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JPH01259536A - Method and device for cleaning both sides of substrate using ultrasonic cleaning spray nozzle - Google Patents

Method and device for cleaning both sides of substrate using ultrasonic cleaning spray nozzle

Info

Publication number
JPH01259536A
JPH01259536A JP8738288A JP8738288A JPH01259536A JP H01259536 A JPH01259536 A JP H01259536A JP 8738288 A JP8738288 A JP 8738288A JP 8738288 A JP8738288 A JP 8738288A JP H01259536 A JPH01259536 A JP H01259536A
Authority
JP
Japan
Prior art keywords
substrate
cleaned
cleaning
ultrasonic
spray nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8738288A
Other languages
Japanese (ja)
Other versions
JPH0795540B2 (en
Inventor
Hiroaki Hagimae
萩前 広明
Mitsuyoshi Otake
大竹 光義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP63087382A priority Critical patent/JPH0795540B2/en
Publication of JPH01259536A publication Critical patent/JPH01259536A/en
Publication of JPH0795540B2 publication Critical patent/JPH0795540B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

PURPOSE:To enable foreign contaminative objects adheres to the surface of a substrate to be cleaned to be removed efficiently by centrally spraying cleaning liquid, where ultrasonic vibration is propagated with a sharp angle to a substrate surface against the direction of revolution, to both sides of the substrate while rotating the substrate to be cleaned. CONSTITUTION:Supporting means for supporting a substrate to be cleaned 1 with at least three fixing tools 3 so that they can rotate, means where at least one ultrasonic cleaning spray nozzle 5 is opposed to both surfaces of the substrate 1 with a sharp slope to the rotary surface of the substrate 1, and means for scanning a ultrasonic cleaning spray nozzle 5 in radius direction of the rotary substrate are provided. Then, the plate-like substrate to be cleaned 1 is rotated and washing liquid is centrally sprayed while rotating it in radius direction of the rotary central axis of the substrate. It allows contaminated foreign objects on both surfaces of the substrate to be cleaned to be eliminated simultaneously in a short time and with improved efficiency.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は超音波洗浄スプレィノズルを用いた基板の洗浄
方法及び洗浄装置に係り、特に基板両面を同時に洗浄す
るのに好適な洗浄方法及び洗浄装置に関する。
Detailed Description of the Invention [Industrial Application Field] The present invention relates to a cleaning method and cleaning apparatus for a substrate using an ultrasonic cleaning spray nozzle, and particularly to a cleaning method and cleaning apparatus suitable for cleaning both sides of a substrate at the same time. Regarding equipment.

〔従来の技術〕[Conventional technology]

従来の超音波洗浄方法は、周知のように洗浄槽内に洗浄
液と超音波発生手段とを設け、被洗浄物を槽内に浸漬し
て洗浄するものが主体であった。
As is well known, conventional ultrasonic cleaning methods mainly involve providing a cleaning liquid and an ultrasonic generation means in a cleaning tank, and cleaning the object by immersing the object in the tank.

しかし、最近はこの洗浄槽を廃し、洗浄水自体に超音波
振動を伝搬させることのできる洗浄スプレィノズルを用
いることにより、この洗浄水を被洗浄、物に噴射し洗浄
する超音波洗浄器が提案されている。
However, recently, an ultrasonic cleaner has been proposed that eliminates this cleaning tank and uses a cleaning spray nozzle that can propagate ultrasonic vibrations into the cleaning water itself, spraying this cleaning water onto the object being cleaned. has been done.

なお、この種の装置として関連するものには、例えば特
開昭56−6077号が挙げられる。
Note that related devices of this type include, for example, Japanese Patent Application Laid-Open No. 56-6077.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記従来技術は、超音波振動子を取り付けたスプレィノ
ズルに純水を供給し、この振動子を発振させて超音波振
動をのせた純水を被洗浄物の一部分に照射するという方
法を取っており、被洗浄物の両面を同時に洗浄する方法
及び装置については何ら配慮がされておらず、汚染異物
の除去能力の向上及び処理時間の短縮に改善すべき技術
課題が多々あった。
The above conventional technology uses a method in which pure water is supplied to a spray nozzle equipped with an ultrasonic vibrator, and the vibrator is caused to oscillate to irradiate a portion of the object to be cleaned with pure water carrying ultrasonic vibrations. However, no consideration was given to a method and apparatus for cleaning both sides of an object at the same time, and there were many technical issues that needed to be improved in order to improve the ability to remove contaminated foreign matter and shorten the processing time.

