JPH0818287A - Electronic part mounting device - Google Patents

Abstract

PURPOSE:To enable vacuum suction and attraction of a fin part by performing vacuum suction and attraction handling for it while keeping its opening part which easily chips and generates cracks when handled by a mechanical chuck method closed airtightly from an upper surface and right and left. CONSTITUTION:A fin 2 is attached to an upper surface of an electronic part 1. The fin 2 is constructed to effectively emit heat from the electronic part 1 and has a large surface area. When such a fin 2 is attracted, vacuum state is not generated just by vacuum suction from an upper surface of the fin 2 alone because of right and left opening parts of the fin 2 in a surface on the fin 2. As a countermeasure for this problem, right and left opening parts of the fin 2 of an electronic part 6 with a fin is closed by a soft sheet 19. The upper surface is further closed by a main suction block 11 and the fin is vacuum sucked and attracted from a tube.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting electronic parts with finned electronic parts mounted on a substrate, and more particularly to a vacuum suction head capable of vacuum-sucking finned electronic parts and an electronic part equipped with the vacuum suction head. Onboard equipment.

[0002]

2. Description of the Related Art FIG. 5 is a view showing a state of a conventional chuck head for electronic parts. In FIG. 5, 201 is an electronic component, and 207 is a substrate mounted on the surface. At the tip of the chuck head, there is a suction plate 202 made of rubber, and below that is the electronic component 201. When vacuum suction is performed from the vacuum suction pipe 205 in this state, the gap 206 between the suction plate 202 and the electronic component 201 is in a vacuum state, and the electronic component 201 is vacuum suctioned and suctioned. When the electronic component 201 comes into contact with the substrate 207, the arm 204 descends, the compression spring 203 is compressed, and a certain amount of force is applied. There is a temporary fixer (not shown in the drawing) on the substrate 207, and if the electronic component 201 is mounted, the electronic fixer 201 can be applied to the substrate 20 by the temporary fixer.
It has a structure that does not deviate from above 7.

As a conventional technique relating to a method of mounting an electronic component on a substrate, for example, Japanese Patent Laid-Open No. 5-1910 is available.
There is No. 92 publication. In this prior art, the radiator on the electronic component is completely wrapped with a rectangular skirt, and further four side surfaces of the rectangular skirt and the upper surface of the electronic component are brought into close contact with each other to form a vacuum state.
It is a method of adsorption.

Further, as a conventional technique, a method of vacuum suction of only a radiator to handle it has not been found.

Further, in the mechanical chuck system using a robot hand or the like, handling is not possible because the fins are easily cracked or cracked.

[0006]

Among electronic components that generate a large amount of heat, as shown in FIG. 2, the fins 2 having an uneven shape are installed on the upper surface of the electronic component 1, and the electronic component 1 is
The heat generated in (1) was conducted to the fins 2 to improve the cooling property. Therefore, in the vacuum suction head having the conventional structure in which the suction plate is sucked onto the uneven upper surface of the fin 2, a vacuum is generated because the concave surface is open to the atmosphere between the lower surface of the suction plate and the uneven upper surface of the fin 2. Therefore, there is a problem that the finned electronic component 6 cannot be sucked by vacuum suction.

The present invention was devised to solve this problem, and it is an object of the present invention to vacuum and suck the fins 2 of the electronic component 6 with fins, in particular.

[0008]

According to the present invention, there is provided a vacuum suction head capable of creating and handling a vacuum state on the surface of the fin of the finned electronic component.

Further, according to the present invention, there is provided an image processing apparatus for measuring an edge of a finned electronic component vacuum-sucked by a vacuum suction head and an edge of a substrate on which the finned electronic component is mounted. Provided is a position correction mechanism that can correct the position of the misalignment if it has occurred.

Further, according to the present invention, there is provided a pressure adjusting mechanism capable of applying a fixed amount of pressure to the finned electronic component each time when it is mounted on a substrate and providing stable position accuracy every time.

