JPH0822875A - Ic socket - Google Patents

Abstract

PURPOSE:To eliminate the need for connecting the electrode portions of a semiconductor chip to an inspecting board via a bump in conducting an electrical test of the semiconductor chip. CONSTITUTION:An IC socket 1 has a connecting board 6 held by a board holder 5, and metallic balls 10 are aligned and joined to a plurality of through holes 8 to match the plurality of electrode portions of a bare chip 7 to be inspected, and extension lines 9 connected to the metallic balls 10 are provided. Each of the extension lines 9 is pressed into contact with the contact portion 11a of an external connector terminal 11. An electrical conduction to the external connector terminal 11 from the electrode portions of the bare chip 7 via the metallic balls 10 and the extension lines 9 can be achieved without the electrode portions of the bare chip 7 being connected temporarily to an inspecting board via a bump of solder or the like. The need for melting solder or re-forming a bump in a conforming bare chip 7 after a test is eliminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket used in an electrical test of a semiconductor device, and is particularly suitable for inspecting a bare chip mounted on a circuit board or the like without using external connection leads. Regarding IC socket.

[0002]

2. Description of the Related Art As one of the methods for mounting a semiconductor device on a circuit board or the like, without using an external connection lead such as a lead frame or TAB, a bump such as a solder formed on an electrode portion of a semiconductor chip is used. A so-called flip-chip mounting is known, in which a chip is connected to a circuit board or the like. A semiconductor chip mounted by such a method is usually called a bare chip.

On the other hand, semiconductor chips are usually subjected to an electrical test, a so-called burn-in test, during the manufacturing process or in the final process for all products or predetermined products.

Conventionally, when inspecting a bare chip as described above, as shown in FIG. 8A, a wiring board 32 is mounted on a wiring board 31 for burn-in test, and a wiring pattern 33 of this wiring board 32 is mounted. The bare chip 36 is mounted by the solder bumps 37.

Alternatively, as shown in FIG. 8B, the connector 38 is mounted on the burn-in test wiring board 31 and the bare chip 3 is formed on the wiring pattern 33 of the wiring board 32.
6 is mounted by the solder bumps 37 in the same manner as described above, and the wiring board 32 is pressed to connect the wiring pattern 33 to the terminals of the connector 38.

[0006]

However, in the conventional bare chip inspection as described above, since the bare chip 36 is temporarily connected to the wiring pattern 33 of the wiring substrate 32 via the solder bumps 37, solder is not applied after the test. After melting, it is necessary to remove the bare chip 36 and re-form a new bump on the non-defective bare chip 36. For this reason, there is a problem that it is not possible to confirm a defect at the time of reprocessing the bump formation, and the inspection process and the manufacturing process are complicated.

Therefore, an object of the present invention is to provide an IC socket in which it is not necessary to temporarily connect the electrode portion of the semiconductor chip to the inspection substrate via the bump during the electrical test of the semiconductor chip.

[0008]

In order to achieve the above object, in an IC socket according to the present invention, conductive projections are arranged corresponding to the electrode portions of a semiconductor chip to be inspected, and the conductivity of the conductive projections is arranged. It is provided with a connecting substrate having a lead wire connected to the projecting body.

The conductive protrusions of the connection board are preferably metal spheres.

Further, it is preferable that the lead-out wiring of the connection board is pressed against the external connector terminal of the socket body.

Further, the lead-out wiring of the connection board and the external connector terminal of the socket body may be connected via a flexible wiring board.

[0012]

According to the IC socket of the present invention configured as described above, the conductive protrusions arranged on the connection board are brought into contact with the electrode portions of the semiconductor chip and are provided on the connection board to be electrically conductive. The lead-out wiring connected to the projecting body is connected to, for example, an external connector terminal of the socket body via a wiring board having pressure contact or flexibility. As a result, electrical connection from the electrode portion of the semiconductor chip to the external connector terminal can be obtained without temporarily connecting the electrode portion of the semiconductor chip to the inspection substrate via the bump such as solder. Therefore, it is not necessary to melt the solder or re-form bumps on the non-defective chip after the test.

[0013]

Embodiments of the IC socket according to the present invention will be described below with reference to FIGS.

