JPH0810192Y2 - Semiconductor mounting structure - Google Patents

Description

[Detailed description of the device]

[0001]

[Industrial application] This invention is a film carrier (T
AB: Tape Automated Bondin
The present invention relates to a semiconductor mounting structure for mounting an electronic component such as a semiconductor chip on a wiring board using g).

[0002]

2. Description of the Related Art Conventionally, as the performance of semiconductor chips such as ICs and LSIs has been improved, remarkably high-density mounting technology has been required. Therefore, in recent years, as a technique for connecting electronic components such as semiconductor chips having high-density multi-terminals such as IC chips onto a wiring board with high reliability, a film carrier (TAB) is used to mount electronic components on a printed wiring board. Mounting technology for high-density surface mounting has been developed and put into practical use.

[0003]

However, in the conventional mounting technique described above, when a plurality of semiconductor chips are surface-mounted on the substrate, the area for the plurality is naturally required. Become. In particular, when semiconductor chips are mounted within a relatively limited fixed mounting area such as a liquid crystal panel, an IC card, a calculator, etc., the number of semiconductor chips that can be mounted is limited (the number decreases). There was a problem.

Therefore, the present invention has been made in consideration of the above circumstances, and it is possible to reduce the mounting area when a plurality of electronic components are surface-mounted on a wiring board. An object of the present invention is to provide a semiconductor mounting structure capable of mounting components and capable of extremely high-density surface mounting.

[0005]

In order to achieve the above-mentioned object, the present invention provides a semiconductor mounting structure in which a semiconductor chip is mounted and a TAB package formed by a film carrier is mounted so as to stand on a wiring board. , A mounting structure in which two bent portions that bend from the connection portions at both ends and rise vertically are formed to have a substantially M-shape in a side view, and between the two bent portions. In this structure, the semiconductor chips are fixed to each other so that they do not overlap each other in the thickness direction, with a vertical displacement.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a semiconductor mounting structure according to the present invention will be described below with reference to the drawings. 1A and 1B are views showing a vertically mounted state of a semiconductor mounting structure in this embodiment. FIG. 1A is an overall perspective view thereof, and FIG. 1B is a side view thereof. 2A and 2B are views showing a laterally mounted state of a semiconductor mounting structure in this embodiment, FIG. 2A is an overall perspective view thereof, and FIG. 2B is a side view thereof. FIG. 3 is a plan view showing the structure of a film carrier (TAB) type semiconductor having a plurality of semiconductor chips mounted thereon. FIG. 4 is a plan view showing the structure of a film carrier (TAB) type semiconductor in which a single semiconductor chip is mounted.

First, as shown in FIG. 3, the structure of a film carrier (TAB) type semiconductor is a sprocket hole (11) for carrying and positioning, a device hole (19) which is an opening portion into which a semiconductor chip (1) is inserted, and A metal foil such as copper is adhered onto an insulating film such as a polyimide having an OLB hole (20), and the metal foil is etched to form leads (inner leads (15) and outer leads (16)) having a desired shape. A film carrier tape (10) is manufactured by forming a pad (14) for electrical screening.
Further, bumps which are metal protrusions are formed on the electrode terminals of the semiconductor chip (1).

Next, the inner leads (15) of the film carrier tape (10) and the bumps of the semiconductor chip (1) are inner lead bonded (ILB) by a thermocompression bonding method or a eutectic method, and attached to the film carrier tape. In this state, a contactor is brought into contact with the electric selection pad (14) to perform electric selection and bias test of the semiconductor chip (1). As a result, the film carrier type semiconductor device is completed. In addition, in order to improve reliability and mechanical protection, the resin may be potted for resin sealing.

Then, in order to mount the above film carrier type semiconductor device on the wiring board (2), the outer lead (16) is cut into a predetermined length (predetermined shape), and TA
Form B package (5).

In this embodiment, the connection parts (4) to the wiring board (2) are provided at both ends of the TAB package (5).
(4) is provided, and a plurality of bent portions (for example, slits) (3a), (3b) and (3c) are further formed so that the TAB package (5) can be bent.

