JPH09126834A - Sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize a sensor device. SOLUTION: A circuit substrate 3, on which a chip-shaped sensor part 1 and a signal process part 2 signal-processing the output of the sensor part 1 are mounted, is contained in a housing 11 which is formed out of a synthetic resin into nearly a box shape. A plurality of terminal plates 20... wherein a metal member is formed into a band plate shape are arrayed in the housing 11 with insert formation. A base end part 20a of the terminal plate 20, which is arrayed on one side of the housing 11 out of the terminal plates 20..., is mounted on a supporting table 12. And, the end part of the circuit substrate 3 in which a near semicircular-shaped through hole 3a is formed is crossed by inclining toward the base end part 20a, and in this state, joined with conductive bonding agent 4. Like this manner, the circuit substrate 3 and the terminal plate 20 are inclined for crossing each other, so that the dimension of the housing 11 is miniaturized in comparison with a conventional example.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor device for detecting a physical quantity such as pressure or acceleration.

[0002]

2. Description of the Related Art FIG. 17 is a side sectional view showing an example of a conventional sensor device. This sensor device is for detecting the acceleration applied to the main body of the device. For example, the sensor device is formed in a chip shape with a diaphragm formed by using semiconductor processing technology, and the magnitude of the applied acceleration is measured. A circuit unit such as an IC, a resistor, or a capacitor that constitutes a sensor unit 1 that outputs a corresponding signal and a signal processing unit 2 that processes a signal output from the sensor unit 1 to obtain a detection output (voltage output, etc.) is mounted. The circuit board 3 is housed in a housing 11 made of synthetic resin.

The housing 11 is formed in a substantially box shape with one surface open, and the end portion of the circuit board 3 is inside the housing 11 with the mounting surface facing the bottom surface facing the opening surface and slightly tilted. It is placed on the support stand 12 that is provided in a protruding manner. Further, a plurality of strip-shaped terminal plates 20 ... Are arranged in a row from both side surfaces adjacent to the opening surface of the housing 11, and the tip ends thereof are projected to the outside and folded to the bottom surface side of the housing 11. It has been tuned.

Further, the terminal boards 20 arranged in a row on one side surface of the housing 11 have their base end portions 20a in the housing 11 on the support base 12 and the circuit board 3 respectively.
Is placed adjacent to, and is electrically connected to the pattern (not shown) provided on the end portion of the circuit board 3 on the side opposite to the mounting surface by wire bonding the gold wire 40.

[0005]

However, in the above-mentioned conventional example, the connection method by wire bonding is used for the connection between the circuit board 3 on which the sensor section 1 and the signal processing section 2 are mounted and each terminal board 20. Therefore, the anti-mounting surface of the circuit board 3 and the surface of the terminal plates 20 need to be substantially flush with each other.
That is, the inclination of both is ± 1 degree at most and the step is 1 μm.
The distance between the support base 12 and the side wall should be considered so that the side wall of the housing 11 does not hit the capillary 35 and hinder the bonding when the capillary 35 of the wire bonder is inserted into the housing 11. Since it was necessary, there was a problem that the housing 11 could not be easily downsized.

On the other hand, in the above-mentioned conventional example, since the housing 11 is made of only synthetic resin, it is likely to be deformed by heat or external force (including distortion transmitted from the terminal plates 20 ...), and the synthetic resin. Made housing 11
However, there is a problem that the sensor unit 1 and the signal processing unit 2 mounted on the circuit board 3 are easily affected by external noise because the internal circuit board 3 is not electrically shielded. It was

The inventions set forth in claims 1 to 3 are intended to solve the former problem, and to provide a sensor device which can be miniaturized. Further, the invention of claims 4 to 7 is intended to solve the latter problem, and it is an object of the invention to provide a sensor device which is prevented from being deformed by heat or an external force and is hardly affected by external noise. It is a thing.