[0011]

In order to achieve the above object, the present invention closes the concave and convex openings of the fins of the electronic component with fins from the upper surface and the left and right, and in a sealed state, the fins of the electronic component with fins are vacuum-sucked by a vacuum suction head. To do. CC the edge of the finned electronic component and the edge of the board on which the finned electronic component is mounted.
Take a picture with the D camera. The deviation of each edge is measured by the image processing device, and if there is deviation, X
The misalignment position is corrected by the Y table and the θ table. After performing the position correction, a fixed amount of pressure is applied every time the finned electronic component is mounted on the substrate.

Thus, the present invention provides a stable method of mounting a finned electronic component every time without attracting and handling the finned electronic component on the substrate on which it is mounted.

[0013]

Embodiments of the present invention will be described below with reference to FIGS.
This will be described with reference to FIG. FIG. 2 is a perspective view of the vacuum suction head 10 and the finned electronic component 6. A fin 2 as shown in the figure is attached to the upper surface of the electronic component 1. The fin 2 has a structure that efficiently generates heat from the electronic component 1 and has a large surface area. When such a fin 2 is sucked, if only vacuum suction from the upper surface of the fin 2 is performed, a vacuum state does not occur because the surface of the fin 2 has openings of the fin 2 on the left and right. Therefore, as a measure to prevent this,
The soft sheet 19 closes the left and right openings of the fin 2 of the finned electronic component 6. Furthermore, the upper surface is the main suction block 1
It is closed by 1, and is suctioned by vacuum suction from the tube A12.

This series of operations is shown in FIGS.
This will be described with reference to (b), FIG. 3 (c) and FIG. 3 (d). FIG. 3A shows a diagram in which the vacuum suction head 10 is on the upper surface of the finned electronic component 6 and is about to be chucked. The left and right soft sheets 19 are the sub suction blocks B13,
The vacuum transmitted by the tubes B14 and C16 by the upper surface of the sub-suction block C15 is vacuum-sucked and adsorbed by the openings of the lower surfaces of the sub-suction block B13 and the sub-suction block C15.

The reason why the left and right soft sheets 19 are vacuum-sucked and sucked by the sub-suction block B13 and the sub-suction block C15 is that the vacuum suction head 1 is attached to the upper surface of the finned electronic component 6.
When 0 is lowered, the width of the two soft sheets 19 on the left and right of the vacuum suction head 10 and the finned electronic component 6 are set.
This is because the fins 2 have the same width. Therefore, the two left and right soft sheets 19 are opened to be wider than the width of the fins 2 and lowered.

FIG. 3B shows a state in which the vacuum suction head 10 is lowered to handle the finned electronic component 6. As described above, the soft sheet 19 is used for the vacuum suction head 10.
Is sucked and held by the sub-suction block B13 and the sub-suction block C15 until the moment when the sheet comes into contact with the fin 2 of the finned electronic component 6, and there is no fear that the soft sheet 19 comes into contact with the fin 2 of the finned electronic component 6.

FIG. 3C shows a state where the soft sheet 19 is in contact with the left and right openings of the fin 2 of the finned electronic component 6. Here, the vacuum state of the sub-suction block B13 and the sub-suction block C15 which are vacuum-sucking the two left and right soft sheets 19 is released. Next, when vacuum suction is started from the tube A12 on the upper surface of the main suction block 11, the vacuum from the upper surface of the opening of the fin 2 of the finned electronic component 6 is transmitted to the left and right of the opening, and the two soft sheets 19 on the left and right are provided. Adhere to the left and right sides of the opening of the fin 2. As a result, the upper surface and the left and right openings of the fins 2 of the finned electronic component 6 are closed by the lower surface of the main suction block 11 of the vacuum suction head 10 and the two left and right soft sheets 19, respectively, and airtightness is maintained. Therefore, it can be sucked in vacuum and can be adsorbed.

FIG. 3D shows a state in which the fin 2 of the finned electronic component 6 is vacuum-sucked, sucked and lifted by the vacuum suction head 10.

FIG. 1 shows an overall configuration diagram of an electronic component mounting apparatus of the present invention. Here, the function of each unit will be described. The base 52 is supported by four vibration isolation adjusters 51 and is installed horizontally. A stand 53 is installed on the base 52, and a Z-axis cylinder 54 as a drive source in the Z direction and a guide guide A55 for vertically descending.
Further, a micrometer head 58, a tension spring 60, and a guide guide B61 are installed for fine adjustment. Further, a shock absorber 57 and a stopper 56 that can be stopped at an arbitrary position are provided in order to eliminate shock and vibration when the sub base 59 descends.

