 1, wherein the cross-sectional area of the inflow pipe and the outflow pipe is smaller than the cross-sectional area of the base, and the longitudinal axes of both the pipes are directed toward the center of the base. 3. a housing having a base that receives heat from the electronic device; a plurality of spaced apart fins, each having a top surface;
the plurality of fins having a bottom surface and opposite ends, the bottom surface connected to the base, each fin being perpendicular to the base and forming a recess in the top surface; and a housing on the opposite side from the base. a first fluid tube communicating with the fin and having a longitudinal axis perpendicular to the base, the axis pointing toward the fin between the ends of the fin, between the first fluid tube and the fin, and between the base and the end of the fin; A cooling fluid is sent between the parts, and the recessed part is the first part.
Between the first fluid pipe communicating with the fluid pipe and communicating fluid between all the fins and the first fluid pipe, the second fluid pipe communicating with the fin, and the top surface and bottom surface of the fin. A fluid heat exchanger for cooling an electronic device, comprising: a plate extending substantially parallel to the base to near the end of the fin, and allowing cooling fluid to flow through the fin through two passages. 4. 4. The fluid heat exchanger for cooling electronic devices according to claim 3, wherein the plate is disposed intermediate between the top surface and the bottom surface of the fin. 5. 4. The fluid heat exchanger of claim 3, wherein the ends of the fins extend into the interior of the housing. 6. 4. The fluid heat exchanger for cooling electronic devices according to claim 3, wherein the first fluid pipe and the second fluid pipe are concentric pipes. 7. 4. The assembly connection of the fin to the plate as claimed in claim 3, wherein the upper surface portion of each fin includes a plurality of upwardly directed protrusions separated by recesses, and wherein the plate has a plurality of spaced apart apertures for receiving the protrusions of the fins. A fluid heat exchanger for cooling electronic devices that is easy to form.