JPH08797Y2 - Refrigerant flow path adjustment structure for electronic devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A refrigerant flow path adjusting structure of an electronic device for adjusting a flow path of a refrigerant for cooling a plurality of modules arranged in an electronic device, the refrigerant flow path of a module requiring cooling. A flow path resistance adjuster is provided on each of the supply side and the discharge side to adjust the refrigerant pressure and flow rate to be optimum for the module. That is, when the pressure of the refrigerant is increased, the valve of the supply side flow path resistance adjuster is slightly opened, and the valve of the discharge side flow path resistance adjuster is slightly narrowed in the opposite direction, and when the flow rate is increased, the discharge side flow path is adjusted. By opening both the valve of the resistance adjuster and the valve of the supply-side flow path resistance adjuster to a slightly large extent, the pressure and flow rate of the refrigerant can be easily adjusted.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a refrigerant flow path adjusting structure for an electronic device, which can adjust the refrigerant pressure and flow rate of a module mounted on the electronic device to optimal values.

In recent years, there has been a strong demand for smaller and lighter electronic devices in general,
Along with this, electronic parts to be mounted on modules constituting electronic devices are also mounted with high density, for example, ICs, which are highly integrated. Therefore, since the power consumption increases and the amount of heat generation increases, the conductive liquid cooling that effectively dissipates the generated heat (cooling is performed by pressing a heat conduction member such as a bellows provided on the refrigerant flow passage against the heating element). Cooling method) is often used. However, since a plurality of modules that make up an electronic device generate different amounts of heat depending on the mounted components, there is a strong demand for the development of a refrigerant flow path adjusting structure for electronic devices that can easily adjust the refrigerant pressure and flow rate according to the amount of heat generated. Has been done.

[Conventional technology]

FIG. 2 is a system diagram illustrating a refrigerant flow path adjusting structure of a conventional electronic device.

In the figure, a plurality of modules 2 (21, 22 ... 2n) and a refrigerant supply device 1 are mounted on an electronic device that requires liquid cooling, and each module 2 (21, 21, Refrigerant is being circulated to the 22 ... 2n).

However, each module 2 (21,22 ... 2n)
In order to adjust the refrigerant pressure and flow rate according to the calorific value of
For example, the module 21 is provided with a supply side flow path resistance adjuster 4 such as a valve on the refrigerant supply side, the module 22 is provided with a discharge side flow path resistance adjuster 5 such as a valve on the refrigerant discharge side, and is supplied to the module 2n. , No flow path resistance regulators 4 and 5 are provided on the discharge side.

Therefore, although the module 21 can easily adjust the flow rate of the refrigerant by operating the supply-side flow path resistance adjuster 4,
The refrigerant pressure depends on the refrigerant supply device 1. Further, the module 22 can relatively easily adjust the refrigerant pressure by the discharge side flow path resistance adjuster 5, but the refrigerant flow rate depends on the refrigerant supply device 1, and the module 2n further adjusts the refrigerant pressure,
The flow rate is unadjusted and depends entirely on the refrigerant supply device 1.

In addition, the module 2 cools the mounted components through a conductive liquid cooling mechanism (not shown) that cools a heat conductive member such as a bellows provided on the refrigerant flow passage by pressing it against a heating element such as an LSI. Has become. Therefore, if the pressure of the refrigerant flowing in the refrigerant flow passage is erroneously set, various troubles will occur (if the pressure of the refrigerant is too small, the conductivity of heat between the bellows and the heating element becomes poor, and the pressure of the refrigerant is If it is too large, there is a risk of damaging fragile heating elements such as LSI). In addition, if the flow rate of the refrigerant is set incorrectly, the cooling efficiency of the module 2 will decrease.

[Problems to be solved by the invention]

In the refrigerant flow path adjusting structure of the electronic device described above, adjustment of the refrigerant pressure and flow rate of the module flow path is provided on either the supply side or the discharge side, or is not provided on either side and is unadjusted. However, there is a problem in that the optimum value of the cooling performance of the module cannot be obtained and the reliability of the mounted components is reduced.

[Means for solving problems]

The present invention provides a refrigerant flow path adjusting structure for an electronic device that solves the above-mentioned problems and facilitates the adjustment of the optimum value of the cooling performance of the module.

