JPH09181256A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a multichip module semiconductor device at a low cost. SOLUTION: A plurality of semiconductor elements 6 is mounted on a semiconductor element mounting substrate 30 made of a resin while the elements 6 are electrically connected to a wiring pattern 30a formed on one surface of the substrate 30 and the peripheral edge section of the other surface of the substrate 30 is joined to the peripheral edge section of a through hole 22 formed through an external connecting terminal supporting substrate 20 made of resin. Then a wiring pattern 20a formed on the joining surface of the substrate 20 is electrically connected to the wiring pattern 30a formed on the surface of the substrate 30 and external connecting terminals 21 provided on the other surface of the substrate 20 and the semiconductor elements 6 are sealed with resin.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a semiconductor device,
More specifically, it relates to a semiconductor device having a multi-chip module (MCM) structure.

[0002]

2. Description of the Related Art Various semiconductor packages have been considered for fully exhibiting these characteristics as semiconductor elements become highly integrated and operate at high speed. Among them, the multi-chip module aims to reduce the signal delay between the semiconductor elements by arranging the semiconductor elements close to each other to cope with high speed. The multi-chip module is generally a type of product in which the semiconductor element 6 is mounted on the ceramic substrate 5 as shown in FIG. Reference numeral 7 is a thin film wiring layer, 8 is a base substrate, and 9 is a sealing resin.

However, since a multi-chip module using such a ceramic substrate requires a high manufacturing cost, a resin substrate is used as a substrate as a product which can be manufactured at a lower cost, and a semiconductor element is mounted on this substrate. Resin-encapsulated products are being considered. FIG. 12 shows a semiconductor device in which the semiconductor element 6 is mounted on the substrate by using the resin substrate 10. This semiconductor device is a BGA type product using solder balls 11 as external connection terminals. 1
Reference numeral 2 is a wiring pattern, 13 is a through hole, and 14 is a solder resist.

[0004]

By the way, in the conventional multi-chip module, since the wiring pattern and the like are formed in accordance with the type and arrangement of the semiconductor elements to be mounted, it is necessary to manufacture a dedicated substrate for each product. This is a cause of high manufacturing cost because it is not possible to use a common substrate. It is an object of the present invention to provide a semiconductor device in such a multi-chip module type semiconductor device that can be used universally for different kinds of products and can reduce the manufacturing cost of the entire semiconductor device. I am trying.

[0005]

The present invention has the following constitution in order to achieve the above object. That is, a plurality of semiconductor elements are mounted by being electrically connected to a wiring pattern formed on one surface of a semiconductor element mounting substrate made of a resin substrate, and a peripheral portion of the other surface of the semiconductor element mounting substrate is a resin. The wiring pattern is formed on the semiconductor element mounting board and the wiring pattern formed on the joining surface side of the external connection terminal supporting board while being joined to the peripheral portion of the through hole formed on the external connecting terminal supporting board formed of the board. A wiring pattern, and a wiring pattern formed on the bonding surface side of the external connection terminal support substrate and an external connection terminal provided on the other surface side of the external connection terminal support substrate are electrically connected, The semiconductor element is resin-sealed. A wiring pattern is formed on the other surface of the semiconductor element mounting substrate, a semiconductor element is mounted by being electrically connected to the wiring pattern, and the wiring pattern is formed on one surface of the semiconductor element mounting substrate. The wiring pattern or the wiring pattern formed on the joint surface side of the external connection terminal supporting substrate is electrically connected. In addition, the wiring pattern formed on one surface of the semiconductor element mounting substrate and the wiring pattern formed on the bonding surface side of the external connection terminal supporting substrate are electrically connected by bonding wires or through holes formed in the semiconductor element mounting substrate. It is characterized in that they are connected to each other. Further, the wiring pattern formed on the other surface of the semiconductor element mounting substrate and the wiring pattern formed on the joint surface side of the external connection terminal supporting substrate are electrically connected by solder. Further, the semiconductor device mounting substrate is characterized in that the peripheral region thereof and the peripheral region of a through hole provided in the external connection terminal supporting substrate are bonded by an adhesive. Further, the external connection terminals are solder balls. Further, the semiconductor element is resin-sealed by a potting method.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below. FIG. 1 is a sectional view showing the structure of a semiconductor device according to the present invention. In the figure, 20 is an external connection terminal supporting substrate, and 30 is a semiconductor element mounting substrate for mounting the semiconductor element 6. Both the external connection terminal support substrate 20 and the semiconductor element mounting substrate 30 are made of resin substrates. 40 is a sealing resin for sealing the semiconductor element 6.

