JP5077800B2 - Manufacturing method of multilayer printed wiring board - Google Patents

Description

  The present invention relates to a multilayer printed wiring board in which a plurality of printed wiring boards are laminated, and a method for manufacturing the same.

  The multilayer printed wiring board is known as a technique that enables high-density mounting of components and can connect the components at the shortest distance (meaning that they are electrically connected; hereinafter simply referred to as connection).

  For example, in Japanese Patent Application Laid-Open No. 2004-95963 (Patent Document 1), an insulating base material (single-sided substrate) provided with a conductive layer (conductor circuit) forming a wiring pattern on one side reaches the conductive layer, and the other surface. A plurality of wiring board bases formed with conductive resin portions having bumps projecting to the bumps are in contact with conductive layers of other wiring board bases, and an adhesive is sandwiched between the wiring board bases. A method for producing a multilayer printed wiring board for laminating and pressing is described (claims 1, 1 and 2). However, in this method, the single-sided base material is sequentially laminated in one direction and batch-laminated press is performed, so that the single-sided base material on the outermost side has the surface of the insulating base material on the outside, so parts on both surfaces Implementation becomes impossible.

  In order to enable component mounting on both surfaces, a copper foil is placed on the surface of the outermost insulating base material and laminated, and after the lamination press, this copper foil is etched (circuit etching). A method of forming a circuit is conceivable. However, since copper foil is used, handling becomes difficult, and etching is necessary after batch lamination, which makes the process very troublesome. In circuit etching, circuit misalignment tends to occur.

  It is also possible to mount components on both surfaces by using an insulating base material (double-sided base material) with metal foil circuits on both surfaces in the center and laminating the single-sided base material on both sides as described above. It can be. However, as described below, in general, circuit etching of a double-sided substrate is conducted by plating the metal foil layers on both sides to through holes or bottomed vias, so that the thickness of the metal layer increases. Therefore, there is a problem that miniaturization is difficult as compared with a single-sided base material and design flexibility is poor.

In addition, in order to connect the metal foil circuits on both surfaces of the double-sided base material, a method of forming a through hole connecting the two metal foil circuits in the substrate and filling the through hole with a conductive resin paste or the like is performed. However, sufficient connection cannot be obtained by this method alone, and it is necessary to plate (through-hole plating) with copper or the like in the through hole or on the opening of the through hole and its periphery. Therefore, there are problems that the manufacturing process becomes more complicated and the thickness of the layer is increased by forming the plating layer as described above.
JP 2004-95963 A (Claim 1, FIG. 1, FIG. 2)

  An object of the present invention is to provide a multilayer printed wiring board capable of mounting components at high density on both surfaces thereof. The present invention also provides a method for producing a multilayer printed wiring board capable of producing a multilayer printed wiring board capable of high-density component mounting on both surfaces thereof with a simple process and with less occurrence of circuit misalignment and the like. The task is to do.

  As a result of the study, the present inventor has at least two surfaces of an insulating substrate having a metal foil circuit on one surface thereof, and a laminated body obtained by bonding with an adhesive so that the metal foil circuit is at least outside both of them. A multilayer printed wiring board including a laminate in which both metal foil circuits are connected by a conductive portion made of a conductive resin composition formed in an insulating substrate and in an adhesive layer solves the above-described problem. I found out. In addition, the inventor uses an insulating substrate having a metal foil circuit on at least one surface thereof, and includes a conductive portion formed of a conductive resin composition in the insulating substrate and a bump provided thereon. By using a wiring board substrate that has the same structure and laminating so that the conductive parts of the wiring board substrate are connected by the bumps, the above multilayer printed wiring board can be generated in a simple process, such as circuit misalignment. We found that it can be manufactured with less. The present invention has been completed based on these findings.

The present invention includes, in claim 1, an insulating substrate, a metal foil circuit provided on at least one surface thereof, and a via hole formed in the insulating substrate and reaching one metal foil circuit and opening on the other surface. Two adhesive board layers, an adhesive layer having a through-hole that adheres between the two wiring board substrates, and has openings at both ends so as to include the openings of the via holes, and Provided is a multilayer printed wiring board comprising a laminate having an inter-circuit conductive part formed by filling the via hole and the through hole with a conductive resin composition.

  Here, as the insulating substrate, an insulating resin film can be used. For example, a resin film mainly composed of PET or polyimide is exemplified. Among them, the resin film mainly composed of polyimide is a heat-resistant film, can meet the demand for high heat resistance corresponding to the use of lead-free solder, and has low loss in high-frequency transmission compared to resin containing ceramic and glass cloth. In addition, the thickness and strength of the insulating substrate can be reduced, which is preferable. Claim 2 corresponds to this preferable mode.

