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JPH01105716A - Resin sealing device - Google Patents

Resin sealing device

Info

Publication number
JPH01105716A
JPH01105716A JP26448387A JP26448387A JPH01105716A JP H01105716 A JPH01105716 A JP H01105716A JP 26448387 A JP26448387 A JP 26448387A JP 26448387 A JP26448387 A JP 26448387A JP H01105716 A JPH01105716 A JP H01105716A
Authority
JP
Japan
Prior art keywords
plungers
plunger
plate
spring
lowering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26448387A
Other languages
Japanese (ja)
Other versions
JPH0523572B2 (en
Inventor
Yoshiro Takemoto
武本 義郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP26448387A priority Critical patent/JPH01105716A/en
Publication of JPH01105716A publication Critical patent/JPH01105716A/en
Publication of JPH0523572B2 publication Critical patent/JPH0523572B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021Plunger drives; Pressure equalizing means for a plurality of transfer plungers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To prevent plungers from pulsating by a method wherein a plurality of the plungers are integrally fixed to one another against their energizing forces by actuating a spring plate toward fixing direction by means of a driving part during the lowering of the plungers. CONSTITUTION:A plurality of plungers 1 are provided so as to be held by respective plunger holders 3, each of which is supported through a spring plate 4 by a plunger plate 5 and pushed down by means of each spring 6. At the lowering of the plunger plate 5 by means of a hydraulic cylinder, the spring plate 4 is actuated upwards integrally with the respective plunger holders 3, resulting in fixing the respective springs 6. Under the state as just mentioned above, the plunger plate 5 and the plungers 1 lower, resulting in making the lowering speeds of the plungers equal to the actuating speed of a hydraulic cylinder for lowering the plungers 1. At the lowering limit of the plungers 1, the pistons 11 of hydraulic cylinders 10 are lowered so as to bring the springs 6 into unfixed state in order to apply pouring pressures to the resin poured in a mold by means of the springs 6, resulting in making the pouring pressures of a plurality of the plungers 1 constant.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は半導体、電子部品等の熱硬化性樹脂材料による
マルチプランジャ方式の樹脂封止装置に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a multi-plunger type resin sealing device for semiconductors, electronic parts, etc. using thermosetting resin materials.

従来の技術 従来の樹脂封止装置を第3図に示す。2o←神、   
      はプランジャで複数設けられておシ各々ボ
ンド21と嵌合する。22はプランジャホルダーでプラ
ンジャ2oに対応して設けられている。23はバネで同
様にプランジャ20に対応して設けられており、各々の
プランジャ2゜に一定した注入圧を与える。24はプラ
ンジャプレートで、油圧シリンダー(図示せず)等で上
下動作する。25はバネカバーで、プランジャプレート
24、バネ23及びバネカバー25とで、プランジャ2
o及びプランジャホルダー22 全支持している。26
は上金型でポット21が固定されており、形成すべき製
品の半分の型27が設けられている。28は下金型で、
ポット21に対応しに−hル部29が設けられておりカ
ル部29よリケード部3oが成形すべき製品の半分の型
31に通じており、樹脂が注入される。上金型26.ポ
ット21及び下金型28はヒーター(図示せず)で加熱
されている。
Prior Art A conventional resin sealing device is shown in FIG. 2o←God,
A plurality of plungers are provided, each of which fits into the bond 21. A plunger holder 22 is provided corresponding to the plunger 2o. A spring 23 is similarly provided corresponding to the plunger 20, and applies a constant injection pressure to each plunger 2°. 24 is a plunger plate, which is moved up and down by a hydraulic cylinder (not shown) or the like. 25 is a spring cover, which includes the plunger plate 24, the spring 23, and the spring cover 25, and the plunger 2
o and plunger holder 22 are fully supported. 26
is an upper mold, to which a pot 21 is fixed, and a mold 27 for half of the product to be formed is provided. 28 is the lower mold,
A -hl part 29 is provided corresponding to the pot 21, and the cull part 29 and the ricade part 3o communicate with a half mold 31 of the product to be molded, into which resin is injected. Upper mold 26. The pot 21 and the lower mold 28 are heated by a heater (not shown).