本発明の目的は、上記した技術課題を解決することにあ
り、その第1の目的は被洗浄基板面に付着した汚染異物
を速やかに、かつ能率よく除去できる改善された被洗浄
基板の洗浄方法を提供することにあり、第2の目的は洗
浄装置を供することにある。
An object of the present invention is to solve the above-mentioned technical problems, and the first object is to provide an improved method for cleaning a substrate to be cleaned, which can quickly and efficiently remove contaminated foreign matter adhering to the surface of the substrate to be cleaned. A second purpose is to provide a cleaning device.

〔課題を解決するための手段〕[Means to solve the problem]

上記第1の目的は、板状の被洗浄基板を回転させながら
、前記基板の両面に基板の回転方向に逆らって、かつ基
板面と鋭角の傾斜をもって超音波振動が伝搬された洗浄
液を基板の回転中心軸の半径方向に走査移動させながら
集中的に噴射、浴びせることを特徴とする超音波スプレ
ィノズルを用いた基板両面の洗浄方法によって達成され
る。
The first purpose is to rotate a plate-shaped substrate to be cleaned and apply a cleaning liquid to both sides of the substrate, in which ultrasonic vibrations are propagated against the direction of rotation of the substrate and at an acute angle with respect to the substrate surface. This is achieved by a method of cleaning both surfaces of a substrate using an ultrasonic spray nozzle, which is characterized by intensive spraying and spraying while scanning in the radial direction of the central axis of rotation.

そして上記第2の目的は、被洗浄基板を少なくとも3個
の固定治具で回転可能に支持する支持手段と、前記基板
の回転方向とは逆らう向きに、しかも基板の回転面に対
し鋭角の傾斜をもって前記基板の両面にそれぞれ少なく
とも1個の超音波洗浄スプレィノズルを対向させる手段
と、前記超音波洗浄スプレィノズルを回転基板の半径方
向に走査する手段とを具備して成ることを特徴とする洗
浄装置によって達成される。
The second object is to provide a support means for rotatably supporting a substrate to be cleaned with at least three fixing jigs, and a supporting means that is tilted at an acute angle with respect to the rotational surface of the substrate in a direction opposite to the rotational direction of the substrate. A cleaning device comprising: means for arranging at least one ultrasonic cleaning spray nozzle to face each side of the substrate; and means for scanning the ultrasonic cleaning spray nozzle in a radial direction of the rotating substrate. achieved by the device.

上記洗浄装置において、好ましくは、上記少なくとも3
個の固定治具の少なくとも1個を回転駆動体とし、他の
少なくとも2個の固定治具で被洗浄基板を支持すると共
に前記固定治具を回転基板の中心軸から遠ざかる方向に
移動可能な構成とすることにより、前記固定治具の移動
で前記被洗浄基板を着脱自在とする構成が望ましい。
In the cleaning device, preferably the at least three
At least one of the fixing jigs is a rotary drive body, and at least two other fixing jigs support the substrate to be cleaned, and the fixing jig is movable in a direction away from the central axis of the rotating substrate. In this way, it is desirable to have a configuration in which the substrate to be cleaned can be attached and detached by moving the fixing jig.

更に好ましくは、上記被洗浄基板の両面に対向配設され
た超音波洗浄スプレィノズルを相互に同期して回転基板
の半径方向に走査移動可能とした超音波洗浄スプレィノ
ズルの走査手段を有していることが望ましい。
More preferably, the ultrasonic cleaning spray nozzle scanning means includes ultrasonic cleaning spray nozzle scanning means that allows the ultrasonic cleaning spray nozzles, which are disposed opposite to each other on both surfaces of the substrate to be cleaned, to scan and move in the radial direction of the rotating substrate in synchronization with each other. It is desirable to be present.