  The insulating substrate constituting the wiring board base is provided with a metal foil circuit on at least one surface thereof. That is, the metal foil circuit may be provided on one surface of the insulating substrate, or may be provided on both surfaces. As will be described later, a single-sided plate provided with a metal foil circuit only on one surface is preferably used.

  The metal foil circuit can be formed, for example, by etching a metal foil such as a copper foil attached on an insulating substrate. For example, after forming a resist layer circuit pattern on a metal foil, immersing the metal foil in an etchant that corrodes the metal foil, removing portions other than the circuit pattern, and then removing the resist layer. Is done. Examples of the etchant in this case include a ferric chloride-based etchant mainly composed of ferric chloride, a cupric chloride-based etchant, and an alkali etchant. Moreover, as an insulating board | substrate with which metal foil was affixed on the one surface or both surfaces, the polyimide resin base material (CCL) with copper foil is illustrated.

  As a material for forming the metal foil circuit, a material mainly composed of copper is preferably exemplified from the viewpoints of conductivity, durability, availability, and the like. Claim 3 corresponds to this preferable mode.

  Examples of the material mainly composed of copper include copper or an alloy mainly composed of copper. As a material for the conductive layer circuit, silver, aluminum, nickel or the like is used in addition to copper.

  In the insulating substrate, a via hole (in the present specification, means a bottomed hole) is formed which reaches one metal foil circuit and opens on the other surface. To reach one metal foil circuit means that one metal foil circuit is the bottom of the via hole. When metal foil circuits are provided on both surfaces of the insulating substrate, the via hole has one metal foil circuit at the bottom, penetrates the insulating substrate and the other metal foil circuit, and is on the other metal foil circuit. An opening is formed.

  The via hole can be formed by drilling using a laser or the like at a position where interlayer connection of the insulating substrate is desired.

  The multilayer printed wiring board of the present invention includes a laminate in which at least part of the multilayer printed wiring board (the central portion in the thickness direction) is bonded with an adhesive layer. This adhesive layer has a through hole. Two wiring board base materials and an adhesive layer are formed so that both outer sides (surfaces) of the obtained laminate have a metal foil circuit, and two openings are provided at both ends of the through holes of the adhesive layer. It arrange | positions so that the opening part of the via hole of each wiring board base material may be included. The arrangement of the opening of the through hole so as to include the opening of the via hole means that both of them contact so that most or all of the opening of the via hole is within the opening of the through hole. To do.

  When the elastic modulus of the adhesive layer is 1 GPa or less, the stress at the time of reflow when a component is mounted on the multilayer printed wiring board is reduced, and this is preferable because of excellent reflow resistance and reliability. On the other hand, if the elastic modulus is less than 0.001 GPa, the amount of deformation (elongation) becomes so large that it may be difficult to handle, so 0.001 GPa or more is preferable. Claim 4 corresponds to this preferred embodiment.

  However, in the case of a composite composed of two or more members in the adhesive layer, even when the overall elastic modulus exceeds 1 GPa, when a member having an elastic modulus of 0.001 GPa to 1 GPa is included. Since the stress at the time of reflow can be reduced at that portion and the reflow resistance and reliability can be improved, it is preferable in the same manner as the aspect of claim 4. Claim 5 corresponds to this preferred embodiment.

  As an adhesive layer of a composite composed of two or more members, a highly rigid porous material is impregnated with an adhesive, or a highly rigid insulating film layer is sandwiched between two layers of adhesive. The sheet | seat etc. which become are illustrated.

  As described above, the openings at both ends of the through holes of the adhesive layer include the openings of the via holes of the two wiring board bases, respectively. A hole reaching both ends of the metal foil circuit is formed. In the multilayer printed wiring board of the present invention, the hole is filled with the conductive resin composition, and the metal foil circuits on both outer sides of the laminate are connected. The hole filled with this conductive resin composition is referred to as an inter-circuit conductive portion.

  Examples of the conductive resin composition include those obtained by kneading conductive particles such as metal fine particles, metal fillers, and carbon fine particles into a resin that is easily plastically deformed. Specifically, silver paste or silver-coated copper Examples include fillers, copper fillers, carbon mixture pastes, and the like. Examples of the resin that easily undergoes plastic deformation include epoxy resins, polyester resins, polyimide resins, polyamide resins, and liquid crystal polymers.

