JPH0765648A - Method and device for supplying anisotropic conductive film - Google Patents

Abstract

PURPOSE:To provide a method and a device for supplying anisotropic conductive film capable of automatic supply of anisotropic conductive film and improvement in workability. CONSTITUTION:A roll type base film 102 on which an anisotropic conductive film 101 is superposed is arranged through a bonding station 4 for bonding the film 101 onto a circuit board between a pair of shafts composed of a supply shaft and winding-up shaft disposed separately on both sides holding therebetween the bonding station 4. The base film 102 is made to run from the side of the shaft 6 to the side of the shaft 7 so that the film 101 is succesively supplied to the station 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for supplying an anisotropic conductive film used as a conductive adhesive between circuit boards which are required to be electrically connected and are bonded to each other. .

[0002]

2. Description of the Related Art Conventionally, there is a method in which an anisotropic conductive film is provided at a location where electrical connection between circuit boards is required, and the anisotropic conductive film is thermocompression bonded and bonded to each other. in this way,
What laminated | stacked the anisotropic conductive film on the base film is used.

FIG. 8 shows a conventional mode in which an anisotropic conductive film is supplied to an assembly line.
Is laminated to a thickness of about 35 μm on a base film 102 made of, for example, a polyester film having a thickness of about 50 μm, which is peelably adhered onto the base film 102 and formed into a tape shape together with the base film 102. It is wound on the annular core material 103 a predetermined number of times and supplied in this roll state. When the anisotropic conductive film 101 is used, the anisotropic conductive film 101 is pulled out together with the base film 102 by a predetermined amount, cut into a required length, and used.

FIG. 6 is a flowchart showing an example of a conventional anisotropic conductive film supplying method. Therefore, an example of a conventional method of supplying an anisotropic conductive film will be described below in the order of (1) to (5) using the flowchart shown in FIG. (1) First, the anisotropic conductive film 101 wound around the core material 103 is pulled out together with the base film 102, and this is cut into a required length. (2) Next, the anisotropic conductive film 101 cut in (1) is attached to the connected portion 104a of the flexible circuit board 104 that has been previously washed with, for example, acetone, etc. The base film 102 side is arranged as a back surface. (3) Next, a predetermined pressure (about 30 kg / cm ³ ) is applied and held for a few seconds (about 30 seconds) by the tool 105 kept at a predetermined temperature (about 150 to 155 ° C.) from the side of the base film 102. Then, the anisotropic conductive film 101 is temporarily adhered to the adhered surface of the connected portion 104a. (4) After that, the tool 105 is raised and only the anisotropic conductive film 101 and the base film 102 are connected to the connected portion 104a.
Remains on the adherend surface. (5) Next, the base film 1 on the connected portion 104a
When 02 is peeled off, only the anisotropic conductive film 101 remains on the connected portion 104a, and the temporary adhesion of the anisotropic conductive film 101 is completed.

In this way, the anisotropic conductive film 10 is formed.
After the temporary bonding of 1 is performed, another circuit board 204 that is bonded to this circuit board 104 and electrically connected is prepared.
As shown in FIG. 7, the circuit board 104 and the circuit board 204 are set in the hot press 300 in such a state that the adherend surfaces are aligned with the anisotropic conductive film 101 interposed therebetween. Then, when the circuit board 104 and the circuit board 204 are heated and pressed by the hot press 300, the circuit board 104 and the circuit board 204 are permanently bonded together through the anisotropic conductive film 101. become.

[0006]

However, in the above-mentioned conventional method for supplying an anisotropic conductive film, the anisotropic conductive film 101 is pulled out from the core material 103 by a required length each time it is needed. This is cut and supplied to the connected portion 104a. Therefore, there are problems that workability is extremely poor and automatic supply is difficult.

The present invention has been made in view of the above problems, and an object thereof is a method for supplying an anisotropic conductive film which enables automatic supply of the anisotropic conductive film and improves workability. And to provide the device.

