JPH0224035B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing a circuit board, and more particularly to a method for manufacturing a circuit board using a resin that is cured by a reticulation reaction.

[Technical background of the invention and its problems]

Conventionally, circuit boards based on resins that have been put to practical use include those based mainly on thermosetting resins, such as paper-phenol boards, glass matte polyester boards, and glass-epoxy boards. Conventionally, in this type of circuit board, a circuit pattern is formed by using a copper-clad thermosetting resin plate, printing a resist, and dissolving and removing the underlying copper by etching.

The main reason why thermosetting resins such as those mentioned above have been common in the past is that thermoplastic resins are sensitive to heat. That is, circuit boards generally require soldering for connection with components, and commonly used solder with a eutectic composition of Sn and Pb is required to withstand temperatures of 220°C to 260°C. This is because thermoplastic resins, on the other hand, cannot withstand the above-mentioned temperatures.

On the other hand, in order to increase the packaging density of circuits, circuit patterns are being multilayered. In this case, conventionally, copper through-holes using electroless plating have been frequently used to connect circuit patterns between layers. That is, etched copper foil laminates and prepreg are alternately layered and bonded under heat, then electroless plating is applied to the hole walls obtained by drilling, and the front and back surfaces are etched in a desired pattern to create a multilayer structure. This process connects the circuit patterns between each layer. However, this method has the disadvantage that the process is complicated and the circuit board is expensive.

Another example of a multilayer circuit board is a thick film circuit board that is made into multiple layers by repeating the process of printing and firing a conductive paste on an insulating substrate, and then printing and firing an insulating paste. This method is simple because it does not require through-hole processing, that is, the process of attaching a conductor to the hole wall. Then, there was a problem that printing became difficult in practice.

Furthermore, in any of the above multilayer circuit boards, the insulating substrate surface and the circuit pattern surface are not on the same plane, and the circuit pattern surface often protrudes from the substrate surface by several tens of micrometers. Therefore, there is a problem in that the operation of parts that require sliding on the circuit board, such as the coupling operation with connectors or the sliding of contacts of switches and variable resistors, tends to become unstable, which is accompanied by mechanical wear and the generation of electric arcs. It was hot.

[Purpose of the invention]

The present invention was made in view of the above-mentioned drawbacks, and its purpose is to create a circuit board with no restrictions on the number of layers, which can be obtained through a simple manufacturing process by using a resin that hardens through a reticulation reaction. The object of the present invention is to provide a manufacturing method, and more specifically, to provide a method for manufacturing a circuit board in which a circuit pattern does not protrude from the surface of an insulating substrate.

Another object is to provide a method for manufacturing a circuit board that can be easily multilayered through a simple manufacturing process by using a resin that hardens through a reticulation reaction, and that also enables three-dimensional wiring. .

Still another object is to provide a method for manufacturing a circuit board that can be connected to components without the need for soldering.

[Summary of the invention]

In the present invention, a base material, which is a first insulating member, is formed from a resin that is in a B-stage state and cures by causing a reticulation reaction, and a curable resin that is also in a B-stage state is placed on this base material as a binder. A circuit pattern is formed using a conductive resin composition, a second insulating member in a B-stage or C-stage state is formed on the circuit pattern, and the first and second insulating members are connected to each other. By thermocompression bonding, the curable resin in the B stage state is plastically deformed, and a part of the circuit pattern is inserted into the second insulating member through the perforation or notch provided in the second insulating member. This is a method of manufacturing a circuit board, characterized in that the circuit board is raised up to the surface.

〔Effect of the invention〕

According to the present invention, an insulating member is formed with a curable resin in a B-stage state, a circuit pattern is formed with a conductive resin composition using a curable resin in the same stage as a binder, and a circuit pattern is formed in a predetermined portion. The circuit pattern is covered with an insulating film having perforations or notches, and these are bonded together by thermocompression, so that the base material made of the curable resin in the B-stage state and the binder in the B-stage state are bonded together by thermocompression bonding. The included circuit pattern is plastically deformed, and a part of the circuit pattern rises to the surface of the insulating film through the perforation or notch without being disconnected. Therefore, a through hole can be formed without electroless plating or the like on the hole wall, and there is no protrusion of the circuit pattern on the surface of the substrate when the substrate is multilayered. Furthermore, connections with other electrical components can be made without using a soldering process. As described above, according to the present invention, it is possible to provide a method of manufacturing a circuit board that can be extremely easily multilayered and is inexpensive.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be explained in Figures 1a to d.
Explain with reference to.