  The multilayer printed wiring board of the present invention includes the above-described laminate, that is, a laminate having a metal foil circuit on the outside of both of them. Usually, the other wiring board base material is further outside of the outside metal foil circuit. , Glued and laminated with adhesive. The other wiring board base material has an insulating substrate and a conductor circuit such as a metal foil circuit provided on at least one surface thereof, and is provided in the insulating substrate and in the adhesive layer. The conductor circuit (metal foil circuit) on the outside of the laminate is connected to the conductor circuit (metal foil circuit) of another wiring board substrate by the conductive portion. The conductive part is formed by, for example, filling a conductive resin composition into a via hole provided in the insulating substrate and a through hole formed in the adhesive layer and the opening of which is in contact with the opening of the via hole. Can be obtained.

  One or more similar wiring board substrates can be laminated on the outer side of the other laminated wiring board substrates, and a multilayer printed wiring board is formed.

  The present invention further provides a method for producing the multilayer printed wiring board.

  That is, the present invention relates to an insulating substrate, a metal foil circuit provided on at least one surface of the insulating substrate, and a via hole formed in the insulating substrate and reaching one metal foil circuit and opening on the other surface. A wiring board base material a having a conductive resin portion filled with a conductive resin composition, an insulating substrate, a metal foil circuit provided on at least one surface thereof, and formed in the insulating substrate 1 A wiring board base having a conductive resin portion formed by filling a conductive resin composition in a via hole that reaches a metal foil circuit and opens on the other surface, and a bump formed of the conductive resin composition on the conductive resin portion A plurality of wiring board base materials including at least two pieces of the material b are bonded to each other so that the conductive resin portion of the wiring board base material a and the bumps of the wiring board base material b are in contact with each other. Sandwiched and stacked, Method of manufacturing a multilayer printed wiring board, which comprises laminating press to provide.

  The insulating substrate, metal foil circuit, and via hole of the wiring board substrate a and the wiring board substrate b are the same as the insulating substrate, metal foil circuit, and via hole described in the above description of the multilayer printed wiring board of the present invention. is there.

  The wiring board base material a has a conductive resin portion formed by filling a via hole with a conductive resin composition. As the conductive resin composition, the same one as the conductive resin composition is used. The method for filling the conductive material is not particularly limited, and examples thereof include a method for filling the conductive material by screen printing.

  The wiring board substrate b is obtained by further forming a conductive bump on the conductive resin portion of the wiring board substrate a. The bump of the conductive material is a protrusion of the conductive material, and the formation method is not particularly limited. For example, a release layer made of polyethylene terephthalate (PET) or the like is formed on the insulating substrate, and the insulating substrate is formed. And a method of forming a projecting portion by forming a via hole penetrating the mold release layer, filling the via hole with a conductive resin composition, and then peeling the mold release layer. Another method for forming the conductive bumps is to fill the via hole with the conductive resin composition and then apply the conductive resin composition on the via hole by screen printing.

  In the method for manufacturing a multilayer printed wiring board according to the sixth aspect, a plurality of wiring board base materials including at least two of the wiring board base material a and the wiring board base material b are laminated. Lamination is performed such that the conductive resin portion of the wiring board substrate a and the bumps of the wiring board substrate b are in contact with each other. Accordingly, both outer sides of the laminated body after lamination have a metal foil circuit.

  Lamination is performed by sandwiching an adhesive between the wiring board base material a and the wiring board base material b. Further, when another wiring board substrate to be described later is further laminated, an adhesive is sandwiched between the other wiring board substrates, and these are laminated and pressed together. The bumps are deformed by this laminating press, and a conductive portion is formed between the wiring board base materials. Since this conductive portion covers the surface portion of the conductive resin portion of the wiring board base material a, the metal of the wiring board base material a The foil circuit and the metal foil circuit of the wiring board base b are connected by the conductive resin part of the wiring board base and the conductive part formed by deforming the bumps.

  The present invention further includes an insulating substrate according to claim 7, a metal foil circuit provided on one or both surfaces of the insulating substrate, a single metal foil circuit formed in the insulating substrate, and the other surface. Two wiring board bases b each having a conductive resin part formed by filling a conductive resin composition in a via hole opened in step B and a bump formed of the conductive resin composition on the conductive resin part. A plurality of wiring board base materials including at least a plurality of wiring board base materials are laminated so that the bumps of the two wiring board base materials b are in contact with each other, and an adhesive is sandwiched between the wiring board base materials, and the lamination pressing is performed. A method for producing a multilayer printed wiring board is provided.