上記被洗浄基板を例えば磁気ディスク、光ディスク等の
記録媒体用ディスク基板とした場合には、すぐれた洗浄
効果を有するディスク基板の洗浄装置が実現可能となる
When the substrate to be cleaned is, for example, a disk substrate for a recording medium such as a magnetic disk or an optical disk, it is possible to realize a disk substrate cleaning apparatus having an excellent cleaning effect.

なお、上記超音波洗浄スプレィノズルは、洗浄液の噴出
と洗浄液への超音波伝搬機能を有する周知のノズルで十
分に対応できる。
Note that the above-mentioned ultrasonic cleaning spray nozzle may be a well-known nozzle having a function of jetting out a cleaning liquid and transmitting ultrasonic waves to the cleaning liquid.

また、上記洗浄基板面に対し鋭角の傾斜をもって、洗浄
液を噴出させる訳であるが、この傾斜角は洗浄力との関
係において重要であり、約30”で最も優れており、こ
れを界にして±15”の範囲が実用的である。
In addition, the cleaning liquid is ejected at an acute angle with respect to the surface of the cleaning substrate, and this angle of inclination is important in relation to cleaning power, and an angle of about 30" is the best, and this is the best in the world. A range of ±15” is practical.

さらにまた、超音波洗浄スプレィノズルの走査移動方向
は外周方向から中心部方向あるいはさらに中心部から外
周方向に往復させることも可能であるが、好ましくは、
中心部から外周方向に一方的に移動した方が好ましい。
Furthermore, the scanning movement direction of the ultrasonic cleaning spray nozzle can be reciprocated from the outer circumference toward the center or further from the center toward the outer circumference, but preferably,
It is preferable to move unilaterally from the center toward the outer circumference.

ノズル先端から基板表面までの距離は、超音波の周波数
に応じ最適値に設定するのが望ましく、−殻内には20
mm以内が、より好ましくは10mm以内である。
It is desirable to set the distance from the nozzle tip to the substrate surface to an optimal value depending on the frequency of the ultrasonic wave.
It is within mm, more preferably within 10 mm.

また、回転基板に対する超音波洗浄スプレィノズルの傾
斜角θは、前述のとおり鋭角であることが望ましく、実
用的には30車±158の範囲がより望ましく、特に望
ましくは約30本である。
Further, the inclination angle θ of the ultrasonic cleaning spray nozzle with respect to the rotating substrate is desirably an acute angle as described above, and in practical terms, a range of 30 ± 158 is more preferable, and particularly preferably about 30 nozzles.

被洗浄基板の両面上に配設される超音波洗浄スプレィノ
ズルは、上述のごとく相互に同期して走査移動するが、
これは一方の面側から他方の面側のノズルに例えばリン
ク機構等の周知の走査手段で動作させることが望ましい
The ultrasonic cleaning spray nozzles arranged on both sides of the substrate to be cleaned scan and move in synchronization with each other as described above.
This is preferably done by moving the nozzles from one side to the other side by means of known scanning means, such as a link mechanism.

〔作用〕[Effect]

回転機構を有した被洗浄基板固定治具支持手段により、
被洗浄基板は一定方向に回転させられる。
By means of supporting a cleaning substrate fixing jig having a rotation mechanism,
The substrate to be cleaned is rotated in a fixed direction.

