JPH02189926A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To eliminate the need for a lead frame and inner leads, to facilitate handling and to realize miniaturization by disposing a lead composed of a conductive material in upright to an electrode pad formed to a semiconductor chip and covering the semiconductor chip with a resin so that the nose of the lead is exposed. CONSTITUTION:Conductive leads 3 are disposed in upright onto electrode pads 2. The leads 3 are formed in such a manner that metallic materials, noses of which are thinned slightly, are formed in a knob shape, the base sections of the large diameters are connected to the electrode pads 2 through contact bonding, etc., and only noses are exposed, and the whole semiconductor chip 1 is covered with a resin 4. On mounting, a semiconductor integrated circuit device is turned down and placed onto a mounting substrate 5, and the noses of the leads 3 are brought into contact with substrate side pads 7 electrically connected by internal wirings 6, and bonded through a reflow method using solder, etc. Accordingly, a lead frame and inner leads are unnecessitated, thus facilitating the handling of the semiconductor integrated circuit device and miniaturizing the device.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device, and particularly to a lead extraction structure.

[Conventional technology]

2. Description of the Related Art Conventionally, a structure shown in FIG. 4 or 5 has been used as a lead extraction structure for electrically connecting electrode pads provided on a semiconductor chip constituting a semiconductor integrated circuit device to the outside.

In the one shown in FIG. 4, a semiconductor chip 1 is mounted on a conductive lead frame 11, and electrode pads 2 are mounted using thin metal wires 12.
It has a structure in which the external lead 13 is electrically connected to the external lead 13. 14 is a sealing resin.

In addition, in the case of FIG. 5, the semiconductor chip 1 is connected to the circuit board 21.
The electrode pad 2 is electrically connected to a circuit pattern 23 provided on a substrate 21 using an inner lead 22. This inner lead 22 is formed of a tape-shaped metal thin film.

(Problems to be Solved by the Invention) Among the conventional lead extraction structures described above, the structure shown in FIG. 4 requires a lead frame 11;
During assembly, it is necessary to prepare individual lead frames that match the dimensions of the semiconductor chip, making manufacturing and management complicated. Furthermore, in order to fix the lead frame, it is necessary to seal it using the resin 14, which poses a problem of increasing the size of the entire semiconductor integrated circuit device.

Furthermore, in the structure shown in FIG. 5, it is extremely difficult to connect and cut the inner leads provided in the form of a tape.
There is also the problem of poor workability, such as the need to handle it carefully. Further, although this structure is more advantageous in terms of size reduction than the structure shown in FIG. 4, there is a limit to the size reduction of the semiconductor integrated circuit device because the inner leads are connected laterally.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor integrated circuit device that is easy to handle and can be miniaturized.

[Means for Solving the Problems] In the semiconductor chip 11Fsr device of the present invention, leads made of a conductive material are erected on electrode pads provided on the semiconductor chip, and the semiconductor chip is covered with resin so that the tips of the leads are exposed. It is covered with.

[Effect]

In the above-described configuration, electrical connections to the outside can be made using leads, and a lead frame or inner lead is not required, making handling easier and downsizing.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.

In the figure, the semiconductor Senknob 1 has a plurality of electrode pads 2 on its surface as before, but a portion 3 of conductive glue is erected on top of these electrode pads 2. As shown in an enlarged view in FIG. 2, this lead 3 is made of a knob-shaped metal material with a somewhat thin tip, and its large diameter base is connected to the electrode band 2 by crimping or the like. , the entire semiconductor chip 1 is covered with a resin 4 so that only the tip of the lead 3 is exposed.

When mounting the semiconductor integrated circuit device configured in this manner, as shown in a partially enlarged view in FIG. The tip of the lead 3 is brought into contact with the electrically connected pad 7 on the board side, and the connection is made using a single port 1 or the like or by a flow method.

Therefore, in this semiconductor integrated circuit device, since the electrical connection with the outside is made by standing on the electrode pad 2 or using the lead 3, a lead frame and an inner lead are not required.
It can be extremely easy to handle. In addition, since the resin 4 holds the semiconductor chip 1 to a minimum size, the size of the entire semiconductor integrated circuit device is reduced by the size of the semiconductor chip 1.
It can be made extremely small to the same extent as .

(Effects of the Invention) As explained above, in the present invention, the leads are erected on the electrode pads of the semiconductor chip and the semiconductor chip is coated with resin, so that electrical connection with the outside can be made using the leads. This eliminates the need for lead frames and inner leads, making it easier to handle semiconductor integrated circuit devices.
Moreover, there is an effect that the miniaturization can be achieved.

[Brief explanation of the drawing]

Fig. 1 is a longitudinal sectional view of one embodiment of the present invention, Fig. 2 is an enlarged perspective view of a part before resin sealing, Fig. 3 is an enlarged sectional view of a part of the mounted state, and Fig. 4 is a conventional A vertical cross-sectional view of an example of a semiconductor integrated circuit device, and FIG. 5 is a partial vertical cross-sectional view of another example of a conventional semiconductor integrated circuit device. 1... Semiconductor chip, 2... Electrode pad, 3...
Lead, 4... Resin, 5... Mounting board, 6... Internal wiring, 7... Group+ffl (i1jl pad, 1)
...Lead frame, 12. Fine metal wire, 13.. External lead, I4.. Resin, 21.. Circuit board, 22.
...Inner lead, 23...Circuit pattern. Figure 2 Figure 5

Claims (1)

[Claims] 1. A semiconductor integrated circuit device characterized in that a lead made of a conductive material is provided upright on an electrode pad provided on a semiconductor chip, and the semiconductor chip is coated with a resin so that the tip of the lead is exposed.