The external connection terminal support substrate 20 is used as a support substrate for bonding and supporting the external connection terminals 21 such as solder balls or lead pins and for bonding and supporting the semiconductor element mounting substrate 30. In order to join the semiconductor element mounting substrate 30 to the central portion of the external connection terminal supporting substrate 20, a rectangular through hole 22 is provided through. A wiring pattern 20a is provided on one surface of the external connection terminal support substrate 20, and a land portion 20b for connecting the external connection terminal 21 is provided on the other surface. The electrical connection between the wiring pattern 20a and the land portion 20b is made through a through hole 20c that penetrates the resin substrate in the thickness direction. The through hole 20c is formed by forming a through hole in the resin substrate and forming a conductor layer on the inner wall surface of the through hole by plating.

In the external connection terminal supporting board 20 of the present embodiment, the through holes 20c are arranged on the outer peripheral edge side, and the end portion of the wiring pattern 20a on one surface of the external connection terminal supporting board 20 is the external connection terminal supporting board. 20 are connected to the through holes 20c by being pulled out to the outer peripheral edge side,
On the other surface of the external connection terminal supporting substrate 20, the land portions 20b arranged in an array from the respective through holes 20c.
A wiring pattern is drawn out to connect the land portion 20b and each through hole 20c. Solder balls are joined to the land portions 20b as the external connection terminals 21. When a lead pin is used as the external connection terminal 21, the lead pin is inserted into the through hole 20c and mounted without providing the land portion 20b.

Since the semiconductor element mounting substrate 30 is joined to and supported by the peripheral portion of the through hole 22 of the external connection terminal supporting substrate 20, it is formed in a rectangular plate shape slightly larger than the through hole 22. The semiconductor element mounting substrate 30 is provided with a plurality of semiconductor elements 6 that can be mounted similarly to the multi-chip module, and each semiconductor element 6 and the external connection terminal 21 mounted on the external connection terminal support substrate 20 are electrically connected. To be done.

In the semiconductor element mounting substrate 30 of this embodiment, wiring patterns 30a and 30b are provided on both sides of the substrate, the semiconductor element 6 is mounted on both sides of the substrate, and each semiconductor element 6 and the wiring patterns 30a and 30b are electrically connected. Connected to each other. The electrical connection between the semiconductor element 6 and the wiring patterns 30a and 30b is performed by the wire bonding method in the present embodiment, but the connection method is not limited to the wire bonding method and other methods such as a flip chip bonding method may be used. Good.

The electrical connection between the semiconductor element 6 mounted on the semiconductor element mounting board 30 and the external connection terminals 21 is performed by connecting the wiring patterns 30a and 30b of the semiconductor element mounting board 30 to the external connection terminals that join the semiconductor element mounting board 30. This is performed by electrically connecting the wiring pattern 20a formed on the bonding surface of the support substrate 20. The wiring pattern 20 formed on the joint surface between the wiring patterns 30a and 30b of the semiconductor element mounting substrate 30 and the external connection terminal supporting substrate 20.
There are several methods for electrically connecting a to the a, but in the present embodiment, the wiring pattern 30a formed on one surface of the semiconductor element mounting substrate 30 and the wiring pattern 20a of the external connection terminal supporting substrate 20 Are connected by the wire bonding method, and the wiring pattern 30b formed on the other surface of the semiconductor element mounting substrate 30 and the wiring pattern 20b of the external connection terminal supporting substrate 20 are connected by the solder 23.

In this embodiment, the solder 23 that electrically connects the wiring pattern 30b of the semiconductor element mounting substrate 30 and the wiring pattern 20a of the external connection terminal supporting substrate 20 electrically connects these wiring patterns 30b and 20a to each other. In addition to the function of connecting, the semiconductor element mounting substrate 30 is bonded to and supported by the external connection terminal supporting substrate 20. That is, the semiconductor element mounting substrate 30 is supported by the external connection terminal supporting substrate 20 by soldering with the solder 23, and the semiconductor element 6 mounted on the semiconductor element mounting substrate 30 and the external connection terminal 21 are electrically connected. .