When the finned electronic component 6 is chucked by the operation described with reference to FIGS. 3A to 3D, the finned electronic component 6 is mounted by the guide guide A55 using the Z-axis cylinder 54 as a drive source. 2-3 (mm) of substrate 101
It descends to the front. At this time, the temporary fixer 100 is applied on the substrate 101 by a dispenser or the like (not shown) to prevent the finned electronic component 6 mounted on the substrate 101 from being displaced. When it is lowered to 2 to 3 (mm) on the upper surface of the substrate 101, the micrometer head 58 is rotated to be lowered and brought into contact with the substrate 101. At this time, guide guide B61
Comes down vertically. A tension spring 60 is attached to the bracket 62 so that fine adjustment can be freely performed in the Z direction.

A strain gauge 71 is attached to the parallel leaf spring 70, and a display counter 73 for converting a minute voltage generated by the strain gauge 71 into a load value by a converter 72 when a load is applied. There is. That is, it is possible to know how much load is being applied when the finned electronic component 6 comes into contact with the substrate 101 and is further pressed. Also, this allows a constant pressure load to be applied every time. The parallel leaf spring 70 has a structure capable of moving in parallel in the vertical direction when a load is applied.

In the vacuum suction head 10 of FIG. 2, the light passage holes A17 and the light passage holes B18 are circular holes centered on the boundary between the main suction block 11 and the sub suction blocks B13 and C15. There is. The two light passing holes A17 and B18 are located directly above the edges A3 and B4 of the fin 2 of the finned electronic component 6. The circle indicated by the dotted line indicates the position 5 corresponding to the light passing hole A17.

Therefore, the halogen lamp 74 shown in FIG. 1 is arranged at a position right above the light passing holes A17 and B18 of the vacuum suction head 10. The light source of the halogen lamp 74 passes through the light passing hole A17 and the light passing hole B18 of the vacuum suction head 10 and is applied to the edges A3 and B4 of the fin 2 of the finned electronic component 6. Scope 8
In 2, the edges A3 and B4 of the fin 2 of the finned electronic component 6 are captured as a dark-field image.

The main suction block 11, the sub suction block B13, and the sub suction block C1 of the vacuum suction head 10
The vacuum suction force of 5 is obtained by the ejector 75. As shown in the figure, the ejector 75 is configured to generate a vacuum inside the ejector 75 by the diffuser effect when compressed air is introduced from the compressed air tube 76. Vacuum suction is performed by the vacuum tube 78 connected thereby. Further, the exhaust air is exhausted from the exhaust tube 77 in the figure.

The positioning of the finned electronic component 6 sucked by the substrate 101 and the vacuum suction head 10 is performed by the temporary fixing liquid 1
It is performed at a position of 0.1 (mm) on the upper surface of the substrate 101 before 00 is applied.

FIG. 4 shows a monitor screen before and after the position correction of the board 101 and the finned electronic component 6. In FIG. 1 and FIG. 4, the substrate edge 24 of the substrate 101 and the edge 23 of the finned electronic component of the fin 2 of the finned electronic component 6 are projected on the monitor screen 25, and the deviation 20 in the X direction and the edge 20 in the Y direction are shown. The deviation 21 and the deviation 22 in the θ direction are measured by the image processing device 83. Next, the deviation 20 in the X direction and the deviation 21 in the Y direction are position-corrected by the XY table 104, and the deviation 22 in the θ direction is the θ table 7.
The position is corrected by 9. The Z table 103 is the substrate 1
01 substrate edge 24 and CCD camera 80 scope 8
It is also used to adjust the focal length of 2. At the tip of the CCD camera 80, a scope 82 is attached so that it can enter even a narrow space, and a magnifying lens 81 is also provided, so that it is possible to magnify and observe, and position correction is performed to 0.
It can be done in units of 01 (mm).