In the present invention, a resin that is cured by causing a reticulation reaction is used. This resin is in a semi-solid state called B stage at room temperature and exhibits plasticity when heated, but after molding, further heat or radiation causes a reticulation reaction and hardens. be.

In FIG. 1a, 1 is a base material made of a B-stage thermosetting resin, and a first
As shown in FIG. b, a circuit pattern 2 is formed by a method described in detail later. The circuit pattern 2 is formed of a conductive resin composition using a B-stage thermosetting resin of the same type or different type as the base material 1 as a binder and mixed with metal powder or semiconductive powder.

Here, the circuit board material used for the base material 1 and the circuit pattern 2 is not limited to thermosetting resins, but may also be materials that are cured by irradiating radiation such as ultraviolet rays to cause a reticulation reaction. good. Examples of thermosetting resins that have practical electrical insulation, moisture resistance, and heat resistance include epoxy resins, unsaturated polyester resins, 1,2 polybutadiene resins,
Thermosetting acrylic resins, polyurethane resins, novolac type phenolic resins, polyimide resins, styrene-divinylbenzene copolymers containing peroxides such as cube member oxide, polyethylene resins containing peroxides, etc. are used. For example, polyethylene resin is used as the cured resin. In addition, metal powders used in the conductive resin composition include gold, silver, copper, nickel, tungsten,
Examples of the semiconductive powder include molybdenum, platinum, aluminum, tin, and alloys or composite powders mainly composed of these. Examples of the semiconductive powder include carbon powder, silicon carbide, vanadium pentoxide powder, and mixed powders thereof. It is most desirable that the thermosetting resins used for the base material 1 and the circuit pattern 2 are of the same type, but they do not necessarily have to be of the same type, and as long as they have properties almost equivalent to the above-mentioned prepolymers, A combination of different types may also be used. As a method for forming a conductive resin composition into a desired pattern,
Preferred is a printing method, such as a dispenser method in which the conductive composition is dissolved in a solvent to form a paste and drawn while being moved to form the desired shape, such as screen printing, offset printing, or inkjet printing. Alternatively, there is a method in which a conductive resin composition is made into powder and electrostatically printed, and a method in which the conductive composition is imparted with heat sensitivity and selectively heated to form a pattern.

Next, as shown in FIG. 1c, the upper surface of the circuit pattern 2 is covered with a B-stage insulating film 3. This insulating film 3 is also made of a curable resin that causes a reticulation reaction when exposed to heat or radiation, and is preferably of the same type as the base material 1, but does not necessarily have to be of the same type, and may have adhesive properties. If the combination is unsuitable, an insulating film with an adhesive layer may be used. Further, the insulating film 3 may be formed in advance into a sheet shape and simply placed on the circuit pattern 2, or may be formed by printing, pressing, laminating, etc. This insulating sheet 3 has perforations 4 or cutouts 5 formed in areas corresponding to specific portions of the circuit pattern 2.

Then, by thermocompression bonding the base material 1 and the insulating film 3 at a desired temperature and pressure in the state shown in FIG. As shown in FIG. d, the surface of the circuit pattern 2 is exposed on the same plane as the insulating film 3 through the perforations 4 or cutouts 5 in the insulating film 3. Next, the base material, circuit pattern, and insulating film are cured by further raising the temperature or irradiating with radiation to cause a reticulation reaction, thereby obtaining the circuit board 6.

Note that the insulating film 3 may be made of C-stage thermosetting resin. In this case, the base material 1 and the circuit pattern 2 are plastically deformed by the thermocompression bonding,
The surface of the circuit pattern 2 is exposed on the same surface as the insulating film 3 through the perforation or notch of the C-stage insulating film 3.

