JPH09278985A - Thermosetting resin composition and cured product thereof - Google Patents
Thermosetting resin composition and cured product thereofInfo
- Publication number
- JPH09278985A JPH09278985A JP8089363A JP8936396A JPH09278985A JP H09278985 A JPH09278985 A JP H09278985A JP 8089363 A JP8089363 A JP 8089363A JP 8936396 A JP8936396 A JP 8936396A JP H09278985 A JPH09278985 A JP H09278985A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- group
- ring
- dihydrobenzoxazine ring
- dihydrobenzoxazine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 60
- 239000011342 resin composition Substances 0.000 title claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 63
- 239000011347 resin Substances 0.000 claims abstract description 63
- BGDOLELXXPTPFX-UHFFFAOYSA-N 3,4-dihydro-2h-1,2-benzoxazine Chemical group C1=CC=C2ONCCC2=C1 BGDOLELXXPTPFX-UHFFFAOYSA-N 0.000 claims abstract description 49
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 23
- 229920001971 elastomer Polymers 0.000 claims abstract description 22
- 239000000806 elastomer Substances 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 125000000524 functional group Chemical group 0.000 claims abstract description 9
- 238000007142 ring opening reaction Methods 0.000 claims abstract description 9
- 125000003118 aryl group Chemical group 0.000 claims abstract description 6
- 125000000962 organic group Chemical group 0.000 claims abstract description 6
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 239000012778 molding material Substances 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000565 sealant Substances 0.000 abstract description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 21
- 229920003986 novolac Polymers 0.000 description 11
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- -1 dihydrobenzoxazine compound Chemical class 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 239000005011 phenolic resin Substances 0.000 description 7
- 229920002857 polybutadiene Polymers 0.000 description 7
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 239000005062 Polybutadiene Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 150000003141 primary amines Chemical class 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 235000019256 formaldehyde Nutrition 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 229920003987 resole Polymers 0.000 description 3
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- JYIZNFVTKLARKT-UHFFFAOYSA-N phenol;1,3,5-triazine-2,4,6-triamine Chemical compound OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 JYIZNFVTKLARKT-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- MQCPOLNSJCWPGT-UHFFFAOYSA-N 2,2'-Bisphenol F Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1O MQCPOLNSJCWPGT-UHFFFAOYSA-N 0.000 description 1
- BCHZICNRHXRCHY-UHFFFAOYSA-N 2h-oxazine Chemical group N1OC=CC=C1 BCHZICNRHXRCHY-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- BRPSWMCDEYMRPE-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=C(O)C=C1 BRPSWMCDEYMRPE-UHFFFAOYSA-N 0.000 description 1
- WFCQTAXSWSWIHS-UHFFFAOYSA-N 4-[bis(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 WFCQTAXSWSWIHS-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical group OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- BHAAPTBBJKJZER-UHFFFAOYSA-N p-anisidine Chemical compound COC1=CC=C(N)C=C1 BHAAPTBBJKJZER-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001256 steam distillation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、耐熱性、難燃性等
に優れる高機能成形材料、塗料、コーティング材、接着
剤、封止材、積層板及びFRP等の原料として好適に用
いられる熱硬化性樹脂組成物及びその硬化物に関する。TECHNICAL FIELD The present invention relates to heat which is preferably used as a raw material for high-performance molding materials, paints, coating materials, adhesives, encapsulating materials, laminates, FRP, etc., which are excellent in heat resistance and flame retardancy. A curable resin composition and a cured product thereof.
【0002】[0002]
【従来の技術】フェノール樹脂、メラミン樹脂、エポキ
シ樹脂、不飽和ポリエステル樹脂、ビスマレイミド樹脂
等の熱硬化性樹脂は、その熱硬化性という性質に基づく
耐熱性、信頼性により、多くの産業分野で用いられてい
る。しかし、フェノール樹脂やメラミン樹脂は硬化時に
揮発性副生成物を発生し、エポキシ樹脂や不飽和ポリエ
ステル樹脂は耐熱性に劣り、ビスマレイミド樹脂は非常
に高価である等それぞれ固有の問題点が存在し、現実に
は用途に応じて問題点については適宜妥協する必要があ
った。そこで、これらの問題点を有しない新規な熱硬化
性樹脂の開発が従来より進められてきた。2. Description of the Related Art Thermosetting resins such as phenolic resins, melamine resins, epoxy resins, unsaturated polyester resins, and bismaleimide resins are used in many industrial fields because of their heat resistance and reliability due to their thermosetting properties. It is used. However, phenolic resins and melamine resins generate volatile by-products during curing, epoxy resins and unsaturated polyester resins have poor heat resistance, and bismaleimide resins are very expensive. Actually, it was necessary to appropriately compromise the problems depending on the application. Therefore, development of a novel thermosetting resin that does not have these problems has been promoted.
【0003】その一つとして、ジヒドロベンゾオキサジ
ン化合物がある(特開昭49−47387号公報、米国
特許5152939号明細書)。この化合物の硬化は、
ジヒドロベンゾオキサジン環の開環重合反応を利用する
ものであるため、揮発分の発生を殆ど伴わずに熱硬化す
る。One of them is a dihydrobenzoxazine compound (JP-A-49-47387, US Pat. No. 5,152,939). The cure of this compound is
Since it utilizes the ring-opening polymerization reaction of the dihydrobenzoxazine ring, it is heat-cured with almost no generation of volatile components.