  The aspect of claim 7 is characterized in that two wiring board bases b having bumps are laminated so that the bumps are in contact with each other, and is otherwise the same as the aspect of claim 6. . Both bumps are deformed and integrated by the laminating press, and a conductive portion is formed between the wiring board substrates. Since each bump is connected to the conductive resin portion of each wiring board substrate, this integration connects the metal foil circuits of the two wiring board substrates b.

  In any of the sixth and seventh aspects, the lamination press can be performed by heating and pressurizing with a cure press or the like.

  In the method for producing a multilayer printed wiring board according to the present invention, usually, another wiring board base material is further added to the outside of the wiring board base material a and / or the wiring board base material b, and laminated. Other wiring board base materials are an insulating substrate, a metal foil circuit provided on one surface thereof, a conductive resin formed in the insulating substrate, leading to a conductor circuit, and opening in the other surface with a conductive resin. A conductive resin portion filled with the composition, and a bump formed of a conductive resin composition on the conductive resin portion, and the bump and another wiring board substrate (wiring board substrate a) Alternatively, the conductor circuit (metal foil circuit) of the wiring board substrate b is laminated so as to be in contact with each other. Claim 8 corresponds to this aspect, and a multilayer printed wiring board having three or more layers can be obtained by this method.

  In the method for producing a multilayer printed wiring board of the present invention, the wiring board substrate a and / or the wiring board substrate b and the other wiring board substrate are stacked with an adhesive sandwiched between them, Press the layers together. That is, since the multilayer printed wiring board of the present invention can be produced by a single laminating press, high productivity can be obtained.

  Examples of a method for sandwiching the adhesive include a method of using an adhesive sheet and sandwiching the sheet. For example, a method of using an adhesive sheet having a through hole at a position corresponding to the bump, and stacking the wiring board substrate b and the adhesive sheet so that the bump is inserted into the through hole can be mentioned. Claim 9 corresponds to an embodiment using this adhesive sheet.

  The diameter of the through hole is preferably about 0.5 to 5 times the diameter (maximum diameter) of the bump. If it is 0.5 times or more, alignment of the through hole and the bump becomes easy. In this case, there is a gap between the adhesive sheet and the bump before the lamination press, but if the diameter of the through hole is about 5 times or less than the diameter of the bump, the adhesive sheet is expanded by the lamination press. The bumps are also plastically deformed so that the conductive material of the bumps and the adhesive are in contact with each other, and this gap is easily eliminated.

  In addition, when stacking the adhesive sheet and the wiring board base material, it is preferable to perform temporary bonding that is simple bonding in order to prevent displacement during lamination or lamination pressing, but temporary bonding is a conventional technique. It is done under much milder conditions than bonding.

  Examples of the adhesive forming the adhesive sheet include a thermoplastic polyimide resin, a resin mainly composed of thermoplastic polyimide and a part of the thermosetting function, and a thermosetting resin such as an epoxy resin and an imide resin. Among these, a resin mainly composed of thermoplastic polyimide and partly having a thermosetting function, a thermosetting epoxy resin, and a thermosetting imide resin are preferable because sufficient adhesive strength is ensured after heat curing. Moreover, the formation method of a through-hole is not specifically limited, The method of drilling mechanically using a drilling etc. with a laser, a drill, etc. is employable.

  As the melt viscosity of the adhesive sheet, the adhesive sheet preferably has a minimum melt viscosity at 100 to 250 ° C. in the range of 500 to 50000 Pa · s. If the melt viscosity is higher than the upper limit of this range, the gap between the bump and the adhesive sheet may be difficult to be eliminated during lamination. On the other hand, if it is lower than the lower limit of this range, the adhesive tends to flow into the interface between the bumps or between the conductive resin part and the bumps, which may cause poor connection. Claim 10 corresponds to this preferred embodiment.

  However, in the case where the adhesive sheet is a composite composed of two or more members, if a member having a melt viscosity in the range of 500 to 50000 Pa · s at 100 to 250 ° C. is included, Since the gap between the bump and the adhesive sheet can be eliminated, it is preferable in the same manner as in the tenth aspect. Claim 11 corresponds to this preferred embodiment.

  The minimum melt viscosity is determined using a temperature-controllable viscoelasticity measuring device, the temperature measurement range is determined so as to include a temperature range of 100 ° C. to 250 ° C., and the measurement frequency is 1 Hz and the heating rate is 5 ° C./min. And measured in the atmosphere.

