JPH0266476A - Testing device for semiconductor circuit - Google Patents
Testing device for semiconductor circuitInfo
- Publication number
- JPH0266476A JPH0266476A JP63217921A JP21792188A JPH0266476A JP H0266476 A JPH0266476 A JP H0266476A JP 63217921 A JP63217921 A JP 63217921A JP 21792188 A JP21792188 A JP 21792188A JP H0266476 A JPH0266476 A JP H0266476A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor circuit
- control system
- optical
- measurement
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000012360 testing method Methods 0.000 title claims description 11
- 238000005259 measurement Methods 0.000 claims abstract description 44
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 239000013307 optical fiber Substances 0.000 claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体回路試験装置に関し、特に制御系と計測
系が分離された試験装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor circuit testing device, and particularly to a testing device in which a control system and a measurement system are separated.
（従来の技術）
従来、この種の試験装置は、第２図に示すように、載置
した半導体回路Ａに電気接続して計測を行う計測系１と
、この計測系１に通信線３で電気接続して計測系１を制
御する制御系２で構成されている。この制御系２は、フ
ァンクションブロック４．レベルブロック５．試料用電
源及び直流測定ブロック６、更に制御部７で構成してお
り、各ブロックからの信号を通信線３を通して計測系１
に送出し、かつ受信することで、計測系１における回路
試験を行っている。(Prior Art) Conventionally, as shown in FIG. 2, this type of test equipment includes a measurement system 1 that is electrically connected to a mounted semiconductor circuit A to perform measurements, and a communication line 3 connected to this measurement system 1. It consists of a control system 2 that is electrically connected to control the measurement system 1. This control system 2 includes function blocks 4. Level block 5. It consists of a sample power source, a DC measurement block 6, and a control section 7. Signals from each block are sent to the measurement system 1 through a communication line 3.
A circuit test in the measurement system 1 is performed by sending the signal to and receiving the signal.
上述した従来の半導体回路試験装置は、計測系ｌと制御
系２を通信線３で接続しているため、周囲に存在する電
磁波等のノイズが通信線３に混入し、このノイズが計測
信号に影響して正確かつ高精度の計測が阻害されるとい
う問題がある。また、計測系１と制御系２の各部を夫々
通信線３で接続する必要があるため、通信線３の線材の
数量が増大して煩雑になるという問題がある。In the conventional semiconductor circuit testing device described above, the measurement system 1 and the control system 2 are connected by the communication line 3, so noise such as electromagnetic waves existing in the surroundings mixes into the communication line 3, and this noise is mixed into the measurement signal. There is a problem in that accurate and high-precision measurement is obstructed. Further, since each part of the measurement system 1 and the control system 2 needs to be connected by the communication line 3, there is a problem that the number of wires of the communication line 3 increases and becomes complicated.
本発明はノイズによる影響を無くし、かつ線材の数量を
低減して上述した問題を解消することを可能とした半導
体回路試験装置を提供することを目的としている。SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor circuit testing apparatus that eliminates the influence of noise and reduces the number of wires to solve the above-mentioned problems.
本発明の半導体回路試験装置は、半導体回路に接触して
電気的な計測を行う計測系と、この計測系を制御する制
御系の夫々に光通信用インターフェイスを配設し、かつ
これらを通信線としての光ファイバで接続して計測系と
制御系間で光信号を送受可能に構成している。The semiconductor circuit testing device of the present invention includes an optical communication interface provided in each of a measurement system that makes electrical measurements by contacting a semiconductor circuit, and a control system that controls this measurement system, and connects these with a communication line. The system is configured so that optical signals can be sent and received between the measurement system and the control system by connecting them with an optical fiber.
また、制御系の一部のブロックを計測系に配設する。Also, some blocks of the control system are placed in the measurement system.