このような構造で、樹脂32がポット21内に供給され
、加熱溶融される。その後プランジャプレート24が油
圧シリンダ等により下降する。各々のポット21に供給
された樹脂32はその量に多少のバラツキがあシ、バネ
23にてその体積のバラツキを吸収し、下降限すなわち
型27及び31に樹脂の注入完了時に発生する成形圧を
一定にする。
With this structure, the resin 32 is supplied into the pot 21 and heated and melted. Thereafter, the plunger plate 24 is lowered by a hydraulic cylinder or the like. The amount of resin 32 supplied to each pot 21 may vary slightly, and the spring 23 absorbs the variation in volume, and the lower limit, that is, the molding pressure generated when the injection of resin into the molds 27 and 31 is completed. Keep constant.

発明が解決しようとする問題点 しかしこの方法では、ポット21とプランジャ20の嵌
合部に樹脂32等がからみ付いて、プランジャ1が下降
動作時に抵抗を受けるとき、バネ23が完全にたわみ切
るため、下降用シリンダーのパワーが抵抗を受けたプラ
ンジャ20に集中し易い。これを繰り返すとプランジャ
20の下降動作が脈動し、注入される樹脂のスピードが
変化して成形品に気泡が発生するという問題がある。従
問題点を解決するための手段  □ 本発明は上記問題点を解決するため、溶融した樹脂を金
型内に注入する為の複数のプランジャと、各々のプラン
ジャに注入圧を与えるバネとを備えた樹脂封止装置にお
いて、この複数のバネを付勢力に抗して一体的に固定あ
るいは前記付勢力を開放するバネプレートと、このバネ
プレートを固定あるいは開放方向に動作させる駆動部と
を設けたことを特徴とする。
Problems to be Solved by the Invention However, in this method, when the resin 32 and the like become entangled in the fitting portion of the pot 21 and the plunger 20, and the plunger 1 receives resistance during the downward movement, the spring 23 completely deflects. , the power of the descending cylinder is likely to be concentrated on the plunger 20, which has received resistance. If this is repeated, the downward movement of the plunger 20 will pulsate, causing a problem in that the speed of the injected resin will change and bubbles will occur in the molded product. Means for Solving Secondary Problems □ In order to solve the above problems, the present invention includes a plurality of plungers for injecting molten resin into a mold, and a spring for applying injection pressure to each plunger. The resin sealing device is provided with a spring plate that integrally fixes the plurality of springs against a biasing force or releases the biasing force, and a drive unit that moves the spring plate in the fixing or releasing direction. It is characterized by

作   用 上記構成によれば、プランジャの下降時、駆動部により
バネプレートを固定方向に動作させて複数のバネをその
付勢力に抗して一体的に固定することにより、前記プラ
ンジャが下降動作時に抵抗を受けても脈動するのを防止
することができ、複数のプランジャを同一スピードで下
降させることができる。
Operation According to the above structure, when the plunger moves downward, the spring plate is moved in the fixing direction by the driving section, and the plurality of springs are integrally fixed against the biasing force, so that when the plunger moves downward, the spring plate is moved in the fixing direction. Pulsation can be prevented even when resistance is encountered, and multiple plungers can be lowered at the same speed.

プランジャの下降限において前記バネプレートを開放方
向に動作させて複数のバネを開放することにより、複数
のプランジャは型内の樹脂に前記バネによる注入圧をか
けることができる。
By operating the spring plate in the opening direction at the lower limit of the plunger to open the plurality of springs, the plurality of plungers can apply injection pressure by the springs to the resin in the mold.