【0004】[0004]
【発明が解決しようとする課題】この開環重合反応を利
用したジヒドロベンゾオキサジン化合物の硬化によって
得られる硬化物は従来知られている熱硬化性樹脂と比較
して耐熱性が良好であり、しかも高強度かつ可撓性に優
れている。しかし、熱可塑性樹脂と比較すると高強度で
はあるが撓み率が小さいなど、靭性が比較的弱い。A cured product obtained by curing a dihydrobenzoxazine compound utilizing this ring-opening polymerization reaction has good heat resistance as compared with conventionally known thermosetting resins, and High strength and excellent flexibility. However, compared with the thermoplastic resin, the toughness is relatively weak, such as the strength being high but the bending rate being small.
【0005】本発明は高強度かつ靭性に優れたジヒドロ
ベンゾオキサジン環を有する熱硬化性樹脂の組成物を提
供することを目的とする。It is an object of the present invention to provide a thermosetting resin composition having a dihydrobenzoxazine ring, which has high strength and excellent toughness.
【0006】[0006]
【課題を解決するための手段】本発明者らは前記目的を
達成するために鋭意研究を重ねた結果、ジヒドロベンゾ
オキサジン環を有する熱硬化性樹脂に特定なエラストマ
ーを配合することにより、ジヒドロベンゾオキサジン環
を有する熱硬化性樹脂単独より靭性を向上させることが
でき、かつその他の特性は低下させないことを見出し、
この知見に基づいて本発明を完成するに至った。DISCLOSURE OF THE INVENTION As a result of intensive studies to achieve the above object, the inventors of the present invention have found that dihydrobenzoxene can be prepared by blending a specific elastomer with a thermosetting resin having a dihydrobenzoxazine ring. It was found that the toughness can be improved more than the thermosetting resin having an oxazine ring alone, and other properties are not deteriorated,
Based on this finding, the present invention has been completed.
【0007】すなわち、本発明はジヒドロベンゾオキサ
ジン環を有する熱硬化性樹脂とジヒドロベンゾオキサジ
ン環を有する熱硬化性樹脂及びジヒドロベンゾオキサジ
ン環が開環して生成するフェノール性水酸基と反応し得
る官能基を有する液状エラストマーを含有することを特
徴とする熱硬化性樹脂組成物を提供するものである。That is, the present invention relates to a thermosetting resin having a dihydrobenzoxazine ring, a thermosetting resin having a dihydrobenzoxazine ring, and a functional group capable of reacting with a phenolic hydroxyl group formed by ring opening of the dihydrobenzoxazine ring. The present invention provides a thermosetting resin composition characterized by containing a liquid elastomer having:
【0008】[0008]
【発明の実施の形態】ジヒドロベンゾオキサジン環を有
する熱硬化性樹脂とジヒドロベンゾオキサジン環を有す
る熱硬化性樹脂及びジヒドロベンゾオキサジン環が開環
して生成するフェノール性水酸基と反応し得る官能基を
有するエラストマーとの配合割合はジヒドロベンゾオキ
サジン環を有する熱硬化性樹脂70〜99重量%とジヒ
ドロベンゾオキサジン環を有する熱硬化性樹脂及びジヒ
ドロベンゾオキサジン環が開環して生成するフェノール
性水酸基と反応し得る官能基を有するエラストマー1〜
30重量%とすることが好ましい。BEST MODE FOR CARRYING OUT THE INVENTION A thermosetting resin having a dihydrobenzoxazine ring, a thermosetting resin having a dihydrobenzoxazine ring, and a functional group capable of reacting with a phenolic hydroxyl group formed by ring opening of the dihydrobenzoxazine ring are formed. The blending ratio with the elastomer has 70 to 99% by weight of a thermosetting resin having a dihydrobenzoxazine ring, a thermosetting resin having a dihydrobenzoxazine ring, and a phenolic hydroxyl group formed by ring opening of the dihydrobenzoxazine ring. Elastomer having functional groups capable of
Preferably, it is 30% by weight.
【0009】前記エラストマーの割合が1重量%未満で
あると靭性を向上させることが難しくなり、30重量%
を超えると機械特性が大幅に低下することがある。すな
わち、エラストマーの配合割合を1〜30重量%、更に
好ましくは2〜25重量%にすることにより、機械特性
等の諸特性を低下させずに靭性を向上させることができ
る。When the proportion of the elastomer is less than 1% by weight, it becomes difficult to improve the toughness, so that 30% by weight is obtained.
If it exceeds, mechanical properties may be significantly reduced. That is, by setting the blending ratio of the elastomer to 1 to 30% by weight, more preferably 2 to 25% by weight, the toughness can be improved without deteriorating various characteristics such as mechanical characteristics.
【0010】エラストマーの分散状態としては、ジヒド
ロベンゾオキサジン環を有する熱硬化性樹脂中に微分散
した海島構造、熱硬化性樹脂との相互貫入高分子網目構
造(IPN構造)が好ましい。As the dispersed state of the elastomer, a sea-island structure finely dispersed in a thermosetting resin having a dihydrobenzoxazine ring and an interpenetrating polymer network structure (IPN structure) with the thermosetting resin are preferable.
