JPH09107263A - Electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce an electronic parts element while always keeping a case close by bending a taking-out electrode to electrically join it to a leading-out electrode provided in the electronic parts element after arranging the electronic parts element in a closed space. SOLUTION: The end part of a lead electrode 11 pierces a diaphragm 1 through a through hole 13 and passes the side of the diaphragm and is extended to the opposite side of the root part and forms a leading-out electrode 14. A taking-out electrode 18 provided on a through hole 17 as the electrode leading- out part formed in a rear case 3 correspondingly to the leading-out electrode 14 is brought into contact with the leading-out electrode 14, and thereby, it is connected to an external electrode 5. After front and rear cases 2 and 3 and the diaphragm 1 are directly joined, the taking-out electrode 18 is bent from the side of the through hole 17 to connect the leading-out electrode 14 connected to an exciting electrode and the taking-out electrode 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component using a package such as crystal and glass.

[0002]

2. Description of the Related Art A conventional electronic component of this type comprises an electronic component element and front and back cases which cover the electronic component element and sandwich the outer peripheral portion of the electronic component element between the electronic component element and the electronic component element. Has a tongue-shaped vibrating portion inside the holding portion by the front and back cases, and excitation electrodes are formed on the front and back of the vibrating portion. The electrical drawing of the electronic component element has been performed by filling a through hole formed in the case by sputtering.

[0003]

In the above-mentioned conventional example, since the hole is filled by sputtering, at the edge portion of the bottom surface of the through hole provided in the case, the film growth from the bottom surface and the wall surface of the through hole are formed. A boundary for film growth will be created. Since a pinhole is formed in this portion, there is a problem that the pinhole serves as a leakage path and the package cannot be sealed.

An object of the present invention is to provide an electronic component having an improved package sealing property.

[0005]

In order to achieve this object, the present invention relates to a lead-out electrode provided on an electronic component element and a lead-out provided on the inner surface of a case so as to close a through-hole provided in at least one of the front and back cases. By bending the electrode inward, the electrode is electrically joined to the lead electrode provided in the electronic component element, and thus the sealing property of the package can be improved.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is an inside / outside case in which the front and back cases are interatomic bonded or an electronic component element is sandwiched between the front and back cases and the substrate and the case are atomically bonded. The electronic component element is disposed in the sealed space provided in the electronic component element, and at least one of the front and back cases is provided in the electronic component element by inwardly bending the extraction electrode provided on the inner surface of the case so as to close the through hole. It is electrically joined to the extraction electrode, and the extraction electrode film is formed on a step-free shape, enabling the formation of a dense, pinhole-free film with excellent sealing properties, and sealing electronic component elements. Since the extraction electrode is curved after being arranged in the space and electrically connected to the extraction electrode provided on the electronic component element, the case can be manufactured while always keeping the case hermetically sealed.

According to a second aspect of the present invention, when a through hole is formed in the case by etching, the lead electrode is curved inward by the external pressure through the through hole, whereby the lead electrode of the electronic component element is formed. It will be able to be electrically connected with.

According to the third aspect of the present invention, when the through hole is provided in the case by the sandblast method, the extraction electrode is curved inward by the abrasive grain jetting pressure, whereby the extraction electrode of the electronic component element can be rationalized. It will be able to be electrically connected with.

According to a fourth aspect of the invention, the case is made of SiO 2.
_It is composed of a material whose main component is ₂ , and facilitates the formation of through holes by etching or sandblasting.

According to a fifth aspect of the present invention, the take-out electrode is made of a material smaller than the case with respect to the processing rate by sandblasting to facilitate bending.

According to a sixth aspect of the present invention, the extraction electrode is composed of at least a layer having sufficient adhesion to the case and a layer having a large shearing force which is easily deformed, and exhibits both bending property and airtightness. It is an improvement.

Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 1 denotes a diaphragm as an electronic component element, which is composed of a quartz plate having a plate thickness of 100 μm. On the front and back of the diaphragm 1, front and back cases 2 and 3 made of a crystal plate having a plate thickness of 400 μm are heated at a temperature lower than the phase transition point of the crystal,
Quartz crystals are directly joined together under pressure. As shown in FIGS. 2 and 3, the vibrating plate 1 has a U-shaped cut groove 6 formed inward thereof, thereby forming a tongue-shaped vibrating portion 7.

