JPH08318226A - Scrubber cleaning device - Google Patents
Scrubber cleaning deviceInfo
- Publication number
- JPH08318226A JPH08318226A JP7151178A JP15117895A JPH08318226A JP H08318226 A JPH08318226 A JP H08318226A JP 7151178 A JP7151178 A JP 7151178A JP 15117895 A JP15117895 A JP 15117895A JP H08318226 A JPH08318226 A JP H08318226A
- Authority
- JP
- Japan
- Prior art keywords
- brush
- arm
- holding frame
- cleaning
- brushes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 43
- 238000005201 scrubbing Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 12
- 239000012530 fluid Substances 0.000 description 6
- 238000005406 washing Methods 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920001410 Microfiber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 210000000050 mohair Anatomy 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、半導体製造におけるウ
エ−ハやその他の被処理物をブラシによりスクラバ洗浄
するためのスクラバ洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scrubber cleaning device for cleaning wafers and other objects to be processed in semiconductor manufacturing with a brush.
【0002】[0002]
【従来の技術】例えば、ウエ−ハは、半導体製造の各種
工程において洗浄されるが、そのような洗浄装置として
回転するブラシを洗浄液をかけながら洗浄面に押し当て
ウエ−ハの表面の付着物を除去するスクラバ洗浄装置が
用いられている。上記の如きスクラバ洗浄に使用するブ
ラシは、洗浄対象物の状況や粗洗浄、仕上洗浄等の洗浄
段階に応じてナイロン、マイクロクロス、ベルクリン
(商品名)、モヘア等の各種のブラシやスポンジブラシ
が用いられている。2. Description of the Related Art For example, a wafer is washed in various steps of semiconductor manufacturing. As such a washing device, a rotating brush is pressed against a washing surface while a washing liquid is applied to the wafer, so that adhered matter on the surface of the wafer is washed. A scrubber cleaning device that removes is used. Brushes used for scrubber cleaning such as those mentioned above are various brushes and sponge brushes such as nylon, micro cloth, Berkulin (trade name), mohair, etc. depending on the condition of the object to be cleaned and the cleaning stage such as rough cleaning and finish cleaning. It is used.
【0003】上記のようにブラシを用いて洗浄する場
合、被処理物から除去した付着物がブラシに再付着して
該ブラシ自体が汚染されるので、ブラシ自体も洗浄する
ように構成されているが、汚染が進行したときにはブラ
シを交換しなければならない。また、ブラシが摩滅した
り、被処理物の状況に応じて最適のブラシを使用するた
めにもブラシを交換しなければならない。そして、その
ような交換作業は従来の洗浄装置では、装置の運転を停
止して行わなければならないので、作業性が良くなく、
またそのような事態を避けるためには複数台の洗浄装置
を用意しなければならないから、経済的にできなかっ
た。When the brush is used for cleaning as described above, since the adhered matter removed from the object to be processed is reattached to the brush and the brush itself is contaminated, the brush itself is also cleaned. However, if the contamination progresses, the brush must be replaced. In addition, the brush must be worn out, or the brush must be replaced in order to use the optimum brush according to the condition of the object to be processed. And in the conventional cleaning device, such a replacement work has to be performed after stopping the operation of the device, so the workability is not good,
Further, in order to avoid such a situation, it is necessary to prepare a plurality of cleaning devices, which is not economically possible.
【0004】[0004]
【発明の解決課題】本発明の目的は、上記のようにブラ
シを用いて被処理物をスクラバ洗浄するようにしたスク
ラバ洗浄装置において、該装置の運転を停止することな
くブラシを自動的に交換できるようにしたスクラバ洗浄
装置を提供することである。DISCLOSURE OF THE INVENTION An object of the present invention is to provide a scrubber cleaning apparatus for cleaning an object to be processed by using the brush as described above, and the brush is automatically replaced without stopping the operation of the apparatus. An object of the present invention is to provide a scrubber cleaning device that can be used.