First, FIG. 1 is a sectional view of an IC socket according to the first embodiment. The IC socket 1 includes a socket body 2, a lid body 3 that can be opened and closed with respect to the socket body 2, and a lock piece 4 that locks the lid body 3 in a closed lid state. Substrate holder 5 for socket body 2
Is slidably fitted in the up-down direction, and the connection substrate 6 is held by the substrate holder 5.

FIG. 2 is a sectional view of the connecting board, and FIG. 3 is a plan view showing the back surface of the connecting board. A plurality of through holes 8 are formed in the connection substrate 6 corresponding to a plurality of electrode portions of the bare chip 7 (see FIG. 1) to be inspected. The connection board 6 is provided with lead wires 9 from each of the through holes 8. The lead-out wiring 9 penetrates on the back surface of the connection substrate 6 and the conductor layer 9 a formed on the front surface of the connection substrate 6 around the through hole 8 and on the inner periphery of the through hole 8. The conductor pattern 9c extending outward from the periphery of the hole 8 is integrally continuous,
The tip of the conductor pattern 9c serves as an electrode pad 9d.

Then, as shown in FIG. 2 (b), metal spheres 10 that are in contact with the electrode portions of the bare chip 7 are joined to the through-holes 8 on the surface of the connecting substrate 6, respectively. It is preferable that the connecting substrate 6 is made of a material, such as glass, which is minimally deformed in order to form the through holes 8 for arranging the metal balls 10 with high accuracy while having insulating properties. Further, the metal sphere 10 preferably has a shape that is as close as possible to a true sphere in order to make the protrusion heights uniform, and it is preferable to use a material excellent in conductivity and corrosion resistance, such as gold.

The connection substrate 6 is held by the substrate holder 5 as shown in FIG. Then, the elastic contact portions 11a of the plurality of external connector terminals 11 arranged in the socket body 2 are inserted into the openings 5a provided in the substrate holder 5, and the lead wiring 9 of the connection substrate 6 is drawn.
Is elastically pressed against the electrode pad 9d.

In the IC socket 1 of the present embodiment configured as described above, the bare chip 7 is mounted on the connecting substrate 6, and the electrode portion of the bare chip 7 is brought into contact with the metal ball 10 of the connecting substrate 6. , The lid 3 is closed. In this state, from the electrode portion of the bare chip 7 to the metal ball 10 and the lead wiring 9
Electrical connection to the external connector terminal 11 can be obtained via. Therefore, the IC socket 1 is mounted on a tester (not shown) via the terminal pin 11b of the external connector terminal 11, and the bare chip 7 is electrically tested.

As described above, according to the IC socket 1 of this embodiment, by providing the connecting substrate 6 on which the metal balls 10 are arranged, the electrode portion of the bare chip 7 is used as the inspection substrate via the bump such as solder. It is not necessary to make a temporary connection, the inspection can be performed only by placing the bare chip 7 on the connection substrate 6, and the bare chip 7 after the test can be easily taken out without melting the solder.

Since the connecting substrate 6 is provided with the metal balls 10, the bare chip 7 can be easily and surely inspected regardless of the presence or absence of bumps in the electrode portion of the bare chip 7. Since the metal balls 10 of the connecting substrate 6 can be arranged in a highly accurate array position and have a uniform protruding height, it is possible to make contact with the electrode portion of the bare chip 7 extremely reliably.

Next, FIG. 4 is a sectional view of an IC socket according to the second embodiment. In this example, the lead wiring 9 connected to the metal ball 10 is formed on the surface of the connection substrate 6. Therefore, the plan view showing the surface of the connecting substrate 6 is the same as FIG. The electrode pad 9d of the lead wiring 9 and the external connector terminal 11 are connected by the flexible wiring board 12. The wiring board 12 is a film substrate 1 made of, for example, polyimide.
It is possible to use the one in which the lead 14 is formed in 3.
In the case of this example, the substrate holder 5 and the socket body 2
An urging spring 15 is provided between and.

According to the second embodiment, by using the flexible wiring substrate 12, the connection substrate 6 is
Since it is sufficient to form the lead-out wiring 9 only on the front surface side provided with the metal spheres 10, its manufacture is simplified. Further, the structure becomes simpler than the case where the contact portions of the plurality of external connector terminals 11 are bent and extended to the surface of the connecting substrate 6.