FIG. 2 shows an enlarged view of the cross-sectional areas (conductive exposed surfaces) 7 and 8 of the circuit board 6 shown in FIG. 1d. That is, in FIG. 2, the fan-shaped portion of the cross-sectional area 10 corresponds to the insulating film 3 of FIG. 1, and the trapezoidal portion of the cross-sectional area 11 corresponds to the base material 1 and the circuit pattern 2 of FIG. As is clear from this figure, the circuit pattern 2 draws a smooth curve in the boundary area 12 between the cross-sectional areas 10 and 11, and is formed continuously and integrally on the almost smooth exposed surface (upper left of the figure). It can be seen that

As is clear from the above explanation, according to the present invention, as shown in FIG. 1d and FIG.
Base material 1, circuit pattern 2 and insulating film 3
By integrally molding the circuit pattern 2 using a resin that hardens through a reticulation reaction, the circuit pattern 2 will not be disconnected at the boundary area between the circuit pattern and the insulating material.
It can be raised to the same plane as the insulating film to ensure electrical connection. Therefore, Figure 1c
By preparing a plurality of pieces corresponding to the above in advance and bonding them by thermocompression, the circuit patterns can be connected to each other and a smooth surface can be maintained.

An embodiment in which the present invention is applied to a multilayer circuit board as described above will be described with reference to FIG.

First, as shown in FIG. 3a, circuit boards 30, 31, 3 obtained by the process explained in FIG.
Prepare 2. Circuit patterns 301 and 303 are formed on the lower surface side of the first layer circuit board 30,
A perforation 302 is formed on the right end side. The second layer circuit board 31 has circuit patterns 31 on both upper and lower surfaces.
1,314 and 312,315 are formed, and a perforation 313 is formed on the left end side. Furthermore, the third
The circuit board 32 of the layer has a circuit pattern 3 on the top side.
21, 323, 324, and 325 are formed, and a perforation 322 is formed on the right end side. Further, in this example, a resistor 33 is interposed between the circuit patterns 303 and 314 of the first and second layer circuit boards 30 and 31 as an individual component attached to the multilayer circuit board. , 32 between diode 3
4 is interposed.

In this state, when the three circuit boards 30, 31, and 32 are integrated by thermocompression bonding, the result is as shown in FIG. 3b. That is, the circuit patterns 311 and 312 on the second layer circuit board 31 are
and 322 through substrates 30 and 3, respectively.
It is raised and exposed on the same plane as the upper and lower surfaces of 2. In addition, circuit patterns 301 and 321
are raised toward each other through a hole 313 provided in the circuit board 31 and come into contact within the hole 313 of the lever, resulting in a conductive state. Also, the upper electrode 33 of the resistor 33
1 is attached to the circuit pattern 303 and the lower electrode 332
is connected to the circuit pattern 314. At this time,
The resistor 33 is embedded in the circuit boards 30 and 31 as shown in FIG. 3b. On the other hand, the left electrode 341 of the diode 34 is connected to the circuit pattern 323 of the circuit board 32, and the right electrode 342 is connected to the circuit pattern 324, respectively. At this time, the diode 34 is embedded in the circuit boards 31 and 32 similarly to the resistor 33. Since the circuit patterns 315 and 325 are located in vertically corresponding positions, they are integrated during thermocompression bonding. Next, after this plastic deformation, a hardening reaction is caused by heating or radiation irradiation.

By integrating the three circuit boards 30, 31, and 32 in this way, a three-layer circuit board is formed with a thickness that is approximately equal to or less than that of three circuit boards. be done.

As described above, according to the present invention, the circuit pattern can be plastically deformed during thermocompression bonding without causing wire breakage, so that the circuit pattern does not protrude from the surface of the substrate even when multilayered. Further, other electrical components can be connected to the circuit pattern without using a soldering process.

If the number of layers increases and thermocompression bonding cannot be performed in one step, the circuit boards may be aligned and pressure bonded in order starting from the upper or lower circuit board.

Furthermore, according to the present invention, the circuit pattern of the circuit board can be plastically deformed without causing disconnection during thermocompression bonding, so that the circuit board can be made three-dimensional. That is, a circuit board 40 as shown in FIG. 4a is made using a B-stage insulating film by the method explained in FIG. 1. In the figure, 41 is a circuit pattern. This circuit board 40 is heated to a state where it can be plastically deformed, and then extruded, vacuum formed, cold worked, etc.
As shown in FIG. 4b, it becomes possible to three-dimensionalize the wiring in a predetermined shape. If this three-dimensional arrangement has an insulating layer on one side and a circuit layer on the other side, it can be used as a casing for an electronic device, and has extremely great practical value.

The embodiments of the present invention described above will be described in more detail.