[0008]

According to the present invention, an object of the present invention is to provide an anisotropic method in which a circuit board to be bonded and connected is interposed as an adhesive and is thermocompression bonded to connect the circuit boards. In the method for supplying a conductive conductive film, a bonding station for bonding the anisotropic conductive film to the circuit board by laminating a base film formed by laminating the anisotropic conductive film on a film surface in a roll shape. Is disposed through the bonding station between a pair of shafts, which are formed separately on both sides with a supply shaft and a winding shaft interposed therebetween, and the base film is provided from the supply shaft side to the winding shaft side. It is achieved by running and sequentially supplying the anisotropic conductive film to the stations.

Further, in the present invention, an object of the present invention is to provide an anisotropic conductive film which is interposed between circuit boards to be bonded and connected as an adhesive and which is thermocompression bonded to connect the circuit boards. In a supply device, a bonding station for bonding the anisotropic conductive film to the circuit board, and a supply shaft on which a roll-shaped base film having the anisotropic conductive film laminated on a film surface is wound and arranged. When,
The base film, which is provided on the opposite side of the supply shaft with the bonding station sandwiched between the winding shaft and the other end of the base film pulled out from the supply shaft through the bonding station. Is run from the supply reel side to the take-up reel side to sequentially supply the anisotropic conductive film to the bonding station. Further, preferably, the base film laminated with the anisotropic conductive film is accommodated in a cassette, and the cassette is provided with an opening corresponding to the bonding station and a roll shaft provided corresponding to the supply shaft. A supply reel that is integrally rotated with the supply shaft around which the base film is wound, and the roll-shaped one that is provided corresponding to the winding shaft and that is drawn out from the supply reel side through the opening. It is preferable to provide a take-up reel that is integrally rotated with the take-up shaft to which the other end of the base film is attached, and a positioning unit that detachably positions and stores the cassette on the apparatus main body side.

[0010]

According to this, when the base film is run from the supply shaft side to the winding shaft side through the bonding station, the anisotropic conductive film is automatically supplied to the bonding station together with the base film by this running. Will be done. Also, automatic bonding can be performed by bonding only the anisotropic conductive film supplied in a predetermined amount to the connected portion at the bonding station.

[0011]

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a configuration diagram of a main part of an anisotropic conductive film automatic supply apparatus according to an embodiment of the present invention. The anisotropic conductive film used in this example is about 3 μm thick on a base film made of, for example, a polyester film having a thickness of about 50 μm, like the anisotropic conductive film described in FIG.
It is laminated in a thickness of about 5 μm, and is adhered to the base film in a peelable manner so as to be formed in a tape shape together with the base film 102. Therefore, in the following description, the anisotropic conductive film and the base film have the same structure and are denoted by the same reference numerals.

In FIG. 1, in this automatic feeder 1,
It has a recess 2 for positioning and accommodating the cassette 20.

A bonding station 4 having a bonding stage 3 in the front opening is arranged in the recess 2.
And a pair of freely rotatable guide rollers 5a and 5b separately provided on both sides of the bonding station 4, and a supply shaft 6 and a take-up shaft 7 provided inside the bonding stage 3. It is arranged. Further, the supply shaft 6 and the take-up shaft 7 are in a state of being forcibly rotated by driving means (not shown).

On the other hand, the cassette 20 is the base film 1
An anisotropic conductive film 101 is laminated on the film surface of No. 02, and a tape-shaped body T formed by integrally winding these is arranged.

The structure of the cassette 20 will be described in more detail. The cassette 20 includes an upper case half body 21A, a lower case half body 21B, a supply reel 22, and a take-up reel 2.
3 and guide rollers 29a, 29b and the like.

Further, the upper case half body 21A and the lower case half body 21B are formed symmetrically, and the through-hole 24 through which the supply reel 22 is rotatably positioned and supported.
A through hole 25 in which the take-up reel 23 is rotatably positioned and supported, and a positioning hole 26 in which the guide rollers 29a and 29b are rotatably positioned and supported. A notch 27 is formed to escape the bonding stage 3.

The upper case half body 21A and the lower case half body 21B are assembled facing each other into a single case 21. In the assembled state, the front half case half body is a substantially flat hexahedron. .