[0008]

In order to achieve the above-mentioned object, the invention of claim 1 obtains a detection output to the outside by performing signal processing on a sensor section for detecting a predetermined physical quantity and the output of this sensor section. A plate-shaped circuit board on which at least a circuit element that constitutes the signal processing unit is mounted, a housing in which the circuit board is housed, and one or a plurality of terminal connecting portions provided at the end of the circuit board are respectively provided. 1. A sensor device comprising: one or a plurality of terminal plates, each of which has its end portion joined and electrically connected to a sensor portion and a signal processing portion on a circuit board, and each tip portion protruding outside the housing. , The terminal end portion of the circuit board and the base end portion of the terminal board, which are crossed with each other in a state where the end portion of the circuit board is tilted at a predetermined angle and intersected with each other, are joined by a conductive adhesive. Consists of times The size of the housing can be reduced by the amount that the board and the terminal board are crossed. Moreover, since the circuit board and the terminal board are tilted by a predetermined angle, a large gap is created between the circuit board and the terminal board. As a result, the adhesion area of the conductive adhesive can be increased, and the bonding strength between the terminal connection portion of the circuit board and the base end portion of the terminal board can be improved. Furthermore, by using a conductive adhesive for joining,
Not only can workability be improved as compared with soldering, but so-called heat shock due to the difference in the coefficient of thermal expansion between the circuit board and the terminal board can be avoided because the housing is not exposed to high temperatures as in the case of soldering. In addition, it is possible to prevent cracks and the like from being generated at the joint portion, and it is not necessary to form the housing with a high heat resistant resin.

According to a second aspect of the invention, in the first aspect of the invention, the adhesive for joining the terminal connecting portion of the circuit board and the base end portion of the terminal board is made of a resin having a softness, which is caused by thermal stress. It is possible to prevent the occurrence of cracks in the joint portion and obtain stable characteristics. According to a third aspect of the present invention, in the first or second aspect of the invention, the terminal connecting portion of the circuit board is provided with a substantially semicircular through hole, and the terminal connecting portion and the base end portion of the terminal plate are provided. Since the appropriate gap is formed by the through hole between them, the adhesive easily flows around the entire joint portion, and the joint area of the terminal connecting portion can be increased to improve the joint strength.

In order to achieve the above object, the invention of claim 4 comprises a sensor section for detecting a predetermined physical quantity and a signal processing section for signal processing the output of this sensor section to obtain a detection output to the outside. A flat plate-shaped circuit board on which the circuit elements are mounted at least, a housing made of synthetic resin in which the circuit board is housed, and a plurality of terminal connection portions arranged in a row at the end portions of the circuit board have respective base end portions. A sensor device comprising a plurality of terminal plates that are joined together and electrically connected to a sensor unit and a signal processing unit on a circuit board, and each tip of which protrudes outside the housing. A terminal connecting plate which is formed in a flat plate shape and integrally connects the respective base end portions of the plurality of terminal plates, and the terminal connecting plate is embedded in the bottom surface of the housing. of Of the housing due to heat and external force, and because the terminal connecting plate is conductive, the circuit board inside the housing is shielded by the terminal connecting plate, which prevents external noise. Can be less affected.

According to a fifth aspect of the invention, in the invention of the fourth aspect, a cover formed in a substantially box-like shape with a conductive member is covered in an opening of a housing formed in a box-like shape having at least one surface opened. The circuit board is also shielded from the opening surface side of the housing by the conductive cover, so that it is possible to further reduce the influence of external noise.

According to a sixth aspect of the invention, in the fifth aspect of the invention, the cover and the terminal connecting plate are electrically connected to each other, and the circuit board in the housing is shielded more reliably to prevent external noise. It can be made very insensitive. According to a seventh aspect of the invention, in the fifth or sixth aspect of the invention, the terminal plate and the cover are formed of a magnetic metal member, and not only electrical shield but also magnetic shield is possible.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION

(Embodiment 1) FIG. 1 is a side sectional view showing a first embodiment of the present invention. The sensor device according to the present embodiment is for acceleration detection, and since the basic configuration is common to that of the conventional example, common parts are denoted by the same reference numerals and description thereof is omitted. The sensor unit 1 mounted on the circuit board 3 made of a printed circuit board has a diaphragm that uses a semiconductor processing technology as in the conventional example to detect acceleration, but the present invention is not limited to this. However, the configuration of the sensor unit or the detected physical quantity is not the gist of the present invention.

As shown in FIG. 3, the circuit board 3 is formed in the shape of a rectangular plate, and substantially semicircular through holes 3a are formed at four positions at the terminal connection portions at both ends in the longitudinal direction. They are arranged in rows at approximately equal intervals. Further, lands 3b formed by attaching AgPt are provided in the vicinity of the peripheral edge and the inner side surface of the four through holes 3a on the one end side, respectively.
These lands 3b are connected to the wiring pattern formed on the circuit board 3, and are connected to the _Vcc terminal, OUT terminal, GND terminal and ER in the internal connection diagram of the sensor device shown in FIG.
It corresponds to each R terminal.