Substrate 1 taken by CCD camera 80
01 substrate edge 24 and fin 2 of finned electronic component 6
An image of the edge 23 of the finned electronic component 6 is connected to the image processing device 83 by a cable and is displayed on the monitor 84.

Further, the plate 102 under the substrate 101 has a hole so that the substrate edge 24 of the substrate 101 can be sufficiently observed by the scope 82 of the CCD camera 80. Although not shown in the figure, there is another CCD camera, and needless to say, this observes a point on the diagonal line of the edge 23 of the finned electronic component 6.

The position correction is performed by the above operation, the finned electronic component 6 is brought into contact with the substrate 101, and a constant pressure is applied,
The electronic component mounting apparatus is characterized in that the vacuum suction head 10 can stably mount the electronic component 6 with fins every time.

[0030]

As described above, according to the present invention, the finned electronic component can be vacuum-sucked and adsorbed to be stably mounted at a correct position on the substrate every time.

[Brief description of drawings]

FIG. 1 is an overall view of an electronic component mounting apparatus showing a practical example of the present invention.

FIG. 2 is a perspective view of a vacuum suction head and a finned electronic component.

FIG. 3 is a diagram showing a series of steps in which a vacuum suction head vacuum handles electronic components with fins.

FIG. 4 is a diagram illustrating a position correction mechanism of an electronic component mounting device.

FIG. 5 is a diagram showing a conventional electronic component handling method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Fin, 3 ... Edge A, 4 ... Edge B, 5 ... Position corresponding to light passing hole A, 6 ... Electronic component with fin, 10 ... Vacuum suction head, 11 ... Main suction block, 12 … Tube A, 13… Sub suction block B, 1
4 ... Tube B, 15 ... Sub suction block C, 16 ... Tube C, 17 ... Light passing hole B, 18 ... Light passing hole C, 19 ... Soft sheet, 20 ... Deviation in X direction, 21 ... Deviation in Y direction,
22 ... Deviation in θ direction, 23 ... Edge of electronic component with fin, 24 ... Edge of substrate, 25 ... Monitor screen, 51 ... Vibration isolation adjuster, 52 ... Base, 53 ... Stand, 54
Z axis cylinder, 55 guide guide A, 56 stopper, 57 shock absorber, 58 micrometer head, 59 subbase, 60 tension spring, 6
1 ... Guide guide B, 62 ... Bracket, 71 ... Strain gauge, 72 ... Transducer, 73 ... Display counter, 74 ... Halogen lamp, 75 ... Ejector, 76 ... Compressed air, 7
7 ... Exhaust air, 78 ... Tube, 79 ... θ table, 8
0 ... CCD camera, 81 ... Magnifying lens, 82 ... Scope, 83 ... Image processing device, 84 ... Monitor, 100 ... Temporary fixative, 101 ... Substrate, 102 ... Plate, 103 ... Z
Table, 104 ... XY table, 201 ... Electronic parts,
202 ... suction plate, 203 ... compression spring, 204 ... arm, 205 ... vacuum suction pipe, 206 ... vacuum state, 2
07 ... substrate.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masato Matsuoka 1 Horiyamashita, Hadano City, Kanagawa Prefecture Hitachi, Ltd. General Computer Division

Claims (4)

[Claims] 1. In an electronic component mounting apparatus for mounting electronic components on a substrate, vacuum suction is performed in a state where the fin openings that are prone to chipping or cracking when handled by a mechanical chuck method are closed from the top and left and right sides and sealed. Vacuum suction head characterized by suction handling. 2. An electronic component mounting apparatus for mounting an electronic component on a substrate, wherein the edge of the finned electronic component and the edge of the substrate suctioned by the vacuum suction head described in claim 1 are photographed by a CCD camera. Then, the position correction mechanism is characterized in that the deviation of each edge is measured by the image processing device and the position is corrected by the XY table and the θ table. 3. An electronic component mounting apparatus for mounting electronic components on a substrate, wherein the electronic component with fins is sucked by the vacuum suction head according to claim 1 and pressure is applied when the electronic component is mounted on the substrate. A pressure adjustment mechanism characterized by giving a certain amount of pressure. 4. An electronic component mounting apparatus for mounting an electronic component on a substrate, comprising the mechanism according to any one of claims 1 to 3.