  Examples of the composite adhesive sheet composed of two or more members include a sheet obtained by impregnating a porous material with an adhesive, and a sheet obtained by sandwiching an insulating film layer between two adhesive layers.

  The multilayer printed wiring board of the present invention is capable of high-density component mounting on both surfaces thereof, and has little misalignment between the wiring boards. Therefore, the multilayer printed wiring board is highly reliable and suitable for manufacturing various electric appliances. Used for. According to the method for producing a multilayer printed wiring board of the present invention, this excellent multilayer printed wiring board can be produced by a simple process.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings. It should be noted that the scope of the present invention is not limited to this form or the examples described later, and can be changed to other forms as long as the gist of the present invention is not impaired.

  The laminate included in the multilayer printed wiring board of the present invention is composed of two wiring board substrates, each of which has a metal foil circuit on at least one surface thereof. It is. That is, as a combination of two wiring board substrates, a combination of two single-sided substrates providing a metal foil circuit on one surface, a single-sided substrate providing a metal foil circuit on one surface, and a metal on both surfaces A combination of double-sided base materials on which a foil circuit is provided and a combination of two double-sided base materials on which metal foil circuits are provided on both surfaces are conceivable.

  FIG. 1 is a schematic cross-sectional view showing a multilayer printed wiring board according to the present invention when the laminate is a combination of two single-sided substrates. In the figure, 51 represents a laminate, and this laminate 51 is composed of a polyimide film 21 and a single-sided base material 31 comprising a copper circuit 11 formed thereon, a polyimide film 22 and a copper circuit 12 formed thereon. The single-sided base material 32 is formed by bonding the polyimide film 21 and the polyimide film 22 with an adhesive 41 having an elastic modulus of 0.001 GPa or more and 1 GPa or less. The single-sided base materials 31 and 32 are formed by etching a copper foil of a single-sided copper foil-attached polyimide resin base material (single-sided CCL).

  In the laminated body 51, a hole extending from the copper circuit 11 to the copper circuit 12 and penetrating the polyimide film 21, the polyimide film 22, and the adhesive 41 is formed. The hole is filled with a conductive resin composition, and the circuit is formed. An intermediate conductive portion 61 is formed. As a result, the copper circuit 11 and the copper circuit 12 are connected. The hole in which the inter-circuit conductive portion 61 is formed is obtained by connecting the via holes 215 and 225 formed in the polyimide film 21 and the polyimide film 22 and the through hole 412 formed in the adhesive 41, respectively. As shown in FIG. 5, the openings at both ends of the through hole 412 are larger than the openings of the via holes 215 and 225, respectively.

  A single-sided base material 33 in which the copper circuit 13 is formed on the polyimide film 23 and a single-sided base material 34 in which the copper circuit 14 is formed on the polyimide film 24 are laminated on both outer sides of the laminate 51. Lamination is performed by bonding polyimide films 23 and 24 with adhesives 42 and 43, respectively.

  A conductive resin composition is filled in a hole in which the via hole in the polyimide film 23 and the through hole in the adhesive 42 are connected, and a conductive portion 62 is formed. Similarly, a conductive resin composition is filled in a hole in which a via hole in the polyimide film 24 and a through hole in the adhesive 43 are connected, and a conductive portion 63 is formed. The copper circuit 13 and the copper circuit 14 are connected to the copper circuit 11 and the copper circuit 12 on the multilayer body 51 by the conductive parts 62 and 63, respectively.

  Similarly, on the copper circuit 13 and the copper circuit 14, a single-sided base material 35 in which the copper circuit 15 is formed on the polyimide film 25 and a single-sided base material 36 in which the copper circuit 16 is formed on the polyimide film 26 are laminated. And are bonded by adhesives 44 and 45, respectively. Then, the copper circuit 15 and the copper circuit 16 are formed by the conductive portions 64 and 65 formed by filling the via holes in the polyimide films 25 and 26 and the through holes in the adhesives 44 and 45 with the conductive resin composition. Respectively connected to the copper circuit 13 and the copper circuit 14, a multilayer printed wiring board is formed.

  FIG. 2 is a schematic cross-sectional view showing one process of manufacturing the multilayer printed wiring board of the present invention. 31 'and 32' in a figure are the wiring board base material b and the wiring board base material a, respectively. The wiring board substrate b31 'is composed of the polyimide film 21 and the copper circuit 11 formed on one surface thereof. Via holes are formed in the polyimide film 21 with the copper circuit 11 at the bottom and open on the other surface. By conducting screen printing of the conductive paste, a conductive resin portion 811 in which the via holes are filled with the conductive paste is formed. Further, bumps 812 are formed on the conductive resin portion 811 by screen printing a conductive paste.

