JPH0730059A - Multichip module - Google Patents

Abstract

PURPOSE:To enable a multichip module mounted with a plurality of semiconductor elements to be enhanced in element mounting density and lessened in size. CONSTITUTION:Semiconductor element, connecting electrodes 4 and 5 are provided to the base of a recess 3 bored in a multilayer board 1 and the upside of the multilayer board 1 respectively, a semiconductor element 6 is housed in the recess 3, and a semiconductor element 8 is mounted on the board 1 bestriding the recess 3 so as to enhance semiconductor elements mounted on the multilayer board 1 in density. By this setup, a multichip module of this constitution can be enhanced to be two to three times as high in degree of integration as or lessened to be 1/2 to 1/3 as large in size as a conventional one.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a multi-chip module formed by mounting a large number of semiconductor elements and other electronic elements on the surface and connecting them by predetermined electric wiring.

[0002]

2. Description of the Related Art A conventional multi-chip module generally has a structure in which semiconductor elements are mounted on one plane of an electric wiring board as shown in FIG. The multi-layer board has electrical wiring for connecting the semiconductor elements and the external input / output terminals, and the semiconductor elements are mounted on one plane of the board. To be done.
The required size of the multilayer substrate is determined by the number and size of semiconductor elements to be mounted (see, for example, Japanese Patent Laid-Open No. 3-93259).

[0003]

In this conventional multi-chip module structure, the size of the substrate is determined by the size and number of semiconductor elements formed on one plane of the substrate, so that the demand for high integration and miniaturization is met. There was a problem that it was difficult.

The present invention has been made in view of the above problems of the conventional technique, and it is an object of the present invention to provide a multi-chip module capable of improving the packaging density of semiconductor elements and miniaturizing the module. Has an aim.

[0005]

The gist of the present invention for achieving the above object lies in the following two items.

[1] In a multi-chip module in which a plurality of electronic elements including semiconductor elements are mounted on the surface and electric wirings connected to the electronic elements are formed, a semiconductor element (6, 8) and a multi-layer substrate are used. Nari, multilayer board (1)
Is provided with a plurality of recesses (1) for fitting the semiconductor elements (6, 8), and semiconductor element connecting electrodes (4,
5) is patterned, a plurality of external input / output terminals (2) for transferring input / output signals to / from the outside are provided, and electric wiring is provided between the semiconductor elements (6, 8) and the external input / output terminals (6). 2) and between the semiconductor element (6, 8) and the external input / output terminal (2), and the semiconductor element (6,
8) is a multi-chip module characterized by being fitted to the bottom of the recess (3) or mounted on the recess (3) with a crotch.

[2] The multichip module according to the above [1], wherein the recess (3) is sealed with a resin.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.

FIG. 1 is a vertical sectional view of a multi-chip module according to an embodiment of the present invention.

A multi-chip module formed by mounting a large number of semiconductor elements 6 and 8 and other electronic elements on the surface and connecting them by predetermined electric wiring is composed of the semiconductor elements 6 and 8 and the multilayer substrate 1.

The multi-layer substrate has semiconductor element connecting electrodes 4 and 5 patterned on the bottom and top thereof, and a plurality of recesses 3 for fitting the semiconductor elements 6 and 8 therein. A plurality of external input / output terminals 2 are provided for exchanging input / output signals with the outside. Electrical wiring is provided between the semiconductor elements 6 and 8, between the external input / output terminals 2, and between the semiconductor elements 6 and 8 and the external input / output terminals at the bottom, the top and the inside.

The semiconductor elements 6 and 8 are the recesses 3 of the multilayer substrate 1.
It is fitted and mounted using the bottom part and the circumference of the upper part of the recess.

An electrode 4 for connecting a semiconductor element is formed on the bottom of the recess 3. Further, the semiconductor element connecting electrode 5 is also provided in a portion corresponding to the upper portion of the recess 3.

First, the semiconductor element 6 is mounted in the recess 3, and the circuit of the semiconductor element 6 is connected to the connection electrode 4 provided at the bottom of the recess. In FIG. 1, the semiconductor element 6 is connected with the circuit side facing upward by a wire bonding method using a gold or aluminum thin wire 7. After mounting the semiconductor element 6 in the recess 3, the semiconductor element 8 is mounted so as to straddle the recess. The semiconductor element 8 straddling the recess is housed in a plastic package or a ceramic package provided with connection terminals 9, or a semiconductor tape having a semiconductor element mounted on a carrier tape (11 in FIG. 3). Use the element.

The connection with the multi-layer substrate is carried out with the connecting electrode 5 provided on the upper part of the recess, and a method such as soldering is used.

FIG. 2 shows a second embodiment.

In the multichip module according to the first aspect of the invention, the recess 3 is sealed with resin.

A bare semiconductor element 6 is formed in the recess 3 of the first embodiment.
Is used, and the recess is sealed with the resin 10 in order to ensure the reliability of the semiconductor element 6.

FIG. 3 shows a third embodiment of the present invention.

After the semiconductor element 6 is mounted on the bottom of the recess 3, only the terminals of the semiconductor element 6 mounted on the carrier tape 11 are connected to the connection electrodes 52 on the upper part of the recess.

Further, the semiconductor element 6 is dropped into the recess 3 and the semiconductor element connecting electrode 52 provided around the upper electrode 52 is mounted on the semiconductor element 8.

FIG. 4 shows a fourth embodiment in which the recess 3 is provided with a step-like step 12.

The structure is characterized in that the connecting distance between the semiconductor element 6 and the connecting electrode of the multilayer substrate is shortened.

[0024]

As described above, in the multi-chip module structure of the present invention, since the semiconductor elements can be stacked and mounted in the height direction, the integration can be increased by 2 to 3 times as compared with the conventional multi-chip module ( Higher density), or 1/2 ~
1/3 reduction in size can be realized. Further, by sealing the recess with resin, the reliability of the semiconductor element 6 and the module can be secured.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a first embodiment of the present invention.

FIG. 2 is a partial vertical cross-sectional view of a second embodiment of the present invention.

FIG. 3 is a partial vertical sectional view of a third embodiment of the present invention.

FIG. 4 is a partial vertical sectional view of a fourth embodiment of the present invention.

FIG. 5 is a vertical sectional view of a conventional multi-chip module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multilayer substrate 2 External input / output terminal 3 Recess 4 Electrode for connecting semiconductor element 5 Electrode for connecting semiconductor element 6 Semiconductor element 7 Fine wire 8 Semiconductor element 9 Connection terminal 10 Resin 11 Terminal portion of carrier tape 12 Stepped step portion 13 Cap 14 Multilayer Substrate 51 Semiconductor Element Connecting Electrode 52 Semiconductor Element Connecting Electrode

Claims (2)

[Claims] 1. A multi-chip module in which a plurality of electronic elements including a semiconductor element are mounted on a surface and electric wirings connected to the electronic elements are formed. The multi-chip module comprises a semiconductor element and a multi-layer substrate. Is provided with a plurality of recesses for fitting the semiconductor elements, patterned electrodes for connecting the semiconductor elements, and a plurality of external input / output terminals for exchanging input / output signals with the outside. The electrical wiring connects between the semiconductor elements and between the external input / output terminals and between the semiconductor element and the external input / output terminals, and the semiconductor element is fitted to the bottom of the recess, Alternatively, the multi-chip module is characterized in that the recess is mounted in a crotch shape. 2. The multi-chip module according to claim 1, wherein the recess is sealed with resin.