The present invention provides a supply side flow path resistance adjuster at the refrigerant supply side and a discharge side flow path resistance adjustment at the refrigerant discharge side for each module unit in which a heat conduction member provided on a refrigerant flow passage is pressed against a heating element by refrigerant pressure. Respectively, the supply side flow path resistance adjuster arranged on the refrigerant supply side of each module and the discharge side flow path resistance adjuster arranged on the refrigerant discharge side of each module of the respective modules. The problem is solved by providing a refrigerant flow path adjusting structure of an electronic device that controls the pressure and flow rate of the refrigerant supplied to each module by adjusting each unit independently.

[Action]

In such a refrigerant flow path adjusting structure of an electronic device, by providing a flow path resistance adjuster such as a valve on the refrigerant supply side and the discharge side of the module, the refrigerant pressure and flow rate of each module can be freely adjusted. Since the optimum value of the cooling performance of the module can be easily obtained, the reliability of the mounted parts is improved.

〔Example〕

FIG. 1 is a system diagram for explaining an embodiment of the present invention, and the same parts as those in FIG. 2 are designated by the same reference numerals.

In the figure, a plurality of modules 2 (21, 22 ... 2n) and a refrigerant supply device 1 are mounted on an electronic device that requires liquid cooling, and each module 2 (21, 21, Refrigerant is being circulated to the 22 ... 2n).

However, each module 2 (21,22 ... 2n)
In order to adjust the refrigerant pressure and flow rate according to the calorific value of
A supply side flow path resistance adjuster 41 such as a valve is provided on the refrigerant supply side of the module 21, a discharge side flow path resistance adjuster 51 such as a valve is attached to the refrigerant discharge side, and a valve etc. is provided on the refrigerant supply side of the module 22. A supply side flow path resistance adjuster 42 is provided, a discharge side flow path resistance adjuster 52 such as a valve is provided on the refrigerant discharge side, and a module 2n is provided.
A supply side flow path resistance adjuster 4n such as a valve is provided on the refrigerant supply side, and a discharge side flow path resistance adjuster 5n such as a valve is provided on the refrigerant discharge side.

Thus, by providing the supply-side flow path resistance adjusters 4 such as valves on the refrigerant supply side of the module 2 and the discharge-side flow path resistance adjusters 5 such as valves on the refrigerant discharge side, for example, the module 21 To increase the refrigerant pressure of, the valve of the supply-side flow path resistance adjuster 41 may be opened, and conversely, the valve of the discharge-side flow path resistance adjuster 51 may be closed.
When increasing the flow rate of 22, supply side flow path resistance adjuster 42
2 and the valve of the discharge side flow path resistance adjuster 52 should be opened widely. Therefore, in order to keep the refrigerant pressure and flow rate of each module 2 constant, the valve of the supply side flow path resistance adjuster 4 and The valve of the side flow path resistance adjuster 5 may be similarly opened to make the fluid resistance constant.

In this embodiment, the supply-side flow path resistance adjuster 4 and the discharge-side flow path resistance adjuster 5 are described as valves, but not limited to valves, replaceable orifices or the like may be used.

[Effect of device]

As is clear from the above description, according to the present invention, it is possible to easily adjust the refrigerant pressure and flow rate corresponding to each module, so that the reliability of the mounted electronic device is improved and it is extremely effective in maintaining the characteristics of the device. is there.

[Brief description of drawings]

FIG. 1 is a system diagram for explaining an embodiment of the present invention, and FIG. 2 is a system diagram for explaining a refrigerant flow path adjusting structure of a conventional electronic device. In the figure, 1 is a refrigerant supply device, 2, 21, 22 ... 2n are modules, 3 is a flow path, 4, 41, 42 ... 4n are supply side flow path resistance adjusters, 5, 51, 52 ... ..5n is the discharge side flow path resistance adjuster,
Are shown respectively.

Claims (1)

[Scope of utility model registration request] 1. A plurality of modules (21-2n) in which a heat-conducting member provided on a refrigerant flow passage is pressed against a heating element mounted in the plurality of modules (21-2n) by the pressure of the refrigerant.
A refrigerant flow path adjusting structure of an electronic device for adjusting a pressure and a flow rate of the refrigerant when cooling a refrigerant, comprising: a supply side flow path resistance adjuster (41 to 4n), a discharge side flow path resistance adjuster (51 to 5n) is arranged on the refrigerant discharge side, and the supply side flow path resistance adjuster (5n) is arranged on the refrigerant supply side of each module (21 to 2n). 41 ~ 4n) and each module (21 ~ 2n)
By independently adjusting the discharge side flow path resistance adjusters (51 to 5n) arranged on the refrigerant discharge side of each of the modules (21 to 2n).
A refrigerant flow path adjusting structure for an electronic device, characterized in that the pressure and the flow rate of the refrigerant supplied to (n) are controlled.