実施例 第1図及び第2図は、本発明の実施例を示す断面図で、
1はプランジャで複数設けられており、下降限において
各々ポット2と嵌合する。3はプランジャホルダーで、
バネプレート4を介し、プランジャプレート6に保持さ
れている。6はバネで、プランジャプレート5に固定さ
れたバネカバー7によりプランジャホルダー3を下方に
押し下げる力が作用する様固定されている。バネプレー
ト4はコネクター8を介して、押し上げプレート9に固
定されている。1oは押し上げプレート9を動作させる
為の油圧シリンダで、バネカバー7に固定されておシ、
ピストン11が押し上げプレート9に接している。プラ
ンジャプレート5は、両側のブロック12を介して油圧
シリンダ(図示せず)に連結されている。ポット2は上
金型13に固定されておシ、上金型13には成形すべき
製品の上半分の型14が設けられている。15は下型で
、ポット2に対応してカル部16ゲート部17及び成形
すべき製品の下半分の型18が設けられている。上金型
13、ポット部2及び下金型16はヒータ(図示せず)
により所定の温度まで加熱されている。
Embodiment FIGS. 1 and 2 are cross-sectional views showing an embodiment of the present invention.
A plurality of plungers 1 are provided, each of which fits into the pot 2 at its lower limit. 3 is the plunger holder,
It is held by a plunger plate 6 via a spring plate 4. Reference numeral 6 denotes a spring, which is fixed to the plunger plate 5 by a spring cover 7 so as to apply a force that pushes the plunger holder 3 downward. The spring plate 4 is fixed to a push-up plate 9 via a connector 8. 1o is a hydraulic cylinder for operating the push-up plate 9, which is fixed to the spring cover 7;
The piston 11 is in contact with the push-up plate 9. The plunger plate 5 is connected to a hydraulic cylinder (not shown) via blocks 12 on both sides. The pot 2 is fixed to an upper mold 13, and the upper mold 13 is provided with a mold 14 for the upper half of the product to be molded. A lower mold 15 is provided with a cull portion 16, a gate portion 17, and a mold 18 for the lower half of the product to be molded, corresponding to the pot 2. The upper mold 13, the pot part 2, and the lower mold 16 are equipped with heaters (not shown).
is heated to a predetermined temperature.

加熱されたポット2内に樹脂19を供給し溶融する。次
にプランジャプレート5が油圧シリンダーにより、下降
する。この際油圧シリンダー10によって押し上げプレ
ート9が押し上げられる。
The resin 19 is supplied into the heated pot 2 and melted. Next, the plunger plate 5 is lowered by the hydraulic cylinder. At this time, the push-up plate 9 is pushed up by the hydraulic cylinder 10.

すなわちバネプレート4がプランジャホルダー3と一体
的に上方に動作し、バネ6は固定される。
That is, the spring plate 4 moves upward integrally with the plunger holder 3, and the spring 6 is fixed.

この状態でプランジャプレート5及びプランジャ1が下
降する。すなわちプランジャ1の下降スピードはプラン
ジャ1下降用の油圧シリンダーの動作スピードに等しく
なる。プランジャ1の下降限で油圧シリンダー10のピ
ストン11を下げバネeを開放する。すなわち型14.
18内に注入された樹脂19にバネ6によって注入圧を
かけ、複数のプランジャ1の注入圧のバラツキをなくシ
ー定の圧力をかけることができる。
In this state, the plunger plate 5 and plunger 1 are lowered. That is, the descending speed of the plunger 1 is equal to the operating speed of the hydraulic cylinder for lowering the plunger 1. At the lower limit of the plunger 1, the piston 11 of the hydraulic cylinder 10 is lowered to release the spring e. That is, type 14.
Injection pressure is applied to the resin 19 injected into the resin 18 by the spring 6, and a constant pressure can be applied without variation in the injection pressure of the plurality of plungers 1.