Reference numeral 24 is a solder resist for protecting the surface of the external connection terminal supporting substrate 20. Semiconductor element 6
Is sealed with resin by the potting method. At the time of resin encapsulation, a resin for encapsulation is potted on both sides of the semiconductor element mounting substrate 30 so that one side of the semiconductor element mounting substrate 30 covers the outer peripheral edge portion of the semiconductor element mounting substrate 30. The other surface of the mounting board 30 is sealed with a sealing resin 40 so as to close the through hole 22 of the external connection terminal supporting board 20. The semiconductor element 6 may be sealed by resin molding instead of the potting method.

FIG. 2 shows another embodiment in which the semiconductor element mounting substrate 30 is bonded to the external connection terminal supporting substrate 20. That is, in the above embodiment, the wiring pattern 30a provided on the semiconductor element mounting substrate 30 and the wiring pattern 20a provided on the external connection terminal supporting substrate 20 are electrically connected by the wire bonding method. A through hole 30c is provided in the substrate 30 at a position where the external connection terminal supporting substrate 20 is joined, and the wiring pattern 30a and the wiring pattern 20 are provided through the through hole 30c.
It is characterized in that it is electrically connected to a.

The through hole 30c penetrates the semiconductor element mounting substrate 30 in the thickness direction as shown in the figure, and is arranged in the peripheral portion of the semiconductor element mounting substrate 30 joined to the external connection terminal supporting substrate 20. The wiring pattern 30a is connected to one end of the through hole 30c on one surface side of the semiconductor element mounting substrate 30, and the wiring pattern 20a is connected to the other end of the through hole 30c on the other surface side of the semiconductor element mounting substrate 30. Connection pads are provided. The wiring pattern 30b provided on the other surface of the semiconductor element mounting substrate 30 is not connected to the through hole 30c, but the semiconductor element mounting substrate 30
Is connected to the connection pad provided on the peripheral portion of.

The connection between the semiconductor element mounting substrate 30 and the external connection terminal supporting substrate 20 is performed by the solder 23 as in the above embodiment.
Made by soldering by. As a result, the wiring patterns 30a and 30b of the semiconductor device substrate 30 and the wiring pattern 20a of the external connection terminal supporting substrate 20 are electrically connected via the through holes 30c. In the case of this embodiment, the wiring patterns 30a and 30b of the semiconductor element mounting substrate 30 and the external connection terminal supporting substrate 20 are simultaneously formed by wire bonding by the operation of bonding the semiconductor device substrate 30 to the external connecting terminal supporting substrate 20. And the wiring pattern 20a can be electrically connected.

FIG. 3 shows still another embodiment in which the semiconductor element mounting substrate 30 and the external connection terminal supporting substrate 20 are bonded together. In this embodiment, the wiring pattern 2 of the external connection terminal supporting substrate 20 is provided only on one surface side of the semiconductor element mounting substrate 30.
0a is provided, and the wiring pattern 30b on the other surface side of the semiconductor element mounting substrate 30 is electrically connected to the connection pattern through the through hole 30c, and the connection pattern and the external connection terminal are provided. Support substrate 20
After the wiring pattern 20a is connected to the wiring pattern 20a by wire bonding, the semiconductor element mounting substrate 30 and the external connection terminal supporting substrate 20 are bonded using an adhesive 26 having no conductivity.

In this embodiment, the wiring patterns 30a and 30b of the semiconductor element mounting substrate 30 and the external connection terminal supporting substrate 2 are used.
Since it is connected to the wiring pattern 20a of 0 by wire bonding, the adhesive 26 is applied to the semiconductor element mounting substrate 30.
It is only necessary to join the external connection terminal supporting substrate 20 with the external connection terminal supporting substrate 20. In addition, the through hole 30 is formed in the semiconductor element mounting substrate 30.
By providing c, as opposed to the case where the connection pattern is provided only on one surface side of the semiconductor element mounting substrate 30 as described above, the connection pattern is provided only on the other surface side of the semiconductor element mounting substrate 30. You can also do it. In this case, the wiring patterns 30a and 30b of the semiconductor element mounting substrate 30 and the wiring pattern 20a of the external connection terminal supporting substrate 20 are electrically connected by soldering the semiconductor element mounting substrate 30 and the external connection terminal supporting substrate 20. Can be connected to.

Next, a method of manufacturing a semiconductor device will be described by taking the semiconductor device shown in FIG. 1 as an example. FIG. 4A shows a board frame 50 used as the external connection terminal supporting board 20.
Shows the state viewed from one side. The board frame 50 of the embodiment is formed in a strip shape in which three external connection terminal supporting boards 20 can be formed. When manufacturing the semiconductor device, the substrate frame 50 is used as a unit for carrying operation and the like. Reference numeral 22 denotes a through hole provided in the external connection terminal supporting board 20, which is formed in the board frame 50 in advance. Reference numeral 20a is the wiring pattern described above. FIG. 4B shows the substrate frame 50 as viewed from the other surface side. External connection terminal support board 2
On the other surface of 0, land portions 20b for joining the external connection terminals 21 are arranged and formed in an array.