【0011】ジヒドロベンゾオキサジン環を有する熱硬
化性樹脂としては、ジヒドロベンゾオキサジン環を有
し、ジヒドロベンゾオキサジン環の開環重合反応により
硬化する樹脂であれば特に限定されない。具体的には多
価フェノール、ヒドロキシル基のオルト位の少なくとも
一つが水素であるヒドロキシフェニル基又はヒドロキシ
フェニレン基を1分子中に合わせて2以上有する化合物
(以下、多官能フェノール化合物という。)と、1級ア
ミンとの混合物を、70℃以上に加熱したホルマリン等
のホルムアルデヒド類中に添加して、70〜110℃、
好ましくは、90〜100℃で、20分〜2時間反応さ
せ、その後、120℃以下の温度で減圧乾燥することに
よって得られる。The thermosetting resin having a dihydrobenzoxazine ring is not particularly limited as long as it has a dihydrobenzoxazine ring and is cured by a ring-opening polymerization reaction of the dihydrobenzoxazine ring. Specifically, a polyhydric phenol, a compound having two or more hydroxyphenyl groups or hydroxyphenylene groups in which at least one ortho-position of a hydroxyl group is hydrogen in one molecule (hereinafter referred to as a polyfunctional phenol compound), The mixture with the primary amine is added to formaldehyde such as formalin heated to 70 ° C. or higher to 70 to 110 ° C.,
Preferably, it is obtained by reacting at 90 to 100 ° C. for 20 minutes to 2 hours and then drying under reduced pressure at a temperature of 120 ° C. or less.
【0012】多官能フェノール化合物としては、カテコ
ール、ヒドロキノン、レゾルシノール、ビス(2−ヒド
ロキシフェニル)メタン、ビス(4−ヒドロキシフェニ
ル)メタン、4,4′−ジヒドロキシジフェニルスルホ
ン、1,1−ビス(4−ヒドロキシフェニル)エタン、
p,p′−イソプロピリデンビフェノール、2,2−ビ
ス[4−(4′−ヒドロキシフェノキシ)フェニル]プ
ロパン、トリス(4−ヒドロキシフェニル)メタン、
1,1,1−トリス(4−ヒドロキシフェニル)エタ
ン、フェノールノボラック樹脂、レゾール樹脂、フェノ
ール変性キシレン樹脂、アルキルフェノール樹脂、メラ
ミンフェノール樹脂、フェノール変性ポリブタジエン等
が挙げられる。これらは特に限定するものではないが架
橋点となるヒドロキシル基のオルト位が無置換であるも
のが硬化特性の点で望ましく、そのため例えばフェノー
ルノボラック樹脂の場合は、オルト率が小さく、比較的
分子量の小さいいわゆるランダムノボラックを用いるこ
とが好ましい。Examples of polyfunctional phenol compounds include catechol, hydroquinone, resorcinol, bis (2-hydroxyphenyl) methane, bis (4-hydroxyphenyl) methane, 4,4'-dihydroxydiphenylsulfone, 1,1-bis (4 -Hydroxyphenyl) ethane,
p, p'-isopropylidenebiphenol, 2,2-bis [4- (4'-hydroxyphenoxy) phenyl] propane, tris (4-hydroxyphenyl) methane,
Examples thereof include 1,1,1-tris (4-hydroxyphenyl) ethane, phenol novolak resin, resol resin, phenol-modified xylene resin, alkylphenol resin, melamine phenol resin, and phenol-modified polybutadiene. These are not particularly limited, but those in which the ortho position of the hydroxyl group serving as a crosslinking point is unsubstituted are desirable in terms of curing properties.For example, in the case of a phenol novolak resin, the ortho ratio is small and the molecular weight is relatively small. It is preferred to use small so-called random novolaks.
【0013】1級アミンとしては具体的にはメチルアミ
ン、アニリン、トルイジン、アニシジンなどの置換アニ
リン等が挙げられる。脂肪族アミンであると、得られた
熱硬化性樹脂は硬化は速いが耐熱性に劣る。アニリンの
ような芳香族アミンであると、得られた熱硬化性樹脂を
硬化させた硬化物の耐熱性はよいが硬化が遅くなる。Specific examples of primary amines include substituted anilines such as methylamine, aniline, toluidine and anisidine. When it is an aliphatic amine, the obtained thermosetting resin cures quickly but has poor heat resistance. When an aromatic amine such as aniline is used, the cured product obtained by curing the obtained thermosetting resin has good heat resistance, but cures slowly.
【0014】ジヒドロベンゾオキサジン環を有する熱硬
化性樹脂のうちで、好ましくは、1分子中に下記式
(A)で表される構造単位(A)及び下記式(B)で表
される構造単位(B)を有し、各構造単位は直接に又は
有機の基を介して結合しており、(A)/(B)のモル
比が1/0.25〜1/9であり、1分子中の構造単位
(A)の数をm、構造単位(B)の数をnとするとき、
m≧1、n≧1かつ10≧m+n≧2である熱硬化性樹
脂が用いられる。Among the thermosetting resins having a dihydrobenzoxazine ring, preferably, the structural unit (A) represented by the following formula (A) and the structural unit represented by the following formula (B) in one molecule (B), wherein each structural unit is bonded directly or via an organic group, the molar ratio of (A) / (B) is 1 / 0.25 to 1/9, and 1 molecule When the number of structural units (A) is m and the number of structural units (B) is n,
A thermosetting resin having m ≧ 1, n ≧ 1 and 10 ≧ m + n ≧ 2 is used.
【0015】[0015]
【化2】 (式中のR1はメチル基、シクロヘキシル基、フェニル
基又は少なくとも1つの炭素数1〜3のアルキル基若し
くはアルコキシル基で置換されたフェニル基であり、
(A)及び(B)の芳香環の水素は(A)のヒドロキシ
ル基のオルト位の一つを除き、炭素数1〜3のアルキル
基若しくはアルコキシル基又はハロゲン原子で置換され
ていてもよい。) m、nが前記の範囲内にあり、構造単位(A)、(B)
間があらかじめ適切な鎖長の基を介して安定な結合によ
って結合されていると、硬化物の特性が良好となる。Embedded image (Wherein R 1 is a methyl group, a cyclohexyl group, a phenyl group, or a phenyl group substituted with at least one alkyl group or alkoxyl group having 1 to 3 carbon atoms,
Hydrogen in the aromatic ring of (A) and (B), except for one of the ortho positions of the hydroxyl group of (A), may be substituted with an alkyl group or alkoxyl group having 1 to 3 carbon atoms or a halogen atom. M and n are within the above ranges, and the structural units (A) and (B)
If the spaces are previously bound by a stable bond via a group having an appropriate chain length, the properties of the cured product will be good.
