JPH0273687A - Mounting structure of surface mounted parts - Google Patents

Abstract

PURPOSE:To simplify the mounting work and also to improve quality in mounting by providing a groove where a conductive pattern is equipped at the inside in the shape corresponding to parts mounted on a printed board so as to press the mounting parts in this groove. CONSTITUTION:In a position where the mounting parts are mounted of a printed board 1 is provided a recessed groove 6 where a conductive pattern is extended at the inside in the shape corresponding to the mounting parts. When surface mounting parts 2 are pressed in this groove 6 the electrode 3 of the parts 2 and the pattern 4 are connected with each other, and soldering, etc., become needless, and the mounting work can be simplified and the quality in mounting can be elevated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a structure for mounting surface-mounted electrical or electronic components on a printed board or the like.

[Conventional technology]

Conventionally, this type of surface mount component, as shown in Figure 2,
A surface mount component 2 is placed on the component mounting position of the printed board 1, and the electrodes 3 provided at both ends of the component 2 are applied with cream solder 5. to the conductive pattern 4 provided on the print Fi,l. Alternatively, a structure is adopted in which mechanical and electrical connections are made using a conductive adhesive or the like. In this case, usually cream solder 5 or conductive adhesive is applied to the conductive pattern 4 in advance, and the solder is melted or the adhesive is softened when the component is mounted to make the connection.

[Problem to be solved by the invention]

The conventional mounting structure described above requires preparation work such as applying cream solder or conductive adhesive to the surface of the printed board in advance, and it is also necessary to make the amount of application uniform.
There is a problem that the work becomes troublesome. In addition, during mounting, a heat source is required to melt the cream solder and soften the conductive adhesive, and the mounting quality after connection (parts floating) is required.

There is also the problem that it takes time to check (inclination, connection status, etc.) and it takes a considerable amount of time to correct them.

An object of the present invention is to provide a mounting structure for surface mount components that can simplify mounting work and improve mounting quality.

(Means for Solving the Problems) The surface mount component mounting structure of the present invention includes a groove having a shape corresponding to the surface mount component at the mounting location of the surface mount component on a printed circuit board, and an inner surface of the groove. A conductive pattern with a portion of the conductive pattern extended is provided, and the surface mount component is press-fitted into this groove, and the electric groove is brought into contact with the conductive pattern.

[Effect]

In the above-described configuration, the surface mount component is mechanically supported by press-fitting into the groove, and the electrode thereof is brought into contact with the conductive pattern to establish an electrical connection.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a longitudinal sectional view of one embodiment of the present invention.

In the figure, 1 is a printed board, 2 is a surface-mounted electronic component, such as a chip resistor, mounted on this printed board 1, and electrodes 3 are formed at both ends thereof. Here, a concave groove 6 having a shape corresponding to the planar shape of the surface mount component 2 to be mounted, for example, a length dimension somewhat smaller than the dimension in the length direction of the component 2, is formed at the mounting location of the printed board 1. are doing.

A conductive pattern 4 connected to other surface areas of the printed board 1 is formed in a required area on the inner surface and inner bottom surface of the groove 6 to extend.

Then, the surface mount component 2 is press-fitted into the groove 6, and this press-fit relationship mechanically supports the surface mount component 2 in the groove 6, and the electrode 3 is connected to the conductive pattern. It is electrically connected to 4.

According to this configuration, there is no need to prepare for applying cream solder or conductive adhesive when mounting surface mount components.
Furthermore, during mounting, it is sufficient to simply press fit the surface mount component 2 into the groove 6. Therefore, the mounting work can be made extremely simple, and there is also the effect that a heat source is not required during mounting.

〔Effect of the invention〕

As explained above, in the present invention, a printed board is provided with a groove and a conductive pattern, and a surface mount component is press-fitted into the groove and its electrode is brought into contact with the conductive pattern. The electrodes are mechanically supported by press-fitting inside, and the electrodes are electrically connected by contacting the conductive pattern, making it possible to mount without the need for solder or conductive adhesive, simplifying the work and increasing the reliability of the mounting. It has the effect of improving sex.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a conventional structure. 1...Printed board, 2...Surface mount components, 3...
Electrode, 4... Conductive pattern, 5... Cream solder,
6...concave groove. Fig. 1 2 Hypnosis 2 Fig. 2

Claims (1)

[Claims] 1. A concave groove having a shape corresponding to the surface mount component is provided at the mounting location of the surface mount component on the printed circuit board, and a conductive pattern with a part of the conductive pattern extended on the inner surface of the concave groove, and the surface mount component is mounted in the concave groove. A mounting structure for a surface mount component, characterized in that the electrode is press-fitted into the groove and brought into contact with the conductive pattern.