FIG. 5 is a perspective view of the semiconductor element mounting substrate 30 bonded to the external connection terminal supporting substrate 20. A wiring pattern 30a electrically connected to the semiconductor element 6 is provided on the semiconductor element mounting substrate 30, and the semiconductor element 6 is mounted in a form similar to that of the multichip module. Since the wiring pattern 30a is wire-bonded at the peripheral portion of the semiconductor element mounting substrate 30, the semiconductor element mounting substrate 30
The wiring patterns 30a are formed at regular intervals along the peripheral edge of the, and the ends thereof are used as the bonding portions 32.

The semiconductor element 6 is preliminarily mounted on the semiconductor element mounting substrate 30, and the semiconductor element 6 and the wiring pattern 30 are mounted.
After wire bonding with a, the semiconductor element mounting substrate 30 is formed with the wiring pattern 20 formed on the substrate frame 50.
Align with a and join. In this embodiment, the semiconductor element mounting substrate 30 and the substrate frame 50 are connected by soldering. FIG. 6 shows a perspective view of the semiconductor element mounting substrate 30 bonded to the substrate frame 50. Three semiconductor element mounting substrates 30 are bonded to the substrate frame 50.

FIG. 7 is a sectional view showing a state in which the semiconductor element mounting substrate 30 is soldered to the substrate frame 50. The semiconductor element 6 has a wiring pattern 30 on the semiconductor element mounting substrate 30.
It is electrically connected to a and 30b. Further, the wiring pattern 3 formed on the other surface of the semiconductor element mounting substrate 30.
0b and the wiring pattern 20a of the external connection terminal supporting substrate 20.
And are electrically connected by solder 23.

Next, the wiring pattern 30a of the semiconductor element mounting substrate 30 and the wiring pattern 20a of the substrate frame 50.
And are connected by a wire bonding method (FIG. 8). 3
6 is a bonding wire. The semiconductor element mounting substrate 3 is formed on the wiring pattern 20a provided on the substrate frame 50.
Bonding portions are provided so as to correspond to the arrangement of the bonding portions 32 of the wiring pattern 30a formed in 0, and the semiconductor element mounting substrate 30 and the external connection terminal supporting substrate 2 are provided.
Wire bonding with 0 is performed between these corresponding bonding portions.

Then, a sealing resin is potted on one surface and the other surface of the semiconductor element mounting substrate 30 to seal the semiconductor element 6 with the resin (FIG. 9). Next, the land portion 20b
Solder balls, which are the external connection terminals 21, are joined to each other, and the external connection terminal supporting board 20 is cut into individual pieces from the board frame 50 (FIG. 10). Thus, a semiconductor device in which the semiconductor element mounting substrate 30 is supported by the external connection terminal supporting substrate 20 and resin-sealed is obtained.

Since the semiconductor device mounting substrate 30 bonded to the external connection terminal supporting substrate 20 described in each of the above embodiments is formed by the semiconductor element mounting substrate 30 on which a plurality of semiconductor elements 6 are mounted in advance. It can be obtained as a product having exactly the same function as a conventional multi-chip module. Since resin substrates are used for the external connection terminal support substrate 20 and the semiconductor element mounting substrate 30, the substrates can be manufactured at low cost and their assembly is easy. In addition, since the resin substrate can use materials with excellent electrical characteristics such as copper for the conductor parts such as wiring patterns,
There is an advantage in that the semiconductor device as a whole can be provided as a semiconductor device having excellent electrical characteristics and excellent characteristics in which an extremely high-speed semiconductor element can be mounted.

Further, as in the above-described embodiment, the through hole 22 is provided in the external connection terminal supporting substrate 20 to form the semiconductor element mounting substrate 3
If 0 is supported, both sides of the semiconductor element mounting substrate 30 can be used as mounting surfaces for the semiconductor elements 6, and a plurality of semiconductor elements 6 can be easily mounted, and various mountings are possible. is there.

