JPH09199064A - Image forming apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image forming apparatus of which an image forming circuit is simply composed and easily manufactured and for which surface conduction type electron emitting elements having phosphor bodies arranged triangularly are used. SOLUTION: Of phosphor 150, three types of phosphors, that is red-, green-, and blue emitting phosphors, are arranged triangularly and in a plurality of lines and rows like a matrix. Based on combinations of a wire 152 in a row direction, wires (i), (j), and reverse and selection of polarity of the signals sent to these wires, electrons are emitted from an electron emitting element 154 while drawing electron trajectories 155 shown as the solid line or the dotted line. The emitted electrons are irradiated to the phosphor 150 positioned at the terminal points of the electron trajectories 155 shown as arrows. Changing the polarity of the signals is carried out during one horizontally synchronized period of an image signal to be input to the image forming apparatus or every one field period.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus using a plurality of surface conduction electron-emitting devices as electron emission sources.

[0002]

2. Description of the Related Art Conventionally, two types of electron-emitting devices, known as a hot cathode device and a cold cathode device, are known. Among them, as the cold cathode element, for example, a field emission type element (hereinafter referred to as FE type), a metal / insulating layer / metal type emission element (hereinafter referred to as MIM type), a surface conduction type emission element, etc. are known. .

As an example of the FE type, for example, W. P. D
yke & W. W. Dolan, "Field emis
zone ", Advance in Electron
Physics, 8, 89 (1956) or C.I. A. Spindt, "Physicalpro
parties of thin-film field
de emission cathodes with
molybdeniumcones ", J. Appl.
Phys. , 47, 5248 (1976).

As an example of the MIM type, for example,
C. A. Mead, “Operation of tun
nel-emission Devices, J. et al. Ap
pl. Phys. , 32,646 (1961) and the like are known.

Further, as the surface conduction electron-emitting device, for example, M. I. Elinson, Radio Eng. E
electron Phys. , 10, 1290, (19
65) and other examples described later are known.

[0006] The surface conduction electron-emitting device utilizes a phenomenon in which an electron is emitted when a current flows in a small-area thin film formed on a substrate in parallel with the film surface. As this surface conduction type emission element, Sn described by Elinson et al.
In addition to those using an O2 thin film, those using an Au thin film [G. Dittmer: "Thin Solid Fi
lms ", 9, 317 (1972)], In2O3 /
According to SnO2 thin film [M. Hartwell an
d C.I. G. FIG. Fonstad: "IEEE Tran
s. ED Conf. , 519 (1975)] and those using carbon thin films [Hisashi Araki et al .: Vacuum, Vol. 26,
No. 1, 22 (1983)]. A typical example of the device configuration of these surface conduction electron-emitting devices is shown in FIG.
9 shows.

FIG. 19 is a plan view of a surface conduction electron-emitting device as a conventional example. Hartwell et al. In the figure, 3001 is a substrate, and 300
Reference numeral 4 is a conductive thin film made of a metal oxide formed by sputtering. The conductive thin film 3004 is formed in an H-shaped planar shape as shown. An electron emission portion 3005 is formed by performing an energization process called energization forming described later on the conductive thin film 3004. The interval L is
0.5 to 1 [mm] and W are set to 0.1 [mm]. Note that, for convenience of illustration, the electron emission unit 30
05 is shown in a rectangular shape in the center of the conductive thin film 3004, but this is a schematic one and does not faithfully represent the actual position or shape of the electron emitting portion.

M. In the above-described surface conduction electron-emitting device including the device by Hartwell et al., The electron-emitting portion 3005 is formed by subjecting the conductive thin film 3004 to an energization process called energization forming before electron emission.
It was common to form That is, the energization forming means that a constant DC voltage or a DC voltage which is boosted at a very slow rate of, for example, about 1 [V / min] is applied to both ends of the conductive thin film 3004. Is locally destroyed or deformed or altered to form an electron emitting portion 3005 in an electrically high resistance state. Note that a crack is generated in a part of the conductive thin film 3004 that is locally broken, deformed, or altered. After the energization forming, the conductive thin film 3004
When an appropriate voltage is applied to, the electrons are emitted near the crack.

The above-mentioned surface conduction electron-emitting device has an advantage that a large number of devices can be formed over a large area because it has a simple structure and is easy to manufacture. Therefore, for example, as disclosed in Japanese Patent Application Laid-Open No. 64-31332 by the present applicant, a method for arranging and driving a large number of elements has been studied.

Regarding the application of the surface conduction electron-emitting device, for example, an image forming apparatus such as an image display apparatus and an image recording apparatus, a charged beam source and the like have been studied.

In particular, as an application to an image forming apparatus, for example, as disclosed in USP 5,066,883 by the present applicant and Japanese Patent Application Laid-Open No. 2-257551, a surface conduction electron-emitting device and an electron beam emit light to emit light. An image forming apparatus using a combination of the above-mentioned phosphors has been studied. An image forming apparatus using a combination of a surface conduction electron-emitting device and a phosphor is expected to have better characteristics than other conventional image forming apparatuses. For example, compared with a liquid crystal image forming apparatus which has become widespread in recent years, it can be said that it is superior in that it requires no backlight because it is a self-luminous type and has a wide viewing angle.

FIG. 20 shows the arrangement of phosphors in such an image forming apparatus.

FIG. 20 is a diagram showing an array of phosphors as a conventional example, in which three phosphors of red, green and blue are arranged in a triangular shape (this array is called a delta array). In the delta array, as shown in the figure, the pitches of the phosphors in the upper and lower two lines are shifted by 1/2 pitch in the horizontal direction. The arrangement of the emitting element portion in this case is shown in FIG.

FIG. 21 is a view showing the arrangement of the emission element portion as a conventional example, and the emission element portion 10 corresponding to each phosphor.
10 also needs to be arranged with a 1/2 pitch shift in the horizontal direction. Accordingly, it is necessary to make the column-direction wiring 1012 meander as shown in the figure (Japanese Patent Publication No. 3-6404).
6).

[0015]

However, in the above-mentioned conventional example, as shown in FIG.
2 pitch shift layout and corresponding column direction wiring 101
The meander of 2 has a problem that the manufacturing process is complicated as compared with the case of a straight line.

Therefore, an object of the present invention is to provide an image forming apparatus using a surface conduction electron-emitting device having phosphors arranged in a triangular shape, which is easy to construct and manufacture an image forming circuit.

[0017]

In order to achieve the above object, the image forming apparatus of the present invention has the following features.

That is, a voltage is applied to the cold cathode element by a rear plate having a plurality of cold cathode elements having an electron emitting portion between a pair of electrodes arranged in a matrix, and row-direction wiring and column-direction wiring of the rear plate. In an image forming apparatus including a voltage applying unit for applying a voltage and a face plate having a phosphor that emits light by electrons emitted from the electron emitting portion, a direction of an electric field applied to the cold cathode element and a horizontal direction of the image forming apparatus. The angle formed by the direction is a predetermined angle θ (θ ≠
It is characterized in that it is 0,90) ° or (θ + 180) °. As a result, the column-direction wiring is made linear, and one phosphor is caused to emit light by the two cold cathode elements.

The phosphors are of three types, red, green, and blue, and a plurality of the three types of phosphors are provided in a triangular shape. As a result, a color image is formed.

Further, the number of the cold cathode devices and the number of the phosphors is 1: 2. This simplifies the image forming circuit and facilitates manufacturing.

Further, a plurality of the phosphors are provided in a triangular shape and are arranged in a matrix at the same time, and the cold cathode devices and the cold cathode elements are arranged every other row between the rows of the phosphors arranged in the matrix. The electron emission part is located.
This simplifies the image forming circuit and facilitates manufacturing.

Further, the cold cathode device is characterized in that it emits electrons to the two phosphors located around it. This simplifies the image forming circuit and facilitates manufacturing.

Further, the voltage applying means reverses the voltage polarity at every predetermined time. In particular,
One horizontal synchronizing period or one field period of the image signal input to the image forming apparatus.