Further, as shown in FIG. 5, a plurality of terminal boards 20 are provided.
Are formed into a strip plate shape by punching a thin plate-shaped metal member, and the base end portion 20a of each terminal plate 20 is wider than the tip end portion 20b. When the substantially box-shaped housing 11 is injection-molded with synthetic resin,
As shown in FIG. 6, the terminal plate 20 is insert-molded,
After that, the terminal boards 20 ... Are separated from the unnecessary edge portions 21 so that the terminal boards 20 ...
Of the housing block 10 with the tip 20b side of the
Are formed (see FIG. 1). Where the housing 11
Four terminal boards 20 inserted into one side of the
₁ to 20 _4, each base end portion 20a each housing 1
1 is mounted at a predetermined interval on a support 12 that is erected inside.

Next, the circuit board 3 which is the gist of the present embodiment
The joining portion between the base end portion 20a of the terminal board 20 and the terminal board 20 will be described. In this embodiment, as shown in FIGS. 1 and 2, the end portion of the circuit board 3 provided with the lands 3b and the through holes 3a is inclined on the base end portion 20a of the terminal board 20 by a predetermined angle so as to intersect. In this state, the land 3b and the base end portion 20a of the terminal board 20 which cross each other have a conductive adhesive 4
It is characterized by being joined by. That is, by intersecting the circuit board 3 and the terminal board 20 at their joints, it is possible to downsize the housing 11 (about 1.5 mm) as in the dimensional example shown in FIG. 1 and FIG. 17 showing the conventional example. Become. However, if the two are simply crossed in a substantially parallel state, the joint area between the circuit board 3 and the terminal board 20 cannot be so large that the joint strength becomes weak. By tilting and intersecting with each other, a gap is formed between the mounting surface of the circuit board 3 and the upper surface of the terminal board 20, around which the adhesive agent wraps. For this reason, the bonding area by the adhesive is expanded and the bonding strength can be improved. Further, by forming a through hole 3a having a substantially semicircular shape at a portion corresponding to the terminal connecting portion on the circuit board 3 side,
As shown in FIG. 2, the periphery of the through hole 3a and the terminal board 20
A proper gap is formed between the gap and the gap, so that the adhesive easily flows into the space created by tilting the circuit board 3 with respect to the terminal board 20 from the gap.

Further, in this embodiment, the land 3b of the circuit board 3 and the base end 20a of the terminal board 20 are joined by a conductive adhesive, but compared to the case of joining by soldering, There are advantages like. That is, in the case of soldering, the space between the joint portion and the side wall 10a of the housing 11 cannot be reduced so much in order to facilitate the work, which is disadvantageous for downsizing, but when using an adhesive. Compared with the case of soldering, it is possible to reduce the above-mentioned interval, and the synthetic resin forming the housing 11 needs to have heat resistance capable of withstanding the high temperature at the time of soldering. In the case of an agent, if one with a relatively low curing temperature (about 150 ° C) is used, the housing 1
Since it is not necessary to use a high heat-resistant resin as the forming material of No. 1, the cost can be reduced. Further, in the case of soldering, the circuit board 3
Also, there is a problem that cracks occur on the solder joint surface when a so-called heat shock is applied due to the difference in the coefficient of thermal expansion of the terminal board 20, but such a problem does not occur in the case of an adhesive. . As an adhesive, Si
By using a synthetic resin-based conductive adhesive that has softness such as resin or urethane, it is possible to more reliably suppress the occurrence of cracks due to the above thermal stress, and stabilize the characteristics as a sensor device. Can be achieved.

By the way, a potting agent 5 made of Si gel is provided inside the housing 11 in which the circuit board 3 is housed.
After being potted, the cover 13 made of synthetic resin and formed in a substantially box shape is fitted from the opening side of the housing 11 as shown in FIG. 7, and the sensor device is completed. In addition,
A pair of locking holes 13a is provided on both side surfaces of the cover 13 in the longitudinal direction, and a pair of engaging claws 14 projecting from both side surfaces of the housing 11 in the longitudinal direction are engaged with the periphery of the locking hole 13a. By fitting the cover 13 to the housing 1,
It is designed to combine with 1.