【0005】[0005]
【課題解決の手段】本発明によれば、ア−ムの先端に着
脱自在にブラシを取付け、該ア−ムが被処理物をスクラ
バ洗浄する位置から後退した位置に複数のブラシを保持
するブラシ保持枠を設け、上記ア−ムに取付けたブラシ
を該保持枠に保持させて該ブラシを外すと共に別のブラ
シを該ア−ムに装着するよう上記ア−ム若しくはブラシ
を交換駆動する手段を設けたスクラバ洗浄装置が提供さ
れ、上記目的が達成される。According to the present invention, a brush is detachably attached to the end of an arm, and the brush holds a plurality of brushes at a position retracted from the position where the arm scrubbers the object to be treated. A holding frame is provided, and means for driving the arm or brush exchanged so that the brush attached to the arm is held by the holding frame, the brush is removed, and another brush is mounted on the arm. The scrubber cleaning device provided is provided to achieve the above object.
【0006】[0006]
【作用】ブラシを先端に取付けたア−ムは、洗浄位置と
後退位置へ移動し、洗浄位置において被処理物にブラシ
を摺接させてスクラバ洗浄する。ブラシを交換する際に
は上記ア−ムを後退位置に移動し、該ブラシを保持枠に
保持させてア−ムから外すと共に該保持枠に保持されて
いる別のブラシが自動的に上記ア−ムに装着される。The arm with the brush attached to the tip moves to the cleaning position and the retracted position, and the scrubber cleaning is performed by bringing the brush into sliding contact with the object to be processed at the cleaning position. When replacing the brush, the arm is moved to the retracted position so that the brush is held by the holding frame and removed from the arm, and another brush held by the holding frame is automatically moved by the arm. -It is attached to the frame.
【0007】[0007]
【実施例】以下、被処理物としてウエ−ハを洗浄する実
施例について説明する。図1,図2において、ア−ム
(1)は、ウエ−ハ(2)を洗浄する洗浄位置で揺動す
ると共に該洗浄位置から後退した位置へ移動するようモ
−タ(3)で駆動される支柱(4)に支持され、かつア
−ムの先端に取付けたブラシ(5)を上記ウエ−ハ
(2)を囲むカップ(6)を越えて該カップ内に挿入し
該ウエ−ハに摺接させるよう空気圧シリンダ、油圧シリ
ンダ等の流体圧シリンダその他の昇降手段(7)により
昇降可能に設けられている。EXAMPLE An example of cleaning a wafer as an object to be processed will be described below. 1 and 2, the arm (1) is swung at a cleaning position for cleaning the wafer (2) and driven by a motor (3) so as to move from the cleaning position to a retracted position. The brush (5) supported by the column (4) and attached to the tip of the arm is inserted into the wafer over the cup (6) surrounding the wafer (2). A fluid pressure cylinder such as a pneumatic cylinder or a hydraulic cylinder or other lifting means (7) is provided so as to be capable of sliding up and down.
【0008】上記ア−ム(1)の先端に着脱自在に取付
けられたブラシ(5)は、モ−タ(8)により回転さ
れ、かつウエ−ハの接触圧を微調整するため空気圧シリ
ンダ等の流体圧シリンダ(9)により上下動できるよう
に構成されているが、上記昇降手段(7)と兼用するこ
とにより該流体圧シリンダ(9)若しくは上記昇降手段
(7)を省略することができる。上記ブラシ(5)は、
目的に応じて材質や形状を適宜に選択でき、またその駆
動機構、ア−ムへの着脱機構その他を後記するように適
宜に構成することができる。A brush (5) removably attached to the tip of the arm (1) is rotated by a motor (8), and a pneumatic cylinder or the like is used for finely adjusting the contact pressure of the wafer. The fluid pressure cylinder (9) is configured to be movable up and down, but the fluid pressure cylinder (9) or the elevation means (7) can be omitted by also using the fluid pressure cylinder (9). . The brush (5) is
The material and shape can be appropriately selected according to the purpose, and the drive mechanism, the mechanism for attaching and detaching the arm, and the like can be appropriately configured as described later.
【0009】図3,図4にはブラシの一実施例が示され
ている。図に示すブラシ(5)は、筒状のブラシ本体(1
0)の下端に下部フランジ(11)を形成しその下面にベルク
リン(商品名)等のスポンジブラシその他のブラシ体(1
2)を設け、その上方に首部(13)を介し上部フランジ(14)
を形成し、該上部フランジ(14)に数ヶ所の切欠(15)を設
けると共に筒状部にも水抜き穴(16)を設け、さらに該筒
状部には後記ブラシ軸(17)の係止突起(18)を係止するた
めの係合孔(19)・・・を形成してある。One embodiment of the brush is shown in FIGS. The brush (5) shown is a cylindrical brush body (1
A lower flange (11) is formed at the lower end of (0) and a sponge brush such as Berklin (trade name) or other brush body (1
2) is provided, and the upper flange (14) is placed above it through the neck (13).