More preferably, the plurality of phosphors provided in a triangular shape are arranged in an equilateral triangle shape, and an acute angle of the equilateral triangle has the predetermined angle θ °, that is, 6 degrees.
Characterized by being equal to 0 degrees.

More preferably, the cold cathode device is a surface conduction electron-emitting device.

[0026]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, the configuration of the drive circuit of the image forming apparatus to which the present invention is applied will be described with reference to FIGS.

FIG. 1 is a block diagram of a drive circuit of an image forming apparatus as an embodiment of the present invention.

In the figure, the sync separation circuit 14 is a circuit for separating the sync signal of the NTSC signal s1 from the video signal. The separated sync signal is sent to the timing control circuit 3. Further, the video signal is sent to the signal processing unit 1. The signal processing unit 1 performs signal processing such as A / D conversion of the video signal, and then sends this to the modulation signal generation unit 2. In the modulation signal generation unit 2, one line of the video signal is serial-parallel converted and the pulse width modulation signal s4 is converted into the MOS-FET1.
Send to Gate 1.

The circuit 4 is a circuit for inverting the polarity of the video signal s5. The emission part 13 in the panel 12 has a structure in which the emission element is sandwiched between the electrodes facing each other. By reversing the polarities of the voltages applied to the pair of electrodes, the emitting element can emit electrons in different directions. The control signal s2 is a signal that controls the timing at which the video signal s5 is inverted. Reference numeral 10 is a switch for inverting the polarity of the video signal.

The circuit 5 is a circuit for inverting the polarity of the scanning signal s6. The pulse generator 6 continues to generate the pulse s7 having the same polarity. The switch 8 is switched by the signal s3, and the polarity of the pulse s7 is inverted by the inverter 9. The polarity is not inverted without the inverter 9. The signal passing through this circuit is sent to the panel 12 as the scanning signal s6 via the scanning row selection circuit 7.

FIG. 2 is a diagram illustrating the panel 12 of FIG. 1 as an embodiment of the present invention.

In the figure, the panel 52 corresponds to the panel 12 of FIG. In the figure, the emitting element 51 is sandwiched by two electrodes 56 and 57 which face each other. Within the emitting device 51, there is an electron emitting portion 53. By applying a voltage of a predetermined value or more between the electrodes 56 and 57, the electron emitting portion 5
3 emits electrons. The electrode 56 is a column-direction wiring 54.
Connected to, and has the same potential as the video signal potential. On the other hand, the electrode 57 is connected to the row wiring 55 and has the same potential as the scanning signal potential. Therefore, if the polarities of the video signal input to the column wiring 54 and the scanning signal input to the row wiring 55 are reversed, the polarities of the potentials applied to the electrodes 56 and 57 are also reversed. Therefore, the polarity of the voltage applied to the emitting element 51 is also inverted. If the voltage applied to the emitting element 51 is reversed, the trajectory of the emitted electrons changes.

FIG. 3 is a cross-sectional view of an emission element portion as an embodiment of the present invention.

In the figure, one emission element portion is shown as a cross section A in FIG.
It is sectional drawing when it cut | disconnects by. In the figure, a phosphor 104 is applied to the inside of the face plate 101. The electrodes 56 and 57 are connected to the column-direction wirings and the row-direction wirings, respectively, and when a voltage (Vf [v]) equal to or higher than a predetermined value is applied, electrons are emitted from the electron emission unit 53. When the electrons are emitted, the electrons are accelerated by the voltage Va [V] applied between the face plate 101 and the electron emitting portion 53, and the phosphor 104 is irradiated with the electrons. At this time, the electron does not travel straight up along the central axis 100 but travels along the electron orbit 102 or the electron orbit 103. When Vf is applied so that the electrode 56 has a negative polarity and the electrode 57 has a positive polarity (the solid line in the figure), the emitted electrons have electron orbit 1
Proceed on the orbit indicated by 03 (solid line). Conversely, when the electrode 56 has a positive polarity and the electrode 57 has a negative polarity (broken line in the figure), the electron orbit 102 (broken line) proceeds. At this time, the distance Lef between the central axis 100 and the electron landing position can be calculated by the following equation (1).

[0035]

(Equation 1)

Lef = 2 × K × Lh × SQR (Vf / Va) (1) where SQR is the square root, Lh [m] is the distance between the emitting element and the phosphor, and K is the type and shape of the emitting element. Represents a constant determined by.

The operation of the first embodiment of the present invention in the image forming apparatus having the above configuration will be described below.

<First Embodiment> As a first embodiment of the present invention, a method of displaying an NTSC signal without interlaced scanning will be described.

The received NTSC signal is sent to the sync separation circuit 1
At 4, it is divided into a sync signal and a video signal. The synchronization signal is sent to the timing control circuit 3. Then, the video signal is sent to the signal processing unit 1. In the signal processing unit 1, R, G, B
Color demodulation, A / D conversion, and the like are performed, and a digital video signal is sent to the modulation signal generator 2. In the modulation signal generator 2,
The data for one line of the sent video signal is serial-
Parallel conversion is performed and the pulse width modulation signal s4 is MOS-
Send it to the gate of FET11.

Reference numeral 4 is a circuit for inverting the polarity of the video signal s5. Reference numeral 10 is a switch for inverting the polarity of the signal. A switch switching signal s2 is sent from the timing control circuit 3 to the switch 10. The switch 10 switches between a and b according to s2.
When the switch 10 is on the a side, the negative video signal s5
Will be sent to the panel 12, and the switch 10
Is on the b side, the positive video signal s5 is displayed on the panel 12
Will be sent to This switching is performed every horizontal synchronization period (hereinafter, 1H).

Reference numeral 5 is a circuit for inverting the polarity of the scanning signal s6. First, the pulse generator 6 generates a pulse signal s7 having the same polarity (for example, positive polarity) and a 1H cycle. The switch 8 is set to 1 by the switch switching signal s3.
Switches every H. When the switch 8 is in c, the pulse signal s7 passes through the circuit 5 as it is. When the switch 8 is set to d, the polarity of the pulse signal s7 is inverted (becomes negative) by the inverter 9, and is sent to the scanning row selection circuit 7. The scanning row selection circuit 7 then selects a panel row for displaying a video signal, and sends the preceding pulse signal to the wiring of that row as a scanning signal s6. Thus 1
The scanning signal s6 whose polarity is inverted for each H is sent to the selected row of the panel 12.

Next, the operation of this embodiment will be described.

FIG. 4 is a timing chart of the drive circuit according to the first embodiment of the present invention, and the symbols are the same as those in FIG.

First, a process of creating a video signal input to the column wiring will be described. The video signal of the NTSC signal s1 is processed into a pulse width modulation signal s4. The pulse width modulation signal s4 is a signal flowing through a certain column direction signal line. The longer the width L of the pulse width modulation signal s4, the longer the time for which electrons are emitted from the electron emitting portion, and the pixel feels brighter. The switch switching signal s2 is generated every 1H to switch the switch 10 of FIG. 4A and 4B show the switch 10
Represents the connection status of. When the switch 10 is on the a side, the video signal s5 has a negative polarity. In the case of the b side, the video signal s
5 has a positive polarity. The state of the video signal s5 is shown in FIG. The thin solid line in the figure is the ground potential (= 0
[V]). The pulse width of the video signal s5 is equal to the width L of the pulse width modulation signal s4.

Next, a process of creating a scanning signal input to the row wiring will be described.

The pulse s7 is generated in a 1H cycle. In the present embodiment, the pulse s7 has a positive polarity. The signal s3 for switching the switch 8 in FIG. 1 is generated in a 1H cycle. As a result, the switch 8 switches to c and d every 1H. Along with this, the scanning signal s6 becomes a signal whose polarity is inverted every 1H as shown in FIG. The scanning signal s6 shows a signal input to the wirings i and j in FIG. 2 as an example. As shown in the scanning signal of FIG. 4, in the present embodiment, a signal in which the polarity is inverted by 1H is applied to one row-direction wiring.
Enter each time. That is, one row of electron-emitting portions of the panel emits electrons 1H at different electron trajectories. How the phosphor is irradiated with electrons when the display device is driven as described above will be described with reference to FIG.