  The wiring board substrate a32 'is composed of the polyimide film 22 and the copper circuit 12 formed on one surface thereof. Via holes are formed in the polyimide film 22 with the copper circuit 12 at the bottom and open on the other surface. By conducting screen printing of the conductive paste, a conductive resin portion 821 having the via holes filled with the conductive paste is formed. Yes.

  Between the wiring board substrate a32 ′ and the wiring board substrate b31 ′, an adhesive sheet 411 made of an adhesive having an elastic modulus after curing of 0.001 GPa or more and 1 GPa or less is disposed, and the conductive resin portion 821 and The wiring board base material a32 ′, the wiring board base material b31 ′, and the adhesive sheet 411 are arranged so that the bumps 812 face each other and the bumps 812 are inserted into the through holes 412 formed in the adhesive sheet 411. Is done.

  An adhesive sheet 421 made of an adhesive having an elastic modulus after curing of 0.001 GPa or more and 1 GPa or less is disposed on the outer side of the wiring board substrate b31 ′, and on the outer side, the polyimide film 23 and one surface thereof are disposed. A single-sided base material 33 ′ having a conductive resin portion 831 and bumps 832 formed by screen printing a conductive paste is disposed in a via hole in the polyimide film 23. The wiring board substrate b31 ′, the adhesive sheet 421, and the single-sided substrate 33 ′ have the bumps 832 inserted into the through holes 422 formed in the adhesive sheet 421 so that the copper circuit 11 and the bumps 832 face each other. Arranged so that.

  Similarly, an adhesive sheet 441 made of an adhesive having an elastic modulus after curing of 0.001 GPa or more and 1 GPa or less is disposed on the outer side of the single-sided base material 33 ′, and on the outer side, the polyimide film 25 and A single-sided substrate 35 ′ comprising a copper circuit 15 formed on one surface and having conductive resin portions 851 and bumps 852 formed by screen-printing a conductive paste in via holes in the polyimide film 25 is made of copper. It arrange | positions so that the bump 852 may be inserted in the through-hole 442 formed in the adhesive sheet 441 so that the circuit 13 and the bump 852 face each other.

  The same applies to the outside of the wiring board substrate a32 ′, which is composed of the adhesive sheet 431, the polyimide film 24 and the copper circuit 14 formed on one surface thereof, and screen-printing a conductive paste in the via hole in the polyimide film 24. The conductive resin portion 841 and the single-sided base material 34 ′ having the bumps 842, the adhesive sheet 451, the polyimide film 26 and the copper circuit 16 formed on one surface thereof are formed in the via hole in the polyimide film 26. The through-holes 432 and 452 formed in the adhesive sheet 431 and the adhesive sheet 451, respectively, in the order of the single-sided base material 36 ′ having the conductive resin portion 861 and the bumps 862 formed by screen printing the conductive paste. , 842 and 862 are inserted, and bumps 842 and 8 are respectively inserted. 2, respectively, are arranged so as to face the copper circuits 12 and 14.

  After arranging the adhesive sheet, the single-sided base material, and the wiring board base material as described above, these are pressure-pressed collectively by a cure press. Each bump is plastically deformed by the pressure press, and each adhesive sheet is also plastically deformed, and the gap between each adhesive sheet and each bump is eliminated, and the multilayer printed wiring board of the present invention shown in FIG. 1 is formed. Is done. An inter-circuit conductive portion and a conductive portion are formed by the conductive resin portions and the bumps.

  The above manufacturing method can be performed in the same manner by using two pieces of the wiring board base material b instead of the wiring board base material b31 'and the wiring board base material a32'. In this case, the two wiring board bases b are arranged with the adhesive sheet sandwiched therebetween so that the respective bumps face each other, but in other respects, the manufacturing method is the same as that shown in FIG. The multilayer printed wiring board of this invention shown by is formed.

  FIG. 3 is a schematic cross-sectional view showing the multilayer printed wiring board of the present invention when the laminate is a combination of a single-sided base material and a double-sided base material. In the figure, 52 represents a laminated body. This laminated body 52 is composed of a polyimide film 211 and a single-sided base material 311 comprising a copper circuit 111 formed on the surface thereof, a polyimide film 221 and copper formed on both surfaces thereof. A double-sided base material 321 composed of the circuits 121 and 122 is formed by bonding the polyimide film 211 and the copper circuit 122 with an adhesive 46 having an elastic modulus of 0.001 GPa or more and 1 GPa or less. Except for the above points, it is the same as the example of FIG. 1 (however, the number of laminated single-sided substrates is small) and can be manufactured by the same method.

