JPH01104063U - - Google Patents
Info
- Publication number
- JPH01104063U JPH01104063U JP19583887U JP19583887U JPH01104063U JP H01104063 U JPH01104063 U JP H01104063U JP 19583887 U JP19583887 U JP 19583887U JP 19583887 U JP19583887 U JP 19583887U JP H01104063 U JPH01104063 U JP H01104063U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electrically
- mounting terminal
- shaped fitting
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図および第2図は本考案の一実施例を示す
もので、第1図は混成集積回路を印刷配線基板に
実装した状態の縦断面図、第2図は取付端子の斜
視図である。
1……混成IC、2……電子部品、3……配線
基板、4……取付端子、5……U形端子、6……
ピン、7……印刷配線基板、8……部品用パター
ン、9……はんだ、10……位置決め孔。
Figures 1 and 2 show an embodiment of the present invention, with Figure 1 being a longitudinal sectional view of a hybrid integrated circuit mounted on a printed wiring board, and Figure 2 being a perspective view of a mounting terminal. . 1...Mixed IC, 2...Electronic component, 3...Wiring board, 4...Mounting terminal, 5...U-shaped terminal, 6...
Pin, 7...Printed wiring board, 8...Component pattern, 9...Solder, 10...Positioning hole.
Claims (1)
パターンに取付端子のU形金具を電気・機械的に
取付け、取付端子のU形金具の底面を印刷配線基
板の部品用パターンにはんだにて電気・機械的に
接続してなることを特徴とする面付用混成集積回
路。 Mount the electronic component on the wiring board, electrically and mechanically attach the U-shaped fitting of the mounting terminal to the input/output pattern, and solder the bottom of the U-shaped fitting of the mounting terminal to the component pattern of the printed wiring board. A surface-mounted hybrid integrated circuit characterized by being electrically and mechanically connected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19583887U JPH01104063U (en) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19583887U JPH01104063U (en) | 1987-12-25 | 1987-12-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01104063U true JPH01104063U (en) | 1989-07-13 |
Family
ID=31486494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19583887U Pending JPH01104063U (en) | 1987-12-25 | 1987-12-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01104063U (en) |
-
1987
- 1987-12-25 JP JP19583887U patent/JPH01104063U/ja active Pending