FIG. 5 is a diagram for explaining the irradiation of electrons on the phosphor according to the first embodiment of the present invention.

In the figure, an electron emitting portion 151 other than the phosphor 150 provided on the face plate, a column direction wiring 152,
The wiring i, the electrode 153, and the emitting element 154 are provided on the rear plate. In the figure, the face plate and the rear plate are drawn on the same plane for convenience. Further, what is indicated by an arrow is a trajectory 155 of electrons emitted from the electron emitting portion 151. The starting point of the arrow is the electron emitting portion 151, and the ending point is the phosphor.

Next, with reference to FIG. 5, the manner in which signals are displayed on the phosphors in the nth row, the n + 1th row, and the n + 2th row will be described.

First, when displaying the nth row, the wiring i is selected in a certain 1H period, and a negative scanning signal is supplied to the wiring i.
At this time, a positive video signal is flowing through the column-direction wiring 152. That is, one of the electrodes 153 connected to the wiring i has a negative polarity, and one connected to the column-direction wiring 152 has a positive polarity. At this time, electrons are emitted from the emission element 154 connected to the wiring i along the solid trajectory of the electron trajectory 155. And electron orbit 155
The phosphor 150 located at the end point of the arrow is irradiated.

In the next 1H period, the signal is displayed on the (n + 1) th row. In this 1H period, as in the previous case, the wiring i is selected and a positive scanning signal is supplied to these wirings. At this time, a negative video signal is flowing through the column wiring 152. That is, of the electrodes 153, the one connected to the wiring i has a positive polarity, and the one connected to the column-direction wiring 152 has a negative polarity. At this time, the emitting element 15 connected to the wiring i
From 4, electrons are emitted by drawing a broken line orbit of the electron orbit 155. Then, the phosphor 150 located at the end point of the arrow of the electron orbit 155 is irradiated.

Further, it is displayed on the (n + 2) th line in the next 1H period. In the 1H period, the wiring j is selected, and a negative scanning signal is supplied to these wirings. At this time, the column wiring 152
A video signal of positive polarity is flowing through. That is, one of the electrodes 153 connected to the wiring j has a negative polarity,
The one connected to the column wiring 152 has a positive polarity. At this time, from the emitting element 154 connected to the wiring j,
Electrons are emitted by drawing a solid line orbit of the electron orbit 155. Then, the phosphor 150 located at the end point of the arrow of the electron orbit 155 is irradiated.

In this way, the electron emitting portion is arranged so as to be inclined,
By reversing the polarity of the voltage applied every 1H, it is possible to realize an image forming apparatus in which phosphors are arranged in a triangular shape (hereinafter, delta arrangement) without causing the column-direction wiring to meander.

<Second Embodiment> Next, as a second embodiment of the present invention, a method for displaying an NTSC signal by interlaced scanning will be described. This embodiment will also be described based on the drive circuit shown in FIG. 1 as in the first embodiment. However, the switching cycle of the switch 8 and the switch 10 is
It is not 1H but one field period. The emitting element is also the same as in the first embodiment, and is wired as shown in FIG.

First, the operation of the drive circuit in this embodiment will be described with reference to FIG.

FIG. 6 is a timing chart of the drive circuit according to the second embodiment of the present invention, and the symbols are the same as those in FIG.

First, the process of creating a video signal input to the column wiring will be described. The video signal of the NTSC signal s1 is processed into a pulse width modulation signal s4. The pulse width modulation signal s4 in the figure shows a signal flowing through a certain column-direction signal line. The longer the width L of the pulse width modulation signal s4, the longer the time for which electrons are emitted from the electron emitting portion. Therefore, the pixels irradiated with electrons feel bright. The switch switching signal s2 is generated every one field period and switches the switch 10 in FIG. 6A and 6B show the connection state of the switch 10. When the switch 10 is on the a side, the video signal has a negative polarity. On the b side, the video signal has a positive polarity. The state of the video signal s5 is shown in FIG. The thin solid line in the figure represents the ground potential (= 0 [V]). The pulse width of the video signal is equal to the pulse width modulation signal s4.

Next, the process of creating the scanning signal input to the row-direction wiring will be described. The pulse s7 is generated in a 1H cycle. In the present embodiment, the pulse s7 has a positive polarity.
The signal s3 for switching the switch 8 in FIG. 1 is generated in a cycle of one field period. This allows switch 8
Switches to c and d every one field period. Accordingly, the scanning signal s6 becomes a signal whose polarity is inverted for each field as shown in FIG. The first row, the second row, ... Of the scanning signal s6 in FIG. 6 indicate the row numbers of the row-direction wirings of the panel. As shown in the scanning signal of FIG. 6, in the present embodiment, a signal whose polarity is inverted at one field period intervals is input to one row wiring. That is, the electron-emitting portion in one row of the panel emits electrons in the electron trajectories in different directions for each one-field period.

As in the first embodiment, how the signals are displayed when the drive circuit of the device is driven as described above will be described with reference to FIG.

The nth line, the n + 1th line, the n + 2th line in FIG.
A manner of displaying a signal on the phosphor of the (n + 3) th row will be described.
Signals are displayed on the nth row and the n + 2th row in a certain one field period, and the n + 1th row and the nth row are displayed in the next one field period.
Suppose a signal is displayed on the + 3rd line. First, it is assumed that signals are displayed on the phosphors in the nth row and the n + 2th row in a certain one field period. When displaying on the n-th row, the wiring i is selected in a certain 1H period, and a negative scanning signal is supplied to the wiring i. At this time, a positive video signal is flowing through the column-direction wiring 152. That is, one of the electrodes 153 connected to the wiring i has a negative polarity, and one connected to the column-direction wiring 152 has a positive polarity. At this time, electrons are emitted from the emission element 154 connected to the wiring i along the solid trajectory of the electron trajectory 155. Then, the phosphor 150 located at the end point of the arrow of the electron orbit 155 is irradiated.

In the next 1H period, one line is skipped to display on the (n + 2) th line. In this 1H period, the wiring j is selected and the negative scanning signal is supplied to these wirings. At this time, a positive video signal is flowing through the column-direction wiring 152. That is, of the electrodes 153, the one connected to the wiring j has a negative polarity, and the one connected to the column-direction wiring 152 has a positive polarity. At this time, electrons are emitted from the emitting element 154 connected to the wiring j along the solid line trajectory of the electron trajectory 155. Then, the phosphor 150 located at the end point of the arrow of the electron orbit 155 is irradiated.

In the next one-field period, signals are displayed on the phosphors on the (n + 1) th row and the (n + 3) th row.

First, when displaying on the (n + 1) th row, the wiring i is selected in a certain 1H period, and a positive scanning signal is supplied to this wiring. At this time, a negative video signal is flowing through the column wiring 152. That is, one of the electrodes 153 connected to the wiring i has a positive polarity, and the column-direction wiring 15
The one connected to 2 has a negative polarity. At this time, the electron orbit 155 is emitted from the emitting element 154 connected to the wiring i.
The electrons are emitted in the orbit of the broken line of. Then, the phosphor 150 located at the end point of the arrow of the electron orbit 155 is irradiated.

In the next 1H period, one line is skipped to display on the n + 3th line. In this 1H period, the wiring j is selected and a positive scanning signal is supplied to these wirings. At this time, a negative video signal is flowing through the column wiring 152. That is, of the electrodes 153, the one connected to the wiring j has a positive polarity, and the one connected to the column-direction wiring 152 has a negative polarity. At this time, the emitting element 1 connected to the wiring j
Electrons are emitted from 54 along the broken line orbit of the electron orbit 155. Then, the phosphor 150 located at the end point of the arrow of the electron orbit 155 is irradiated.

As described above, the electron emitting portion is arranged so as to be inclined,
By reversing the polarity of the voltage applied every one field period, it is possible to realize a display device in a delta arrangement without causing the column-direction wiring to meander.

<Structure and Manufacturing Method of Display Panel> Next, the structure and manufacturing method of the display panel of the image forming apparatus to which the present invention is applied will be described with reference to specific examples.

