JPH09290587A - Ic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make an IC module appear presentable when loaded in an IC card as the IC module is especially preferably used for a hybrid card with a photorecording part and the IC module. SOLUTION: In an IC module 30 for a plastic card which comprises an IC chip covered with a molded resin part 32 on a substrate 31, a resin used for forming the molded resin part 32 is dyed in the same color as or in a similar color to the color of the plastic card which is visible from an opposite face to the side where the contact part of the IC module 30 is positioned. The resin used for forming the molded resin part 32 is preferably dyed by adding a colorant such as a pigment or dye. In a conventional IC card, the IC module does not appear conspicuous, if the molded resin part 32 is seen through. On the other hand, in a hybrid card, the IC module is not an unpleasing sight, if its bottom is visible from the photorecording face.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module used by being embedded in a plastic card.

[0002]

In recent years, reflecting the card era, an optical card having a large-capacity information recording function has been actively developed as an information recording card next to a magnetic card and an IC card. In the field of this optical card, a so-called heat mode recording material has been proposed in which a recording layer made of an optical recording material is spotwise irradiated with an energy beam such as a laser beam to change the state of a part of the recording layer for recording. There is. However, in an optical card having an optical recording section made of such an optical recording material, the written information cannot be changed after the information is once written in the optical recording section. For this reason, for example, if an attempt is made to write data of a sequentially changed character such as a directory (search information) of recorded contents or FAT (file allocation table) to the optical recording unit, a new recording area is consumed each time. However, there is a problem that the original data area is narrowed. Therefore, a semiconductor memory chip is mounted on such an optical card, and a directory or FA is mounted on the semiconductor memory chip.
A so-called hybrid card in which data such as T needs to be rewritten is proposed.

In the case of this hybrid card, when the data is read from the card, only the file name is designated from the host computer, and the card drive electrically accesses the solid-state memory (semiconductor memory chip) in the card at high speed. It is possible to read the target data file by searching the directory, knowing the track number in which the target data file is written, and accessing the track in the optical recording section with the optical pickup. And if the formats are unified, this card can be used freely in any network system. Further, although data cannot be rewritten in the optical recording section, data can be rewritten relatively easily in the IC memory. Therefore, data that needs rewriting or data that requires security is recorded in the IC module section.

Generally, not only a semiconductor chip having only a memory, but an IC module having a form of a COB (Chip on Board) as shown in FIG. Is used in the above hybrid card. This type of I
For the C module, each terminal of the IC module and R
An I / O line is formed by making contact with and electrically connecting with a contact portion of / W (reader / writer), and information is read and written only through the I / O line. Then, the CPU enables advanced judgment and calculation for maintaining the security of information.

The IC module 10 shown in FIG. 1 will be briefly described. The copper foil layer 1 is formed on one surface of the substrate 11.
The CLK (clock) line, the I / O line, the Vcc (power supply) line, the RST (reset) line, and the GND (ground) line in which the gold plating layer 14 is applied to the portion 2 through the Ni plating layer 13 as the base plating IC terminals (semiconductor elements) mounted on the other surface of the terminal 11 and the substrate 11 are provided with a plurality of terminals 15, etc.
The 16 electrode pads are electrically connected via wires 17, and the IC chip 16 side is further sealed with a mold resin portion 18. In FIG. 1, the copper foil layers 12 on the front and back sides of the substrate 11 are electrically conducted through the through holes 19. A black resin is used for the mold resin portion 18. Also, I enclosed in
A module identification mark is often printed on the back surface of the mold resin portion 18 using white ink so that the type of the C chip 16 can be seen.

In the hybrid card in which the IC module 10 is embedded, the surface on the side having the optical recording portion with respect to the card base material is protected by the transparent base material, and the card itself is thin and standardized (ISO standard 0.76). ± 0.08 mm), when the IC module 10 is embedded from the card base material side, the bottom of the IC module 10 protrudes from the card base material to the transparent base material and is visible from the optical recording surface side. The appearance is not good and the appearance is not preferable. Also, if the module identification mark is written on the back surface of the mold resin portion 18, it can be read, and the appearance is not good either. Even in a normal IC card, if the bottom of the recess for embedding is thin, the molded resin part may be seen through from the back surface of the card.

The present invention has been made in view of the above problems, and an object thereof is to be particularly suitably used for a hybrid card having an optical recording section and an IC module. An object of the present invention is to provide an IC module that looks good when it is loaded into the IC module.