また、この被洗浄基板面上に傾斜して設けられた超音波
洗浄スプレィノズルは、上記被洗浄基板面との距離を超
音波振動の伝播効率の最もよい距離に固定し、上記ノズ
ルの傾斜角度も一定にして被洗浄基板の中心部から外周
方向、或いはその逆方向へ走査移動する。それによって
、被洗浄基板は一度の処理により両面が同時に洗浄され
るので短時間で効率よく汚染異物の除去が可能となる。
In addition, the ultrasonic cleaning spray nozzle installed at an angle on the surface of the substrate to be cleaned is fixed at a distance from the surface of the substrate to be cleaned at a distance that provides the best propagation efficiency of ultrasonic vibration, and the inclination angle of the nozzle is It scans and moves from the center of the substrate to be cleaned toward the outer periphery, or vice versa, while keeping the distance constant. As a result, both sides of the substrate to be cleaned are simultaneously cleaned in a single process, making it possible to efficiently remove contaminants in a short period of time.

〔実施例〕〔Example〕

以下本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described below with reference to the drawings.

先ず各図の概略を説明すると、第1図は本発明による基
板両面洗浄装置の構成を説明する概略正面図である。第
2図は側面図、第3図(a)は被洗浄基板1の回転方向
(矢印17)とスプレィノズル5の走査移動方向18を
示した説明図、第3図(b)はスプレィノズル5の基板
面1に対する傾斜角θと、ノズル先端から基板面迄の距
離dを説明するための図である。第4図はスプレィノズ
ルと洗浄基板1との距@dを決定するために汚染異物除
去率と照射距離について検討した結果の特性曲線図、そ
して第5図は傾斜角θをパラメータとした場合の異物除
去率と洗浄時間との関係を示した特性曲線図である。
First, to explain the outline of each figure, FIG. 1 is a schematic front view illustrating the configuration of a double-sided substrate cleaning apparatus according to the present invention. 2 is a side view, FIG. 3(a) is an explanatory diagram showing the rotation direction (arrow 17) of the substrate 1 to be cleaned and the scanning movement direction 18 of the spray nozzle 5, and FIG. 3(b) is an illustration of the spray nozzle 5. FIG. 2 is a diagram for explaining the inclination angle θ with respect to the substrate surface 1 and the distance d from the nozzle tip to the substrate surface. Figure 4 shows a characteristic curve diagram of the results of examining the contaminant removal rate and irradiation distance to determine the distance @d between the spray nozzle and the cleaning substrate 1, and Figure 5 shows the characteristic curve when the inclination angle θ is used as a parameter. FIG. 3 is a characteristic curve diagram showing the relationship between foreign matter removal rate and cleaning time.

以下、各図についてさらに具体的に説明すると、第1図
及び第2図に示す被洗浄基板1は、回転機構を有した基
板固定治具2と洗浄基板1を支えるだけの固定治具3に
装着される。装着された洗浄基板1は回転機構を有した
基板固定治具2が駆動伝達部12を介して駆動モータ8
により回転することで一定方向に回転する。この回転す
る洗浄基板1に洗浄基板の両側に設けられた超音波スプ
レィノズル5から超音波振動をのせた純水が給水タンク
9から給水管11を通して、図面の省略された導管を介
して送給され照射される。この超音波スプレィノズル5
は駆動装置8により洗浄基板1と一定距離と角度を保持
するために設けられたガイド7に沿って移動する。なお
、ノズル5は支持棒4、支持台6を介して駆動装置8か
ら動力が伝達される。また、超音波スプレィノズル5か
ら照射(本来は噴射と表現すべきであるが、超音波も加
わっていることからここでは照射と称す)される純水は
純水供給タンク9から給水配管11を通して供給され、
洗浄後の排液は洗浄室15の底部しきり板14に設けら
れた連絡通路16から排液タンク10へもどされる。さ
らに、装置は超音波スプレィノズル5から照射された純
水や除去された汚染異物が他へ飛散しないためと、洗浄
基板1の汚染防止のために飛散防止カバー13で覆われ
ている。
To explain each figure in more detail below, the substrate to be cleaned 1 shown in FIGS. It will be installed. The mounted cleaning substrate 1 is connected to a substrate fixing jig 2 having a rotation mechanism by a drive motor 8 via a drive transmission section 12.
Rotates in a fixed direction by rotating. Ultrasonic vibrations are applied to the rotating cleaning substrate 1 from ultrasonic spray nozzles 5 provided on both sides of the cleaning substrate, and pure water is supplied from the water tank 9 through the water supply pipe 11 and through a conduit (not shown). and irradiated. This ultrasonic spray nozzle 5
is moved by a drive device 8 along a guide 7 provided to maintain a constant distance and angle from the cleaning substrate 1 . Note that power is transmitted to the nozzle 5 from a drive device 8 via a support rod 4 and a support stand 6. Further, the pure water irradiated from the ultrasonic spray nozzle 5 (originally it should be expressed as injection, but since ultrasonic waves are also added, it is referred to as irradiation here) is passed from the pure water supply tank 9 through the water supply pipe 11. supplied,
The drained liquid after cleaning is returned to the drained liquid tank 10 through a communication passage 16 provided in the bottom partition plate 14 of the cleaning chamber 15. Further, the apparatus is covered with a scattering prevention cover 13 to prevent the purified water irradiated from the ultrasonic spray nozzle 5 and the removed contaminated foreign matter from scattering elsewhere and to prevent contamination of the cleaning substrate 1.