Further, the sensor device thus assembled can detect the acceleration applied in the direction of the arrow in FIG. 7 (b). That is, by supplying an operating power supply from the outside between the _Vcc terminal and the GND terminal shown in FIG. 4, the detection output (voltage output) according to the direction and magnitude of the applied acceleration as shown in FIG. 8 is output. It can be taken out from the terminal.

(Embodiment 2) The second embodiment of the present invention is characterized by the structure of the housing block 10 ', and other configurations are common to those of the first embodiment. Therefore, only the characteristic parts of the present embodiment will be described, and illustration and description of the parts common to the first embodiment will be omitted.

The housing block 1 in this embodiment
In 0 ', as shown in FIG. 10, the base end portions 20 of the three terminal boards 20 _{5 to} 20 ₇ which are not joined to the circuit board 3 are connected.
9A, a terminal connecting plate 22 formed in a substantially L shape is provided to integrally connect the base end portions 20a ...
As shown in FIG. 5, it is embedded in the bottom of the housing 11 'by insert molding.

The terminal connecting plates 22 are formed at the same time when the terminal plates 20 are formed by punching, and in the case of the first embodiment, the removed portions, that is, the terminal plates 20 ₁ to 4 having four ends are formed. the shed flat portion 20 _4, is formed by bending a substantially L-shaped at the three terminal plates 20 _{5-20 7} of the base end portion 20a of the other end. Then, as described in the first embodiment,
The seven terminal boards 20 ...
Insert molding is performed at the same time when 1'is injection-molded, and the terminal connecting plate 22 is embedded in the bottom portion of the housing 11 'facing the opening surface.

According to this embodiment, each base end portion 2 of the terminal plates 20 _{5 to} 20 ₇ is provided on the bottom of the synthetic resin housing 11 ′.
Since the terminal connecting plate 22 that integrally connects 0a ... Is embedded, the strength of the housing 11 'can be increased by the terminal connecting plate 22. Therefore, it is possible to prevent the deformation of the housing 11 ′ due to the heat or the external force applied from the outside, and the circuit board 3 accompanying the deformation of the housing 11 ′.
It is possible to suppress the transmission of stress and strain to the. As a result, it is possible to prevent cracks from occurring in the soldered portions of the circuit components mounted on the circuit board 3 and to prevent changes in the characteristics of acceleration detection due to distortion of the sensor unit 1. In addition, since the terminal connecting plate 22 is formed of a metal member, it is possible to electrically shield the circuit parts constituting the sensor unit 1 and the signal processing unit 2 mounted on the circuit board 3 inside the housing 11 ′. This makes it possible to reduce the influence of external noise and stabilize the characteristics.

(Embodiment 3) The third embodiment of the present invention is characterized by the cover 15 fitted in the housing 11 ', and other configurations are common to the first and second embodiments. Therefore, only the characteristic parts of the present embodiment will be described, and illustration and description of the parts common to the first and second embodiments will be omitted.

The cover 15 in this embodiment is shown in FIG.
As shown by the two-dot broken line, a cover 15 having a developed shape having side pieces 15b and 15c on each of the four sides of the rectangular top plate 15a facing each other is cut out from the plate-shaped metal member. By bending 15c in the same direction at a substantially right angle, it is formed in a substantially box shape. A pair of notches 16 are formed on the side pieces 15b facing the longitudinal direction of the top plate 15a so as to be easily bent. Further, locking holes 17 for coupling the cover 15 to the housing 11 'are provided at both ends divided by the notch 16. Further, terminal pieces 18 are provided so as to protrude along the longitudinal direction of the top plate 15a in the unfolded state at substantially the center of each side piece 15b. As shown in FIG. 12, the cover 15 thus formed is fitted into the housing block 10 ′ from the opening surface side thereof, and the engaging claws 14 of the housing 11 ′ are engaged with the peripheral portion of the locking hole 17. By doing so, the cover 15 and the housing 11 'are coupled to complete the sensor device.