Furthermore, when the case 21 is assembled, the tape-shaped body T is wound around the supply reel 22 by a predetermined amount, and the other end of the tape-shaped body T is fixed to the take-up reel 23. In addition, the end of the supply reel 22 is placed in the through hole 25, and the end of the take-up reel 23 is placed in the positioning hole 2.
6 are inserted and positioned, and the ends of the guide rollers 29a and 29b are inserted and positioned in the positioning holes 26 to be assembled at the same time. In this case, the tape-shaped body T wound between the supply reel 22 and the take-up reel 23 is disposed outside the guide rollers 29a and 29b so that it can be pulled out from the front opening of the case 21, and the guide roller 29a is also provided. , 29b in FIG.
As shown as an enlarged view of the portion C of FIG.
02 is disposed inside (the side facing the bonding stage 3) and the anisotropic conductive film 101 is disposed outside.

In the case 21 thus constructed, when the take-up reel 23 side is rotated in the take-up direction, the tape-like body T wound around the supply reel 22 is pulled along with this, and the supply reel is supplied. As the roll 22 rotates, the roll 22 is wound around the take-up reel 23. Therefore, by this winding operation, the tape-shaped body T is in a state of traveling between the pair of guide rollers 29a and 29b at the front opening portion.

When the cassette 20 is used, it is set in the recess 2 with the front opening side corresponding to the bonding stage 3 side. Then,
The supply shaft 6 is integrally rotatably engaged with the supply reel 22, and the winding shaft 7 is integrally rotatably engaged with the winding reel 23. Further, the bonding stage 3 and the guide rollers 5a and 5b correspond to the cutout portion 27, which is arranged inside the tape-shaped body T inside the cutout portion 27. FIG. 1 shows a state in which the cassette 20 is set in the recess 2 in this way.

FIG. 4 is a flow chart showing a method of supplying the anisotropic conductive film 101 to the connected portion of the circuit board 104 by using the automatic supply device of the present invention. Therefore, next, in FIG.
The operation of the anisotropic conductive film automatic feeder shown in FIG. 4 will be described with reference to the flowchart of FIG.

(1) The guide roller 2 is attached to the connected portion 104a of the flexible circuit board which has been washed with acetone or the like.
The anisotropic conductive film 101 of the tape-shaped body T which is fed out between 9a and 29b is aligned. (2) Next, the tool 105 kept at a predetermined temperature (about 150 to 155 ° C.) is attached to the bonding stage 3 from the rear side of the connected portion 104a for a few seconds (about 30 seconds) under a predetermined pressure (about 30 kg). / Cm ³ ) and press down. Then, the anisotropic conductive film 101 is temporarily adhered to the adhered surface of the connected portion 104a. (3) Next, the tool 105 is raised. (4) Next, the connected portion 104a of the flexible circuit board is removed from the bonding station 4. Then, at this time, the anisotropic conductive film 101 is peeled off from the base film 102 together with the connected portion 104a and transferred to the connected portion 104a side, whereby the anisotropic conductive film 101 is temporarily adhered to the connected portion 104a side. Is completed. (5) After that, the winding shaft 7 is rotationally driven by a predetermined amount. When the tape-shaped body T is wound around the take-up reel 23, a new anisotropic conductive film 10 is provided before the bonding stage 3.
1 is provided and a new flexible circuit board is placed and processed in the same manner, and this is repeated. (6) Furthermore, when the anisotropic conductive film 101 in the cassette 20 is used up, the cassette 20 is replaced with a new cassette 20 and the work is similarly performed.

Therefore, according to the anisotropic conductive film automatic feeder according to the present embodiment, the feed shaft 6 (feed reel 22).
When the tape-shaped body T is run from the side toward the take-up shaft 7 (the take-up reel 23) through the bonding station 4, the running of the anisotropic conductive film 101 causes the base film 10 as well.
It will be automatically and sequentially supplied to the bonding station 4 together with 2. Further, only the anisotropic conductive film 101 supplied in the predetermined amount can be bonded to the connected portion 104a at the bonding station 4.
As a result, automatic bonding becomes possible, workability is improved, and production capacity can be improved.