A plurality of cutouts (15) are formed on the upper flange (14) and a drainage hole (16) is also provided on the tubular part, and the tubular part is provided with a brush shaft (17) described later. Engagement holes (19) ... for locking the stopper projections (18) are formed.
【0010】上記ブラシ軸(17)は、図4(A)に示すよ
うに上述のモ−タ(8)により回転されるようブラシヘ
ッド(20)にねじ着等で固着され、先端を先細にテ−パ−
させると共に軸方向にスリット(21)を設けて可撓性をも
たせ、該可撓性を有する部片の側方に弧状の係止突起(1
8)を突設してある。そして、上記係止突起(18)部分を内
方に撓ませながら上記ブラシ(5)の筒状部をブラシ軸
(17)の先端に挿入し、上記係止突起(18)と係合孔(19)を
係合すれば、図4(B)に示すようにブラシ軸(17)とブ
ラシ(5)を回転不能に装着することができ、また該ブ
ラシ(5)を保持してブラシ軸(17)を上昇させれば上記
係止突起(18)部分は内方に撓んで該ブラシ(5)を上記
ブラシ軸(17)から離脱することができる。なお、図示と
は逆に、ブラシヘッド(20)側に筒状の軸を設け、ブラシ
(5)側に上記ブラシ軸(17)の如き軸を設けて着脱自在
に取付けてよい。The brush shaft (17) is fixed to the brush head (20) by screwing or the like so as to be rotated by the motor (8) as shown in FIG. Taper
In addition, the slit (21) is provided in the axial direction so as to have flexibility, and the arc-shaped locking projection (1
8) is projected. Then, while bending the locking protrusion (18) inward, the cylindrical portion of the brush (5) is moved to the brush shaft.
Insert it at the tip of (17) and engage the locking projection (18) with the engagement hole (19) to rotate the brush shaft (17) and brush (5) as shown in FIG. 4 (B). If the brush (5) is held and the brush shaft (17) is raised, the locking protrusion (18) portion is bent inward and the brush (5) is fixed to the brush (5). It can be disengaged from the shaft (17). Contrary to the illustration, a cylindrical shaft may be provided on the brush head (20) side and a shaft such as the brush shaft (17) may be provided on the brush (5) side for detachable attachment.
【0011】図5には、ブラシの他の実施例が示されて
いる。図5(A)に示すブラシ(5)は、ア−ム(1)
に設けたブラシヘッド(20)にねじ着するようねじ軸(22)
を形成したブラシ本体(10)を有し、該ねじ軸(22)の下方
に上部フランジ(14)を設け、該上部フランジ(14)の下部
に回り止めの角軸を形成した首部(13)を設けてその下方
に下部フランジ(11)を設けてブラシ体(12)を形成してあ
る。該ブラシ(5)を保持して上記ブラシヘッド(20)を
回転させれば、回転方向により上記ブラシは該ブラシヘ
ッド(20)に装着でき、若しくは取り外しできる。なお、
図5(B)に示すように、ブラシヘッド(20)側にねじ軸
(23)を設け、ブラシ(5)のブラシ本体(10)にねじ孔(2
4)を形成しても上述と同様にブラシをア−ムに着脱自在
に取付けることができる。着脱機構としては、上記実施
例の他レバ−機構、カム機構、ばね機構、磁石若しくは
電磁石機構その他適宜の機構を適用して構成することが
できる。FIG. 5 shows another embodiment of the brush. The brush (5) shown in FIG. 5 (A) is an arm (1).
Screw shaft (22) for screwing onto the brush head (20) provided on the
A neck (13) having a brush body (10) formed with an upper flange (14) below the screw shaft (22) and a rotation-preventing angular shaft formed under the upper flange (14). Is provided and a lower flange (11) is provided below it to form a brush body (12). If the brush head (20) is rotated while holding the brush (5), the brush can be attached to or removed from the brush head (20) depending on the rotation direction. In addition,
As shown in Fig. 5 (B), screw shaft on the brush head (20) side.
