JPH09330907A - Heat exchanger for regulating temperature of liquid - Google Patents
Heat exchanger for regulating temperature of liquidInfo
- Publication number
- JPH09330907A JPH09330907A JP14711996A JP14711996A JPH09330907A JP H09330907 A JPH09330907 A JP H09330907A JP 14711996 A JP14711996 A JP 14711996A JP 14711996 A JP14711996 A JP 14711996A JP H09330907 A JPH09330907 A JP H09330907A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- liquid
- exchanger
- thermoelectric conversion
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、半導体処理液等の特に
高精度の温度制御が必要とされる液体の温度調節装置に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature control device for a liquid such as a semiconductor processing liquid, which requires particularly precise temperature control.
【0002】[0002]
【従来の技術】例えば、半導体素子の製造におけるフォ
ト・エッチング工程では、現像液やエツチング溶液の高
精度の温度制御が要求される。従来、この種の用途に用
いられている液体温度調節装置としては、図4に示すよ
うに、水位計105を装置した恒温槽100に、水温調
節器110を付設し、恒温槽100中の水を所定の温度
に保ち、この恒温槽100中に、図示を省略したエッチ
ング装置に送液パイプ131を介して連結する、フッ素
樹脂製熱交換チューブ130を、コイル状にして収納し
て水中に浸漬し、恒温槽中の水と熱交換することによ
り、チューブ130中を流れるエッチング液を所定の温
度に調節するようにしたものが用いられている。2. Description of the Related Art For example, in a photo-etching process in manufacturing a semiconductor device, highly accurate temperature control of a developing solution or an etching solution is required. Conventionally, as a liquid temperature control device used for this type of application, as shown in FIG. 4, a water temperature controller 110 is attached to a constant temperature bath 100 in which a water level gauge 105 is installed. Is kept at a predetermined temperature, and in this constant temperature bath 100, a fluororesin heat exchange tube 130, which is connected to an etching device (not shown) via a liquid supply pipe 131, is housed in a coil and immersed in water. Then, the one in which the etching liquid flowing in the tube 130 is adjusted to a predetermined temperature by exchanging heat with water in the constant temperature bath is used.
【0003】水温調節器110としては、熱電変換素子
(ペルチェ素子)111を、カーボングラファイトと
か、アルミニウムや銅或いはこれらの合金などの熱良導
性素材から成って水の流路を貫通して設けた伝熱ブロッ
ク体112と、同様の素材から成る放熱体113とによ
って挟圧する構成により、熱電変換素子111と伝熱ブ
ロック体及び放熱体との間で、熱授受がなされるように
した、熱電冷凍サイクルが用いられている。115は、
放熱器の冷却水の流路である。又、116は、恒温槽1
00から温度調節器110に流入する水温を検知する温
度検出器であり、117は、その検出信号に基づいて温
度調節された水を、恒温槽100に圧送する循環ポンプ
である。As the water temperature controller 110, a thermoelectric conversion element (Peltier element) 111 is provided through a water flow path made of carbon graphite or a material having good heat conductivity such as aluminum, copper or alloys thereof. The heat transfer block body 112 and the heat dissipation body 113 made of the same material sandwich the pressure, so that heat is transferred between the thermoelectric conversion element 111 and the heat transfer block body and the heat dissipation body. A refrigeration cycle is used. 115 is
It is a flow path of cooling water for the radiator. Further, 116 is a constant temperature bath 1.
00 is a temperature detector that detects the temperature of the water flowing into the temperature controller 110, and 117 is a circulation pump that pressure-feeds the water whose temperature has been adjusted based on the detection signal.
【0004】さらに、熱電変換素子を制御するために
は、交流電源(100又は200ボルト)から直流電源
に変換する直交流変換器が必要となる。さらに、電流時
間や方向を切り替えるためのスイッチング機構等の電源
ユニットが必要とされ、熱交換器とは別の筐体内に配設
するか、又は、水温調節器110と同じ筐体内に収納す
る。Further, in order to control the thermoelectric conversion element, a cross current converter for converting an AC power supply (100 or 200 V) into a DC power supply is required. Further, a power supply unit such as a switching mechanism for switching the current time and direction is required, and the power supply unit is arranged in a housing separate from the heat exchanger or is housed in the same housing as the water temperature controller 110.
