JPH03133146A - Manufacture of integrated circuit device - Google Patents

Abstract

PURPOSE:To restrain development of thin burr and to improve charging properties of a lead frame groove part by attaching a tape to a surface of a terminal for external connection. CONSTITUTION:A porous tape 5 is attached to one face 1a of a lead frame and an integrated circuit chip 7 is mounted on the other face 1b and connected electrically. After the integrated circuit chip 7 and an electrical connecting means are covered with sealing resin 9, the tape 5 is removed. Thereby, bubbles developed in a groove part 1x of the lead frame during resin sealing is extruded outside through the porous tape 5 by a pressure of the resin 9. According to this constitution, it is possible to improve charging properties of sealing resin and to prevent development of thin burr without creeping of sealing resin to a surface of a terminal for external connection of the lead frame since the tape 5 adheres closely to the surface.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an integrated circuit device used in an IC card, etc., which has a built-in integrated circuit element for processing or storing data, and is capable of exchanging data with an external device. This also concerns the manufacturing method.

2. Description of the Related Art In recent years, so-called IC cards, in which integrated circuit elements such as microcomputers and memories are mounted or embedded in plastic cards, have been put into practical use.

This IC card has a larger storage capacity than the already widely used magnetic stripe card and is superior in terms of confidentiality, so it has been put into practical use in many fields such as finance, credit, and medical care. It's coming.

Such an IC card has a structure in which an integrated circuit device having connection terminals for external devices such as a reader/writer is mounted on a plastic card such as vinyl chloride, and this integrated circuit device has a simple structure and high dimensional accuracy. It is necessary to make it extremely thin. For this reason, integrated circuit devices
It is manufactured using a lead frame made of a thin metal plate formed into a desired electrode shape.

A conventional method of manufacturing an integrated circuit device will be described below.

Fig. 2 is a perspective view of the integrated circuit device, Fig. 3 is a plan view of the lead frame used in this integrated circuit device 2o, and Figs. FIG. 3 is a sectional view taken along line o-o of the conventional integrated circuit device manufacturing method shown in FIG. As shown in FIGS. 3 and 4(a), the lead frame 1oo has an integrated circuit element mounting section 101 and a plurality of KW sections 102. And Fig. 4 (b
) As shown in FIG.
A plastic tape 103 is attached to the surface 100a, and an adhesive 104 is applied to the other surface 100b to attach the integrated circuit element j0.
5 is installed to form the configuration shown in FIG. 5(C). Next wire 1
08, the electrode part 10 corresponding to the integrated circuit element 105
2 are electrically connected to form the figure (d), and then this intermediate material is placed in a base such as a mold to cover the integrated circuit element 105 and the wire 106 as shown in the figure (e). A sealing resin 107 is molded.

After that, this intermediate material is taken out from inside the base, and the plastic tape 103 is peeled off to expose one surface jooa of the lead frame 1oo as a terminal surface for external connection.
Finally, lead frame 1o.

The integrated circuit device 20 shown in FIG. 4(f) and FIG. 2 is obtained by cutting the support portion 108 of the
Publication No. 96).

Problems to be Solved by the Invention This method of fabricating the integrated circuit device 20 by attaching the tape 103 to one surface 100a of the lead frame is to attach a seal to the external connection terminal surface 100a of the integrated circuit device 20. This is an effective method in that thinning does not occur due to the wrapping of the stopper resin 107.

However, in the above manufacturing method, when molding the sealing resin 107, the integrated circuit element mounting part 1o1 and the electrode part 102 are
Since air is sealed and remains as bubbles in the grooves 100K of the lead frame 100, such as between the gaps and between the electrodes 102, unfilling of the sealing resin IQ7 was likely to occur in these areas after molding. If the sealing resin 107 is not filled, the water resistance and moisture resistance of the integrated circuit device 2° will be significantly deteriorated, and the input/output terminal portion of the integrated circuit element 106 may be corroded. How to improve the filling properties of 107 has been a problem in the prior art.

The present invention solves these problems, and provides a method for manufacturing an integrated circuit device that suppresses the occurrence of thinning by attaching tape to the external connection terminal surface and improves the ability to fill the grooves of the lead frame. It is intended to.