(23) are provided, and the screw hole (2
Even if 4) is formed, the brush can be detachably attached to the arm in the same manner as described above. The attachment / detachment mechanism can be configured by applying a lever mechanism, a cam mechanism, a spring mechanism, a magnet or an electromagnet mechanism, or any other appropriate mechanism other than the above-described embodiment.
【0012】上記ア−ム(1)は、モ−タ(3)の作用
で洗浄位置で揺動されると共に該洗浄位置から後退位置
へ移動されるが、該後退位置には、複数のブラシを保持
するようブラシ保持枠(25)を設けてある。該ブラシ保持
枠(25)は、図1に示すように平面を円板状に形成した
り、図6に示すように長尺板状に形成し、一側に開口(2
6)する保持溝(27)を形成してある。図7に示すように、
上記保持溝(27)は、上記ブラシ(5)を上方から差し込
むことができるよう開口(26)側に大きく拡開された挿通
部(28)を有し、該挿通部(28)の内方に上記ブラシ(5)
の首部(13)のみを嵌入させるよう径少に形成した係止部
(29)を有し、該係止部(29)の周囲には、図8に示すよう
に上記上部フランジ(14)を載置する段部(30)が形成され
ている。また、上記保持溝(27)に対応して図に示すよう
に数字、アルファベッド等で識別記号を設けておけば、
ブラシの管理がしやすい。The arm (1) is swung at the cleaning position by the action of the motor (3) and moved from the cleaning position to the retracted position. At the retracted position, a plurality of brushes are provided. A brush holding frame (25) is provided to hold the. The brush holding frame (25) has a flat plate shape as shown in FIG. 1 or a long plate shape as shown in FIG. 6, and has an opening (2
A holding groove (27) for 6) is formed. As shown in FIG.
The holding groove (27) has an insertion portion (28) which is greatly expanded on the opening (26) side so that the brush (5) can be inserted from above, and the inside of the insertion portion (28). Above brush (5)
Locking part formed with a small diameter so that only the neck part (13) of the
(29), and a stepped portion (30) for mounting the upper flange (14) is formed around the locking portion (29) as shown in FIG. Further, as shown in the figure, corresponding to the holding groove (27), if an identification symbol is provided with numbers, alpha beds, etc.,
Easy to manage brushes.
【0013】上記ブラシ保持枠(25)は、図1,図2に示
すように、交換すべきブラシを所定位置に定置させるよ
う円周方向や長手方向に移動手段で移動される。図2に
示す実施例では、保持枠を円周方向に回転する移動手段
としてモ−タ(31)を用いているが、図6に示す如き実施
例ではモ−タシリンダ(図示略)やラック、ピニオン機
構等の長手方向に移動させる手段を用いることができ、
その他保持枠に対応した適宜の手段を用いて、各ブラシ
(5)若しくは保持溝(27)が後退位置にあるブラシヘッ
ド(20)に対応する位置に移動するようにする。As shown in FIGS. 1 and 2, the brush holding frame (25) is moved by a moving means in the circumferential direction and the longitudinal direction so that the brush to be replaced can be fixed at a predetermined position. In the embodiment shown in FIG. 2, the motor (31) is used as the moving means for rotating the holding frame in the circumferential direction, but in the embodiment shown in FIG. 6, a motor cylinder (not shown), a rack, A means for moving in the longitudinal direction such as a pinion mechanism can be used,
In addition, each brush (5) or holding groove (27) is moved to a position corresponding to the brush head (20) in the retracted position by using an appropriate means corresponding to the holding frame.
【0014】上記ブラシ保持枠(25)は、好ましくはカセ
ット式に形成し、全体を保持枠カセットとして上記後退
位置へ搬送できるようにするとよい。このような搬送手
段としては例えば、図2に示す実施例では、ロ−タリ−
アクチュエ−タ−(図示略)によりテ−ブル(32)を揺動
可能に設け、鎖線に示す位置で使用済のブラシを保持し
た保持枠カセットを回収できるようにすると共に新しい
ブラシを保持したブラシ保持枠カセット(25)を該テ−ブ
ル(32)に装着し、実線で示す位置に搬送してブラシを交
換するようにしてある。この実施例では、カセット全体
を交換しているが、鎖線に示す位置でブラシのみを交換
するようにしてもよい。The brush holding frame (25) is preferably formed in a cassette type so that the entire brush holding frame (25) can be conveyed to the retracted position as a holding frame cassette. As such a conveying means, for example, in the embodiment shown in FIG.