Excitation electrodes 8 and 9 are formed on the front and back surfaces of the vibrating portion 7, and lead electrodes 11 and 12 thereof are drawn out through the root portion 10 of the vibrating portion 7, respectively. The end portion of the inner lead electrode 11 penetrates the diaphragm 1 by a through hole 13 as shown in FIGS.
As shown in FIG. 5, the extraction electrode 14 is formed by passing through the side of the vibrating portion 7 and extending to the opposite side of the root portion 10. Further, the lead electrode 12 forms a lead electrode 15 on the side of the root portion 10. And these extraction electrodes 1
The lead-out electrodes 18 provided on the through-holes 16 and 17 as the electrode lead-out portions formed in the back case 3 corresponding to 4, 4 and 15 are connected to the external electrodes 4 and 5 by contacting the lead-out electrodes 14 and 15, respectively. Has been done.

The front and back cases 2 and 3 sandwich the front and back outer peripheral portions of the diaphragm 1 at their outer peripheral portions, and are joined by direct bonding of quartz crystals. The outer peripheral portion of the cut groove 6 is joined, and the portion where the lead electrode 11 passes through the side of the vibrating portion 7 is joined to the back case 3 on the outer side thereof.

In order to form the lead electrode 11 on the side of the vibrating portion 7 on the rear surface side of the diaphragm 1 as described above, as shown in FIGS. , 3 is thickened only at the sandwiching part, and the vibration part 7
The portions where the lead electrodes 11 and 12 are formed are thinned by etching.

FIG. 4 clearly shows the diaphragm 1 after this etching step, and the thickness of the rear surface portion corresponding to the frame line 19 is reduced by etching. Further, the outer peripheral portion of the frame line 19 is a portion which is sandwiched and joined by the front and back cases 2 and 3, and as is apparent from FIG. 4, the sandwiching width 20 on the longitudinal side of the diaphragm 1 is shorter than that of the diaphragm 1. It is wider than the holding width 21.

Further, since the lead electrode 11 is provided on the side of the vibrating portion 7 as shown in FIG. 3, the vibrating portion 7 is naturally deviated to one side from the central portion of the vibrating plate 1.

The notch of the kerf 6 in the root portion 10 has a semicircular shape as shown in FIG. 4, so that cracks are less likely to occur even when an excessive impact is applied.

As shown in FIGS. 7A to 7C, the lead-out electrode 18 is formed in advance on the back case 3 in the single plate state, and then the lead-out electrode 18 and the back case 3 overlap each other. Through holes 16 and 17 are provided by removing a part of the back case 3, and the back case 3 is formed. Since the extraction electrode 18 serves as a sealing film for the package, the adhesion to the back case 3 and the extraction electrode 1
8 The preciseness of itself is required. When the back case 3 is made of quartz, the extraction electrode 18 has a laminated structure, and Ti, Cr, N
Adhesion and denseness can be obtained by forming an adhesion layer using a material such as i and a sealing layer using Cu, Au, Al, or the like by sputtering. In order to remove a part of the back case 3, only the back case 3 is etched using a chemical that does not attack the extraction electrode 18.

The take-out electrode 18 is formed so as to be approximately 1000Å thinner than the gap thickness between the back case 3 obtained by subtracting the thickness of the excitation electrode 9 from the etching thickness of the vibration plate 1 and the back electrode 3. After joining the diaphragm 1 by direct joining, the extraction electrode 18 and the excitation electrode 9
There will be a gap of about 1000Å between them. After joining the front and back cases 2 and 3 and the diaphragm 1 by direct joining, the lead-out electrode 18 is bent from the side of the through holes 16 and 17 so that the lead-out electrodes 14 and 15 connected to the excitation electrode 9 and the lead-out electrodes 14 and 15 are taken out. The electrode 18 will be connected.

At this time, the extraction electrode 18 due to plastic deformation
In order to prevent the occurrence of cracks, it is necessary to select a material having a soft ductility for the sealing layer of the extraction electrode 18. Further, at least 1 μm is required as the thickness that can endure plastic deformation. External electrodes 4 and 5 are high temperature solder,
Eutectic solder or the like is used, but the extraction electrode 18 can also be bent by the thermal process at this time. However, since crystal and solder have poor wettability, a metallization layer with good wettability such as Au / T is prepared in advance.
i, Au / Cu / Ti, Au / Cr, Au / Cu / Cr
Need to be formed. Further, by dipping these materials with a dispenser and applying pressure during the dipping, it is possible to obtain sufficient deflection of the extraction electrode 18.