【0016】構造単位(A)と構造単位(B)とは直接
に又は有機の基を介して結合している。有機の基として
はアルキレン基、2価の芳香族基が挙げられる。アルキ
レン基の例としては、炭素数5以上の長鎖のアルキレン
基、−CR2H−(式中、R2は水素原子、メチル基、エ
チル基、プロピル基、イソプロピル基、フェニル基又は
置換フェニル基である。)で表されるアルキリデン基が
挙げられる。置換フェニル基の置換基としてはメチル
基、メトキシ基、カルボキシル基が挙げられる。また、
2価の芳香族基としてはフェニレン基、キシリレン基、
トリレン基が挙げられる。上記の有機の基は各構造単位
の間に2つ以上挿入されていてもよい。The structural unit (A) and the structural unit (B) are bonded directly or via an organic group. Examples of the organic group include an alkylene group and a divalent aromatic group. Examples of the alkylene group include a long-chain alkylene group having 5 or more carbon atoms, -CR 2 H- (wherein R 2 is a hydrogen atom, a methyl group, an ethyl group, a propyl group, an isopropyl group, a phenyl group or a substituted phenyl group. An alkylidene group represented by the formula: Examples of the substituent of the substituted phenyl group include a methyl group, a methoxy group, and a carboxyl group. Also,
As the divalent aromatic group, a phenylene group, a xylylene group,
And a tolylene group. Two or more of the above organic groups may be inserted between each structural unit.
【0017】本発明の熱硬化性樹脂は、(A)/(B)
のモル比が好ましくは、1/0.25〜1/9、更に好
ましくは1/0.67〜1/9である。この範囲外であ
ると、硬化性、機械強度、耐熱性が低下することがあ
る。The thermosetting resin of the present invention comprises (A) / (B)
Is preferably 1 / 0.25 to 1/9, more preferably 1 / 0.67 to 1/9. Outside this range, curability, mechanical strength, and heat resistance may decrease.
【0018】上記のジヒドロベンゾオキサジン環を有す
る熱硬化性樹脂は、ヒドロキシル基のオルト位の少なく
とも1つが水素であるヒドキシフェニレン基を1分子中
に2以上有する化合物(以下、反応し得るヒドロキシフ
ェニレン基を有する化合物という。)と、1級アミンと
の混合物を、70℃以上に加熱したホルマリン等のホル
ムアルデヒド類中に添加して、70〜110℃、好まし
くは、90〜100℃で、20分〜2時間反応させ、そ
の後、120℃以下の温度で減圧乾燥することによって
得られる。この反応においては、反応し得るヒドロキシ
フェニレン基を有する化合物のヒドロキシル基1モルに
対し、1級アミンを0.2〜0.9モル及びホルムアル
デヒド類を1級アミンの2倍モル以上の比で用いること
が肝要である。The above-mentioned thermosetting resin having a dihydrobenzoxazine ring is a compound having two or more hydroxyphenylene groups in which at least one ortho-position of a hydroxyl group is hydrogen in one molecule (hereinafter referred to as reactable hydroxyphenylene group). A compound having a group) and a primary amine are added to formaldehyde such as formalin heated to 70 ° C. or higher, and the mixture is heated at 70 to 110 ° C., preferably 90 to 100 ° C. for 20 minutes. It is obtained by reacting for ˜2 hours and then drying under reduced pressure at a temperature of 120 ° C. or lower. In this reaction, the primary amine is used in an amount of 0.2 to 0.9 mol and the formaldehydes are used in a ratio of at least twice the molar amount of the primary amine with respect to 1 mol of the hydroxyl group of the compound having a reactive hydroxyphenylene group. It is essential.
【0019】反応し得るヒドロキシフェニレン基を有す
る化合物としては、部分的にフェノール核を有する種々
の化合物を用いることができる。具体的にはフェノール
ノボラック樹脂、レゾール樹脂、フェノール変性キシレ
ン樹脂、アルキルフェノール樹脂、メラミンフェノール
樹脂、フェノール変性ポリブタジエン等が挙げられる。As the compound having a reactive hydroxyphenylene group, various compounds partially having a phenol nucleus can be used. Specific examples thereof include phenol novolac resin, resol resin, phenol-modified xylene resin, alkylphenol resin, melamine phenol resin, and phenol-modified polybutadiene.
【0020】このジヒドロベンゾオキサジン環を有する
熱硬化性樹脂は、150℃以上、望ましくは170〜2
20℃に加熱することにより、触媒や硬化剤を用いない
で、副生成物を生じることなく硬化する。The thermosetting resin having this dihydrobenzoxazine ring has a temperature of 150 ° C. or higher, preferably 170-2.
By heating to 20 ° C., curing is performed without using a catalyst or a curing agent and without generating by-products.
【0021】本発明に用いられるジヒドロベンゾオキサ
ジン環を有する熱硬化性樹脂は2種類以上を組み合わせ
て用いることもできる。またこれらの熱硬化性樹脂を予
め80〜180℃、好ましくは120〜160℃で処理
することにより、その一部を予備重合させ成形時の硬化
速度や溶融粘度を調節することもできる。The thermosetting resin having a dihydrobenzoxazine ring used in the present invention can be used in combination of two or more kinds. In addition, by preliminarily treating these thermosetting resins at 80 to 180 ° C., preferably 120 to 160 ° C., a part of them can be pre-polymerized to control the curing rate and melt viscosity during molding.