【0005】この電源ユニットは、発熱があるため、過
熱を防止するように、筐体内に冷却用送風機を設けて、
強制的に冷却を行う場合が多かった。Since this power supply unit generates heat, a cooling blower is provided in the housing to prevent overheating.
In many cases, it was forcibly cooled.
【0006】[0006]
【問題点】上記液体温度調節装置は、放熱体内に冷却水
を通過させて熱電変換素子と伝熱ブロック体及び放熱体
との間で、熱授受がなされるようにしていると共に、電
源ユニットの発熱の放出とは別々に独立してなされてい
る。このため、装置が大きくなり易いとともに、送風機
によって送風をするため、精密電子部品にとっては弊害
とされる発塵や振動が発生し易い不具合があった。[Problem] In the liquid temperature control device, cooling water is allowed to pass through the heat radiator so that heat is transferred between the thermoelectric conversion element and the heat transfer block body and the heat radiator. It is done separately from the release of heat. For this reason, there is a problem that the device tends to be large and air is blown by the blower, which easily causes dust and vibration, which are harmful to precision electronic components.
【0007】[0007]
【発明の目的】本発明の目的は、構成が単純かつ小型軽
量で、発塵・振動がない液体温度調節装置を提供するこ
とにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a liquid temperature control device having a simple structure, a small size and a light weight, and free from dust and vibration.
【0008】[0008]
【発明の構成】本発明の要旨は、放熱体の熱電変換素子
とは反対側の面に、熱電変換素子の電源ユニットを取り
付ける熱良導性素材からなる電源ユニット取付板を密着
固定したことを特徴とする液体温度調節用熱交換器にあ
る。The gist of the present invention is that a power supply unit mounting plate made of a highly conductive material for mounting a power supply unit of a thermoelectric conversion element is closely fixed to the surface of the radiator opposite to the thermoelectric conversion element. It is a characteristic heat exchanger for liquid temperature control.
【0009】[0009]
【実施例】図1〜2は、本発明の第1実施例を示すもの
である。半導体素子製造のフォト・エッチング工程で用
いるエッチング溶液を所定の温度に調節するための装置
として最適である。液体温度調節用熱交換器1の基本的
な原理は、従来技術において記載した水温調節器110
と同じで、熱電冷凍サイクルから成る。図2において、
互いに重ね合わせることができる同形の3枚の黒鉛プレ
ート3a、3b、3cのうち、中央の黒鉛プレート3a
の左右両面に、横断面が半円形をなす溝4a、4a、…
が作られており、このプレート3aの左右両側から重接
する(重なり接する)黒鉛プレート3b及び3cの対向
位置にも、同様の溝4b、4b、…、及び、4c、4
c、…が形成されている。1 and 2 show a first embodiment of the present invention. It is optimal as an apparatus for adjusting the etching solution used in the photo-etching process for manufacturing a semiconductor device to a predetermined temperature. The basic principle of the heat exchanger 1 for liquid temperature control is the water temperature controller 110 described in the prior art.
The same as the thermoelectric refrigeration cycle. In FIG.
Of the three graphite plates 3a, 3b, 3c of the same shape that can be overlapped with each other, the central graphite plate 3a
Grooves 4a, 4a having a semicircular cross section on both the left and right sides of
Are formed, and the same grooves 4b, 4b, ...
c,... are formed.
【0010】伝熱ブロック体3は、これらの黒鉛プレー
ト3a〜cを重接させて、互いに向かい合う半円形溝に
より、貫通孔4、4、…を形成したものから構成されて
いる。黒鉛プレートの重接面と溝の内周面には、伝熱性
シリコングリス(例えば、信越化学工業株式会社製G7
47)を塗布するか、若しくはごく薄い熱伝導性シリコ
ンフィルムを介在させることにより、重接面どうしの密
着性と伝熱性、並びに、後記する液体導管と溝内周面と
の密着性及び伝熱性をよくする。更に、必要に応じて、
これらプレート重接面及び溝内周面を予めCVD法など
により、フッ素樹脂を蒸着せしめて、黒鉛の微細な気孔
を充填処理して熱伝導性や耐食性を改善してもよい。こ
の表面処理は、伝熱ブロック体として、黒鉛以外の素
材、例えばアルミニウムプレートなどを採用した場合で
も、望ましい処理である。The heat transfer block 3 is constructed by contacting these graphite plates 3a to 3c and forming through holes 4, 4, ... With semi-circular grooves facing each other. On the heavy contact surface of the graphite plate and the inner peripheral surface of the groove, heat conductive silicon grease (for example, G7 manufactured by Shin-Etsu Chemical Co., Ltd.) is used.