Means for Solving the Problems To achieve the object, the present invention includes the steps of: attaching a breathable tape to one surface of a lead frame comprising an integrated circuit element mounting section and a plurality of electrode sections; a step of mounting an integrated circuit element on the integrated circuit element mounting portion on the other side of the lead frame via an adhesive; a step of electrically connecting the input/output terminal of the integrated circuit element and the electrode;
A step of covering at least the integrated circuit element and the electrical connection means with a sealing resin on the other surface of the lead frame, a step of peeling off the tape, and a supporting part of the integrated circuit element mounting part and the electrode part of the lead frame. The present invention provides a method for manufacturing an integrated circuit device, which comprises a step of separating.

Function: By using this manufacturing method, air bubbles generated in the groove of the lead frame during resin sealing are pushed out through the breathable tape by the pressure of the resin.
The filling properties of the sealing resin can be improved. Further, since the tape is in close contact with the external connection terminal surface of the lead frame, the sealing resin does not wrap around this surface, and no thinning burrs occur.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

FIGS. 1(a) to 1(f) are cross-sectional views showing a method of manufacturing an integrated circuit device according to an embodiment of the present invention. In Figure 1,
1 is a lead frame, 1a is one surface of the lead frame 1, 1b is the other surface of the lead frame 1, 1x is a groove of the lead frame, 2 is an integrated circuit element mounting portion, 3 is an electrode portion, and 4 is an adhesive for tape 6 is a porous aluminum foil, 6 is an adhesive for integrated circuit elements, 7 is an integrated circuit element, 8 is a thin gold wire,
9 is a sealing resin, 1o is a transfer mold, 10a is a surface of the lower mold of the transfer mold 10, 11 is a sealing resin inlet of the transfer mold 1 mold, and 12 is an exhaust port.

First, a ferrous metal thin plate having a thickness of 0.15 m was etched to produce a lead frame 1 having an integrated circuit element mounting part 2 and an electrode part 3 (FIG. 1(a)).

Here, the lead frame 1 has the same shape as the conventional lead frame 1oO shown in FIG. 3.

The dimensions of the electrode part 3 are 3.0 m x 2.1 ml,
The arrangement complied with the standards set by I5O (International Organization for Standardization). Next, a thermosetting tape adhesive 4 is applied to one side 1a of the lead frame to a thickness of about 10 μm, and a porous aluminum foil 6 of 20 μm thick is attached thereon. This tape adhesive 4 was cured in a high temperature bath at 150° C. (FIG. 1 Q)). Here, in the porous aluminum box 6, aluminum foil is etched to form 9,600 holes with a diameter of 10 to 20 μm per 1 square 7 inches.
I used one with at least one space between the two.

Next, about 30 minutes of thermosetting integrated circuit element adhesive 6 is applied onto the integrated circuit element mounting portion 2 on the other side 1b of the lead frame 1.
After applying the adhesive 6 to a thickness of 0.011 m and mounting the integrated circuit element 7 thereon, the adhesive 6 for integrated circuit elements was cured in a high temperature bath at 150 C for 1 hour (FIG. 1(C)).

Then, the input/output terminals of this integrated circuit element 7 and the corresponding electrode portions were electrically connected by a thin gold wire 8 having a wire diameter of 26 μm (FIG. 1(d)).

Thereafter, this intermediate material is placed in the transfer molding mold 10 so that the aluminum foil 6 is in contact with the lower mold surface 10a of the transfer molding mold 1o, and the sealing resin injection port 11 is placed at a mold temperature of 1eo°C. An epoxy-based sealing resin 9 was injected to seal the integrated circuit element 7 and the metal plate M8 (Fig. 1(e)).
). Here, the lower mold surface 10 that this aluminum foil 5 contacts
A has been roughened by etching,
Air discharged from the groove portion 1x of the lead frame through the aluminum foil 6 is allowed to pass through this roughened portion to the exhaust port 12 of the transfer molding die 1o.

After the resin-sealed intermediate material was taken out from the transfer mold 10, the aluminum foil 5 was peeled off and the supporting portion of the lead frame 1 was separated to obtain an integrated circuit device 20 shown in FIG. The total thickness of this integrated circuit device 20 is 0.62
ai, and the outer circumferential dimensions were 12 mm in width and 10 JIm in height.