Specific example 1 In the manufacturing process shown in Figure 1, bisphenol A with an average molecular weight of 2500 containing 5% dicyandiamide
3mm made of epoxy resin in the B stage state of the mold
100 parts by weight of a prepolymer made of the same B-stage epoxy resin and 330 parts by weight of a mixed solvent containing cyclohexanone and n-butyl carbitol in a 1:1 ratio were added to a thick base material 1 under heating to form a homogeneous solution. None, plus 850 parts by weight of average particle size in this solution
Silver powder of 5μ was added and kneaded with a paint roll to obtain a conductive resin composition. This was printed on the base material 1 by screen printing as shown in FIG. 1b, and then dried at room temperature and under reduced pressure for 1 hour to form a circuit pattern 2. Next, holes of 3 mm diameter were made at predetermined locations in a 0.1 mm thick insulating film 3 made of the same prepolymer as described above, and a circuit pattern 2 printed on the base material 1 using this insulating film 3 was formed as shown in Fig. 1c. It was covered and thermocompression bonded as shown.
The thermocompression bonding conditions were 80°C, 5Kg/cm ² (resin pressure), and 30 minutes. Next, in order to reticulate this and move it to the C stage, it was heated at 100°C for 30 minutes at the same pressure.
The reticulation reaction was carried out at 120°C for 20 minutes and at 150°C for 1 hour. As a result, a circuit board was obtained in which the insulating film 3 and the surface of the circuit pattern 2 were on the same plane as shown in FIG. 1d. Furthermore, when the connection between the exposed portion of the circuit pattern 2 and the inner layer portion was measured, the connection was found to be perfect. In addition, as shown in Fig. 5, holes 51 of 2 mmφ are drilled in a film-like insulating substrate, and 50 holes are made in a row at a pitch of 10 mm. When circuit patterns (conductor paths) 52 with a width of 1 mm were alternately printed and thermocompression bonded, the conductor paths on the front and back surfaces were embedded in the substrate, and the conductor paths on the front and back surfaces were connected within the holes 51. A continuous conductor path was formed from one end to the other. The resistance value was also sufficiently low at 25Ω. Moreover, even when this circuit board was deformed and bent, almost no change in resistance value was observed.

Concrete Example 2 As shown in Figure 6a, 0.5% Qyumen peroxide and 50% by weight average particle size 10 μm
B-stage 1,2 polybutadiene resin containing fused silica (Polybutadiene B manufactured by Nippon Soda Co., Ltd.)
2.4 x 1.2 mm holes 62, 63 are made in a 0.8 mm thick base material 61 obtained by molding a 0.8 mm thick material (-4000) with a press, and then 2.4 x 1.2 x 0.8 mm holes 62, 63 are made in this as shown in Fig. 6b. A chip resistor 64 and a chip capacitor 65 of 3.0 x 1.8 x 0.8 mm were press-fitted, and the surface was made approximately flat. Note that 66a, 66b, 67a, and 67b are terminals. Next, B stage 1,2 polybutadiene resin (manufactured by Nippon Soda Co., Ltd., polybutadiene resin B-
A conductive resin composition was prepared by adding 2% of Qyumen peroxide and 80% of silver grains with an average particle size of 5 μm to (2000) and adding a small amount of tetralin using a three-roll process. was printed and dried under reduced pressure to form a circuit pattern 68 as shown in FIG. 6c. Next, as shown in FIG. 6d, an insulating film 69 with holes 70 formed at specific positions of a prepolymer sheet made of the same resin as the base material 61 is stacked on top of the circuit pattern 68, and further insulated on the back side. A film 71 (0.1 mm thick) is placed in a mold that can be heated and pressurized, and it is heated to 10 kg/cm ² at room temperature.
By applying (resin pressure), a component-integrated circuit board was obtained. Then, by thermocompression bonding, the exposed surface 73 of the circuit pattern 68 was formed on the same plane as the insulating film 69, as shown in FIG. 6e. Next, press this on both sides with a mold.
The temperature was raised to 180°C to carry out the reticulation reaction.
When the connections of the circuit board thus obtained were checked, there were no disconnections and the circuit operated normally.