発明の効果 前記の様にバネの付勢力を固定してプランジャの下降ス
ピードを一定に保つことで、プランジャの脈動を生じる
ことなく溶融樹脂の型内流人スピードを一定にすること
ができ、かつ前記下降スピードをコントロールすること
で、前記流入スピードをコントロールすることができる
ので、樹脂の流入スピードの急倣な変化がなく、気泡の
巻き込みやボイドの発生を抑えることができる。従って
半導体4品の場合、ボンディングワイヤの倒れや切れな
どの発生を防止することができる。
Effects of the Invention By fixing the biasing force of the spring and keeping the descending speed of the plunger constant as described above, the speed at which the molten resin flows into the mold can be kept constant without causing pulsation of the plunger, and By controlling the descending speed, the inflow speed can be controlled, so there is no sudden change in the resin inflow speed, and the entrainment of air bubbles and the generation of voids can be suppressed. Therefore, in the case of four semiconductors, it is possible to prevent the bonding wire from falling or breaking.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例に於ける側断面図、第2図はそ
の正面断面図、第3図は従来例の側断面図である。 1・・・・・・プランジャ、4・・・・・・バネプレー
ト、6・・・・・・バネ、10・・・・・・シリンダー
、13・・・・・・上金型、15・・・・・・下金型。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名t 
−アラシジャ 第   1   図                
                  4′1ノX′千
フ−L体トーハ半 第 2 図 第3図
FIG. 1 is a side sectional view of an embodiment of the present invention, FIG. 2 is a front sectional view thereof, and FIG. 3 is a side sectional view of a conventional example. 1... Plunger, 4... Spring plate, 6... Spring, 10... Cylinder, 13... Upper mold, 15... ...Lower mold. Name of agent: Patent attorney Toshio Nakao and 1 other person
-Arashija Figure 1
4'1'X'1000-L body Toha half 2nd figure

Claims (1)

【特許請求の範囲】[Claims]  溶融した樹脂を金型内に注入する為の複数のプランジ
ャと、各々のプランジャに注入圧を与えるバネとを備え
た樹脂封止装置において、この複数のバネを付勢力に抗
して一体的に固定あるいは前記付勢力を開放するバネプ
レートと、このバネプレートを固定あるいは開放方向に
動作させる駆動部とを設けたことを特徴とする樹脂封止
装置。
In a resin sealing device equipped with a plurality of plungers for injecting molten resin into a mold and springs that apply injection pressure to each plunger, the plurality of springs are integrally connected against a biasing force. A resin sealing device comprising: a spring plate that fixes or releases the biasing force; and a drive unit that moves the spring plate in the fixing or releasing direction.
JP26448387A 1987-10-20 1987-10-20 Resin sealing device Granted JPH01105716A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26448387A JPH01105716A (en) 1987-10-20 1987-10-20 Resin sealing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26448387A JPH01105716A (en) 1987-10-20 1987-10-20 Resin sealing device

Publications (2)

Publication Number Publication Date
JPH01105716A true JPH01105716A (en) 1989-04-24
JPH0523572B2 JPH0523572B2 (en) 1993-04-05

Family

ID=17403864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26448387A Granted JPH01105716A (en) 1987-10-20 1987-10-20 Resin sealing device

Country Status (1)

Country Link
JP (1) JPH01105716A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9100339A (en) * 1991-02-26 1992-09-16 Boschman Tech Bv DEVICE FOR ENCLOSING ELECTRONIC COMPONENTS.
US5328347A (en) * 1991-09-16 1994-07-12 Amco Hi-Tech B.V. Device for introducing a plastic material into a mould cavity

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9100339A (en) * 1991-02-26 1992-09-16 Boschman Tech Bv DEVICE FOR ENCLOSING ELECTRONIC COMPONENTS.
US5158780A (en) * 1991-02-26 1992-10-27 Boschman Technologies B.V. Device for encapsulating electronic components
US5328347A (en) * 1991-09-16 1994-07-12 Amco Hi-Tech B.V. Device for introducing a plastic material into a mould cavity

Also Published As

Publication number Publication date
JPH0523572B2 (en) 1993-04-05

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