FIG. 7 is a perspective view of a display panel used in the embodiment of the present invention. One of the panels is shown to show the internal structure.
The part is cut away.

In the figure, 1005 is a rear plate, and 1006.
Is a side wall, 1007 is a face plate, 1005
˜1007 form an airtight container for maintaining a vacuum inside the display panel. When assembling an airtight container, it is necessary to seal the joints of each member in order to maintain sufficient strength and airtightness.For example, apply frit glass to the joints, and in the atmosphere or nitrogen atmosphere, Sealing was achieved by firing at 400-500 degrees for 10 minutes or more. A method of evacuating the inside of the airtight container to a vacuum will be described later.

The rear plate 1005 has a substrate 1001.
Are fixed, but N × M surface conduction electron-emitting devices 1002 are formed on the substrate. (N and M are positive integers of 2 or more, and are appropriately set according to the target number of display pixels. For example, in a forming device intended to display a high-definition television, N = 3000, M = 100
It is desirable to set a number of 0 or more. In this embodiment, N = 3072 and M = 1024. ) The N
The xM surface conduction electron-emitting devices have M row-direction wirings 10.
03 and N column-direction wirings 1004 form a simple matrix wiring. The portion constituted by 1001 to 1004 is called a multi-electron beam source. The manufacturing method and structure of the multi-electron beam source will be described in detail later.

In this embodiment, the multi-electron beam source substrate 1001 is fixed to the rear plate 1005 of the airtight container, but the multi-electron beam source substrate 10 is fixed.
01 has sufficient strength, the substrate 10 of the multi-electron beam source is used as a rear plate of the hermetic container.
01 itself may be used.

A fluorescent film 1008 is formed on the lower surface of the face plate 1007. Since the present embodiment is a color image forming apparatus, the fluorescent film 1008 is separately coated with phosphors of three primary colors of red, green and blue used in the field of CRT. This state is shown in FIG.

FIG. 8 is a diagram showing an arrangement of phosphors on a face plate as an embodiment of the present invention.

In the figure, the phosphors of the respective colors are separately coated in a delta shape, and black conductors 2010 are provided between the phosphors. R, G and B are red, green and blue phosphors, respectively. The purpose of providing the black conductor 2010 is to prevent the display color from deviating even if the electron beam irradiation position is slightly deviated, and to prevent the reduction of the display contrast by preventing the reflection of external light. This is to prevent the fluorescent film from being charged up by the electron beam. Although graphite was used as the main component for the black conductor 2010, other materials may be used as long as they are suitable for the above purpose.

In the case of producing a monochrome display panel, a monochromatic phosphor material may be used for the phosphor film 1008, and a black conductive material may not necessarily be used.

On the surface of the fluorescent film 1008 on the rear plate side, a metal back 1009 known in the field of CRT is used.
Is provided. The purpose of providing the metal back 1009 is
A part of the light emitted from the fluorescent film 1008 is specularly reflected to improve the light utilization rate, and the fluorescent film 10
08 is to be protected, to act as an electrode for applying an electron beam accelerating voltage, and to act as a conductive path for excited electrons in the fluorescent film 1008.
The metal back 1009 was formed by forming a fluorescent film 1008 on the face plate substrate 1007, smoothing the surface of the fluorescent film, and vacuum-depositing Al thereon. The metal back 1009 is not used when a low voltage phosphor material is used for the phosphor film 1008.

Although not used in this embodiment, for the purpose of applying an acceleration voltage and improving the conductivity of the fluorescent film, a transparent material made of, for example, ITO is provided between the face plate substrate 1007 and the fluorescent film 1008. Electrodes may be provided.

Further, Dx1 to Dxm and Dy1 to Dyn and Hv
Is an electric connection terminal of an airtight structure provided for electrically connecting the display panel and an electric circuit (not shown).
Dx1 to Dxm are row-direction wirings 100 of the multi-electron beam source
3 and Dy1 to Dyn are column-direction wiring 1 of the multi-electron beam source
004 and Hv are the metal back 10 of the face plate
09 is electrically connected.

In order to evacuate the inside of the airtight container to a vacuum, after assembling the airtight container, an exhaust pipe (not shown) and a vacuum pump are connected to each other, and the inside of the airtight container is reduced to 10 −7 [T
orr]. Then, the exhaust pipe is sealed, but in order to maintain the degree of vacuum in the airtight container, a getter film (not shown) is formed at a predetermined position in the airtight container immediately before or after the sealing. The getter film is, for example, a film formed by heating a getter material containing Ba as a main component with a heater or high-frequency heating and vapor-depositing the film. The degree of vacuum is maintained at a power of [Torr]. The basic configuration and manufacturing method of the display panel according to the embodiment of the present invention have been described above.

Next, a method of manufacturing the multi-electron beam source used for the display panel of this embodiment will be described. The multi-electron beam source used in the image forming apparatus of the present invention is not limited in the material, shape, or manufacturing method of the surface conduction electron-emitting device as long as it is an electron emission source in which the surface conduction electron-emitting device is wired in a simple matrix. However, the inventors of the present application have found that among the surface conduction electron-emitting devices, the one in which the electron-emitting portion or its peripheral portion is formed of a fine particle film has excellent electron-emitting characteristics and can be easily manufactured. . Therefore, it can be said that it is most suitable for use in a multi-electron beam source of an image forming apparatus having high brightness and a large screen. Therefore, in the display panel of the above embodiment, a surface conduction electron-emitting device in which the electron-emitting portion or its peripheral portion is formed of a fine particle film is used. Therefore, the basic configuration, manufacturing method, and characteristics of a suitable surface conduction electron-emitting device will be described first, and then the structure of a multi-electron beam source in which a large number of devices are wired in a simple matrix will be described.

<Preferable Element Configuration and Manufacturing Method of Surface Conduction Emitting Element> Typical configurations of the surface conduction type emitting element in which the electron emitting portion or its peripheral portion is formed of a fine particle film include a planar type and a vertical type. There are two types.

(Planar surface conduction electron-emitting device) First, the structure and manufacturing method of a flat surface conduction electron-emitting device will be described.

FIG. 9 is a plan view and a sectional view of a surface conduction electron-emitting device as an embodiment of the present invention.

In the figure, 1101 is a substrate, 1102 and 110.
Reference numeral 3 denotes an element electrode; 1104, a conductive thin film; 1105, an electron-emitting portion formed by an energization forming process;
Is a thin film formed by energization activation treatment.

As the substrate 1101, for example, various glass substrates such as quartz glass and soda lime glass, various ceramic substrates such as alumina, or an insulating layer made of, for example, SiO 2 is laminated on the above various substrates. Substrate, etc. can be used.

Further, the device electrodes 1102 and 1103 provided on the substrate 1101 so as to face each other in parallel with the substrate surface are made of a conductive material. For example, N
i, Cr, Au, Mo, W, Pt, Ti, Cu, Pd,
Materials such as Ag and the like, alloys of these metals, metal oxides such as In2 O3 --SnO2, semiconductors such as polysilicon, and the like may be appropriately selected and used. The electrodes can be easily formed by combining a film forming technique such as vacuum deposition and a patterning technique such as photolithography and etching, but it can be formed by another method (for example, a printing technique). It doesn't matter.

The shapes of the device electrodes 1102 and 1103 are appropriately designed according to the application purpose of the electron-emitting device.
Generally, the electrode interval L is designed by selecting an appropriate value from the range of several hundreds angstroms to several hundreds of micrometers, but it is preferable that the electrode spacing L is more than several micrometers for application to an image forming apparatus. It is in the range of several tens of micrometers. Further, the thickness d of the device electrode is usually selected from an appropriate value within the range of several hundred angstroms to several micrometers.

A fine particle film is used for the conductive thin film 1104. The fine particle film mentioned here is a film containing many fine particles as a constituent element (including an island-shaped aggregate).
I mean If you examine the microparticle film microscopically, usually
A structure in which the individual particles are spaced apart, a structure in which the particles are adjacent to each other, or a structure in which the particles overlap each other is observed.