〔作用］
上述した構成では、計測系と制御系との間の信号を光信
号で送受でき、周囲の電磁波等によるノイズの影響を解
消する。また、制御系の一部のブロックを計測系に配設
することで、通信線の数を低減できる。[Operation] With the above-described configuration, signals can be transmitted and received between the measurement system and the control system as optical signals, and the influence of noise caused by surrounding electromagnetic waves and the like can be eliminated. Further, by arranging some blocks of the control system in the measurement system, the number of communication lines can be reduced.
次に、本発明を図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の試験装置の一実施例の構成図である。FIG. 1 is a block diagram of an embodiment of the testing apparatus of the present invention.
図において、１はテスターステーション、即ち計測系で
あり、載置した半導体回路Ａに電気接続して電気的特性
等の計測を行う。ここでは計測系１内にレベルブロック
５．及び光通信インターフェイス８を配設している。ま
た、２はテスター本体、即ち制御系であり、ファンクシ
ョンブロック４．試料用電源及び直流測定ブロック６、
及び制御部７を有するとともに、ここでは光通信インタ
ーフェイス９を設けている。そして、これら各県の光通
信インターフェイス８，９を通信線の一部としての光フ
ァイバ３１により接続している。In the figure, reference numeral 1 denotes a tester station, that is, a measurement system, which is electrically connected to the mounted semiconductor circuit A to measure electrical characteristics and the like. Here, within the measurement system 1 there is a level block 5. and an optical communication interface 8. 2 is the main body of the tester, that is, a control system, and a function block 4. Sample power supply and DC measurement block 6,
and a control section 7, and here an optical communication interface 9 is provided. The optical communication interfaces 8 and 9 of each prefecture are connected by an optical fiber 31 as part of a communication line.
なお、計測系１と前記試料用電源及び直流測定ブロック
６は、これまでと同様に電気的な線材からなる通信線３
で接続している。Note that the measurement system 1, the sample power source, and the DC measurement block 6 are connected to the communication line 3 made of electrical wire as before.
It is connected with
この構成によれば、計測系１０半導体回路Ａの計測にお
いては、各種の電気特性を計測するが、特にレベル計測
のみは計測系ｌ内で行うことになる。このため、計測系
１と制御系２とを接続する通信線の本数を低減すること
ができる。According to this configuration, various electrical characteristics are measured in the measurement of the semiconductor circuit A of the measurement system 10, and in particular, only level measurement is performed within the measurement system 1. Therefore, the number of communication lines connecting the measurement system 1 and the control system 2 can be reduced.
また、これらの計測に際しての計測系１と制御系２との
間の信号の送受は、両者に設けた光通信インターフェイ
ス８．９によってレーザ光等の光信号に変換した上で、
光ファイバ３１を介して行うことになる。このため、周
囲に存在する電磁波等の影響を受けることはなく、ノイ
ズの影響が殆どない計測が実現できる。また、光信号の
送受により、信号の多重化を容易にし、ケーブル数を一
層低減して計測系１と制御系２との接続を簡素化するこ
ともできる。これにより、装置の移設、移動時の切り離
しが容易となり、工数を低減できる効果もある。In addition, during these measurements, signals are transmitted and received between the measurement system 1 and the control system 2 after being converted into optical signals such as laser light by an optical communication interface 8.9 provided on both.
This will be done via the optical fiber 31. Therefore, it is not affected by electromagnetic waves existing in the surroundings, and measurement with almost no influence of noise can be realized. Furthermore, by transmitting and receiving optical signals, signal multiplexing can be facilitated, the number of cables can be further reduced, and the connection between the measurement system 1 and the control system 2 can be simplified. This makes it easy to relocate the device and disconnect it during movement, which also has the effect of reducing the number of man-hours.
なお、通信線３は電源及び直流を通流させるためのもの
であり、ノイズが影響されることはない。Note that the communication line 3 is for passing power and direct current, and is not affected by noise.