以上、第1図及び第2図で説明した基板両面洗浄装置に
おいて超音波スプレィノズル5と洗浄基板1との距離d
、ノズルの走査移動方向18、傾斜角θ、基板1の回転
方向17の詳細な説明図が第3図(a)、(b)である
。超音波スプレィノズル5から照射された純水19に効
率よく超音波振動がのり、汚染異物除去が行われる距離
は限られている。
As described above, the distance d between the ultrasonic spray nozzle 5 and the cleaning substrate 1 in the substrate double-sided cleaning apparatus explained in FIGS. 1 and 2.
, the scanning movement direction 18 of the nozzle, the inclination angle θ, and the rotation direction 17 of the substrate 1 are detailed in FIGS. 3(a) and 3(b). The distance over which ultrasonic vibrations are efficiently applied to the pure water 19 irradiated from the ultrasonic spray nozzle 5 and contaminant foreign matter is removed is limited.

この距離dは、第4図に示した汚染異物除去率と距離d
との関係から約10mmで100%に近い除去率を示し
ており、実用上20mm以内、好ましくは10in以内
である。
This distance d is determined by the contaminant removal rate and distance d shown in Figure 4.
From the relationship, the removal rate is close to 100% at about 10 mm, which is practically within 20 mm, preferably within 10 inches.

第5図は、被洗浄基板1とノズル5との距離dを10+
++mとしたときの、傾斜角θが洗浄効果に如何なる影
響を与えるかを測定した結果の特性曲線図である。すな
わち、この図からθ=308の場合、洗浄時間的30s
ecで除去率100%に達しており、308が最適傾斜
角であることがわかる。実用的には30”±158の範
囲である。
In FIG. 5, the distance d between the substrate 1 to be cleaned and the nozzle 5 is 10+
It is a characteristic curve diagram of the result of measuring how the inclination angle θ affects the cleaning effect when ++m. In other words, from this figure, when θ=308, the cleaning time is 30 seconds.
It can be seen that the removal rate reached 100% at ec, and 308 was the optimum tilt angle. Practically, the range is 30''±158.

なお、参考までに基板1の回転方向17を上記第3図(
a)とは逆方向にしたところ、異物除去率は格段に劣化
し、実用にはならなかった。
For reference, the rotation direction 17 of the substrate 1 is shown in the above figure 3 (
When the direction was reversed to a), the foreign matter removal rate was markedly degraded and was not practical.

また、上記実施例においては、被洗浄基板1として、磁
気ディスク用金属円板を用いたが、金属に限らず、ガラ
ス板その他あらゆる洗浄を必要とする基板に適用可能で
あることは云うまでもない。
Further, in the above embodiment, a metal disc for a magnetic disk was used as the substrate 1 to be cleaned, but it goes without saying that it is applicable not only to metal but also to glass plates and any other substrates that require cleaning. do not have.