The arrangement of the external connection terminals 21 on the external connection terminal supporting board 20 is often set in common even if the semiconductor elements 6 mounted are different, and the semiconductor element mounting board 30 and the external connection terminal supporting board are arranged. By making the electrical connection portion with 20 common, it is possible to commonly use the external connection terminal support substrate 20 and the substrate frame 50 even when using the semiconductor element mounting substrate 30 on which different semiconductor elements 6 are mounted. From this point, there is an advantage that the manufacturing cost can be reduced.

[0028]

As described above, the semiconductor device according to the present invention can be provided as a multi-chip module which can be produced at low cost as a semiconductor device using a resin substrate, and can be provided as a semiconductor device suitable for mass production. . In addition, a remarkable effect such as being able to be provided as a semiconductor device having excellent characteristics that can sufficiently cope with high speed is exhibited.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a semiconductor device according to the present invention.

FIG. 2 is a cross-sectional view showing another embodiment of a semiconductor device.

FIG. 3 is a sectional view showing still another embodiment of a semiconductor device.

FIG. 4 is a perspective view of a substrate frame used for manufacturing a semiconductor device.

FIG. 5 is a perspective view of a semiconductor element mounting substrate.

FIG. 6 is a perspective view showing a state where a semiconductor element mounting substrate is connected to a substrate frame.

FIG. 7 is a cross-sectional view showing a state in which a semiconductor element mounting substrate is connected to a substrate frame.

FIG. 8 is a cross-sectional view showing a state in which a semiconductor element mounting substrate and an external connection terminal supporting substrate are wire-bonded between wiring patterns.

FIG. 9 is a cross-sectional view of a semiconductor element sealed with a resin.

FIG. 10 is a cross-sectional view showing a state in which solder balls are joined together to form individual pieces of a semiconductor device.

FIG. 11 is a cross-sectional view showing a configuration of a conventional example of a multi-chip module.

FIG. 12 is a sectional view showing a configuration of a conventional example of a semiconductor device in which a semiconductor element is mounted on a resin substrate.

[Explanation of symbols]

 6 Semiconductor Chip 10 Resin Substrate 20 External Connection Terminal Support Substrate 20a Wiring Pattern 20b Land 20c Through Hole 21 External Connection Terminal 22 Through Hole 23 Solder 24 Solder Resist 26 Adhesive 30 Semiconductor Element Mounting Substrate 30a, 30b Wiring Pattern 30c Through Hole 32 Bonding part 36 Bonding wire 40 Sealing resin 50 Substrate frame

Claims (7)

[Claims] 1. A plurality of semiconductor elements are mounted by being electrically connected to a wiring pattern formed on one surface of a semiconductor element mounting substrate made of a resin substrate, and a peripheral edge of the other surface of the semiconductor element mounting substrate. Part is joined to the peripheral portion of the through hole provided in the external connection terminal supporting substrate made of a resin substrate, and the wiring pattern formed on the joint surface side of the external connecting terminal supporting substrate and the semiconductor element mounting substrate. The formed wiring pattern is electrically connected, and the wiring pattern formed on the joint surface side of the external connection terminal support substrate and the external connection terminal provided on the other surface side of the external connection terminal support substrate are electrically connected. And the semiconductor element is resin-sealed. 2. A wiring pattern is formed on the other surface of the semiconductor element mounting substrate, a semiconductor element is mounted by being electrically connected to the wiring pattern, and the wiring pattern is formed on one surface of the semiconductor element mounting substrate. 2. The semiconductor device according to claim 1, wherein the formed wiring pattern or a wiring pattern formed on the bonding surface side of the external connection terminal supporting substrate is electrically connected. 3. A wiring pattern formed on one surface of a semiconductor element mounting substrate and a wiring pattern formed on a bonding surface side of an external connection terminal supporting substrate are bonding wires or through holes formed on the semiconductor element mounting substrate. 3. The semiconductor device according to claim 1, wherein the semiconductor device is electrically connected by. 4. The wiring pattern formed on the other surface of the semiconductor element mounting substrate and the wiring pattern formed on the bonding surface side of the external connection terminal supporting substrate are electrically connected by soldering. The semiconductor device according to claim 1. 5. The semiconductor device according to claim 1, wherein the peripheral edge portion of the semiconductor element mounting substrate and the peripheral edge portion of the through hole provided through the external connection terminal supporting substrate are bonded with an adhesive. apparatus. 6. The semiconductor device according to claim 1, wherein the external connection terminal is a solder ball. 7. The semiconductor element is resin-sealed by a potting method, according to claim 1, 2, 3, 4, 5.
Alternatively, the semiconductor device according to item 6.