A table (32) is swingably provided by an actuator (not shown) so that a holding frame cassette holding a used brush can be collected at a position shown by a chain line and a brush holding a new brush. The holding frame cassette (25) is attached to the table (32), and the holding frame cassette (25) is conveyed to the position shown by the solid line to replace the brush. In this embodiment, the entire cassette is replaced, but only the brush may be replaced at the position shown by the chain line.
【0015】上記ブラシは、ウエ−ハ等の被処理物を洗
浄する毎に交換するようにしてもよいし、また被処理物
から離れた位置に公知のブラシ洗浄部を設けてブラシ洗
浄し、複数回被処理物を洗浄して汚れが進行したら交換
するようにしてもよい。該ブラシ洗浄部(33)としては、
超音波ジェット、メガソニック超音波ジェット、シャワ
−洗浄その他のブラシの種類に応じた適宜の洗浄方式を
採用することができる。なお、該ブラシ洗浄部(33)は、
図2に示す実施例では、洗浄位置と後退位置の間に設け
てあるが、後退位置で待機している上記ブラシ保持枠(2
5)に保持されているブラシを洗浄するようにしてもよ
い。このようにすれば、上記ア−ムが洗浄位置に移動し
てウエ−ハをスクラバ洗浄している間に、先に使用した
ブラシを洗浄することができる。The brush may be replaced every time an object to be processed such as a wafer is cleaned, or a known brush cleaning section may be provided at a position distant from the object to be brush-cleaned. The object to be processed may be washed a plurality of times and replaced when the contamination progresses. As the brush cleaning unit (33),
An ultrasonic jet, a megasonic ultrasonic jet, shower cleaning, or any other appropriate cleaning method according to the type of brush can be employed. The brush cleaning unit (33) is
In the embodiment shown in FIG. 2, it is provided between the cleaning position and the retracted position, but the brush holding frame (2
You may make it wash the brush hold | maintained at 5). By doing so, the brush used previously can be washed while the arm is moved to the washing position and the wafer is being scrubbed.
【0016】上記ア−ム(1)に取付けられているブラ
シ(5)を外して上記ブラシ保持枠(25)の保持溝(27)に
保持すると共に該保持枠(25)に保持されている他のブラ
シを上記ア−ムに装着するよう上記ア−ムを交換駆動す
るための手段が設けられている。該駆動手段は、上記ブ
ラシをア−ムにどのような機構で着脱自在に取付けてい
るかによって種々に構成される。上記図1〜図4に示す
実施例の場合には、後記するように、上記ア−ム(1)
を回転する上記モ−タ(3)及び上下動する流体圧シリ
ンダ等の上記昇降手段(7)が上記交換駆動するための
手段としても用いられている。The brush (5) attached to the arm (1) is removed and held in the holding groove (27) of the brush holding frame (25) and held in the holding frame (25). Means are provided for interchangeably driving the arm to mount another brush on the arm. The driving means is variously configured depending on the mechanism for removably attaching the brush to the arm. In the case of the embodiment shown in FIGS. 1 to 4, the arm (1) is used as described later.
The elevating means (7) such as the motor (3) for rotating the motor and the fluid pressure cylinder which moves up and down are also used as means for the exchange driving.
【0017】すなわち、上記モ−タ(3)により上記ア
−ム(1)を揺動させて、上記ブラシ(5)を上記保持
枠(25)の保持溝(27)の挿通部(28)に対向させ、その位置
で上記昇降手段(7)によりア−ム(1)を降下して上
記ブラシ(5)を該挿通部(28)に差し込み、該ブラシ
(5)の首部(13)を上記保持溝(27)の係止部(29)に対向
させる。そして、さらに上記モ−タ(3)によってア−
ム(1)を移動して上記係止部(29)にブラシ(5)の首
部(13)を嵌入する。その後、上記昇降手段(7)により
ア−ム(1)を上昇させると、上記ブラシ(5)は下部
フランジ(11)が上記係止部(29)の溝縁に当って上昇が阻
止されるので、該保持溝(27)に係止され、上記ブラシ
(5)からブラシ軸(17)が外れる。別のブラシを上記ブ
ラシ軸に装着するには、上記と逆の操作で行えばよい。That is, the arm (1) is swung by the motor (3), and the brush (5) is inserted into the holding groove (27) of the holding frame (25). The arm (1) is lowered by the elevating means (7) at that position to insert the brush (5) into the insertion portion (28), and the neck portion (13) of the brush (5) is placed. The holding part (29) of the holding groove (27) is made to face. Then, further by the motor (3),
The brush (1) is moved to fit the neck portion (13) of the brush (5) into the locking portion (29). Then, when the arm (1) is lifted by the lifting means (7), the lower flange (11) of the brush (5) hits the groove edge of the engaging portion (29) and is prevented from rising. Therefore, the brush shaft (17) is disengaged from the brush (5) by being locked in the holding groove (27). To install another brush on the brush shaft, the reverse operation to the above may be performed.