47) or by interposing a very thin thermally conductive silicon film, the adhesion and heat transfer between the heavy contact surfaces, and the adhesion and heat transfer between the liquid conduit and the groove inner peripheral surface to be described later. To improve In addition, if necessary,
Fluorine resin may be vapor-deposited on the plate contact surface and the groove inner peripheral surface in advance by a CVD method or the like to fill fine pores of graphite to improve thermal conductivity and corrosion resistance. This surface treatment is a desirable treatment even when a material other than graphite, such as an aluminum plate, is used as the heat transfer block.
【0011】この伝熱ブロック体の両側に、モジュール
化された熱電変換素子2、2、…が、熱良導性シリコン
グリスの薄層を介して同様に重接している。これらの熱
電変換素子2、2、…の外側に、前記黒鉛プレート3a
〜cと同形の黒鉛プレートから成る放熱体6が重接し、
更に、放熱体6aの外側から、固定板10aを当接して
いる。さらに、放熱体6bの外側には、アルミニウム製
の板からなる伝熱プレート21を、固定板10bを当接
して、、締付ボルト11で、固定板どうしを締め付ける
ことにより、伝熱ブロック体3、熱電変換素子2、…、
放熱体6、6及び伝熱プレートが、相互に圧接固定され
ている。On both sides of the heat transfer block, the thermoelectric conversion elements 2, 2, ... Which are modularized are similarly in contact with each other through a thin layer of heat conductive silicon grease. The graphite plate 3a is provided outside the thermoelectric conversion elements 2, 2 ,.
The heat-dissipating body 6 made of a graphite plate having the same shape as ~ c is in contact with
Furthermore, the fixing plate 10a is in contact with the radiator 6a from the outside. Further, a heat transfer plate 21 made of a plate made of aluminum is brought into contact with the fixing plate 10b on the outer side of the heat radiating body 6b, and the fixing plates are tightened with the tightening bolts 11. , Thermoelectric conversion element 2, ...
The radiators 6 and 6 and the heat transfer plate are pressed and fixed to each other.
【0012】伝熱プレート21は、放熱体6bから延長
され、該延長された部分は下方に直角に折り曲げられて
おり、直交流変換器、制御基板等の電源ユニット20
が、熱的に遮断されないように取り付けられている。放
熱体中には、冷却水流路7が設けられており、冷却水
は、入口管7aから入り、放熱体を冷却しながら放熱体
中を流れて、出口管7bに流出する。The heat transfer plate 21 is extended from the radiator 6b, and the extended portion is bent downward at a right angle. The power source unit 20 such as a cross flow converter or a control board is provided.
Are mounted so that they are not thermally interrupted. A cooling water flow path 7 is provided in the radiator, and the cooling water enters through the inlet pipe 7a, flows through the radiator while cooling the radiator, and flows out to the outlet pipe 7b.
【0013】一方、液体導管5、5、…の一端5a、5
a、…は、下端に液体流入口8aが開口する天井部が閉
塞された筒状の分流室に接続しており、溝4a、4bに
より構成される貫通孔群側から突出した液体導管の他端
5b、…は、すべて、下端に液体流出口を備えた合流室
9に接続して連通している。12は、合流室9内の液体
温度を検出して、熱電変換素子の電源ユニット20に、
検出信号を送る温度検出器である。分流室や合流室も、
液体導管と同―のフッ素樹脂製若しくは少なくとも、内
面は、フッ素樹脂コートがほどこされている。On the other hand, one ends 5a, 5 of the liquid conduits 5, 5, ...
are connected to a cylindrical flow-dividing chamber whose ceiling is closed at the lower end where the liquid inlet 8a is opened, and other liquid conduits protruding from the through hole group side formed by the grooves 4a and 4b. All the ends 5b, ... Are connected to and communicate with a merging chamber 9 having a liquid outlet at the lower end. 12 detects the liquid temperature in the merging chamber 9, and the power unit 20 of the thermoelectric conversion element,
It is a temperature detector that sends a detection signal. The diversion room and the merging room,
The same as the liquid conduit, which is made of fluororesin, or at least the inner surface of which is coated with fluororesin.