以上説明したように本発明は、計測系と制御系の夫々に
光通信用インターフェイスを配設し、かつこれらを光フ
ァイバで接続して計測系と制御系間で光信号を送受可能
に構成しているので、周囲の電磁波等によるノイズの影
響を解消することができ、正確かつ高精度の計測が実現
できる。また、信号を多重化することで、通信線の本数
を低減でき、接続構造の簡略化を図ることもできる。As explained above, the present invention is configured such that an optical communication interface is provided in each of the measurement system and the control system, and these are connected with an optical fiber so that optical signals can be transmitted and received between the measurement system and the control system. Therefore, it is possible to eliminate the influence of noise caused by surrounding electromagnetic waves, etc., and achieve accurate and high-precision measurements. Furthermore, by multiplexing signals, the number of communication lines can be reduced and the connection structure can be simplified.
第１図は本発明の一実施例の全体構成図、第２図は従来
の半導体回路試験装置の全体構成図である。
１・・・計測系、２・・・制御系、３・・・通信線、４
・・・ファンクションブロック、５・・・レベルブロッ
ク、６・・・試料用電源及び直流測定ブロック、７・・
・制御部、８．９・・・光通信用インターフェイス、３
１・・・光ファイバ、Ａ・・・半導体回路。FIG. 1 is an overall configuration diagram of an embodiment of the present invention, and FIG. 2 is an overall configuration diagram of a conventional semiconductor circuit testing apparatus. 1...Measurement system, 2...Control system, 3...Communication line, 4
...Function block, 5...Level block, 6...Sample power supply and DC measurement block, 7...
・Control unit, 8.9... Optical communication interface, 3
1...Optical fiber, A...Semiconductor circuit.
Claims (1)
、この計測系を制御する制御系と、これら計測系と制御
系とを接続する通信線とで構成され、前記計測系と制御
系の夫々に光通信用インターフェイスを配設し、かつこ
れらを光ファイバで接続して計測系と制御系間で光信号
を送受可能に構成したことを特徴とする半導体回路試験
装置。1. Consists of a measurement system that makes electrical measurements by contacting a semiconductor circuit, a control system that controls this measurement system, and a communication line that connects these measurement systems and the control system. A semiconductor circuit testing device characterized in that each system is provided with an optical communication interface, and these are connected with an optical fiber so that optical signals can be transmitted and received between a measurement system and a control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63217921A JPH0266476A (en) | 1988-08-31 | 1988-08-31 | Testing device for semiconductor circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63217921A JPH0266476A (en) | 1988-08-31 | 1988-08-31 | Testing device for semiconductor circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0266476A true JPH0266476A (en) | 1990-03-06 |
Family
ID=16711819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63217921A Pending JPH0266476A (en) | 1988-08-31 | 1988-08-31 | Testing device for semiconductor circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0266476A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372378U (en) * | 1989-11-15 | 1991-07-22 | ||
| WO1998022829A1 (en) * | 1996-11-15 | 1998-05-28 | Advantest Corporation | Integrated circuit device tester |
| US6586953B1 (en) | 1998-02-05 | 2003-07-01 | Advantest Corporation | Optically driven driver, optical output type voltage sensor, and IC testing equipment using these devices |
-
1988
- 1988-08-31 JP JP63217921A patent/JPH0266476A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372378U (en) * | 1989-11-15 | 1991-07-22 | ||
| WO1998022829A1 (en) * | 1996-11-15 | 1998-05-28 | Advantest Corporation | Integrated circuit device tester |
| GB2322203A (en) * | 1996-11-15 | 1998-08-19 | Advantest Corp | Integrated circuit device tester |
| US6157200A (en) * | 1996-11-15 | 2000-12-05 | Advantest Corporation | Integrated circuit device tester |
| US6586953B1 (en) | 1998-02-05 | 2003-07-01 | Advantest Corporation | Optically driven driver, optical output type voltage sensor, and IC testing equipment using these devices |
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