The particle diameter of the fine particles used for the fine particle film is in the range of several angstroms to several thousand angstroms, but the range of 10 angstroms to 200 angstroms is particularly preferable. Further, the thickness of the fine particle film is appropriately set in consideration of various conditions described below. That is, the device electrode 1102
Alternatively, the conditions necessary for making good electrical connection with 1103, the conditions necessary for favorably performing the energization forming described below, the conditions necessary for setting the electric resistance of the fine particle film itself to an appropriate value described below, Etc.

Specifically, it is set within the range of several angstroms to several thousand angstroms, but the range of 10 angstroms to 500 angstroms is particularly preferable.

Materials that can be used for forming the fine particle film include, for example, Pd, Pt, Ru, Ag and A.
u, Ti, In, Cu, Cr, Fe, Zn, Sn, T
Metals such as a, W, Pb, etc., PdO, Sn
O2, In2 O3, PbO, Sb2 O3, and other oxides, HfB2, ZrB2, LaB6, CeB
Borides such as 6, YB4, GdB4, etc., T
Carbides such as iC, ZrC, HfC, TaC, SiC, WC, etc., nitrides such as TiN, ZrN, HfN, etc., semiconductors such as Si, Ge, etc., carbon, etc. And can be appropriately selected from these.

As described above, the conductive thin film 1104 is formed of a fine particle film, and its sheet resistance value is
It was set to be included in the range of 10 3 to 10 7 [Ohm / sq].

The conductive thin film 1104 and the device electrode 110
Since it is desirable that 2 and 1103 be electrically connected well, they have a structure in which some of them overlap each other. In the example of FIG. 9, the overlapping is such that the substrate, the device electrode, and the conductive thin film are stacked in this order from the bottom.
In some cases, the substrate, the conductive thin film, and the device electrode may be stacked in this order from the bottom.

Further, the electron emission portion 1105 is a crack-like portion formed in a part of the conductive thin film 1104, and has an electrically higher resistance property than the surrounding conductive thin film. The crack is formed by performing a later-described energization forming process on the conductive thin film 1104. Fine particles having a particle diameter of several angstroms to several hundred angstroms may be arranged in the cracks. Since it is difficult to accurately and accurately show the actual position and shape of the electron-emitting portion, it is schematically shown in FIG.

The thin film 1113 is a thin film made of carbon or a carbon compound and covers the electron emitting portion 1105 and its vicinity. The thin film 1113 is formed by performing an energization activation process described later after the energization forming process.

The thin film 1113 is made of single crystal graphite, polycrystalline graphite, amorphous carbon, or a mixture thereof, and has a film thickness of 500 [angstrom] or less, but 300 [angstrom] or less. Is more preferable.

Since it is difficult to accurately illustrate the actual position and shape of the thin film 1113, it is schematically shown in FIG. Also, in the plan view (a), the thin film 1113
The device in which a part of is removed is shown.

The basic structure of the preferred element has been described above. In the embodiment, the following element is used.

That is, soda lime glass was used for the substrate 1101, and Ni thin films were used for the device electrodes 1102 and 1103. The thickness d of the device electrode was 1000 [angstrom], and the electrode interval L was 2 [micrometer].

Pd or P as the main material of the fine particle film
The thickness of the fine particle film was about 100 [angstrom] and the width W was 100 [micrometer] using dO.

Next, a description will be given of a method of manufacturing a suitable flat surface conduction electron-emitting device.

FIG. 10 is a cross-sectional view for explaining a manufacturing process of a flat surface conduction electron-emitting device as an embodiment of the present invention.

In the figure, (a) to (d) show respective manufacturing steps of the surface conduction electron-emitting device, and the reference numerals of the respective members are the same as those in FIG.

1) First, as shown in FIG. 10A, device electrodes 1102 and 1103 are formed on a substrate 1101.

Before forming, the substrate 1 is formed.
After sufficiently washing 101 with a detergent, pure water and an organic solvent,
The material of the device electrode is deposited. (As a method for depositing, for example, a vacuum film forming technique such as a vapor deposition method or a sputtering method may be used.) Thereafter, the deposited electrode material is patterned using photolithography / etching technology,
A pair of device electrodes (1102 and 1103) shown in (a).
To form

2) Next, a conductive thin film 1104 is formed as shown in FIG.

In forming the film, first, the organometallic solution is applied to the substrate (a), dried, and heated and baked to form a fine particle film, which is then patterned into a predetermined shape by photolithography and etching. . here,
The organic metal solution is a solution of an organic metal compound containing a material of fine particles used for the conductive thin film as a main element. (Specifically, Pd is used as the main element in the present embodiment. Further, although the dipping method is used as the coating method in the embodiment, other methods such as a spinner method or a spray method may be used.) Further, as a method for forming a conductive thin film formed of a fine particle film, other than the method of applying the organometallic solution used in the present embodiment, for example, a vacuum vapor deposition method, a sputtering method, a chemical vapor deposition method, or the like is used. Sometimes used.

3) Next, as shown in FIG. 7C, the forming power supply 1110 to the device electrodes 1102 and 110 are removed.
3, an appropriate voltage is applied, and an energization forming process is performed to form the electron-emitting portion 1105.

The energization forming treatment means that the electroconductive thin film 1104 made of a fine particle film is energized so that a part of it is appropriately destroyed, deformed or altered to change into a structure suitable for electron emission. It is a process that causes it. In a portion of the conductive thin film made of the fine particle film that has been changed to a structure suitable for emitting electrons (that is, the electron emitting portion 1105), an appropriate crack is formed in the thin film. It should be noted that the electrical resistance measured between the device electrodes 1102 and 1103 after formation is significantly increased as compared with that before the electron emission unit 1105 is formed.

In order to describe the energization method in more detail, an example of an appropriate voltage waveform applied from the forming power supply 1110 will be shown.

FIG. 11 is a diagram showing an example of applied voltage waveforms in the energization forming process according to the embodiment of the present invention.

In the figure, when forming a conductive thin film made of a fine particle film, a pulsed voltage is preferable, and in the case of the present embodiment, a triangular pulse having a pulse width T1 as shown in the figure. Was continuously applied at a pulse interval T2. At that time, the peak value Vpf of the triangular wave pulse is
The pressure was increased sequentially. In addition, a monitor pulse Pm for monitoring the state of formation of the electron-emitting portion 1105 was inserted between triangular-wave pulses at appropriate intervals, and the current flowing at that time was measured by an ammeter 1111.

In the present embodiment, for example, in a vacuum atmosphere of about 10 −5 [torr], for example, the pulse width T1 is 1 [millisecond] and the pulse interval T2 is 1.
0 [millisecond], and the peak value Vpf is set to 0.
The voltage was increased by 1 [V]. Then, the monitor pulse Pm was inserted at a rate of one every time five triangular waves were applied. The monitor pulse voltage Vpm was set to 0.1 [V] so as not to adversely affect the forming process. Then, when the electric resistance between the element electrodes 1102 and 1103 becomes 1 × 10 6 [ohm], that is, the current measured by the ammeter 1111 when the monitor pulse is applied becomes 1 × 10 −7 [A] or less. At the stage
The energization related to the forming process has ended.

The above method is a preferable method for the surface conduction electron-emitting device of this embodiment. For example, the design of the surface conduction electron-emitting device such as the material and film thickness of the fine particle film or the element electrode spacing L is changed. In this case, it is desirable to appropriately change the energization conditions accordingly.

4) Next, as shown in FIG.
The device electrodes 1102 and 1103 are supplied from the activation power source 1112.
During the energization activation process, apply an appropriate voltage during
The electron emission characteristics are improved.

The energization activation process is a process of energizing the electron-emitting portion 1105 formed by the energization forming process under appropriate conditions to deposit carbon or a carbon compound in the vicinity thereof. (In the figure, a deposit made of carbon or a carbon compound is schematically shown as the member 1113.) Incidentally, by performing the energization activation treatment, the emission current at the same applied voltage is typically compared with that before the activation. Specifically, it can be increased 100 times or more.