In the above embodiment, the structure in which the tape-shaped body T is stored in the cassette 20 and used is described. However, the storage reel 20 is not stored in the cassette 20 but is an open reel type, and the supply reel 22 is a supply shaft. It is also possible to mount the take-up reel 23 on the take-up shaft 7 so as to be able to rotate integrally therewith while also being mounted on the take-up reel 7 so as to be able to rotate integrally.

Further, when a large bonding stage 3 is used and the bonding stage 3 interferes with the loading / unloading operation of the cassette 20, for example, as shown in FIG. Of the tape-shaped body T with the second guide rollers 9a and 9b and the guide rollers 5a and 5b so as to be movable between the recess 2 and the bonding stage 3. Alternatively, the bonding stage 3 may be guided.
Further, in FIG. 5, the same reference numerals as those in FIGS. 1 to 3 denote the same as those in FIGS. 1 to 3.

[0026]

As described above, according to the present invention,
When the base film runs from the supply shaft side to the winding shaft side through the bonding station, the anisotropic conductive film is automatically supplied to the bonding station together with the base film by this running. Further, automatic bonding can be performed by bonding only the anisotropic conductive film supplied in a predetermined amount to the connected portion at the bonding station. Therefore, the workability can be improved and the production capacity can be improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a main part of an anisotropic conductive film automatic supply device shown as an embodiment of the present invention.

FIG. 2 is an enlarged view of portion C in FIG.

FIG. 3 is an exploded perspective view of a main part of a cassette alone in the apparatus according to the embodiment of the present invention.

FIG. 4 is a flow chart showing a method of supplying an anisotropic conductive film in the device of the present invention.

FIG. 5 is a main part configuration diagram showing a modified example of the device of the embodiment of the present invention.

FIG. 6 is a flowchart showing a conventional method of supplying an anisotropic conductive film.

FIG. 7 is an explanatory diagram of connections between circuit boards.

FIG. 8 is a perspective view showing a supply mode of a conventional anisotropic conductive film.

[Explanation of symbols]

 1 Automatic Supply Device 2 Recess (Positioning Part) 3 Bonding Stage 4 Bonding Station 6 Supply Shaft 7 Winding Shaft 20 Cassette 22 Supply Reel 23 Winding Reel 101 Anisotropic Conductive Film 102 Base Film T Tape-like Material

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Yuko Kitayama 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd.

Claims (3)

[Claims] 1. A method of supplying an anisotropic conductive film, which is interposed as an adhesive between circuit boards to be bonded and bonded together and is thermocompression bonded to connect the two circuit boards, wherein the anisotropic conductive film is The roll-shaped base film laminated on the film surface is divided into a supply shaft and a winding shaft, which are separately provided on both sides of a bonding station for bonding the anisotropic conductive film to the circuit board. Is disposed between the pair of shafts through the bonding station, and the anisotropic conductive film is sequentially supplied to the bonding station by running the base film from the supply shaft side to the winding shaft side. A method for supplying an anisotropic conductive film, characterized in that 2. A device for supplying an anisotropic conductive film, which is interposed between circuit boards to be bonded and bonded together as an adhesive, and is thermocompression bonded to connect the two circuit boards together. A bonding station for bonding to the circuit board, a supply shaft on which a roll-shaped base film having the anisotropic conductive film laminated on a film surface is wound and arranged, and the supply shaft with the bonding station interposed therebetween. And a take-up shaft provided on the opposite side to the other end of the base film pulled out from the supply shaft through the bonding station, and winding the base film from the supply reel side. The anisotropic conductive film is characterized in that the anisotropic conductive film is sequentially supplied to the bonding station by traveling to the reel side. Supply device. 3. A base film, on which the anisotropic conductive film is laminated, is housed in a cassette, and the roll-shaped base is provided in the cassette in correspondence with the opening corresponding to the bonding station and the supply shaft. A supply reel that is integrally rotated with the supply shaft around which the base film is wound, and the roll-shaped one that is provided corresponding to the winding shaft and that is drawn out from the supply reel side through the opening. The take-up reel which is integrally rotated with the take-up shaft to which the other end of the base film is attached is provided, and a positioning section for detachably positioning and accommodating the cassette is provided on the apparatus main body side. A device for supplying an anisotropic conductive film as described above.