【0014】[0014]
【作用】上記のような構成から成る本願液体温度調節用
熱交換器の実施例は、フォト・エッチング装置からエッ
チング液を圧送する液体圧送管の一端を、分流室8の液
体流入口8aに連結し、合流室9の液体流出口9aに、
フォト・エッチング装置への戻り管の一端を接続する。
分流室8に入った液体は、ここから液体導管5、…に分
流し、伝熱ブロック体3内を通過する過程で、所定の温
度に調整されて、合流室に入り、流出口9aから、フォ
ト・エッチング装置に戻る。放熱体6、6には、冷却水
が通過することにより、熱電変換素子が汲み上げた熱を
外部に放出する。同時に、直交流変換器や基板等の電源
ユニット20から発生した熱を、伝熱プレート21を介
して放熱体6から冷却水が吸収し、熱を外部に放出す
る。In the embodiment of the heat exchanger for liquid temperature control of the present invention having the above-mentioned structure, one end of the liquid pressure feeding pipe for feeding the etching liquid from the photo etching device is connected to the liquid inlet 8a of the flow dividing chamber 8. Then, at the liquid outlet 9a of the merging chamber 9,
Connect one end of the return tube to the photoetcher.
The liquid that has entered the flow dividing chamber 8 is divided into the liquid conduits 5, ... From here, and while being passed through the heat transfer block body 3, the liquid is adjusted to a predetermined temperature, enters the merging chamber, and flows out from the outlet 9a. Return to photo etching equipment. When the cooling water passes through the radiators 6 and 6, the heat pumped by the thermoelectric conversion element is released to the outside. At the same time, the heat generated from the power supply unit 20 such as the cross flow converter or the substrate is absorbed by the cooling water from the radiator 6 via the heat transfer plate 21, and the heat is released to the outside.
【0015】なお、図3は、本願発明の第2実施例を示
し、伝熱プレート21を、21a、21bの2枚に分割
して、ねじによって、締結、組立てたものであって、組
立て性を向上させている。FIG. 3 shows a second embodiment of the present invention, in which the heat transfer plate 21 is divided into two pieces 21a and 21b, which are fastened and assembled by screws, and the assemblability is improved. Is improving.
【0016】[0016]
【効果】以上詳述した本願発明の装置によれば、電源ユ
ニットの発熱が、熱電変換素子の放熱の冷却に合わせて
冷却することができるため、強制的な冷却装置を別途設
けなくともよい。さらに、従来装置と異なり、恒温槽を
介することなく、液体を直接冷却して温度調節するた
め、液体温度の変動に対して、素早く応答して、温度調
節する事ができると共に装置が大幅に簡素化され、設置
スぺースも少なくてすむ。According to the apparatus of the present invention described in detail above, since the heat generation of the power supply unit can be cooled in accordance with the cooling of the heat radiation of the thermoelectric conversion element, it is not necessary to separately provide a forced cooling device. Furthermore, unlike the conventional device, the liquid is directly cooled and temperature is adjusted without going through a constant temperature bath, so it is possible to respond quickly to liquid temperature changes and adjust the temperature, and the device is greatly simplified. The space required for installation has been reduced.
【図1】本願発明の第1実施例を示す説明図である。FIG. 1 is an explanatory diagram showing a first embodiment of the present invention.
【図2】図1のA−A断面説明図である。FIG. 2 is an explanatory sectional view taken along the line AA of FIG. 1;
【図3】本願発明の第2実施例を示す斜視説明図であ
る。FIG. 3 is a perspective explanatory view showing a second embodiment of the present invention.
【図4】従来技術の一例を示す説明図である。FIG. 4 is an explanatory diagram showing an example of a conventional technique.