  FIG. 4 is a schematic cross-sectional view showing the multilayer printed wiring board of the present invention when the laminate is a combination of a single-sided base material and a double-sided base material. 53 in the figure represents a laminate, and this laminate 53 is formed on the polyimide film 212 and the double-sided base material 312 composed of the copper circuits 112 and 113 formed on both surfaces thereof, and on the polyimide film 222 and both surfaces thereof. The double-sided base material 322 made of the formed copper circuits 123 and 124 is formed by bonding the copper circuits 113 and 124 with an adhesive 47 having an elastic modulus of 0.001 GPa or more and 1 GPa or less. Except for the above points, it is the same as the example of FIG. 1 (however, the number of laminated single-sided substrates is small) and can be manufactured by the same method.

[Production of single-sided wiring board substrate]
Via holes (opened) with a copper foil on one side of a polyimide film (PI) and YAG laser on a single-sided copper-clad substrate (PI: 25 μm, copper thickness: 18 μm) bonded without using an adhesive. The aperture was 100 μm) and wet desmearing was performed with alkali and potassium permanganate. A total of eight via holes were formed.

  A solution using butyl carbitol acetate as a solvent was prepared on an epoxy resin consisting of 70 parts by weight of an bisphenol A type epoxy resin (epoxy equivalents 7000-8500) and 30 parts by weight of a bisphenol F type epoxy resin (epoxy equivalents 160-170). In addition, an imidazole-based latent curing agent was added, and the silver particles were dispersed so as to be 55% by volume of the total solids, thereby preparing a silver paste.

  Each via hole was filled with the silver paste thus obtained by screen printing, and temporarily cured. Further, a silver paste having the same components as the above silver paste and having a higher viscosity by changing the amount of solvent was screen-printed to form a total of 8 bumps (convex portions) having a diameter of 200 μm and a height of 60 μm, and temporarily cured. Carried out. In this manner, a single-sided wiring board substrate corresponding to 31 ', 33', 34 ', 35', 36 'in FIG.

  Further, a single-sided wiring board substrate corresponding to 32 'in FIG. 2 was prepared in the same manner as described above, except that screen printing with a silver paste with increased viscosity was not performed.

[Preparation of insulating sheet for interlayer adhesion]
A through hole having a diameter of 300 μm was formed at a predetermined position of an adhesive sheet made of an epoxy resin having a thickness of 25 μm (TLF-Y30: manufactured by Yodogawa Paper Mill, minimum melt viscosity at 100 to 250 ° C. is 4700 Pa · s). Formed.

[Lamination press]
FIG. 2 shows the single-sided wiring board base material (single-sided wiring board base material corresponding to 31 ′, 32 ′, 33 ′, 34 ′, 35 ′, and 36 ′ in FIG. 2) and the interlayer adhesive insulating sheet. In this way, after stacking so that the bumps are inserted into the through holes of the interlayer adhesive insulation, a bonding process is performed by a vacuum press, and then a circuit is formed so that the interlayer connection portion becomes a daisy chain. A printed wiring board was produced.

  A single-sided wiring board on which the bumps used in Example 1 are formed instead of the single-sided wiring board base on which the bumps used in Example 1 are not formed (a wiring board base corresponding to 32 'in FIG. 2) The same wiring board base material as the base material (wiring board base material corresponding to 31 ′ in FIG. 2) was used. Further, only the sheet corresponding to 411 in FIG. 2 among the insulating sheets for interlayer adhesion is drilled at a predetermined position of the adhesive sheet made of epoxy resin (TLF-Y30: manufactured by Yodogawa Paper Mill) having a thickness of 35 μm. The one having a through hole having a diameter of 300 μm was used. In other respects, a multilayer printed wiring board was produced in the same manner as in Example 1.

  In the same manner as in Example 1 except that an epoxy resin having a thickness of 25 μm (TLF-Y30F: manufactured by Yodogawa Paper Mill, a minimum melt viscosity of 21000 Pa · s at 100 to 250 ° C.) was used for the production of the insulating sheet for interlayer adhesion. A multilayer printed wiring board was produced.

  In the same manner as in Example 1 except that an epoxy resin having a thickness of 25 μm (TLF-Y20: manufactured by Yodogawa Paper Mill, the minimum melt viscosity at 100 to 250 ° C. is 700 Pa · s) was used for the production of the insulating sheet for interlayer adhesion. A multilayer printed wiring board was produced.

