JPS62184821A - Molder for transfer molding - Google Patents
Molder for transfer moldingInfo
- Publication number
- JPS62184821A JPS62184821A JP2852286A JP2852286A JPS62184821A JP S62184821 A JPS62184821 A JP S62184821A JP 2852286 A JP2852286 A JP 2852286A JP 2852286 A JP2852286 A JP 2852286A JP S62184821 A JPS62184821 A JP S62184821A
- Authority
- JP
- Japan
- Prior art keywords
- cull
- head
- plunger head
- resin
- transfer molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001721 transfer moulding Methods 0.000 title claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/586—Injection or transfer plungers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂封止型半導体装置の製造に使用するトラン
スファーモールド用成形機の構造に関し、特にプランジ
ャーヘッドの構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a transfer molding machine used for manufacturing resin-sealed semiconductor devices, and particularly to the structure of a plunger head.
従来、この種のプランジャー１３のプランジャーヘッド
１２は第２図に示すように樹脂１５と接する底面１８の
形状は平面であった。１１はプランジャーヘッド１２の
上端に設けた支柱である。Conventionally, in the plunger head 12 of this type of plunger 13, the shape of the bottom surface 18 in contact with the resin 15 was flat, as shown in FIG. 11 is a support provided at the upper end of the plunger head 12.
上述した従来のプランジャーヘッド１２ではその底面１
８と、底面１８と接する部分の樹脂（以下カルと称する
）１５との接する面積が最小であるので、熱の供給面積
が小さく、従ってカルの硬化に時間がかかるという欠点
がある。トランスファーモールドの場合、カル１５の樹
脂が硬化するまでに最も時間がかかるため、この部分の
硬化が遅いということは全体の成形サイクル時間が長く
なることであり、従って量産性が極端に悪くなる欠点を
有している。In the conventional plunger head 12 described above, the bottom surface 1
8 and the resin (hereinafter referred to as cull) 15 in contact with the bottom surface 18 is the smallest, so the heat supply area is small and therefore it takes time to harden the cull. In the case of transfer molding, it takes the longest time for the resin of Cal 15 to harden, so slow curing in this part means that the entire molding cycle time becomes longer, resulting in extremely poor mass productivity. have.
本発明の目的はカル部の硬化時間を短縮するトランスフ
ァーモールド用成形機を提供することにある。An object of the present invention is to provide a transfer molding machine that shortens the curing time of the cull portion.
本発明のトランスファーモールド用成形機はプランジャ
ーヘッドの樹脂と接する底面に凹凸を設けた特徴とする
ものである。The transfer molding machine of the present invention is characterized by providing irregularities on the bottom surface of the plunger head that comes into contact with the resin.
次に本発明の一実施例について図面を参照して説明する
。Next, an embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の断面図である。上金型１６
内を上下に移動するプランジャーヘッド１２の底面には
、実質的に表面積が大きくなるように凹凸１４を設けで
ある。従って、上下金型１６．１７の型合せを行い、そ
の両型１６．１７間に樹脂１０を注入し、プランジャー
ヘッドＩ２にてカルＬ５を圧下すると、カル１５の上部
がヘッド１２の凹凸１４に入り込んで接触し、カル１５
とヘッド１２との接触面積が増大する。これにより、樹
脂１２の熱がヘッド１２（金型１６．１７）を介して放
散されるため、カル１５の硬化時間が短縮される。FIG. 1 is a sectional view of an embodiment of the present invention. Upper mold 16
The bottom surface of the plunger head 12 that moves up and down within the plunger head 12 is provided with unevenness 14 so as to substantially increase the surface area. Therefore, when the upper and lower molds 16.17 are matched, the resin 10 is injected between the two molds 16.17, and the cull L5 is pressed down with the plunger head I2, the upper part of the cull 15 is aligned with the unevenness 14 of the head 12. Enter and contact Cal 15
The contact area between the head 12 and the head 12 increases. As a result, the heat of the resin 12 is dissipated via the head 12 (mold 16, 17), so that the curing time of the cull 15 is shortened.
従来の構造のプランジャーヘッドと本発明の実施例のプ
ランジャーヘッドとでカルの硬化時間を調べた結果、従
来のものが８０秒であったのに対し、本発明の実施例で
は６０秒であった。As a result of examining the cull hardening time between a plunger head with a conventional structure and a plunger head according to an embodiment of the present invention, it was 80 seconds for the conventional structure, while it was 60 seconds for the embodiment of the present invention. there were.
以上説明したように本発明はプランジャーヘッドの底面
に凹凸を設けることにより、カル部の硬化を速め、従っ
て成形サイクル時間を短くすることができ量産性が上が
る効果がある。As explained above, the present invention has the effect of providing unevenness on the bottom surface of the plunger head to speed up the curing of the cull portion, thereby shortening the molding cycle time and increasing mass productivity.
第１図は本発明の実施例を示す断面図、第２図は従来の
プランジャーヘッドと金型部分を示す断面図である。
１１・・・支柱、１２・・・プランジャーヘッド、１３
・・・プランジャー、Ｉ４・・・凹凸、Ｉ５・・・カル
、Ｉ６・・・上金型、Ｉ７・・・下金型。
特許出願人 日本電気株式会社、１，７や代理人 弁理
士菅野 中、゛、゛）
第２図FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional plunger head and mold portion. 11... Strut, 12... Plunger head, 13
...Plunger, I4...Irregularity, I5...Cull, I6...Upper mold, I7...Lower mold. Patent applicant NEC Corporation, 1,7 and agent Patent attorney Kanno Naka,゛,゛) Figure 2
Claims (1)
ヘッドにおいて、該プランジャーヘッドの樹脂と接する
面に凹凸を設けたことを特徴とするトランスファーモー
ルド用成形機。(1) A molding machine for transfer molding, characterized in that the plunger head of the molding machine for transfer molding is provided with irregularities on the surface of the plunger head that comes into contact with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2852286A JPS62184821A (en) | 1986-02-12 | 1986-02-12 | Molder for transfer molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2852286A JPS62184821A (en) | 1986-02-12 | 1986-02-12 | Molder for transfer molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62184821A true JPS62184821A (en) | 1987-08-13 |
Family
ID=12251001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2852286A Pending JPS62184821A (en) | 1986-02-12 | 1986-02-12 | Molder for transfer molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62184821A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5204122A (en) * | 1990-10-11 | 1993-04-20 | Dai-Ichi Seiko Co., Ltd. | Mold for use in resin encapsulation molding |
| US5460502A (en) * | 1993-09-15 | 1995-10-24 | Majercak; Michael L. | Plunger apparatus used in a resin molding device for encapsulating electronic components |
| US6200504B1 (en) | 1994-05-09 | 2001-03-13 | Fico B.V. | Method for encapsulating with plastic a lead frame with chips |
-
1986
- 1986-02-12 JP JP2852286A patent/JPS62184821A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5204122A (en) * | 1990-10-11 | 1993-04-20 | Dai-Ichi Seiko Co., Ltd. | Mold for use in resin encapsulation molding |
| US5460502A (en) * | 1993-09-15 | 1995-10-24 | Majercak; Michael L. | Plunger apparatus used in a resin molding device for encapsulating electronic components |
| US6200504B1 (en) | 1994-05-09 | 2001-03-13 | Fico B.V. | Method for encapsulating with plastic a lead frame with chips |
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