Next, FIG. 5 is an enlarged cross-sectional view of an essential part showing a method of joining the metal balls to the connecting substrate. First, the same figure (a)
As shown in FIG. 3, the metal balls 10 are arranged in each of the through holes 8. For this arrangement, a method can be used in which the metal balls 10 are collectively adsorbed by vacuum suction through the through holes 8. Next, as shown in FIG. 2B, the metal sphere 10 is pressed from above to pull out the metal sphere 10 and the conductor layer 9 of the wiring 9.
Join a.

As shown in FIG. 6, when the metal sphere 10 is pressed and joined, the upper end of the metal sphere 10 is aligned with the electrode portion of the bare chip 7, for example, the flat surface 10a as shown in FIG. Alternatively, it may be formed on the concave surface 10b as shown in FIG.

Further, as shown in FIG. 7A, the surface of the joined metal sphere 10 is plated with a protective material 16 to improve the hardness of the metal sphere 10 and the joining strength between the metal sphere 10 and the conductor layer 9a. Alternatively, the conduction performance may be improved. Also, FIG.
As shown in FIG. 3, the surface of the metal sphere 10 may be plated 16, and at the same time, the conductor layer 9b in the through hole 8 of the connection substrate 6 may be plated 17. Further, as shown in FIG. 3C, a stepped portion 18 may be provided at the joint between the metal sphere 10 and the conductor layer 9a to increase the joint area between the two.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various effective modifications and applications are possible based on the technical idea of the present invention. For example, although metal spheres were used in the examples as the conductive protrusions in the present invention, protrusions of various effective materials and shapes can be used.

[0027]

As described above, according to the present invention,
Provision of a connection board in which conductive protrusions are arranged corresponding to the electrodes of the semiconductor chip to be inspected allows the electrode section of the semiconductor chip to be temporarily connected to the inspection board via bumps such as solder during testing. Since it is not necessary to do so, it is not necessary to melt the solder after the test or re-form bumps on the non-defective chip. Therefore, since there is no occurrence of defects due to the reprocessing of bump formation, the yield can be significantly improved, and the inspection process and thus the manufacturing process can be significantly simplified.

Further, according to the present invention, since the connecting substrate has the conductive protrusion, the semiconductor chip can be easily and surely inspected regardless of the presence or absence of the bump in the electrode portion of the semiconductor chip. You can Therefore, it is not limited to a bare chip having bumps on the electrode portion, but may be applied to an electrode portion such as a semiconductor chip wire-bonded from the electrode portion to a lead frame lead, a semiconductor chip in which a lead having a transfer bump in the TAB method is connected to the electrode portion A wide range of application can be obtained even for various types of semiconductor chips without bumps.

[Brief description of drawings]

FIG. 1 is a sectional view of an IC socket according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a connection board in the first embodiment.

FIG. 3 is a plan view showing a back surface of the connection board.

FIG. 4 is a sectional view of an IC socket according to a second embodiment of the present invention.

FIG. 5 is an enlarged cross-sectional view of a main part showing a method of joining metal balls to a connection substrate in an example.

FIG. 6 is an enlarged cross-sectional view of a main part showing a modified example in joining the metal balls.

FIG. 7 is an enlarged cross-sectional view of a main part showing a modified example in joining the metal balls.

FIG. 8 is a cross-sectional view showing a conventional bare chip inspection method.

[Explanation of symbols]

 1 IC Socket 2 Socket Body 3 Lid 4 Lock Piece 5 Board Holder 6 Connection Board 7 Bare Chip 8 Through Hole 9 Lead Wire 9a, 9b Conductor Layer 9c Conductor Pattern 9d Electrode Pad 10 Metal Ball 11 External Connector Terminal 11a Contact 11b Terminal Pin 12 Wiring board 13 Film base material 14 Lead

Claims (4)

[Claims] 1. A connection board having conductive projections arranged corresponding to electrode portions of a semiconductor chip to be inspected and having lead wirings connected to the conductive projections. Characteristic IC socket. 2. The IC socket according to claim 1, wherein the conductive protrusion of the connection board is a metal ball. 3. The IC socket according to claim 1, wherein the lead-out wiring of the connection board is pressed against an external connector terminal of the socket body. 4. The IC socket according to claim 1, wherein the lead-out wiring of the connection board and the external connector terminal of the socket body are connected via a flexible wiring board.