【0022】本発明においてジヒドロベンゾオキサジン
環を有する熱硬化性樹脂に配合される液状エラストマー
としては、ジヒドロベンゾオキサジン環を有する熱硬化
性樹脂及びジヒドロベンゾオキサジン環が開環して生成
するフェノール性水酸基と反応し得る官能基を有する液
状エラストマーが用いられる。In the present invention, the liquid elastomer blended with the thermosetting resin having a dihydrobenzoxazine ring includes a thermosetting resin having a dihydrobenzoxazine ring and a phenolic hydroxyl group formed by ring opening of the dihydrobenzoxazine ring. A liquid elastomer having a functional group capable of reacting with is used.
【0023】エラストマーの種類としてはジヒドロベン
ゾオキサジン環を有する熱硬化性樹脂及びジヒドロベン
ゾオキサジン環が開環して生成するフェノール性水酸基
と反応し得る官能基を有する液状エラストマーである限
り特に限定されないが、アクリル系、ブタジエン系のエ
ラストマーが好ましく用いられる。これらのエラストマ
ーとしては、1種類のモノマーからなる単独重合体、2
種類以上のモノマーからなるブロック共重合体、グラフ
ト共重合体、ランダム共重合体及びこれらの混合物が挙
げられる。特に好ましくは、液状アクリロニトリル−ブ
タジエン共重合体エラストマー、液状ポリブタジエンが
用いられる。The type of elastomer is not particularly limited as long as it is a thermosetting resin having a dihydrobenzoxazine ring and a liquid elastomer having a functional group capable of reacting with a phenolic hydroxyl group formed by ring opening of the dihydrobenzoxazine ring. , Acrylic and butadiene elastomers are preferably used. These elastomers include homopolymers composed of one type of monomer, 2
Examples thereof include block copolymers, graft copolymers, random copolymers, and mixtures thereof, which are composed of at least one kind of monomer. Particularly preferably, liquid acrylonitrile-butadiene copolymer elastomer and liquid polybutadiene are used.
【0024】ジヒドロベンゾオキサジン環を有する熱硬
化性樹脂及びジヒドロベンゾオキサジン環が開環して生
成するフェノール性水酸基と反応し得る官能基として
は、アミノ基、エポキシ基、カルボキシル基、フェノー
ル性水酸基等が挙げられる。The thermosetting resin having a dihydrobenzoxazine ring and the functional group capable of reacting with the phenolic hydroxyl group formed by ring opening of the dihydrobenzoxazine ring include an amino group, an epoxy group, a carboxyl group and a phenolic hydroxyl group. Is mentioned.
【0025】上記のエラストマーはジヒドロベンゾオキ
サジン環を有する熱硬化性樹脂が硬化する前に予め60
〜180℃、好ましくは80〜160℃でその一部を予
備重合させてもよい。The above-mentioned elastomer is preliminarily prepared before the thermosetting resin having a dihydrobenzoxazine ring is cured.
A part thereof may be prepolymerized at ˜180 ° C., preferably 80 to 160 ° C.
【0026】また、ヘキサメチレンテトラミンや水酸化
カルシウム等のフェノール樹脂用の硬化剤及びフェノー
ルノボラック樹脂のような構造単位中にフェノール性水
酸基を持つ化合物を硬化剤として、必要に応じて配合す
ることができる。これらの好ましい配合割合は、前記熱
硬化性樹脂100重量部に対して1〜35重量部であ
る。Further, if necessary, a compound having a phenolic hydroxyl group in a structural unit such as phenol novolac resin and a curing agent for phenol resin such as hexamethylenetetramine or calcium hydroxide may be added as a curing agent. it can. The preferable mixing ratio of these is 1 to 35 parts by weight with respect to 100 parts by weight of the thermosetting resin.
【0027】ジヒドロベンゾオキサジン環を有する熱硬
化性樹脂とエラストマーとは両者を溶媒に溶解させ混合
してもよいが、加熱ロール等で溶融混合することが好ま
しい。The thermosetting resin having a dihydrobenzoxazine ring and the elastomer may be dissolved in a solvent and mixed, but it is preferable that the thermosetting resin and the elastomer are melt-mixed with a heating roll or the like.
【0028】また、上記組成物には必要に応じて、充填
材、強化繊維、離型剤、着色剤、接着剤、相溶化剤等を
添加することもできる。Further, a filler, a reinforcing fiber, a release agent, a colorant, an adhesive, a compatibilizer, and the like can be added to the composition as required.
【0029】本発明の熱硬化性樹脂組成物を加熱ロール
等により混練し、然る後に180〜220℃、成形圧2
0〜70kgf/cm2で3〜10分間圧縮成形又は移
送成形して硬化させることにより、ジヒドロベンゾオキ
サジン環を有する熱硬化性樹脂単独より靭性が向上し、
更に機械特性や難燃性が良好な硬化物を得ることができ
る。The thermosetting resin composition of the present invention is kneaded by a heating roll or the like, and thereafter, the temperature is 180 to 220 ° C. and the molding pressure is 2
By performing compression molding or transfer molding at 0 to 70 kgf / cm 2 for 3 to 10 minutes and curing, the toughness is improved as compared with a thermosetting resin having a dihydrobenzoxazine ring alone,
Further, a cured product having good mechanical properties and flame retardancy can be obtained.
【0030】また、この硬化物を更に180〜220℃
で5〜120分間後硬化させることにより、より良好な
特性を有する硬化物が得られる。The cured product is further heated at 180 to 220 ° C.
By post-curing for 5 to 120 minutes, a cured product having better properties can be obtained.