さらにまた、洗浄液も水に限らず、通常用いられている
有機、無機の洗浄剤いずれにおいても使用可能である。
Furthermore, the cleaning liquid is not limited to water, and any commonly used organic or inorganic cleaning agent can be used.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、被洗浄基板の両面を同時に短時間に、
しかも高効率で汚染異物の除去が出来るので、基板洗浄
における高清浄化や短時間処理に効果があり、十分に従
来の技術課題を解決することができた。
According to the present invention, both sides of a substrate to be cleaned can be cleaned simultaneously in a short time.
In addition, since it is possible to remove contaminated foreign matter with high efficiency, it is effective in high cleaning and short processing time in substrate cleaning, and it has been able to sufficiently solve the conventional technical problems.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例の基板両面洗浄装置の概略説明
用正面図、第2図はその側面図、第3図(a)は洗浄基
板の回転方向と超音波スプレィノズルの移動方向を説明
する要部正面図、第3図(b)は基板に対する超音波ス
プレィノズルの傾斜角θを説明する図、第4図は超音波
スプレィノズルと洗浄基板の距離と異物除去率との関係
を余した特性曲線図、第5図はノズルの傾斜角θをパラ
メータとした時の洗浄時間と異物除去率との関係を示し
た特性曲線図である。 図において。 1・・・被洗浄基板 2・・・回転機構付き固定治具 3・・・固定治具 4・・・支持棒 5・・・超音波スプレィノズル 6・・・支持台      7・・・ガイド8・・・駆
動装置     9・・・純水タンク10・・・排水タ
ンク    11・・・給水配管12・・・駆動伝達部
    13・・・飛散防止カバー14・・・しきい板
     】5・・・洗浄室代理人弁理士  中 村 
純之助 (a) 第3図 第4図
FIG. 1 is a schematic front view of a double-sided substrate cleaning apparatus according to an embodiment of the present invention, FIG. 2 is a side view thereof, and FIG. FIG. 3(b) is a front view of the main parts to explain the angle of inclination θ of the ultrasonic spray nozzle with respect to the substrate, and FIG. 4 shows the relationship between the distance between the ultrasonic spray nozzle and the cleaning substrate and the foreign matter removal rate. The remaining characteristic curve diagram, FIG. 5, is a characteristic curve diagram showing the relationship between the cleaning time and the foreign matter removal rate when the nozzle inclination angle θ is taken as a parameter. In fig. 1... Substrate to be cleaned 2... Fixing jig with rotating mechanism 3... Fixing jig 4... Support rod 5... Ultrasonic spray nozzle 6... Support stand 7... Guide 8 ... Drive device 9 ... Pure water tank 10 ... Drainage tank 11 ... Water supply piping 12 ... Drive transmission part 13 ... Scattering prevention cover 14 ... Threshold plate] 5 ... Washing Room Representative Patent Attorney Nakamura
Junnosuke (a) Figure 3 Figure 4

Claims (1)

