JPH0215745U - - Google Patents
Info
- Publication number
- JPH0215745U JPH0215745U JP9428688U JP9428688U JPH0215745U JP H0215745 U JPH0215745 U JP H0215745U JP 9428688 U JP9428688 U JP 9428688U JP 9428688 U JP9428688 U JP 9428688U JP H0215745 U JPH0215745 U JP H0215745U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- semiconductor chip
- semiconductor device
- capacitor
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す構造図、第
２図は第１図の要部を拡大して示す斜視図、第３
図は第２図のＡ―Ａ線断面図、第４図は従来の半
導体装置を示す構造図、第５図は第４図の半導体
装置を印刷配線板に装着した状態を示す平面図で
ある。
１……半導体装置本体、２……半導体チツプ、
４……ダイパツド、５……リード端子、５ａ……
電源リード端子、５ｂ……グランド（接地）リー
ド端子、６……インナーリード部、１２……コン
デンサ、１３ａ……一方の電極端子、１３ｂ……
他方の電極端子。なお、図中同一符号は同一また
は相当部分を示す。
Fig. 1 is a structural diagram showing an embodiment of this invention, Fig. 2 is a perspective view showing an enlarged main part of Fig. 1, and Fig. 3 is a structural diagram showing an embodiment of the invention.
The figures are a cross-sectional view taken along the line A--A in Fig. 2, Fig. 4 is a structural diagram showing a conventional semiconductor device, and Fig. 5 is a plan view showing the semiconductor device shown in Fig. 4 mounted on a printed wiring board. . 1...Semiconductor device main body, 2...Semiconductor chip,
4... Die pad, 5... Lead terminal, 5a...
Power lead terminal, 5b...Ground lead terminal, 6...Inner lead portion, 12...Capacitor, 13a...One electrode terminal, 13b...
the other electrode terminal. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
デンサを設け、このコンデンサの一方の電極端子
を前記半導体チツプの電源リード端子に接続し、
他方の端子を半導体チツプの接地リード端子に接
続したことを特徴とする半導体装置。 A capacitor is provided in a semiconductor device body having a semiconductor chip, one electrode terminal of the capacitor is connected to a power lead terminal of the semiconductor chip,
A semiconductor device characterized in that the other terminal is connected to a ground lead terminal of a semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9428688U JPH0215745U (en) | 1988-07-16 | 1988-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9428688U JPH0215745U (en) | 1988-07-16 | 1988-07-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215745U true JPH0215745U (en) | 1990-01-31 |
Family
ID=31318796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9428688U Pending JPH0215745U (en) | 1988-07-16 | 1988-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215745U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62194184U (en) * | 1986-05-30 | 1987-12-10 |
-
1988
- 1988-07-16 JP JP9428688U patent/JPH0215745U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62194184U (en) * | 1986-05-30 | 1987-12-10 |