【0031】[0031]
【実施例】以下、本発明の実施例及びその比較例によっ
て本発明を更に具体的に説明するが、本発明はこれらの
実施例に限定されるものではない。EXAMPLES Hereinafter, the present invention will be described more specifically with reference to Examples of the present invention and Comparative Examples thereof, but the present invention is not limited to these Examples.
【0032】実施例1〜8、比較例1〜5 ジヒドロベンゾオキサジン環を有する熱硬化性樹脂の合
成(I) (1)フェノールノボラック樹脂の合成 フェノール1.9kg、ホルマリン(37%水溶液)
1.15kg、しゅう酸4gを5リットルフラスコに仕
込み、還流温度で6時間反応させた。引き続き、内部を
6666.1Pa以下に減圧して未反応のフェノール及
び水を除去した。得られた樹脂は軟化点89℃(環球
法)、3〜多核体/2核体比89/11(ゲルパーミエ
ーションクロマトグラフィーによるピーク面積比)であ
った。Examples 1 to 8 and Comparative Examples 1 to 5 Synthesis of thermosetting resin having dihydrobenzoxazine ring (I) (1) Synthesis of phenol novolac resin 1.9 kg of phenol, formalin (37% aqueous solution)
1.15 kg and 4 g of oxalic acid were charged in a 5 liter flask and reacted at reflux temperature for 6 hours. Subsequently, the internal pressure was reduced to 6666.1 Pa or less to remove unreacted phenol and water. The obtained resin had a softening point of 89 ° C. (ring and ball method) and a 3 to polynuclear / binuclear ratio of 89/11 (peak area ratio by gel permeation chromatography).
【0033】(2)ジヒドロベンゾオキサジン環の導入 上記により合成したフェノールノボラック樹脂1.7k
g(ヒドロキシル基16mol相当)をアニリン0.9
8kg(11mol相当)と混合し80℃で5時間撹拌
し、均一な混合溶液を調製した。5リットルフラスコ中
に、ホルマリン1.62kgを仕込み90℃に加熱し、
ここへノボラック/アニリン混合溶液を30分間かけて
少しずつ添加した。添加終了後30分間、還流温度に保
ち、然る後に100℃で2時間、6666.1Pa以下
に減圧して縮合水を除去し、反応し得るヒドロキシル基
の75%がジヒドロベンゾオキサジン化された熱硬化性
樹脂を得た(m=1、n=2.2)。(2) Introduction of dihydrobenzoxazine ring 1.7 k of phenol novolac resin synthesized as described above
g (equivalent to 16 mol of hydroxyl groups) to aniline 0.9
The mixture was mixed with 8 kg (corresponding to 11 mol) and stirred at 80 ° C. for 5 hours to prepare a uniform mixed solution. In a 5 liter flask, 1.62 kg of formalin was charged and heated to 90 ° C.
The novolak / aniline mixed solution was gradually added thereto over 30 minutes. After the addition was completed, the temperature was maintained at reflux temperature for 30 minutes, and after that, the condensation water was removed by reducing the pressure to 6666.1 Pa or less at 100 ° C. for 2 hours to remove the heat by which 75% of the reactive hydroxyl groups were dihydrobenzoxazinated. A curable resin was obtained (m = 1, n = 2.2).
【0034】ジヒドロベンゾオキサジン環を有する熱硬
化性樹脂の合成(II) (1)フェノールノボラック樹脂の合成 フェノール1.9kg、ホルマリン(37%水溶液)
1.0kg、しゅう酸4gを5リットルフラスコに仕込
み、ジヒドロベンゾオキサジン環を有する熱硬化性樹脂
の合成(I)と同様にしてフェノールノボラック樹脂を
合成した。得られた樹脂は軟化点84℃(環球法)、3
〜多核体/2核体比82/18(ゲルパーミエーション
クロマトグラフィーによるピーク面積比)であった。Synthesis of thermosetting resin having dihydrobenzoxazine ring (II) (1) Synthesis of phenol novolac resin Phenol 1.9 kg, formalin (37% aqueous solution)
1.0 kg and 4 g of oxalic acid were charged into a 5 liter flask, and a phenol novolac resin was synthesized in the same manner as in the synthesis (I) of thermosetting resin having a dihydrobenzoxazine ring. The obtained resin has a softening point of 84 ° C. (ring and ball method), 3
The polynuclear body / binuclear body ratio was 82/18 (peak area ratio by gel permeation chromatography).
【0035】(2)ジヒドロベンゾオキサジン環の導入 以下、ジヒドロベンゾオキサジン環を有する熱硬化性樹
脂の合成(I)と同様にしてジヒドロベンゾオキサジン
環を導入した。得られた熱硬化性樹脂は、フェノールノ
ボラック樹脂の、反応し得るヒドロキシル基の71%に
ジヒドロベンゾオキサジン環が導入されたものであった
(m=3、n=5)。(2) Introduction of dihydrobenzoxazine ring Hereinafter, the dihydrobenzoxazine ring was introduced in the same manner as in the synthesis (I) of the thermosetting resin having a dihydrobenzoxazine ring. The resulting thermosetting resin was a phenol novolac resin in which a dihydrobenzoxazine ring was introduced into 71% of the reactive hydroxyl groups (m = 3, n = 5).
【0036】ジヒドロベンゾオキサジン環を有する熱硬
化性樹脂の合成(III) キシリレン変性フェノール樹脂(三井東圧化学株式会社
製商品名ミレックスXL−225−3L)1.70kg
(ヒドロキシル基10mol相当)、アニリン0.52
kg(5.6mol)、ホルマリン(37%水溶液)
0.91kgの配合で上記合成法と同様に反応し得るヒ
ドロキシル基の71%にジヒドロベンゾオキサジン環が
導入された熱硬化性樹脂を合成した(m=2.2、n=
2.8)。Synthesis of Thermosetting Resin Having Dihydrobenzoxazine Ring (III) 1.70 kg of xylylene-modified phenol resin (trade name Milex XL-225-3L manufactured by Mitsui Toatsu Chemicals, Inc.)