[0008]

In order to achieve the above-mentioned object, the IC module of the present invention is an I module provided on a substrate.
In a plastic card IC module in which a C chip is covered with a mold resin portion, a card in which the color of the resin itself forming the mold resin portion can be seen from the surface opposite to the side where the contact portion of the IC module is located It is characterized in that it is colored in the same color as or a similar color. Specifically, it is advisable to add a coloring agent such as a pigment or a dye to the resin forming the mold resin portion for coloring.

For example, in the hybrid card as described above, when the color of white vinyl chloride is visible because the card base under the transparent base is not printed, the color of the mold resin is set to white or a color close to white. Is preferred. If printing is performed, the print color is matched.

The IC module constructed as described above has the same or similar color as the surrounding color even when the mold resin portion at the bottom of the IC module is embedded in the hybrid card, even if it is visible from the optical recording surface. It looks better than the conventional black.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to examples.

(Embodiment 1) In this embodiment, an optical recording portion and an I
An IC module for a hybrid card having a C module is manufactured. Specifically, instead of using a black resin as the mold resin, a resin colored with white color by adding titanium dioxide was used, and the IC module 20 shown in FIG. That is, the substrate 21
Then, an IC chip is set on the assembly, assembly such as die bonding and wire bonding is performed, and the white resin is used to form a molding resin portion 22 by means of transfer molding, potting, printing or the like, and sealing is performed.

In a hybrid card having an optical recording section and an IC module, white PVC is usually used as a card substrate 23 as shown in FIG. 2, and a transparent PC is used as a protective layer 25 covering the optical recording section 24. ing. Therefore, the IC manufactured above is placed in the recess formed from the card substrate 23 side.
When the module 20 is embedded, the color of the mold resin portion 22 is matched with the color of the card base material 23, so that the appearance is better than that of the case where the mold resin portion is black.

When a module identification mark is required on the back surface of the mold resin portion 22, it is preferable to use an ink such as fluorescent ink that is not readable by visible light and use offset printing, silk printing, ink jet or the like means.
As a result, even if the bottom of the IC module can be seen from the optical recording surface, the module identification mark cannot be read, so there is no problem in appearance, and when necessary, it can be read by applying light other than visible light such as ultraviolet light. .

(Embodiment 2) In this embodiment, an IC module for an ordinary IC card having a back surface printed is manufactured.
Specifically, instead of using a black resin as the molding resin, a resin colored by adding a pigment or dye of a desired color to match the printing color on the back surface of the card is used, and the same procedure as in the conventional case is used. The IC module 30 shown in was produced. That is, an IC chip is set on the substrate 31, assembly such as die bonding and wire bonding is performed, and a molding resin portion 32 is formed and sealed by means of transfer molding, potting, printing, etc. using the above-mentioned colored resin. .

In a normal IC card, white PVC is used for the core sheet as the card substrate 33 shown in FIG.
Printing is performed on one side or both sides, and a transparent oversheet is laminated on both sides. Therefore, when the IC module 30 manufactured above is embedded in the recess formed in the card base material 33, the color of the mold resin portion 32 matches the color printed on the back surface of the card base material 33. Looks better than the black one. When a module identification mark is required on the back surface of the mold resin portion 32, it is preferable to use an ink that is not readable by visible light, such as fluorescent ink, as described above.

[0017]

As described above, in the IC module of the present invention, the color of the resin itself forming the mold resin portion covering the IC chip is changed from the surface opposite to the side where the contact portion of the IC module is located. By coloring with the same or similar color as the color of the visible card, it is not conspicuous even if the molded resin part can be seen through in the case of a normal IC card, so it looks better than the conventional black molded resin part. . In particular, in the case of a hybrid card having an optical recording section and an IC module, even if the bottom of the IC module is visible from the optical recording surface, it will not be unsightly.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a conventional IC module.

FIG. 2 is a schematic cross-sectional view showing an example in which the IC module of the present invention is used in a hybrid card.

FIG. 3 is a schematic cross-sectional view showing an example in which the IC module of the present invention is used in a normal IC card.

[Explanation of symbols]

 10 IC Module 11 Substrate 12 Copper Foil Layer 13 Ni Plating Layer 14 Gold Plating Layer 15 Terminal 16 IC Chip 17 Wire 18 Mold Resin Part 19 Through Hole 20 IC Module 21 Board 22 Mold Resin Part 23 Card Base Material 24 Optical Recording Part 25 Protective Layer 30 IC Module 31 Substrate 32 Mold Resin Section 33 Card Base Material

Claims (1)

[Claims] 1. In an IC module for a plastic card in which an IC chip provided on a substrate is covered with a mold resin portion, the color of the resin itself forming the mold resin portion is determined by the position of the contact portion of the IC module. An IC module characterized in that it is colored in the same color as or a color similar to the color of the card seen from the side opposite to the side where it is processed.