Specific Example 3 As shown in Figure 7a, the weight ratio of
Holes 81 with a diameter of 1 mm were made at predetermined locations on substrates 80 and 80' made of prepolymer containing 20% glass fiber, and circuit patterns 82 and 83 made of a conductive resin composition were printed from the front and back sides. At this time, hole 81
A conductive resin composition flowed into the inside, and the circuit patterns on the front and back sides were connected as shown. Thereafter, this was left at room temperature for 24 hours to dry. The conductive resin composition used here was the same as that used in Specific Example 2, and printing was performed by a roll transfer method.

Next, holes 9 are formed in specific parts between the two substrates having different conductor patterns prepared in this way.
Made of the same material as the base material 80 having a diameter of 0.91
An insulating film 85 with a thickness of 100 μm is interposed, and the outermost layer has holes 87 to 89 in specific parts.
Insulating films 84 and 86 with a thickness of 100 μm are arranged,
Heat and press at 60℃ and 10Kg/cm ² (resin pressure), then heat and press at 180℃ and 60Kg/cm ² for 30 minutes.
Pressure pressing was performed, and after cooling, it was taken out. The cross section of the obtained circuit board had a structure approximately as shown in FIG. 7b, and the electrical connection between the circuit patterns of the upper and lower circuits was maintained well.

Specific example 4 A sheet of B-stage polyethylene resin with a thickness of 0.5 mm is used as a base material, and on the other hand, 10 parts of B-stage polyethylene resin, 80 parts of tetralin, and 80 parts of copper grains with an average particle size of 5 μm are used as a base material.
A conductive resin composition was prepared containing 0.2 parts of pirocarol and 0.2 parts of pirocarol. In this case, the paste was prepared by kneading the formulation with hot rolls heated to about 60°C. Next, while this conductive resin composition was kept warm, it was screen printed in a predetermined pattern on the substrate heated to about 60°C, and dried at 40 to 5°C under reduced pressure.
Layer the polyethylene films together and heat at 130°C.
It was laminated with a hot roll to a thickness of 5 to 10 kg/cm ² (resin thickness). This operation was repeated twice.

Next, the obtained circuit board sheet was molded using a mold having a female mold as shown in FIG.
After preheating to ℃ and performing vacuum forming, Fig. 4b
A three-dimensional circuit board as shown in is obtained. Next, this was irradiated with radiation mainly consisting of β rays to cause a reticulation reaction. It was confirmed that the obtained circuit board had no cutting of the circuit pattern, and could be fully used as a circuit board.

Next, a modification of the present invention will be described with reference to FIGS. 8 and 9. That is, according to the embodiment described in FIG. 1, the circuit pattern is formed so as to be exposed on the same plane as the circuit board. Since this circuit pattern is formed from a composition containing a conductive material and a resin as a binder, it has a problem in terms of wear resistance and connection strength with other terminals. This article describes the formation of a protective layer to compensate for this.

That is, the steps a to d in FIG. 8 are similar to those in FIG.
The steps from step d to step d are the same. Next, after applying Cu or Ni plating to the exposed surface 7 of the circuit pattern 2,
(See Figure 8e) After applying a protective layer 7a such as gold or silver plating, this protective layer 7a is bonded again by thermocompression.
was press-fitted into an insulating film (Fig. 8f).

In FIG. 9, a gold or silver thin piece 7b is inserted in advance into the perforation 4 of the insulating film 3 (see FIG. 9c).
By thermocompression bonding, the gold or silver thin piece is exposed on the same plane as the insulating film, as shown in FIG. This is an example of the formation.

As described above, according to the present invention, multilayer wiring becomes possible without using a soldering process or connection technology such as through-holes. For this reason, in recent years, thin type devices have been developed that embed integrated circuits in substrates with a thickness of 1 mm or less, and process external inputs used in accordance with the desired usage pattern with their own basic circuits before outputting new signals. It has the advantage that it can be widely applied to, for example, calculators, cash cards, credit cards, etc.

It goes without saying that various applications and modifications can be made to the present invention without departing from the gist thereof.

[Brief explanation of drawings]

FIG. 1 is a process diagram for explaining one embodiment of the method for manufacturing a circuit board according to the present invention, and FIG. 2 shows a circuit pattern and an insulating film of the circuit board of the present invention obtained by the manufacturing process shown in FIG. 3 to 7 are process diagrams and plan views for explaining specific examples of the present invention, and FIGS. 8 and 9 are cross-sectional views showing the state of the boundary area of It is a manufacturing process diagram for explaining a modification. 1...Circuit board, 2,11...Circuit pattern,
3, 10... Insulating film, 4... Perforation, 7, 8
...Conductive exposed surface.