  An example was used except that an aramid nonwoven fabric impregnated with a resin (EA541: Shin-Kobe Electric, the minimum melt viscosity of the resin at 100 to 250 ° C. was 63 Pa · s) was used for the production of the insulating sheet for interlayer adhesion. In the same manner as in Example 1, a multilayer printed wiring board was produced.

[Evaluation test]
In any of Example 1, Example 2, Example 3, and Example 4, conduction was obtained, and the resistance change rate was 10% or less even when the lead-free reflow test was performed three times. On the other hand, in Example 5, the resistance change rate was 15%.

It is a schematic cross section which shows an example of the multilayer printed wiring board of this invention. It is a schematic cross section which shows one process of manufacture of the multilayer printed wiring board of this invention. It is a schematic cross section which shows an example of the multilayer printed wiring board of this invention. It is a schematic cross section which shows an example of the multilayer printed wiring board of this invention.

Explanation of symbols

11, 12, 13, 14, 15, 16, 111, 112, 113, 121, 122, 123, 124 Copper circuit 21, 22, 23, 24, 25, 26, 211, 221, 212, 222 Polyimide film 215, 225 Via hole 31 'Wiring board substrate b
32 'Wiring board substrate a
31, 32, 33, 33 ', 34, 34', 35, 36, 36 ', 311 Single-sided base material 312, 321, 322 Double-sided base material 41, 42, 43, 44, 45, 46, 47 Adhesive layer 412 422, 432, 452 Through hole 51, 52, 53 Laminate 61 Inter-circuit conductive part 64, 65 Conductive part 811, 821, 831, 841, 851, 861 Conductive resin part 812, 832, 842, 852, 862 Bump 411 , 421, 431, 441, 451 Adhesive sheet

Claims (5)

An insulating substrate, a metal foil circuit provided on at least one surface thereof, and a conductive resin composition formed by filling a conductive resin composition into a via hole formed in the insulating substrate and reaching one metal foil circuit and opening on the other surface. A wiring board substrate a having a resin portion, an insulating substrate, a metal foil circuit provided on at least one surface thereof, and a via hole formed in the insulating substrate and reaching one metal foil circuit and opening on the other surface A wiring board substrate b having a conductive resin portion filled with a conductive resin composition, and a bump formed of the conductive resin composition on the conductive resin portion;
A plurality of wiring board substrates including at least two of
An adhesive sheet having a through hole at a position corresponding to the bump is sandwiched and laminated between the wiring board base material a and the wiring board base material b, and the bump is inserted into the through hole. And placing the adhesive sheet on
The conductive resin portion of the wiring board substrate a and the bumps of the wiring board substrate b are in contact with each other.
A method for producing a multilayer printed wiring board, comprising laminating and pressing these together. Insulating substrate, metal foil circuit provided on at least one surface thereof, conductive resin formed by filling conductive resin composition in via hole formed in said insulating substrate and reaching one metal foil circuit and opening on the other surface A plurality of wiring board substrates including at least two wiring board substrates b having a portion and a bump formed of a conductive resin composition on the conductive resin portion,
An adhesive sheet having a through hole at a position corresponding to the bump is sandwiched and laminated between the two wiring board bases b, and the bonding is performed so that the bump is inserted into the through hole. While arranging the agent sheet,
The bumps of the two wiring board bases b are in contact with each other,
A method for producing a multilayer printed wiring board, comprising laminating and pressing these together.   In addition to the wiring board base material a and / or the wiring board base material b, the plurality of wiring board base materials are further provided with an insulating substrate, a metal foil circuit provided on one surface thereof, and the insulating substrate. A wiring having a conductive resin portion formed by filling a conductive resin composition in a via hole that reaches a metal foil circuit and opens on the other surface, and a bump formed of the conductive resin composition on the conductive resin portion The method for producing a multilayer printed wiring board according to claim 1 or 2, comprising a board substrate, wherein the bumps and the metal foil circuit of another wiring board substrate are laminated so as to contact each other.   The method for producing a multilayer printed wiring board according to any one of claims 1 to 3, wherein a minimum melt viscosity at 100 to 250 ° C of the adhesive sheet is in a range of 500 to 50000 Pa · s. .   The said adhesive agent sheet is a composite_body | complex containing the member which has the melt viscosity in the range whose minimum melt viscosity in 100-250 degreeC is 500-50000 Pa.s, The any one of Claim 1 thru | or 3 characterized by the above-mentioned. The manufacturing method of the multilayer printed wiring board as described in 2 ..

Images