Further, as shown in FIGS. 8 (a) to 8 (c),
The extraction electrode 18 is provided in advance on the back case 3 in the single plate state under the above-described conditions, and is bonded to the diaphragm 1 by direct bonding. Then, when sandblasting is performed from the side of the back case 3 where the extraction electrode 18 is not provided so that the hole provided in the back case 3 is smaller than the extraction electrode 18, the sandblasting rate of the material of the extraction electrode 18 is reduced. If selected so as to be sufficiently slower than the sandblasting rate of the case 3, only a part of the back case 3 can be removed. When the back case 3 is made of crystal, the crystal is very hard and the processing rate by sandblasting is very fast. When a metal is selected for the extraction electrode 18, the metal is softer and the processing rate by sandblasting is slower than that of crystal, so that a sufficient processing rate can be easily obtained. The ratio is obtained.

When the back case 3 is processed by sandblasting in this manner, the ejection pressure is also applied to the extraction electrode 18 by the sandblasting after the back case 3 part is penetrated by the sandblasting, so that the extraction electrode 18 has a sufficient amount of pressure. You can get a bend. Further, by applying an injection pressure to the extraction electrode 18 by sandblasting, the particle size of the extraction electrode 18 can be reduced, and the film quality can be further densified, whereby a film having excellent sealing performance can be obtained. At the time of sandblasting, it is usually processed with abrasive grains of # 600, which has a high rate.
It is difficult to control the processing by sand blasting of No. 8. Therefore, when the # 1500 abrasive grains are used, the processing rate becomes slow, and the control of removing only a part of the back case 3 becomes easy.

Further, the extraction electrode 18 and the extraction electrode 1
If materials 4 and 15 are selected and alloyed when they are contacted at a high temperature, a more reliable connection can be obtained. In this way, instead of filling the through holes 16 and 17 of the back case 3 later, the extraction electrode 1 having a sealing property in advance is used.
8 is provided in the back case 3, and when the electrodes in the package are taken out by bending it, it is possible to take the electrodes out without penetrating the holes in the back case 3, and the sealing property is very high. You can make an excellent package. By using this structure, the atmosphere at the time of bonding by direct bonding can be vacuumized, so that the package can be vacuum-sealed and an electronic component that can ensure high reliability can be realized.

[0025]

As described above, according to the present invention, the extraction electrode provided on the inner surface of the case is curved inward so as to close the lead-out electrode provided on the electronic component element and the through-hole provided in advance on at least one of the front and back cases. Since it is electrically bonded to the extraction electrode provided on the electronic component element, the extraction electrode is provided in advance on the inner surface of the case, so that the extraction electrode film is formed on a stepless shape and has excellent sealing performance. Since a dense and pinhole-free film is formed, the sealing property of the package can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an embodiment of an electronic component of the present invention.

FIG. 2 is an exploded perspective view thereof.

FIG. 3 is an exploded perspective view thereof.

FIG. 4 is a top view of the diaphragm.

FIG. 5 is a diagram A- of a diaphragm in which a cover is joined to the diaphragm of FIG. 4;
A sectional view

FIG. 6 is a cross-sectional view of a diaphragm obtained by joining a cover to the diaphragm of FIG.
B sectional view

FIG. 7 is a cross-sectional view of the manufacturing method of the electrode extraction portion.

FIG. 8 is a cross-sectional view of the manufacturing method of the electrode extraction portion.

[Explanation of symbols]

 1 diaphragm 2 front case 3 back case 4 external electrode 5 external electrode 6 kerf 7 vibrating part 8 excitation electrode 9 excitation electrode 10 root part 11 lead electrode 12 lead electrode 13 through hole 14 extraction electrode 15 extraction electrode 16 through hole 17 Through Hole 18 Extraction Electrode

Claims (6)

[Claims] 1. An electronic component element is disposed in a sealed space provided in a front and back case in which an electronic component element is sandwiched between the front and back cases or an electronic component element is sandwiched between the front and back cases and the substrate and the case are atomically coupled to each other, An electronic component electrically connected to an extraction electrode provided on the electronic component element by bending an extraction electrode provided on the inner surface of the case so as to close the through hole in at least one of the front and back cases in advance. 2. The electronic component according to claim 1, wherein a through hole is formed in the case by etching, and the extraction electrode is curved inward by external pressure through the through hole. 3. The conductor is curved inward by the abrasive grain injection pressure when the through holes are formed by the sandblast method.
Electronic components listed. 4. The electronic component according to claim 1, wherein the case is made of a material containing SiO ₂ as a main component. 5. The electronic component according to claim 3, wherein the extraction electrode is made of a material smaller than the case with respect to a processing rate by sandblasting. 6. The electronic component according to claim 1, wherein the lead-out electrode is composed of at least a layer having sufficient adhesion to the case and a layer having a large shearing force and being easily deformed.