(Corresponding to 10 mol of hydroxyl group), aniline 0.52
kg (5.6 mol), formalin (37% aqueous solution)
A thermosetting resin in which a dihydrobenzoxazine ring was introduced into 71% of hydroxyl groups capable of reacting in the same manner as in the above synthetic method was synthesized with the addition of 0.91 kg (m = 2.2, n =
2.8).
【0037】ジメチレンエーテル型レゾール樹脂の合成 フェノール樹脂2kg、ホルマリン(37%水溶液)
0.38kg、パラホルムアルデヒド0.78kg、酢
酸亜鉛9.3gを5リットルフラスコに仕込み、還流温
度で6時間反応させた。引き続き内部を6666.1P
a以下に減圧し、水蒸気蒸留により未反応のフェノール
及び水を除去した。得られた樹脂は軟化点77℃であっ
た。Synthesis of dimethylene ether type resole resin 2 kg phenol resin, formalin (37% aqueous solution)
0.35 kg, 0.78 kg of paraformaldehyde and 9.3 g of zinc acetate were charged in a 5 liter flask and reacted at a reflux temperature for 6 hours. 6666.1P inside
The pressure was reduced to a or less, and unreacted phenol and water were removed by steam distillation. The obtained resin had a softening point of 77 ° C.
【0038】エラストマーとしては、液状アクリロニト
リル−ポリブタジエン共重合体(1)(宇部興産株式会
社製商品名CTBN1300X31、AN量27.0重
量%、カルボキシル基量2.47重量%)、液状アクリ
ロニトリル−ポリブタジエン共重合体(2)(宇部興産
株式会社製商品名ATBN1300X16、AN量1
6.5重量%、アミノ基含有、アミン当量900)、液
状ポリブタジエン(出光アトケム株式会社製商品名デナ
レックスR−45EPI、エポキシ当量200、エポキ
シ基含有)を使用した。As the elastomer, liquid acrylonitrile-polybutadiene copolymer (1) (trade name: CTBN1300X31 manufactured by Ube Industries, Ltd., AN amount 27.0% by weight, carboxyl group amount 2.47% by weight), liquid acrylonitrile-polybutadiene copolymer Polymer (2) (trade name: ATBN1300X16, manufactured by Ube Industries, Ltd., AN amount: 1)
6.5 wt%, amino group-containing, amine equivalent 900), liquid polybutadiene (trade name Denarex R-45 EPI, manufactured by Idemitsu Atchem Co., Ltd., epoxy equivalent 200, epoxy group-containing) was used.
【0039】熱硬化性樹脂とエラストマーは80〜10
0℃に加熱した2軸混練ロールを用いて均一になるまで
3分間混練した。The thermosetting resin and the elastomer are 80 to 10
Using a biaxial kneading roll heated to 0 ° C., kneading was continued for 3 minutes until uniform.
【0040】上記により混合した樹脂組成物を粉砕し、
内径120×80×15mmの金型内に充填し180
℃、1.96MPaで10分間加熱加圧して硬化物を作
製した。The resin composition mixed as described above is crushed,
180 in the mold with an inner diameter of 120 x 80 x 15 mm
A cured product was produced by heating and pressurizing at 1.96 MPa for 10 minutes.
【0041】硬化物の特性は、シャルピー衝撃強さ、曲
げ強さ及び曲げ弾性率はJISK6911に準じ、23
℃、曲げ速度2mm/分で評価した。The characteristics of the cured product are Charpy impact strength, flexural strength and flexural modulus according to JIS K6911.
Evaluation was made at a temperature of 2 ° C. and a bending speed of 2 mm / min.
【0042】難燃性についてはUL−94に準じ、3.
6mm厚さで評価した。Regarding flame retardancy, according to UL-94, 3.
Evaluation was made with a thickness of 6 mm.
【0043】以下、配合組成(重量部)、測定結果を表
1〜5に示す。The blending composition (parts by weight) and the measurement results are shown in Tables 1 to 5 below.
【0044】[0044]
【表1】 [Table 1]
【0045】[0045]
【表2】 [Table 2]
【0046】[0046]
【表3】 [Table 3]
【0047】[0047]
【表4】 [Table 4]
【0048】[0048]
【表5】 [Table 5]
【0049】[0049]
【発明の効果】本発明の熱硬化性樹脂組成物は高靭性で
あり、その硬化物は良好な機械特性、難燃性を備えてい
る。したがって、本発明の熱硬化性樹脂組成物は高機能
性成形材料、塗料、コーティング剤、接着剤、封止剤、
積層板及びFRPなどの原料として有用である。The thermosetting resin composition of the present invention has high toughness, and the cured product has good mechanical properties and flame retardancy. Therefore, the thermosetting resin composition of the present invention is a highly functional molding material, paint, coating agent, adhesive, sealant,
It is useful as a raw material for laminated plates and FRP.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C08L 21:00) (72)発明者 長瀬 英雄 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内 (72)発明者 沼田 俊一 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内 (72)発明者 吉村 幸雄 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Internal reference number FI technical display location C08L 21:00) (72) Inventor Hideo Nagase 1500 Ogawa, Shimodate-shi, Ibaraki Hitachi Chemical Co., Ltd. Shimodate Factory (72) Inventor Shunichi Numata 1500 Ogawa, Shimodate, Ibaraki Hitachi Chemical Co., Ltd.Shimodate Factory (72) Inventor Yukio Yoshimura 1500 Ogawa, Shimodate, Ibaraki Hitachi Chemical Co., Ltd. Shimodate Factory
Claims (4)
硬化性樹脂とジヒドロベンゾオキサジン環を有する熱硬
化性樹脂及びジヒドロベンゾオキサジン環が開環して生
成するフェノール性水酸基と反応し得る官能基を有する
液状エラストマーを含有することを特徴とする熱硬化性
樹脂組成物。1. A thermosetting resin having a dihydrobenzoxazine ring, a thermosetting resin having a dihydrobenzoxazine ring, and a liquid having a functional group capable of reacting with a phenolic hydroxyl group formed by ring opening of the dihydrobenzoxazine ring. A thermosetting resin composition comprising an elastomer.