【0018】上記図5に示す実施例では、上記ブラシ
(5)を回転するモ−タ(8)も上記駆動手段として用
いられる。すなわち、上述の実施例と同様に、ブラシ
(5)の角軸の首部(13)を保持溝(27)の係止部(29)に嵌
入させて回り止めした後、上記モ−タ(8)を、ねじ軸
(22),(23)がゆるむ方向に回転させてブラシ(5)とブ
ラシヘッド(20)を外すようにしてある。装着する場合
は、上記モ−タ(8)の回転方向をねじ軸(22),(23)と
ブラシヘッドをねじ着する方向に回転させればよい。In the embodiment shown in FIG. 5, the motor (8) for rotating the brush (5) is also used as the driving means. That is, similarly to the above-mentioned embodiment, after the neck portion (13) of the square shaft of the brush (5) is fitted into the locking portion (29) of the holding groove (27) to prevent rotation, the motor (8) is rotated. ), Screw shaft
The brushes (5) and the brush head (20) are removed by rotating the (22) and (23) in a loosening direction. When mounting, the motor (8) may be rotated in the direction in which the screw shafts (22) and (23) are screwed onto the brush head.
【0019】上記各実施例に示す駆動手段は、いずれも
ア−ム(1)側に設けたモ−タ(3),昇降手段
(7),モ−タ(8)等を用いているが、これらのモ−
タ(3)等と同効の作用を奏するモ−タや流体圧シリン
ダ等をブラシ保持枠(25)側に設けてブラシを直接交換駆
動する駆動手段とすることもできる。The driving means shown in each of the above-mentioned embodiments uses the motor (3), the elevating means (7), the motor (8), etc. provided on the arm (1) side. , These modes
It is also possible to provide a motor, a fluid pressure cylinder or the like having the same effect as that of the motor (3) or the like on the brush holding frame (25) side to directly drive the brush for replacement.
【0020】[0020]
【発明の効果】本発明は上記のように構成されているの
で、上記ア−ム(1)を洗浄位置に移動してウエ−ハ
(2)等の被処理物にブラシ(5)を摺接させ、公知の
ようにスクラバ洗浄することができ、そして、後退位置
に上記ア−ムを移動させれば、ブラシ保持枠(25)に保持
されている他のブラシ(5)と交換することができ、常
に清浄なブラシを用いることが可能であり、その上用途
に応じた数種のブラシを保持枠に保持させておけば、粗
洗浄、仕上洗浄等の洗浄工程に応じて自動的に最適のブ
ラシに交換して洗浄することができ、効率よくかつ1台
の洗浄装置により経済的にスクラバ洗浄することができ
る。Since the present invention is constructed as described above, the arm (1) is moved to the cleaning position and the brush (5) is slid on the object to be processed such as the wafer (2). Can be contacted and scrubber cleaned as is known, and if the arm is moved to the retracted position, it can be replaced with another brush (5) held by the brush holding frame (25). It is possible to use a clean brush at all times. Moreover, if several types of brushes according to the application are held in the holding frame, it can be automatically used according to the cleaning process such as rough cleaning and finish cleaning. The brush can be replaced with an optimum brush for cleaning, and scrubber cleaning can be performed efficiently and economically with one cleaning device.
【図1】本発明の一実施例を示す斜視図。FIG. 1 is a perspective view showing an embodiment of the present invention.
【図2】本発明の構成を示す説明図。FIG. 2 is an explanatory diagram showing a configuration of the present invention.
【図3】ブラシの一実施例を示す斜視図。FIG. 3 is a perspective view showing an example of a brush.