In this embodiment, as shown in FIGS. 1 and 2, the TAB package (5) formed as described above.
Is mounted on the wiring board (2) in an upright state. First, the bent portion (3) at the center of the TAB package (5) is mounted.
At the portion a), the semiconductor chips (1) and (1) are folded in two so that they face each other, and the bent portions (3c) at both ends.
In the portion (3c), the connecting portions (4) and (4) are bent by about 90 ° in the directions away from each other. For example, when the connecting portions (4) and (4) have a small area and there is a margin in the height direction (vertical direction to the substrate (2)), the state of vertical installation ((a) and (b) in FIG. 1) is set. Or, if there is no room in height, it is further bent in the lateral direction (horizontal direction with respect to the substrate (2)) at the bent portions (3b) (3b) in the middle, and other semiconductor chip parts (8) It is configured in a laterally placed state ((a) and (b) of FIG. 2) in which the height is reduced by stacking on the upper side of the.

The step of outer lead bonding (OLB) the outer lead (16) to the conductive pattern of the wiring board (2) is performed by pressurizing and heating the lead with a pressure tool as in the ILB step. The joining is performed by a thermocompression bonding method, a eutectic method, or brazing using solder.

The preferred embodiment of the present invention has been described above in detail, but the present invention is not limited to this, and it is apparent that various modifications can be made without departing from the scope of the present invention. Is.

For example, the bent portions (3a), (3b), (3
c) is not limited to the slit shape as in this embodiment, but may be
It can be replaced by various structures such as perforations, thinnesses, etc. that allow the TAB package (5) to bend. Also,
For example, as shown in FIG. 5, the semiconductor chips (1) and (1) to be mounted on the TAB package (5b) are formed in different arrangements by being displaced from the center position, and are bent and mounted in an accordion type to achieve a thickness dimension. There is an advantage that (H) can be made even thinner. Further, in the above-mentioned embodiment,
The example in which two semiconductor chips (1) are mounted on the TAB package (5) has been described, but the present invention is not limited to this, and of course, two or more (plural) semiconductor chips can be mounted.
It goes without saying that one piece (single piece) may be mounted like the AB package (5a). In this case, particularly in the semiconductor chip (1) having a large number of pins, it is possible to widen the pitch of the connection portion by allocating the patterns to the left and right. The reference numerals of the TAB packages (5a) and (5b) of FIGS. 4 and 5 are the same as those of the above-described embodiment, and thus the description thereof is omitted here.

As described above, according to the present embodiment, the T formed by the film carrier on which the semiconductor chip (1) is mounted.
By mounting the AB package (5) so as to stand on the wiring board (2), it is possible to reduce the mounting area when a plurality of semiconductor chips (1) are surface-mounted on the wiring board (2). In other words, a large number of semiconductor chips (1) can be mounted, and extremely high-density surface mounting becomes possible. Further, since the connecting portions (4) and (4) for connecting to the wiring board (2) are provided at both ends of the TAB package (5), the area of the connecting portion can be made small and the TAB package (5) is erected. There is an advantage that the TAB package (5) can be stably supported. Furthermore, the TA
Since the B package (5) is provided with the bending portion (3b) and the like so as to be bendable, the substrate (2) is not limited to the vertically placed state (see FIG. 1) but can be placed horizontally (see FIG. 2). Therefore, there is an advantage that the height can be reduced.

As described in detail above, according to the present invention, a large number of electronic components can be mounted on a wiring board, and extremely high density surface mounting is possible. Even if the semiconductor chips are fixed between the curved portions, they do not overlap in the thickness direction of the chips, so that the heat generation of the chips can be prevented from becoming high temperature.

[Brief description of drawings]

FIG. 1 is a view showing a vertically mounted state of a semiconductor mounting structure according to the present invention.

FIG. 2 is a view showing a laterally mounted state of a semiconductor mounting structure according to the present invention.

FIG. 3 is a plan view showing the structure of a film carrier (TAB) type semiconductor on which a plurality of semiconductor chips are mounted.

FIG. 4 is a plan view showing the structure of a film carrier (TAB) type semiconductor in which a single semiconductor chip is mounted.

FIG. 5 is a view showing another example of a semiconductor mounting structure according to the present invention.

[Explanation of symbols]

 (1) Semiconductor chip (2) Wiring board (3a) (3b) (3c) Bent part (4) Connection part (5) (5a) (5b) TAB package

Claims (1)

[Scope of utility model registration request] 1. A semiconductor mounting structure in which a semiconductor chip is mounted and a TAB package formed of a film carrier is mounted on a wiring board so as to stand upright.
Form two bends that bend from the
The mounting structure is such that the side view is substantially M-shaped.
There are two folds that are opposite to each other
Position, the semiconductor chips must not overlap in the thickness direction.
The semiconductor mounting structure is characterized in that it is fixed with a vertical displacement .