【特許請求の範囲】 1、板状の被洗浄基板を回転させながら、前記基板の両
面に基板の回転方向に逆らって、かつ基板面と鋭角の傾
斜をもって超音波振動が伝搬された洗浄液を基板の回転
中心軸の半径方向に走査移動させながら集中的に噴射、
浴びせることを特徴とする超音波スプレイノズルを用い
た基板両面の洗浄方法。 2、被洗浄基板を少なくとも3個の固定治具で回転可能
に支持する支持手段と、前記基板の回転方向とは逆らう
向きに、しかも基板の回転面に対し鋭角の傾斜をもって
前記基板の両面にそれぞれ少なくとも1個の超音波洗浄
スプレイノズルを対向させる手段と、前記超音波洗浄ス
プレイノズルを回転基板の半径方向に走査する手段とを
具備して成ることを特徴とする洗浄装置。 3、上記少なくとも3個の固定治具の少なくとも1個を
回転駆動体とし、他の少なくとも2個の固定治具で被洗
浄基板を支持すると共に前記固定治具を回転基板の中心
軸から遠ざかる方向に移動可能な構成とすることにより
、前記固定治具の移動で前記被洗浄基板を着脱可能とし
たことを特徴とする請求項2記載の洗浄装置。 4、上記被洗浄基板の両面に対向配設された超音波洗浄
スプレイノズルを相互に同期して回転基板の半径方向に
走査移動可能とした超音波洗浄スプレイノズルの走査手
段を有して成ることを特徴とする請求項2記載の洗浄装
置。 5、被洗浄基板を記録媒体用ディスク基板としたことを
特徴とする請求項2、3もしくは4記載のディスク基板
の洗浄装置。
[Claims] 1. While rotating a plate-shaped substrate to be cleaned, a cleaning liquid in which ultrasonic vibrations are propagated to both sides of the substrate in a direction opposite to the direction of rotation of the substrate and at an acute angle with respect to the substrate surface is applied to the substrate. Concentrated injection while scanning in the radial direction of the central axis of rotation.
A method for cleaning both sides of a substrate using an ultrasonic spray nozzle characterized by spraying water onto the substrate. 2. Supporting means for rotatably supporting the substrate to be cleaned with at least three fixing jigs, and supporting means for rotatably supporting the substrate to be cleaned with at least three fixing jigs; 1. A cleaning device comprising: means for opposing at least one ultrasonic cleaning spray nozzle; and means for scanning the ultrasonic cleaning spray nozzle in a radial direction of a rotating substrate. 3. At least one of the at least three fixing jigs is a rotational drive body, and at least two other fixing jigs support the substrate to be cleaned, and the fixing jig is moved in a direction away from the central axis of the rotating substrate. 3. The cleaning apparatus according to claim 2, wherein the cleaning apparatus is configured to be movable so that the substrate to be cleaned can be attached or detached by moving the fixing jig. 4. The ultrasonic cleaning spray nozzle scanning means is configured to allow the ultrasonic cleaning spray nozzles disposed facing each other on both surfaces of the substrate to be cleaned to scan and move in the radial direction of the rotating substrate in synchronization with each other. The cleaning device according to claim 2, characterized in that: 5. The disk substrate cleaning apparatus according to claim 2, 3 or 4, wherein the substrate to be cleaned is a disk substrate for a recording medium.
JP63087382A 1988-04-11 1988-04-11 Method and apparatus for cleaning both sides of substrate using ultrasonic cleaning spray nozzle Expired - Lifetime JPH0795540B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63087382A JPH0795540B2 (en) 1988-04-11 1988-04-11 Method and apparatus for cleaning both sides of substrate using ultrasonic cleaning spray nozzle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63087382A JPH0795540B2 (en) 1988-04-11 1988-04-11 Method and apparatus for cleaning both sides of substrate using ultrasonic cleaning spray nozzle

Publications (2)

Publication Number Publication Date
JPH01259536A true JPH01259536A (en) 1989-10-17
JPH0795540B2 JPH0795540B2 (en) 1995-10-11

Family

ID=13913347

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
JP (1) JPH0795540B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998001896A1 (en) * 1996-07-03 1998-01-15 Ultraclean Technology Research Institute Washing apparatus and washing method
US6012192A (en) * 1997-04-21 2000-01-11 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP2001319849A (en) * 2000-05-08 2001-11-16 Tokyo Electron Ltd Liquid processing device and liquid processing method
US6497240B1 (en) * 1999-04-21 2002-12-24 Sharp Kabushiki Kaisha Ultrasound cleaning device and resist-stripping device
US6683007B1 (en) 1999-03-15 2004-01-27 Nec Corporation Etching and cleaning methods and etching and cleaning apparatus used therefor
US6726777B1 (en) * 1999-06-24 2004-04-27 Sumitomo Heavy Industries Ltd. Cleaning method and apparatus using fluid spraying
US6748961B2 (en) * 2001-03-30 2004-06-15 Lam Research Corporation Angular spin, rinse, and dry module and methods for making and implementing the same
US7226514B2 (en) * 1999-04-08 2007-06-05 Applied Materials, Inc. Spin-rinse-dryer
JP2008198632A (en) * 2007-02-08 2008-08-28 Fujitsu Ltd Cleaning device and method
CN102513301A (en) * 2011-12-29 2012-06-27 清华大学 Megasonic cleaning device for wafer
JPWO2011135979A1 (en) * 2010-04-28 2013-07-18 コニカミノルタ株式会社 Method for manufacturing imaging lens
CN113471108A (en) * 2021-07-06 2021-10-01 华海清科股份有限公司 Vertical rotation processing apparatus of wafer based on marangoni effect