Claims (1)

[Claims] 1. A step of forming a first insulating member using a resin that is in a B-stage state and cured by causing a reticulation reaction, and a resin that is in a B-stage state and cured by causing a reticulation reaction. a step of forming a circuit pattern made of a conductive resin composition using as a binder on the first insulating member; and a step of forming a circuit pattern made of a resin that is cured by causing a reticulation reaction in a B-stage or C-stage state. a second part having a perforation or notch in a region corresponding to a predetermined part of the second part;
forming an insulating member so as to cover at least the circuit pattern; and thermocompression bonding the first and second insulating members and the circuit pattern to each other so that a part of the circuit pattern is formed in the perforation or the circuit pattern. A method for manufacturing a circuit board, comprising the steps of: raising the surface through the notch until the surface is substantially flush with the second insulating member; and curing the insulating member and the circuit pattern. 2. The method of manufacturing a circuit board according to claim 1, wherein the resin used to form the first and second insulating members and the circuit pattern is a thermosetting resin. 3 The thermosetting resin is an epoxy resin, an unsaturated polyester resin, a 1,2 polybutadiene resin, a thermosetting acrylic resin, a polyurethane resin, a novolac type phenolic resin, a polyimide resin, a styrene-divinylbenzene copolymer containing a peroxide. ,
3. The method for manufacturing a circuit board according to claim 2, wherein the material is at least one selected from polyethylene resins containing peroxide. 4. Claim 1, wherein the resin used to form the first and second insulating members and the circuit pattern is a radiation-curable resin.
2. Method for manufacturing a circuit board as described in Section 3. 5. The method of manufacturing a circuit board according to claim 4, wherein the radiation-curable resin is a polyethylene resin. 6. The method of manufacturing a circuit board according to claim 1, wherein the conductive resin composition forming the circuit pattern contains metal powder or semiconductive powder. 7 Claims characterized in that the metal powder is at least one selected from gold, silver, copper, nickel, tungsten, molybdenum, platinum, aluminum, and tin, or an alloy of two or more of these. 7. The method for manufacturing a circuit board according to item 6. 8. The method of manufacturing a circuit board according to claim 6, wherein the semiconductive powder is at least one selected from carbon, silicon carbide, and panadium pentoxide. 9 A step of forming the first and second insulating members using a resin that is cured by causing a reticulation reaction in a B-stage state, and a step of forming the resin that is cured by causing a reticulation reaction in a B-stage state as a binder. a step of forming a circuit pattern made of a conductive resin composition facing each other on the first and second insulating members; A third insulating member having a perforation in a region corresponding to a predetermined portion of the circuit pattern formed oppositely on the first and second insulating members is connected to the first insulating member and the third insulating member. the circuit pattern formed on the first insulating member and the second insulating member by thermocompression bonding the first to third insulating members; The method further comprises the steps of: connecting the circuit pattern formed on the insulating member in a perforated portion of the third insulating member; and thereafter curing the insulating member and the circuit pattern. Characteristic circuit board manufacturing method. 10 A step of forming the first and second insulating members using a resin that is cured by causing a reticulation reaction in a B-stage state, and a step of forming the resin that is cured by causing a reticulation reaction in a B-stage state as a binder. a step of forming a circuit pattern made of a conductive resin composition facing each other on the first and second insulating members; forming a third insulating member having a perforation in a region corresponding to a predetermined portion of the circuit pattern;
forming on at least one surface of the third insulating member a circuit pattern made of a conductive resin composition whose binder is a resin that hardens by causing a reticulation reaction in a B-stage state; and the circuit pattern. is interposed between the first insulating member and the second insulating member, and the third insulating member and the first and second insulating members are interposed between the third insulating member and the first and second insulating members. a step of interposing an electrical component between the electrical component and at least one of the electrical members; Connecting a circuit pattern and the circuit pattern formed on the second insulating member in a perforation of the third insulating member, and at least one of the first and second insulating members. a step of connecting the circuit pattern formed on the member and the circuit pattern formed on the third insulating member to an electrode of the electrical component, and then connecting the insulating member and the circuit pattern. A method for manufacturing a circuit board, comprising the step of curing.