【図4】ブラシ及びブラシ軸を示し、(A)は分離した
状態の一部を断面して示す正面図、(B)はブラシ軸に
ブラシを取付けた状態の断面図。FIG. 4 shows a brush and a brush shaft, FIG. 4A is a front view showing a part of the brush shaft in a separated state, and FIG. 4B is a cross-sectional view showing a state where the brush is attached to the brush shaft.
【図5】ブラシの他の実施例を示し、(A)はブラシに
ねじ軸を設けた実施例の一部の断面図、(B)はブラシ
にねじ孔を設けた実施例の正面図。5A and 5B show another embodiment of the brush, FIG. 5A is a partial cross-sectional view of the embodiment in which the brush is provided with a screw shaft, and FIG. 5B is a front view of the embodiment in which the brush is provided with a screw hole.
【図6】ブラシ保持枠の他の実施例を示す斜視図。FIG. 6 is a perspective view showing another embodiment of the brush holding frame.
【図7】ブラシ保持枠の保持溝を示す一部の拡大平面
図。FIG. 7 is a partial enlarged plan view showing a holding groove of a brush holding frame.
【図8】ブラシ保持枠にブラシを保持させた状態の正面
図。FIG. 8 is a front view showing a state where a brush is held by a brush holding frame.
1 ア−ム 3 モ−タ 5 ブラシ 7 昇降手段 17 ブラシ軸 20 ブラシヘッド 25 ブラシ保持枠 1 arm 3 motor 5 brush 7 lifting means 17 brush shaft 20 brush head 25 brush holding frame
Claims (2)
よう移動可能に設けたア−ムの先端にブラシを着脱自在
に取付け、該ア−ムを洗浄位置から後退させた位置に複
数のブラシを保持するブラシ保持枠を設け、該ブラシ保
持枠に上記ア−ムに取付けたブラシを外して保持すると
共に該保持枠に保持されている他のブラシを上記ア−ム
に装着するよう上記ア−ム若しくはブラシを交換駆動す
る手段を具備することを特徴とするスクラバ洗浄装置。1. A brush is detachably attached to a tip of an arm provided so as to be movable for scrubbing an object to be cleaned at a cleaning position, and a plurality of brushes are retracted from the cleaning position. A brush holding frame for holding the brush is attached to the brush holding frame by removing the brush attached to the arm and the other brush held by the holding frame is attached to the arm. A scrubber cleaning device, characterized in that it comprises means for exchanging the brush or brush.
を所定位置に定置させるよう上記ブラシ保持枠を移動す
る手段を含む請求項1に記載のスクラバ洗浄装。2. The scrubber cleaning device according to claim 1, further comprising means for moving the brush holding frame so as to set the brush to be replaced corresponding to the arm at a predetermined position.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7151178A JPH08318226A (en) | 1995-05-26 | 1995-05-26 | Scrubber cleaning device |
KR1019950039938A KR100221572B1 (en) | 1995-05-26 | 1995-11-06 | A brush scrubber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7151178A JPH08318226A (en) | 1995-05-26 | 1995-05-26 | Scrubber cleaning device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08318226A true JPH08318226A (en) | 1996-12-03 |
Family
ID=15513011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7151178A Pending JPH08318226A (en) | 1995-05-26 | 1995-05-26 | Scrubber cleaning device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH08318226A (en) |
KR (1) | KR100221572B1 (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10177977A (en) * | 1996-12-17 | 1998-06-30 | Shibaura Eng Works Co Ltd | Brush cleaning device |
JPH10223584A (en) * | 1997-02-07 | 1998-08-21 | Dainippon Screen Mfg Co Ltd | Substrate cleaning device |
JPH10308370A (en) * | 1997-05-08 | 1998-11-17 | Dainippon Screen Mfg Co Ltd | Wafer cleaner |
WO1999018600A1 (en) * | 1997-10-06 | 1999-04-15 | Advanced Micro Devices, Inc. | Apparatus and method for cleaning semiconductor wafer |
JPH11285671A (en) * | 1998-04-03 | 1999-10-19 | Tokyo Electron Ltd | Treating device and treating method |
JP2017017201A (en) * | 2015-07-02 | 2017-01-19 | 株式会社ディスコ | Washing device |
WO2017163633A1 (en) * | 2016-03-22 | 2017-09-28 | 東京エレクトロン株式会社 | Substrate cleaning apparatus |