According to this embodiment, since the cover 15 fitted in the housing 11 'is made of metal, the sensor unit 1 and the signal processing unit 2 mounted on the circuit board 3 in the housing 11' by the cover 15 are made. It is possible to electrically shield the circuit components and the like that constitute the. Moreover, in the present embodiment, since the metal terminal connecting plate 22 is embedded in the bottom of the housing 11 ′ and the bottom side is also shielded, a higher shielding effect can be obtained. Further, since the cover 15 is provided with the terminal piece 18 (see FIG. 13), the terminal piece 18 is electrically connected to the terminal plates 20 _{5 to} 20 ₇ connected by the terminal connecting plate 22 to provide a shielding property. The terminal board 20 ₅
By dropping to ground 20 ₇ and the terminal piece 18 with the GND terminal of the appropriate sensor device, it is possible to perform a more effective shielding. The terminal boards 20 _{5 to} 20
_If the terminal connecting plate 22 including ₇ and the cover 15 are each formed of a magnetic metal member, for example, an iron-based metal member such as 42 alloy and SPC, the terminal connecting plate 22 and the cover 1 are formed.
With 5, the magnetic shield can be performed simultaneously with the electric shield.

Now, the manufacturing process of the sensor device of this embodiment will be briefly described with reference to the process flow chart schematically shown in FIG. In addition, some housing blocks 10 '
Excluding the structure and the material and shape of the cover 15
The manufacturing process of the sensor device in 3 is common. First,
V notches 31 for dividing into a plurality of circuit boards 3 are formed vertically and horizontally on the surface of a flat alumina substrate 30 having a thick film resistor for trimming formed on the back surface.
The signal processing section 2 is provided on each circuit board 3 sectioned by
The circuit components such as the IC 32 and the ceramic capacitor 33 that compose the above are mounted (see FIG. 3A), and the chip-shaped sensor unit 1 is mounted and the gold wire 34 is wire-bonded to the sensor on the pattern of the substrate 30. The parts 1 are connected (see FIG. 2B). Then, a protective JCR (Junctin C) is provided on the connection portion between the sensor unit 1 including the gold wire 34 and the pattern.
Oating Resin) 36 is applied (see FIG. 11C).

Next, the alumina substrate 30 is divided at the V notches 31 to obtain individual circuit boards 3 (see FIG. 1D), and the circuit board 3 is attached to the housing block 1.
It is housed in the housing 11 ′ of 0 ′ (see (e) in the figure). At this time, an adhesive is applied to an upper surface portion of the support base 12 erected in the housing 11 ′ on which the base end portions 20 a of the terminal boards 20 are not placed, and the circuit board 3
Are fixed to the support 12. Then, a conductive adhesive is injected from a substantially semicircular through hole 3a formed at the peripheral end of the circuit board 3 to insert a terminal board 20 ₁ into the land 3b of the circuit board 3 and the housing 11 '. ~ 20
The base end portion 20a of ₄ is joined (see (f) in the figure).

Then, Si is placed inside the housing 11 '.
The potting agent 5 made of gel is potted (see FIG. 9 (g)), the edge portion 21 is separated from the tip portion 20b of the terminal plate 20, and the terminal plate 20 is bent to the bottom surface side (see FIG. )reference). Finally, the metal cover 15 is fitted into the housing 11 ′ from the opening surface side, and the housing 1
The sensor device is completed by connecting the cover 15 to 1 '(see (i) and (j) in the figure).

(Embodiment 4) The fourth embodiment of the present invention is characterized by the structure of the cover 15 'fitted in the housing 11', and other configurations are common to those of the first to third embodiments. Is. Therefore, only the characteristic part of the present embodiment will be described, and illustration and description of parts common to the first to third embodiments will be omitted.

The cover 15 'in the present embodiment is common to the third embodiment in that it is formed of a metal member in a substantially box shape, but as shown in FIG. 15, instead of the terminal piece 18, the housing block 10'. The difference is that a press-fitting groove 19 into which the terminal plates 20 _{5 to} 20 ₇ are press-fitted is provided. That is, when a rectangular press-fitting groove 19 is provided at the lower end of both side pieces 15c 'which face each other along the longitudinal direction of the top plate 15a' of the cover 15 ', and when the cover 15' is assembled to the housing block 10 ', it is shown in FIG. The present embodiment is characterized in that the terminal plates 20 _{5 to} 20 ₇ are press-fitted into the press-fitting grooves 19 as described above. The lower end of the press-fitting groove 19 has a terminal plate 20 ₅ ...
The diameter is slightly increased to make it easier to press.