No thinning of the sealing resin 9 was observed on the external connection terminal surface of the integrated circuit device 2o manufactured in this manner. Also,
No unfilled portion was found in the sealing resin 9 in the groove 1x of the lead frame 1. and.

This integrated circuit device 20 was subjected to a moisture resistance test, and as a result, it passed a pressure/kutsuka test for more than 500 hours and a high temperature and high humidity test for more than 2000 hours.

In the manufacturing method of this embodiment, the groove 1! of the lead frame 1 during manufacturing! The sealing resin 9 seeped out through the holes in the aluminum foil 6, but this was removed together with the aluminum foil 6 when the aluminum foil 6 was peeled off.

In addition, since the tape adhesive 4 enters the holes in the aluminum foil 5 and hardens, it adheres strongly to the aluminum foil 5 and is removed together with the aluminum foil S when the aluminum foil 5 is peeled off from the lead frame 1. External connection terminal surface 1a
(It did not remain in the llII. Also, the external connection terminal surface 1a of the completed integrated circuit device 2° was recessed from the sealing resin surface by the thickness of the tape adhesive 4. However, this was to the extent that it did not cause any problems in terms of functionality or appearance.

Note that in this embodiment, porous aluminum foil 6 was used as the tape attached to the lead frame 1.

Other breathable heat-resistant tapes, such as fibrous heat-resistant plastic tapes, may also be used.

Further, in this embodiment, a thermosetting resin is used as the tape adhesive 3, but other adhesives such as adhesives, room temperature curing adhesives, ultraviolet curable adhesives, etc. may be used.

Further, in this embodiment, the surface of the lower die of the transfer molding die was roughened by etching, but the surface may be roughened by other mechanical methods such as polishing.

Effects of the Invention As described above, the present invention provides a lead frame with a breathable tape attached to one side, an integrated circuit element mounted on the other side, and electrically connected. The manufacturing method involves covering the connecting means with sealing resin and then peeling off the tape, which improves the fillability of the sealing resin without changing the conventional manufacturing process, and provides excellent water and moisture resistance. This makes it possible to manufacture integrated circuit devices.

Furthermore, by using a metal foil having a plurality of holes for this breathable tape, there is no need to use an expensive heat-resistant plastic tape, making it possible to lower manufacturing costs than before.

Furthermore, when molding the sealing resin, if this breathable tape is installed on a substrate with a roughened surface, it is possible to increase the exhaust efficiency of the air exhausted through the breathable tape, making it more perfect. The sealing resin can be molded in a filled state.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing a method of manufacturing an integrated circuit device according to an embodiment of the present invention, FIG. 2 is a perspective view of the integrated circuit device,
FIG. 3 is a plan view of a lead frame used in manufacturing this integrated circuit device, and FIG. 4 is a sectional view showing a conventional method of manufacturing an integrated circuit device. 1...Reet frame+, 1a-...One surface of the lead frame, 1b...The other surface of the lead frame, 1x...Groove portion of the lead frame, 2... Integrated circuit element mounting section, 3...
Electrode part, 4... Adhesive for tape, 5...
・Porous aluminum foil, 6...adhesive for integrated circuit elements, finished...integrated circuit elements, 8. gold wire, 9... sealing resin , 10...Transfer molding mold, 10a...Lower mold surface of transfer molding mold, 11...Sealing resin injection port of transfer molding mold, 12. ...Exhaust port of transfer molding mold.

Claims (3)

[Claims] (1) A step of attaching a breathable tape to one side of a lead frame consisting of an integrated circuit element mounting part and a plurality of electrode parts, and adhering it to the integrated circuit element mounting part on the other side of the lead frame. a step of electrically connecting the input/output terminals of the integrated circuit device to the electrodes; and a step of electrically connecting the integrated circuit device and the electrodes on the other surface of the lead frame. A method for manufacturing an integrated circuit device, comprising the steps of: covering a connecting means with a sealing resin; peeling off the tape; and separating an integrated circuit element mounting portion of the lead frame and a supporting portion of an electrode portion. (2) The method for manufacturing an integrated circuit device according to claim 1, wherein a metal foil having a plurality of holes is used as the tape. (3) The method for manufacturing an integrated circuit device according to claim 1 or 2, wherein the tape is placed on the surface of the substrate that has been roughened during molding of the sealing resin.