Specifically, 10 to the minus 4th power or 1
By applying a voltage pulse periodically in a vacuum atmosphere within the range of 0 to the fifth power [torr], carbon or a carbon compound originating from an organic compound existing in the vacuum atmosphere is deposited. The deposit 1113 is any of single crystal graphite, polycrystalline graphite, and amorphous carbon, or a mixture thereof, and has a thickness of 500.
[Angstrom] or less, more preferably 300 [angstrom] or less.

Next, the energization method will be described in more detail with reference to FIG.

FIG. 12 is a diagram for explaining the applied voltage and the emission current in the energization activation process according to the embodiment of the present invention.

In the figure, (a) shows an example of an appropriate voltage waveform applied from the activation power supply 1112, and (b) shows the emission current Ie emitted with the application of the voltage. In the present embodiment, the energization activation process is performed by periodically applying a rectangular wave of a constant voltage. Specifically, the voltage Vac of the rectangular wave is 14 [V], and the pulse width T3 is 1 [mm]. Second] and the pulse interval T4 is 10 [milliseconds]. The above-mentioned energization conditions are preferable conditions for the surface-conduction type electron-emitting device of the present embodiment, and when the design of the surface-conduction type electron-emitting device is changed, it is desirable to appropriately change the conditions accordingly.

Reference numeral 1114 shown in FIG. 10D is an anode electrode for capturing the emission current Ie emitted from the surface conduction electron-emitting device, to which the DC high voltage power supply 1115 and the ammeter 1116 are connected. . (Note that the substrate 1101
When the activation process is performed after the display panel is incorporated into the display panel, the phosphor screen of the display panel is connected to the anode electrode 1114.
Used as While the voltage is applied from the activation power supply 1112, the emission current Ie is measured by the ammeter 1116 to monitor the progress of the energization activation process.
12 is controlled. An example of the emission current Ie measured by the ammeter 1116 is shown in FIG. 12 (b). When the application of the pulse voltage from the activation power supply 1112 is started, the emission current Ie increases with the passage of time, but the emission current Ie saturates. Will almost never increase. As described above, when the emission current Ie is almost saturated, the voltage application from the activation power supply 1112 is stopped, and the energization activation process is ended.

The above energization conditions are preferable conditions for the surface-conduction type electron-emitting device of this embodiment, and when the design of the surface-conduction type electron-emitting device is changed, the conditions should be changed accordingly. desirable. As described above, the plane type surface conduction electron-emitting device shown in FIG. 10E was manufactured.

(Vertical Type Surface Conduction Type Emitting Element) Next, another typical structure of the surface conduction type emitting element in which the electron emitting portion or its periphery is formed of a fine particle film, that is, vertical type surface conduction type emitting element. The configuration of the element will be described.

FIG. 13 is a sectional view of a vertical surface conduction electron-emitting device as an embodiment of the present invention.

In the figure, reference numeral 1201 designates substrates 1202 and 120.
3 is an element electrode, 1206 is a step forming member, 1204 is a conductive thin film using a fine particle film, 1205 is an electron emitting portion formed by an energization forming process, and 1213 is a thin film formed by an energization activation process.

The vertical type is different from the above-described flat type in that one of the element electrodes (1202) is provided on the step forming member 1206, and the conductive thin film 1204 covers the side surface of the step forming member 1206. The point is that they are covered. Therefore, the device electrode interval L in the flat type shown in FIG. 9 is set as the step height Ls of the step forming member 1206 in the vertical type. The substrate 1201, the device electrodes 1202 and 1
For 203 and the conductive thin film 1204 using a fine particle film, the materials listed in the description of the planar type can be similarly used. The step forming member 1206 is made of an electrically insulating material such as SiO2.

Next, a method of manufacturing a vertical surface conduction electron-emitting device will be described.

FIG. 14 is a cross-sectional view for explaining a manufacturing process of a vertical type surface conduction electron-emitting device as an embodiment of the present invention.

In the figure, (a) to (f) show respective manufacturing steps of the surface conduction electron-emitting device, and the reference numerals of the respective members are shown in FIG.
Is the same as

1) First, as shown in FIG. 14A, a device electrode 1203 is formed on a substrate 1201.

2) Next, as shown in FIG. 13B, an insulating layer for forming the step forming member is laminated. The insulating layer may be formed by laminating, for example, SiO2 by a sputtering method.
For example, another film forming method such as a vacuum vapor deposition method or a printing method may be used.

3) Next, as shown in FIG. 13C, a device electrode 1202 is formed on the insulating layer.

4) Next, as shown in FIG. 9D, a part of the insulating layer is removed by using, for example, an etching method to expose the device electrode 1203.

5) Next, as shown in FIG. 7E, a conductive thin film 1204 using a fine particle film is formed. For formation, a film forming technique such as a coating method may be used as in the case of the flat type.

6) Next, as in the case of the flat type, an energization forming process is performed to form an electron emitting portion.
(The same process as the planar energization forming process described with reference to FIG. 10C may be performed.) 7) Next, as in the case of the planar type, the energization activation process is performed to emit electrons. Carbon or a carbon compound is deposited near the portion.
(The same process as the planar energization activation process described with reference to FIG. 10D may be performed.) As described above,
The vertical type surface conduction electron-emitting device shown in FIG. 14F was manufactured.

Next, the characteristics of the elements used in the image forming apparatus will be described.

<Characteristics of Surface Conduction Type Emitting Element Used in Image Forming Apparatus> FIG. 15 is a diagram showing characteristics of the surface conduction type emitting element according to the embodiment of the present invention.

The figure shows typical examples of (emission current Ie) vs. (device applied voltage Vf) characteristics and (device current If) vs. (device applied voltage Vf) characteristics. The emission current I
Since e is much smaller than the device current If, it is difficult to illustrate it on the same scale, and these characteristics are changed by changing design parameters such as the size and shape of the device. The graphs of the books are shown in arbitrary units.

The element used in the image forming apparatus has an emission current I
e has the following three characteristics.

(1) A certain voltage (this is the threshold voltage Vt
(referred to as h) above, the emission current Ie rapidly increases when a voltage larger than the threshold voltage Vt is applied to the device.
At a voltage below h, the emission current Ie is hardly detected. That is, it is a non-linear element having a clear threshold voltage Vth with respect to the emission current Ie.

(2) Since the emission current Ie changes depending on the voltage Vf applied to the device, the emission current Ie at the voltage Vf.
The magnitude of e can be controlled.

(3) Since the response speed of the current Ie emitted from the element is fast with respect to the voltage Vf applied to the element, the charge amount of the electrons emitted from the element is controlled by the length of time the voltage Vf is applied. it can.

Due to the above-mentioned characteristics, the surface conduction electron-emitting device could be preferably used in the forming apparatus. For example, in the forming device in which a large number of elements are provided corresponding to the pixels of the display screen, by utilizing the characteristic (1), it is possible to sequentially scan the display screen and perform display. That is, the threshold voltage Vth is set to the driven element according to the desired emission brightness.
The above voltages are appropriately applied, and a voltage lower than the threshold voltage Vth is applied to the non-selected element. By sequentially switching the elements to be driven, the display screen can be sequentially scanned and displayed. Further, since the emission brightness can be controlled by using the characteristic (2) or the characteristic (3), it is possible to perform a gradation display.

<Structure of multi-electron beam source in which a large number of elements are wired in a simple matrix> Next, the structure of a multi-electron beam source in which the above surface conduction electron-emitting devices are arranged on a substrate and wired in a simple matrix will be described.

FIG. 16 is a plan view of a substrate of a multi-electron beam source as an embodiment of the present invention.

The figure is a plan view of a multi-electron beam source used in the display panel of FIG. In FIG.
The surface conduction electron-emitting devices similar to those shown in are arranged, and these devices are wired in a simple matrix by row-direction wiring electrodes 1003 and column-direction wiring electrodes 1004. Row-direction wiring electrode 1003 and column-direction wiring electrode 10
An insulating layer (not shown) is formed between the electrodes at the intersection of 04 to maintain electrical insulation.

FIG. 17 is a cross-sectional view of the substrate of the multi-electron beam source according to the embodiment of the present invention.
An A ′ cross section is shown.