According to the present embodiment, since the cover 15 'is provided with the press-fitting groove 19 into which the terminal plate 20 ₅ is press-fitted, the cover 15' is fitted into the housing 11 'by fitting and is fitted into the press-fitting groove 19. If the terminal board 20 ₅ is press-fitted, the terminal board 20 ₅
, And the cover 15 ′ can be easily electrically connected to each other, and the terminal piece 18 of the cover 15 ′ is not necessary, so that the cost can be reduced. Also in the present embodiment, it goes without saying that the terminal plates 20 ₅ and the cover 15 ′ can be formed of a magnetic metal member so that the magnetic shield is performed simultaneously with the electrical shield.

[0033]

According to the first aspect of the present invention, at least the circuit element constituting the sensor section for detecting a predetermined physical quantity and the signal processing section for processing the output of the sensor section to obtain the detected output to the outside is mounted. A flat plate-shaped circuit board, a housing in which the circuit board is housed, and one or a plurality of terminal connecting portions provided at the end portions of the circuit board, each having a base end joined to the sensor part on the circuit board. And a terminal device electrically connected to the signal processing unit and each of which has one or a plurality of terminal plates each having a front end protruding from the housing, wherein a circuit board end is a base end of the terminal plate. Since the terminal connection portion and the base end portion of the terminal board, which intersect with each other in a state of being inclined at a predetermined angle and intersecting each other, are joined by a conductive adhesive, the circuit board and the terminal board are crossed with each other. Housing only Law can be reduced, moreover, since tilting the circuit board and the terminal plate by a predetermined angle,
To increase the bonding area of the conductive adhesive by increasing the gap generated between the circuit board and the terminal board, and to improve the bonding strength between the terminal connection part of the circuit board and the base end part of the terminal board. There is an effect that can be. Furthermore, by using a conductive adhesive for joining, not only can workability be improved compared to joining by soldering, but the housing is not exposed to high temperatures as in soldering, so circuit boards and terminals There is no so-called heat shock due to the difference in the coefficient of thermal expansion from the plate, it is possible to prevent cracks and the like from occurring at the joint part, and there is an effect that the cost can be reduced because it is not necessary to form the housing with highly heat-resistant resin. .

According to the second aspect of the present invention, since the adhesive for joining the terminal connecting portion of the circuit board and the base end portion of the terminal plate is made of a soft resin, it is possible to prevent the occurrence of cracks in the joining portion due to thermal stress. There is an effect that stable characteristics can be obtained. According to the invention of claim 3, since the terminal connecting portion of the circuit board is provided with a substantially semicircular through hole, an appropriate gap is formed by the through hole between the terminal connecting portion and the base end portion of the terminal plate. As a result, the adhesive easily flows around the entire joint portion, and the joint area of the terminal connecting portion can be increased to improve the joint strength.

According to a fourth aspect of the present invention, a flat plate on which at least a circuit element that constitutes a sensor section for detecting a predetermined physical quantity and a signal processing section for processing the output of the sensor section to obtain a detection output to the outside is mounted. -Shaped circuit board, a housing made of synthetic resin in which the circuit board is housed, and a plurality of terminal connection parts arranged in a row at the end of the circuit board, each of which has a base end joined to the sensor A plurality of terminal plates electrically connected to the signal processing unit and the signal processing unit and each tip of which protrudes outside the housing. Since the terminal connecting plate that integrally connects the base end portions of the terminal plate is provided, and the terminal connecting plate is embedded in the bottom surface of the housing, the terminal connecting plate improves the strength of the housing to prevent heat and external force. Ha It is possible to suppress the deformation of the housing, and since the terminal connecting plate has conductivity, the circuit board in the housing is shielded by the terminal connecting plate, and it is possible to reduce the influence of external noise. This has the effect of stabilizing the characteristics.

According to a fifth aspect of the present invention, since a cover formed in a substantially box shape with a conductive member is fitted in the opening portion of the housing formed in a box shape having at least one surface opened, The cover having the property shields the circuit board from the opening surface side of the housing as well, so that it is possible to further reduce the influence of external noise.

According to the sixth aspect of the invention, since the cover and the terminal connecting plate are electrically connected to each other, the circuit board in the housing can be more surely shielded so that it is extremely unlikely to be affected by external noise. The effect is that you can do it. According to the invention of claim 7, since the terminal plate and the cover are made of a magnetic metal member, not only electric shield but also magnetic shield is possible, and both electric noise and magnetic noise can be obtained. This has the effect of making it less susceptible to the effects.

