JPH0275744U - - Google Patents
Info
- Publication number
- JPH0275744U JPH0275744U JP15574688U JP15574688U JPH0275744U JP H0275744 U JPH0275744 U JP H0275744U JP 15574688 U JP15574688 U JP 15574688U JP 15574688 U JP15574688 U JP 15574688U JP H0275744 U JPH0275744 U JP H0275744U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- utility
- semiconductor device
- scope
- fitting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の断面図である。
１…ＩＣ本体、２…リード、２Ａ…弾性嵌入部
、３…スルーホール、４…プリント基板、５…導
体。
FIG. 1 is a sectional view of an embodiment of the present invention. 1... IC body, 2... Lead, 2A... Elastic fitting part, 3... Through hole, 4... Printed circuit board, 5... Conductor.
Claims (1)
含むことを特徴とする半導体装置。 A semiconductor device comprising a lead having an elastic fitting portion bent in an uneven shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15574688U JPH0275744U (en) | 1988-11-29 | 1988-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15574688U JPH0275744U (en) | 1988-11-29 | 1988-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275744U true JPH0275744U (en) | 1990-06-11 |
Family
ID=31433645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15574688U Pending JPH0275744U (en) | 1988-11-29 | 1988-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275744U (en) |
-
1988
- 1988-11-29 JP JP15574688U patent/JPH0275744U/ja active Pending