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JP6797526B2 (en) * 2014-11-11 2020-12-09 株式会社荏原製作所 Substrate cleaning equipment
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JPS60143634A (en) * 1983-12-29 1985-07-29 Fujitsu Ltd Wafer treatment and device thereof
JPS6218717A (en) * 1985-07-18 1987-01-27 Matsushita Electric Ind Co Ltd Drying nozzle

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JPS5994425A (en) * 1982-11-19 1984-05-31 Nec Kyushu Ltd Manufacturing device for semiconductor
JPS59150584A (en) * 1983-02-16 1984-08-28 株式会社日立製作所 Ultrasonic washing method and apparatus
JPS60143634A (en) * 1983-12-29 1985-07-29 Fujitsu Ltd Wafer treatment and device thereof
JPS6218717A (en) * 1985-07-18 1987-01-27 Matsushita Electric Ind Co Ltd Drying nozzle

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6325081B1 (en) 1996-07-03 2001-12-04 Kabushiki Kaisha Ultraclean Technology Research Institute Washing apparatus and washing method
WO1998001896A1 (en) * 1996-07-03 1998-01-15 Ultraclean Technology Research Institute Washing apparatus and washing method
US6012192A (en) * 1997-04-21 2000-01-11 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US7862658B2 (en) 1999-03-15 2011-01-04 Renesas Electronics Corporation Etching and cleaning methods and etching and cleaning apparatuses used therefor
US6683007B1 (en) 1999-03-15 2004-01-27 Nec Corporation Etching and cleaning methods and etching and cleaning apparatus used therefor
US6964724B2 (en) 1999-03-15 2005-11-15 Nec Corporation Etching and cleaning methods and etching and cleaning apparatuses used therefor
US8420549B2 (en) 1999-03-15 2013-04-16 Renesas Electronics Corporation Etching and cleaning methods and etching and cleaning apparatuses used therefor
US7226514B2 (en) * 1999-04-08 2007-06-05 Applied Materials, Inc. Spin-rinse-dryer
US6497240B1 (en) * 1999-04-21 2002-12-24 Sharp Kabushiki Kaisha Ultrasound cleaning device and resist-stripping device
US6726777B1 (en) * 1999-06-24 2004-04-27 Sumitomo Heavy Industries Ltd. Cleaning method and apparatus using fluid spraying
JP2001319849A (en) * 2000-05-08 2001-11-16 Tokyo Electron Ltd Liquid processing device and liquid processing method
US6748961B2 (en) * 2001-03-30 2004-06-15 Lam Research Corporation Angular spin, rinse, and dry module and methods for making and implementing the same
US7029539B2 (en) * 2001-03-30 2006-04-18 Lam Research Corporation Angular spin, rinse, and dry module and methods for making and implementing the same
JP2008198632A (en) * 2007-02-08 2008-08-28 Fujitsu Ltd Cleaning device and method
JPWO2011135979A1 (en) * 2010-04-28 2013-07-18 コニカミノルタ株式会社 Method for manufacturing imaging lens
CN102513301A (en) * 2011-12-29 2012-06-27 清华大学 Megasonic cleaning device for wafer
CN113471108A (en) * 2021-07-06 2021-10-01 华海清科股份有限公司 Vertical rotation processing apparatus of wafer based on marangoni effect
CN113471108B (en) * 2021-07-06 2022-10-21 华海清科股份有限公司 Vertical rotatory processing apparatus of wafer based on marangoni effect

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