The multi-electron emission source having such a structure is prepared by previously forming the row-direction wiring electrodes 1003, the column-direction wiring electrodes 1004, the inter-electrode insulating layer (not shown), and the device electrodes of the surface conduction electron-emitting device on the substrate. After forming a conductive thin film, the row-direction wiring electrode 1003 and the column-direction wiring electrode 100
The device was manufactured by supplying current to each element via the device 4 and performing a current forming process and a current activation process.

FIG. 18 is a block diagram of a multifunctional image forming apparatus using the image forming apparatus according to the embodiment of the present invention.

In the figure, 2100 is a display panel and 2 is a display panel.
101 is a display panel drive circuit, 2102 is a display controller, 2103 is a multiplexer,
2104 is a decoder, 2105 is an input / output interface circuit, 2106 is a CPU, 2107 is an image generation circuit,
2108 and 2109 and 2110 are image memory interface circuits, 2111 is an image input interface circuit, 2112 and 2113 are TV signal receiving circuits, 21
Reference numeral 14 denotes an input unit. Incidentally, when the image forming apparatus receives a signal including both video information and audio information such as a television signal, it naturally reproduces audio at the same time as displaying video. Descriptions of circuits, speakers, etc. relating to reception, separation, reproduction, processing, storage, etc. of voice information not directly related to the features will be omitted.

The functions of the respective parts will be described below along the flow of image signals.

First, the TV signal receiving circuit 2113 is a circuit for receiving a TV image signal transmitted using a wireless transmission system such as radio waves or spatial optical communication. The system of the TV signal to be received is not particularly limited, and various systems such as NTSC system, PAL system, SECAM system may be used. Further, a TV signal (for example, a so-called high-definition TV such as the MUSE system) including a larger number of scanning lines than these is suitable for taking advantage of the display panel suitable for a large area and a large number of pixels. It is a signal source. The TV signal received by the TV signal receiving circuit 2113 is output to the decoder 2104.

The TV signal receiving circuit 2112 is a circuit for receiving a TV image signal transmitted using a wire transmission system such as a coaxial cable or an optical fiber. Similar to the TV signal receiving circuit 2113, the TV signal system to be received is not particularly limited, and the TV signal received by this circuit is also output to the decoder 2104.

Further, the image input interface circuit 21
Reference numeral 11 denotes a circuit for capturing an image signal supplied from an image input device such as a TV camera or an image reading scanner, and the captured image signal is output to the decoder 2104.

The image memory interface circuit 2
110 is a video tape recorder (hereinafter abbreviated as VTR)
Is a circuit for capturing the image signal stored in the decoder 2104. The captured image signal is output to the decoder 2104.

The image memory interface circuit 2
Reference numeral 109 denotes a circuit for capturing an image signal stored in the video disk, and the captured image signal is output to the decoder 2104.

The image memory interface circuit 2
Reference numeral 108 denotes a circuit for taking in an image signal from a device that stores still image data, such as a so-called still image disk.
It is output to 04.

In addition, the input / output interface circuit 210
Reference numeral 5 is a circuit for connecting the image forming apparatus to an external computer, a computer network, or an output device such as a printer. In addition to inputting / outputting image data, character data, and graphic information, in some cases, it is possible to input / output control signals and numerical data between the CPU 2106 of the image forming apparatus and the outside. is there.

Further, the image generating circuit 2107 is provided with image data, character / graphic information, or CPU which is externally input through the input / output interface circuit 2105.
A circuit for generating display image data based on the image data and character / graphic information output from 2106.
Inside this circuit, for example, a rewritable memory for accumulating image data and character / graphic information, a read-only memory in which image patterns corresponding to character codes are stored, and a processor for performing image processing Etc. and the circuits necessary for image generation are incorporated. The display image data generated by this circuit is the decoder 21.
However, in some cases, it is also possible to input / output to / from an external computer network or printer via the input / output interface circuit 2105.

Further, the CPU 2106 mainly performs operations related to operation control of the image forming apparatus and generation, selection and editing of a display image. For example, a control signal is output to the multiplexer 2103 to appropriately select or combine image signals to be displayed on the display panel. At that time, a control signal is generated to the display panel controller 2102 according to the image signal to be displayed, and the screen display frequency, the scanning method (for example, the interlace system or the non-interlace system), the number of scanning lines in one screen, etc. The operation of the image forming apparatus is controlled appropriately.

Image data or character / graphic information is directly output to the image generation circuit 2107, or an external computer or memory is accessed through the input / output interface circuit 2105 to generate image data or character / figure information. Enter graphic information. It is needless to say that the CPU 2106 may be involved in work for purposes other than this (for example, it may be directly involved in a function of generating or processing information, such as a personal computer or a word processor). ). Alternatively, as described above, the computer may be connected to an external computer network via the input / output interface circuit 2105, and work such as numerical calculation may be performed in cooperation with an external device.

The input unit 2114 is the CPU 21
A user inputs commands, programs, data, and the like into 06. For example, in addition to a keyboard and a mouse, various input devices such as a joystick, a bar code reader, and a voice recognition device can be used. .

The decoder 2104 is a circuit for inversely converting various image signals input from the image generation circuit 2107 or the TV signal reception circuit 2113 into three primary color signals or luminance signals and I signals and Q signals. . It is desirable that the decoder 2104 has an image memory therein, as indicated by a broken line in the figure. This is to handle a television signal that requires an image memory for reverse conversion, such as the MUSE method. Further, the provision of the image memory facilitates the display of a still image, or the image generation circuit 2107 and the CPU 21.
This is because in cooperation with 06, there is an advantage that image processing and editing such as image thinning, interpolation, enlargement, reduction, and composition can be easily performed.

The multiplexer 2103 is a CPU
The display image is appropriately selected based on the control signal input from the 2106. That is, the multiplexer 2103
Selects a desired image signal from the inversely converted image signals input from the decoder 2104 and selects the drive circuit 210.
Output to 1. In that case, by switching and selecting an image signal within one screen display time, it is possible to divide one screen into a plurality of areas and display different images depending on the areas, as in a so-called multi-screen TV. .

Also, the display panel controller 2
Reference numeral 102 denotes a circuit for controlling the operation of the drive circuit 2101 based on a control signal input from the CPU 2106.

First, as a device related to the basic operation of the display panel, for example, a signal for controlling the operation sequence of a power source (not shown) for driving the display panel is output to the drive circuit 2101. In addition, as a signal relating to the driving method of the display panel, for example, a signal for controlling a screen display frequency and a scanning method (for example, an interlace system or a non-interlace system) is output to the drive circuit 2101. In some cases, the drive circuit 210 outputs control signals relating to image quality adjustment such as brightness, contrast, color tone, and sharpness of a display image.
1 may be output.

The drive circuit 2101 is a circuit for generating a drive signal to be applied to the display panel 2100, and an image signal input from the multiplexer 2103 and the display panel controller 21.
02 operates based on a control signal input from the control unit 02.

Although the functions of the respective units have been described above, the image information input from various image information sources can be displayed on the display panel 2100 in the present image forming apparatus by the configuration illustrated in FIG. . That is, various image signals such as television broadcasting are transmitted to the decoder 2
After inverse conversion at 104, multiplexer 210
3 is appropriately selected and input to the drive circuit 2101. On the other hand, the display controller 2102 generates a control signal for controlling the operation of the drive circuit 2101 according to the image signal to be displayed. The drive circuit 2101 controls the display panel 2 based on the image signal and the control signal.
100 is applied with a drive signal. Accordingly, an image is displayed on display panel 2100. These series of operations are totally controlled by the CPU 2106.

Further, in this forming apparatus, the decoder 2
An image memory built in 104 and an image generation circuit 2107
In addition to the display of a selection from a plurality of image information, the involvement of the CPU 2106 and
For image information to display, for example, enlargement, reduction, rotation,
It is also possible to perform image processing such as movement, edge enhancement, thinning, interpolation, color conversion, and aspect ratio conversion of images, and image editing such as combining, erasing, connecting, replacing, and fitting. Further, although not particularly mentioned in the description of the present embodiment, like the image processing and image editing described above,
A dedicated circuit for processing and editing audio information may also be provided.