JP2018049926A (en) * | 2016-09-21 | 2018-03-29 | 株式会社Screenホールディングス | Brush storage container, brush storage container storing cleansing brush, and substrate processing apparatus |
CN110813810A (en) * | 2019-11-22 | 2020-02-21 | 湖南新敏雅新能源科技有限公司 | Annotate liquid mouth cleaning device |
JP2021136418A (en) * | 2020-02-28 | 2021-09-13 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
JP2022543181A (en) * | 2019-07-30 | 2022-10-11 | ワールド ワイド デイリー ホールディングス カンパニー リミテッド | Toothbrush and toothbrush head attachment and/or removal device |
KR20240025822A (en) * | 2022-08-19 | 2024-02-27 | 세메스 주식회사 | Semiconductor package burr removing apparatus and method |
KR20240130632A (en) | 2023-02-22 | 2024-08-29 | 가부시키가이샤 스크린 홀딩스 | Substrate processing device |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100372896B1 (en) * | 2000-06-14 | 2003-02-19 | (주)케이.씨.텍 | Apparatus For Cleaning A Substrate |
KR20130039882A (en) * | 2011-10-13 | 2013-04-23 | 세메스 주식회사 | Apparatus for cleaning substrate |
KR101351412B1 (en) * | 2013-04-12 | 2014-01-23 | 주식회사 로그테크놀러지 | The combination method of disc brush for cleaning the glass and wapor and thereof device |
KR101467369B1 (en) * | 2013-10-04 | 2014-12-10 | 주식회사 로그테크놀러지 | The combination method of disc brush for cleaning the glass and wapor and thereof device |
-
1995
- 1995-05-26 JP JP7151178A patent/JPH08318226A/en active Pending
- 1995-11-06 KR KR1019950039938A patent/KR100221572B1/en not_active IP Right Cessation
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10177977A (en) * | 1996-12-17 | 1998-06-30 | Shibaura Eng Works Co Ltd | Brush cleaning device |
JPH10223584A (en) * | 1997-02-07 | 1998-08-21 | Dainippon Screen Mfg Co Ltd | Substrate cleaning device |
JPH10308370A (en) * | 1997-05-08 | 1998-11-17 | Dainippon Screen Mfg Co Ltd | Wafer cleaner |
WO1999018600A1 (en) * | 1997-10-06 | 1999-04-15 | Advanced Micro Devices, Inc. | Apparatus and method for cleaning semiconductor wafer |
JPH11285671A (en) * | 1998-04-03 | 1999-10-19 | Tokyo Electron Ltd | Treating device and treating method |
JP2017017201A (en) * | 2015-07-02 | 2017-01-19 | 株式会社ディスコ | Washing device |
CN108885985A (en) * | 2016-03-22 | 2018-11-23 | 东京毅力科创株式会社 | Weft cleaner |
WO2017163633A1 (en) * | 2016-03-22 | 2017-09-28 | 東京エレクトロン株式会社 | Substrate cleaning apparatus |
JPWO2017163633A1 (en) * | 2016-03-22 | 2019-01-10 | 東京エレクトロン株式会社 | Substrate cleaning device |
CN108885985B (en) * | 2016-03-22 | 2023-07-07 | 东京毅力科创株式会社 | Substrate cleaning device |
JP2018049926A (en) * | 2016-09-21 | 2018-03-29 | 株式会社Screenホールディングス | Brush storage container, brush storage container storing cleansing brush, and substrate processing apparatus |
JP2022543181A (en) * | 2019-07-30 | 2022-10-11 | ワールド ワイド デイリー ホールディングス カンパニー リミテッド | Toothbrush and toothbrush head attachment and/or removal device |
CN110813810A (en) * | 2019-11-22 | 2020-02-21 | 湖南新敏雅新能源科技有限公司 | Annotate liquid mouth cleaning device |
JP2021136418A (en) * | 2020-02-28 | 2021-09-13 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
KR20240025822A (en) * | 2022-08-19 | 2024-02-27 | 세메스 주식회사 | Semiconductor package burr removing apparatus and method |
KR20240130632A (en) | 2023-02-22 | 2024-08-29 | 가부시키가이샤 스크린 홀딩스 | Substrate processing device |
Also Published As
Publication number | Publication date |
---|---|
KR960042995A (en) | 1996-12-21 |
KR100221572B1 (en) | 1999-09-15 |
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