1 熱交換器 2 電変換素子 3 伝熱ブロック体 4 貫通孔 5 液体流路 6 放熱体 20 電源ユニット 21 伝熱プレート DESCRIPTION OF SYMBOLS 1 Heat exchanger 2 Electric conversion element 3 Heat transfer block body 4 Through hole 5 Liquid flow path 6 Radiator 20 Power supply unit 21 Heat transfer plate
Claims (1)
性素材から成る伝熱ブロック体と放熱体とを、前記熱電
変換素子と熱授受可能に配設し、前記伝熱ブロック体に
は、液体流路を該伝熱ブロック体と熱授受可能に貫通し
て設けて、該液体導管の一側開口を、温度調節すべき液
体の流入口を持つ液体分流室に連通させると共に、前記
液体導管の他側開口を、液体の流出口を備えた液体合流
室に連通させ、前記放熱体には、冷却液流路を設けた液
体温度調節用熱交換器において、前記放熱体の熱電変換
素子とは反対側の面に、熱良導性素材からなる電源ユニ
ット取付板を密着固定すると共に、該電源ユニット取付
板に熱電変換素子の電源ユニットを取り付けたことを特
徴とする体液温度調節用熱交換器。1. A heat transfer block body, which is made of a material having good thermal conductivity, and a heat radiator are arranged on both sides of the thermoelectric conversion element so as to be able to exchange heat with the thermoelectric conversion element. A liquid passage is provided so as to be able to exchange heat with the heat transfer block, and one side opening of the liquid conduit is communicated with a liquid distribution chamber having a liquid inlet for temperature adjustment, In the heat exchanger for liquid temperature adjustment, the other side opening of the liquid conduit is communicated with a liquid merging chamber having a liquid outlet, and the radiator is provided with a cooling liquid flow path. Body fluid temperature control characterized in that a power supply unit mounting plate made of a material with good heat conductivity is closely fixed to the surface opposite to the conversion device, and a power supply unit of the thermoelectric conversion device is mounted on the power supply unit mounting plate. Heat exchanger.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14711996A JPH09330907A (en) | 1996-06-10 | 1996-06-10 | Heat exchanger for regulating temperature of liquid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14711996A JPH09330907A (en) | 1996-06-10 | 1996-06-10 | Heat exchanger for regulating temperature of liquid |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09330907A true JPH09330907A (en) | 1997-12-22 |
Family
ID=15422970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14711996A Pending JPH09330907A (en) | 1996-06-10 | 1996-06-10 | Heat exchanger for regulating temperature of liquid |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09330907A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003056995A (en) * | 2001-08-20 | 2003-02-26 | Komatsu Electronics Inc | Heat exchanger |
JP2004087549A (en) * | 2002-08-23 | 2004-03-18 | Tokyo Electron Ltd | Tank for processing liquid and processing apparatus |
JP2009041865A (en) * | 2007-08-10 | 2009-02-26 | Orion Mach Co Ltd | Heat exchanger for chemicals |
JP2009133563A (en) * | 2007-11-30 | 2009-06-18 | Taisei Laminator Co Ltd | Refrigerator |
JP2019075582A (en) * | 2016-03-31 | 2019-05-16 | 株式会社村田製作所 | Solid-state electrolytic capacitor |
KR102094009B1 (en) * | 2020-01-13 | 2020-03-26 | 방민철 | Temperature control apparatus for chemical liquid for manufacturing semiconductor |
-
1996
- 1996-06-10 JP JP14711996A patent/JPH09330907A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003056995A (en) * | 2001-08-20 | 2003-02-26 | Komatsu Electronics Inc | Heat exchanger |
JP2004087549A (en) * | 2002-08-23 | 2004-03-18 | Tokyo Electron Ltd | Tank for processing liquid and processing apparatus |
JP2009041865A (en) * | 2007-08-10 | 2009-02-26 | Orion Mach Co Ltd | Heat exchanger for chemicals |
JP2009133563A (en) * | 2007-11-30 | 2009-06-18 | Taisei Laminator Co Ltd | Refrigerator |
JP2019075582A (en) * | 2016-03-31 | 2019-05-16 | 株式会社村田製作所 | Solid-state electrolytic capacitor |
KR102094009B1 (en) * | 2020-01-13 | 2020-03-26 | 방민철 | Temperature control apparatus for chemical liquid for manufacturing semiconductor |
CN113113327A (en) * | 2020-01-13 | 2021-07-13 | 方珉喆 | Temperature control device for chemical liquid for semiconductor manufacturing |
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