[Brief description of the drawings]

FIG. 1 is a side sectional view of a state in which a cover of the first embodiment is removed.

FIG. 2 is a side sectional view showing a main part of the same.

FIG. 3 is a circuit board of the same as above, (a) is a front view, (b) is a side view, and (c) is a back view.

FIG. 4 is an internal connection diagram of the above.

FIG. 5 shows the terminal plate in the above, (a) is a plan view,
(B) is a side view.

FIG. 6 shows a housing block of the above,
(A) is a plan view, (b) is a side sectional view, (c) is another side sectional view, and (d) is a rear view.

FIG. 7 shows the same as above, (a) is a partially cutaway plan view,
(B) is a side view, (c) is another side view, (d) is a sectional view taken along the line AA of (a) of the same figure.

FIG. 8 is an explanatory diagram for explaining the operation of the above.

9A and 9B show a housing block according to Embodiment 2, where FIG. 9A is a plan view, FIG. 9B is a side sectional view, FIG. 9C is another side sectional view, and FIG.

FIG. 10 shows the terminal plate of the above, wherein (a) is a plan view and (b) is a side view.

11A and 11B show a cover according to a third embodiment, wherein FIG. 11A is a plan view, FIG. 11B is a partially cutaway side view, and FIG. 11C is another partially cut away side view.

FIG. 12 shows the same as above, (a) is a partially cutaway plan view,
(B) is a side view, (c) is another side view, (d) is a sectional view taken along the line AA of (a) of the same figure.

FIG. 13 is an internal connection diagram of the above.

FIG. 14 is an explanatory diagram for explaining the above manufacturing process.

FIG. 15 shows Embodiment 4, where (a) is a partially broken plan view, (b) is a side view, (c) is another side view, and (d) is AA of the same figure. It is a line side sectional view.

FIG. 16 is a perspective view showing a main part of the above.

FIG. 17 is a side sectional view of a conventional example with a cover removed.

[Explanation of symbols]

 1 Sensor Section 2 Signal Processing Section 3 Circuit Board 3a Through Hole 4 Adhesive 11 Housing 20 Terminal Board 20a Base End

Claims (7)

[Claims] 1. A flat plate-shaped circuit board on which at least a circuit unit that constitutes a sensor unit for detecting a predetermined physical quantity and a signal processing unit for processing the output of the sensor unit to obtain a detection output to the outside is mounted. , A housing in which the circuit board is housed, and one or a plurality of terminal connection portions provided at an end portion of the circuit board are joined at their base ends to electrically connect to a sensor section and a signal processing section on the circuit board. A sensor device comprising: one or a plurality of terminal plates, each of which is connected to the terminal end of the circuit board, and each of which is protruded outside the housing. 1. A sensor device, comprising: a terminal connecting portion and a base end portion of a terminal plate, which are crossed with each other in a crossed state, and which are joined together by a conductive adhesive. 2. The sensor device according to claim 1, wherein the adhesive for joining the terminal connecting portion of the circuit board and the base end portion of the terminal plate is made of a resin having flexibility. 3. The circuit board according to claim 1, wherein the terminal connecting portion is provided with a substantially semicircular through hole.
The sensor device according to claim 1. 4. A flat circuit board on which at least a circuit element that constitutes a sensor section for detecting a predetermined physical quantity and a signal processing section for processing the output of the sensor section to obtain a detection output to the outside is mounted. , A synthetic resin housing in which the circuit board is housed, and a plurality of terminal connection portions arranged in a row at the end portions of the circuit board, each of which has a base end portion joined to the sensor portion and a signal processing portion on the circuit board. A sensor device comprising a plurality of terminal plates electrically connected to the terminal plate and each tip of which protrudes outside the housing, wherein each of the plurality of terminal plate bases is formed in a flat plate shape wider than the terminal plate. A sensor device comprising a terminal connecting plate for integrally connecting end portions, the terminal connecting plate being embedded in a bottom surface of the housing. 5. A cover, which is formed in a substantially box shape and is made of a conductive material, is fitted to the opening of a box-shaped housing having at least one surface opened. The described sensor device. 6. The sensor device according to claim 5, wherein the cover and the terminal connecting plate are electrically connected to each other. 7. The sensor device according to claim 5, wherein the terminal plate and the cover are formed of a magnetic metal member.