Therefore, the present image forming apparatus includes a television broadcast display device, a video conference terminal device, an image editing device that handles still images and moving images, a computer terminal device,
It is possible to combine the functions of a word processor and other business terminal devices, game consoles, etc., and it has a very wide range of applications for industrial or consumer use. The structure shown in FIG. 18 is an example of the structure of an image forming apparatus using a display panel having a surface conduction electron-emitting device as an electron beam source, and it goes without saying that the structure is not limited to this. For example, among the constituent elements in FIG. 18, circuits related to unnecessary functions may be omitted depending on the purpose of use. On the contrary, the constituent elements may be added depending on the purpose of use. For example, when the present forming apparatus is applied as a video telephone, it is preferable to add a television camera, a voice microphone, an illuminator, a transmission / reception circuit including a modem, and the like to the components.

In this forming apparatus, the display panel using the surface conduction electron-emitting device as an electron beam source can be easily thinned, so that the depth of the entire image forming apparatus can be reduced. In addition, a display panel that uses a surface-conduction type electron-emitting device as an electron beam source can easily enlarge a screen, has high brightness, and has excellent viewing angle characteristics, so that the image forming apparatus is highly realistic and has a powerful image. Can be displayed with good visibility.

[0171]

As described above, according to the present invention,
(EN) It is possible to provide an image forming apparatus using a surface conduction electron-emitting device having phosphors arranged in a triangular shape, which is easy to configure and manufacture an image forming circuit. That is, by making the wiring in the column direction linear, the load of wiring formation in the manufacturing process is reduced. Furthermore, since one emission element irradiates two phosphors with electrons, the resolution can be improved as compared with the case where one emission element irradiates one phosphor.

[0172]

[Brief description of drawings]

FIG. 1 is a block configuration diagram of a drive circuit of an image forming apparatus as an embodiment of the present invention.

FIG. 2 is a diagram illustrating the panel 12 of FIG. 1 as an embodiment of the present invention.

FIG. 3 is a cross-sectional view of an emission element portion as an embodiment of the present invention.

FIG. 4 is a timing chart of the drive circuit according to the first embodiment of the present invention.

FIG. 5 is a diagram illustrating electron irradiation to the phosphor according to the first embodiment of the present invention.

FIG. 6 is a timing chart of a drive circuit according to a second embodiment of the present invention.

FIG. 7 is a perspective view of a display panel used in an embodiment of the present invention.

FIG. 8 is a diagram showing a phosphor array of a face plate as an embodiment of the present invention.

FIG. 9 is a plan view and a cross-sectional view of a surface conduction electron-emitting device as an embodiment of the present invention.

FIG. 10 is a cross-sectional view for explaining a manufacturing process of the planar surface conduction electron-emitting device as the embodiment of the present invention.

FIG. 11 is a diagram showing an example of an applied voltage waveform in the energization forming process according to the embodiment of the present invention.

FIG. 12 is a diagram illustrating applied voltage and emission current in the energization activation process according to the embodiment of the present invention.

FIG. 13 is a cross-sectional view of a vertical surface conduction electron-emitting device as an embodiment of the present invention.

FIG. 14 is a cross-sectional view for explaining a manufacturing process of a vertical surface conduction electron-emitting device as an embodiment of the present invention.

FIG. 15 is a diagram showing characteristics of a surface conduction electron-emitting device as an embodiment of the present invention.

FIG. 16 is a plan view of a substrate of a multi-electron beam source according to an embodiment of the present invention.

FIG. 17 is a sectional view of a substrate of a multi-electron beam source according to an embodiment of the present invention.

FIG. 18 is a block configuration diagram of a multifunctional image forming apparatus using the image forming apparatus according to the exemplary embodiment of the present invention.

FIG. 19 is a plan view of a surface conduction electron-emitting device as a conventional example.

FIG. 20 is a diagram showing an arrangement of phosphors as a conventional example.

FIG. 21 is a diagram showing an arrangement of emission element portions as a conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 signal processing part 2 modulation signal generating part 3 timing control circuit 4 video signal inverting circuit 5 scanning signal inverting circuit 6 pulse generator 7 scanning signal selecting circuit 8 scanning signal inverting switch 9 inverting device 10 video signal inverting switch 11 MOS-FET 12 Panel 13 Emission element part 14 Synchro separation circuit s1 NTSC signal s2 Switch switching signal s3 Switch switching signal s4 Pulse width modulation signal s5 Video signal s6 Scanning signal s7 pulse 51 Emission element 52 Panel 53 Electron emission part 54 Column direction wiring 55 Row direction wiring 56 electrode 57 electrode 100 central axis 101 face plate 102 electron orbit 103 electron orbit 104 phosphor Lh distance between phosphor and electron emission part Va electron acceleration voltage Vf voltage applied to emission element 150 phosphor 151 electron emission part 153 electrode 1 4 Emitting Element 155 Electron Orbit 1001 Substrate 1002 Surface Conduction Emitting Element 1003 Row Direction Wiring 1004 Column Direction Wiring 1005 Rear Plate 1006 Side Wall 1007 Face Plate 1008 Fluorescent Film 1009 Metal Back 1010 Emitting Element Part 1011 Row Direction Wiring 1012 Column Direction Wiring 1020 Emission Element portion 1021 Row direction wiring 1022 Column direction wiring 1101 Substrate 1102, 1103 Element electrode 1104 Conductive thin film 1105 Electron emission section 1110 Forming power supply 1111 Ammeter 1112 Activation power supply 1113 Thin film 1114 Anode electrode 1115 DC high voltage power supply 1116 Ammeter 1201 Substrate 1202, 1203 Element Electrode 1204 Conductive Thin Film 1205 Electron Emitting Portion 1206 Step Forming Member 1213 Thin Film 2010 Black Conductor Material 2100 Display panel 2101 Drive circuit 2102 Display controller 2103 Multiplexer 2104 Decoder 2105 Input / output interface circuit 2106 CPU 2107 Image generating circuits 2108, 2109 and 2110 Image memory interface circuit 2111 Image input interface circuit 2112, 2113 TV signal receiving circuit 2114 Input section 3001 Substrate 3004 Conductive thin film 3005 Electron emission part

Claims (10)

[Claims] 1. A voltage is applied to the cold cathode element by a rear plate in which a plurality of cold cathode elements having electron emission portions are arranged in a matrix between a pair of electrodes, and row-direction wiring and column-direction wiring included in the rear plate. In an image forming apparatus including a voltage applying unit for applying a voltage and a face plate having a phosphor that emits light by electrons emitted from the electron emitting portion, a direction of an electric field applied to the cold cathode element and a horizontal direction of the image forming apparatus. The angle formed with the direction is a predetermined angle θ (θ ≠ 0, 9
The image forming apparatus is 0) ° or (θ + 180) °. 2. The image forming apparatus according to claim 1, wherein the phosphors are three kinds of red, green, and blue, and a plurality of the three kinds of phosphors are provided in a triangular shape. apparatus. 3. The number of the cold cathode device and the phosphor is 1:
The image forming apparatus according to claim 1, wherein the image forming apparatus is 2. 4. A plurality of the phosphors are provided in a triangular shape and are arranged in a matrix at the same time, and the cold cathode elements and the cold cathode elements are arranged every other row between the rows of the phosphors arranged in the matrix. The image forming apparatus according to claim 3, wherein the electron emitting portion is located. 5. The image forming apparatus according to claim 1, wherein the cold cathode device emits electrons to the two phosphors located around the cold cathode device. 6. The image forming apparatus according to claim 1, wherein the voltage applying unit reverses the voltage polarity every predetermined time. 7. The image forming apparatus according to claim 6, wherein the predetermined time period is one horizontal synchronization period of an image signal input to the image forming apparatus. 8. The image forming apparatus according to claim 6, wherein the predetermined time period is one field period of an image signal input to the image forming apparatus. 9. The phosphors provided in a triangular shape are arranged in an equilateral triangle shape, and an acute angle of the equilateral triangle is equal to the predetermined angle θ °. The image forming apparatus according to claim 2. 10. The image forming apparatus according to claim 1, wherein the cold cathode device is a surface conduction electron-emitting device.