硬化性樹脂が70〜99重量%並びにジヒドロベンゾオ
キサジン環を有する熱硬化性樹脂及びジヒドロベンゾオ
キサジン環が開環して生成するフェノール性水酸基と反
応し得る官能基を有するエラストマーが1〜30重量%
である請求項1記載の熱硬化性樹脂組成物。2. A thermosetting resin having a dihydrobenzoxazine ring reacts with 70 to 99% by weight and a thermosetting resin having a dihydrobenzoxazine ring and a phenolic hydroxyl group formed by ring opening of the dihydrobenzoxazine ring. 1 to 30% by weight of an elastomer having a functional group to be obtained
The thermosetting resin composition according to claim 1, which is
硬化性樹脂が1分子中に下記式(A)で表される構造単
位(A)及び下記式(B)で表される構造単位(B)を
有し、各構造単位は直接に又は有機の基を介して結合し
ており、(A)/(B)のモル比が1/0.25〜1/
9であり、1分子中の構造単位(A)の数をm、構造単
位(B)の数をnとするとき、m≧1、n≧1かつ10
≧m+n≧2である熱硬化性樹脂である請求項1又は2
記載の熱硬化性樹脂組成物。 【化1】 (式中のR1はメチル基、シクロヘキシル基、フェニル
基又は少なくとも1つの炭素数1〜3のアルキル基若し
くはアルコキシル基で置換されたフェニル基であり、
(A)及び(B)の芳香環の水素は(A)のヒドロキシ
ル基のオルト位の一つを除き、炭素数1〜3のアルキル
基若しくはアルコキシル基又はハロゲン原子で置換され
ていてもよい。)3. A thermosetting resin having a dihydrobenzoxazine ring contains a structural unit (A) represented by the following formula (A) and a structural unit (B) represented by the following formula (B) in one molecule. And each structural unit is bonded directly or via an organic group, and the molar ratio of (A) / (B) is 1 / 0.25 to 1 /
9 and m is the number of structural units (A) and n is the number of structural units (B) in one molecule, m ≧ 1, n ≧ 1 and 10
A thermosetting resin satisfying ≧ m + n ≧ 2.
The thermosetting resin composition according to the above. Embedded image (Wherein R 1 is a methyl group, a cyclohexyl group, a phenyl group, or a phenyl group substituted with at least one alkyl group or alkoxyl group having 1 to 3 carbon atoms,
Hydrogen in the aromatic ring of (A) and (B), except for one of the ortho positions of the hydroxyl group of (A), may be substituted with an alkyl group or alkoxyl group having 1 to 3 carbon atoms or a halogen atom. )
脂組成物を硬化させてなる硬化物。4. A cured product obtained by curing the thermosetting resin composition according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8089363A JPH09278985A (en) | 1996-04-11 | 1996-04-11 | Thermosetting resin composition and cured product thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8089363A JPH09278985A (en) | 1996-04-11 | 1996-04-11 | Thermosetting resin composition and cured product thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09278985A true JPH09278985A (en) | 1997-10-28 |
Family
ID=13968633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8089363A Pending JPH09278985A (en) | 1996-04-11 | 1996-04-11 | Thermosetting resin composition and cured product thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09278985A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005272743A (en) * | 2004-03-26 | 2005-10-06 | Hitachi Chem Co Ltd | Novel thermosetting benzoxazine resin, production process therefor and its cured product |
JP2010265480A (en) * | 2010-08-04 | 2010-11-25 | Hitachi Chem Co Ltd | Novel thermosetting benzoxazine resin, method of producing the same and cured product of the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58183743A (en) * | 1982-04-20 | 1983-10-27 | Ig Tech Res Inc | Preparation of non-cracking phenolic resin |
JPH07188364A (en) * | 1993-12-27 | 1995-07-25 | Hitachi Chem Co Ltd | Thermosetting compound, its cured material and production of theremosetting compound |
-
1996
- 1996-04-11 JP JP8089363A patent/JPH09278985A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58183743A (en) * | 1982-04-20 | 1983-10-27 | Ig Tech Res Inc | Preparation of non-cracking phenolic resin |
JPH07188364A (en) * | 1993-12-27 | 1995-07-25 | Hitachi Chem Co Ltd | Thermosetting compound, its cured material and production of theremosetting compound |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005272743A (en) * | 2004-03-26 | 2005-10-06 | Hitachi Chem Co Ltd | Novel thermosetting benzoxazine resin, production process therefor and its cured product |
JP4715102B2 (en) * | 2004-03-26 | 2011-07-06 | 日立化成工業株式会社 | Novel thermosetting benzoxazine resin, process for producing the same, and cured product |
JP2010265480A (en) * | 2010-08-04 | 2010-11-25 | Hitachi Chem Co Ltd | Novel thermosetting benzoxazine resin, method of producing the same and cured product of the same |
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