JPS6111227A - Formation of coverlay for flexible print wiring plate - Google Patents

Abstract

PURPOSE:To make positioning of a long coverlay film and a long FPC easier as well as to raise the operability of the positioning by a method in which the coverlay film and the FPC are continuously run in the same directions and positioned in a state of being backed with a male mold paper, and the bonding and separation of the male mold paper are continuously performed. CONSTITUTION:Under the guidance of each guide film, a coverlay film 11 and EPC1 are both drawn out of sending drums 15 and 17 and run toward a receiver 16. During the period, a press board 24 is lowered, a perforation 40 and holes 9 are drilled in the film 11, and the film 11 and FPC1 are positioned by the holes 9 and temporarily bonded by a heating roller 28. They are wound up by the winding drum 29 of a separator 21 to separate the adhesive layer 13 with a male mold paper 12 from the insulating film 6 and sent into a heating furnace 31, where the adhesive layer 7 is hardened to strongly bond the film 6 to FPC1 and cooled. They are then continuously wound around the take-up roll 6 for storage.

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a method of forming a coverlay for a flexible printed wiring board (hereinafter abbreviated as IPPC) used in electronic equipment and the like.

"Prior Art" FIG. 8 shows an example of FPC. This FPO
I is made up of a highly flexible base film 2 such as polyester film or polyimide film having a thickness of about 20 to 100/Jm, and a wiring pattern 3 made of a copper foil conductor adhered thereto. be.

Conventionally, the following method has been used to form a coverlay 4 serving as an insulating protective film on the wiring pattern 3 of such an FPCI. First, a coverlay film 5 as shown in FIG. 9 is prepared. This coverlay film 5 has an adhesive layer 7 with a coating thickness of 20 to 30 μm formed on one side of an insulating film 6 made of polyester film, polyimide film, etc. with a thickness of about 20 to 40 μm, which serves as the coverlay 4. A release paper 8 such as silicone resin-treated paper is pasted onto the layer 7.

After holes 9 corresponding to the soldering portions and contact portions of the wiring pattern 3 are formed in such a coverlay film 5, the release paper 8 is peeled off from the coverlay film 5, and then, After aligning the adhesive layer 7 toward the FPCI wiring pattern 3 so that the holes 9 of the insulating film 6 are in the predetermined positions, it is lowered onto the wiring pattern 3, and heated with a heating roller 2, etc. Temporary adhesive is used, and final adhesive is applied using a hot plate press.

"Problems to be Solved by the Invention" However, in this method of forming the coverlay 4, the thin and stiff insulating film 6 must be aligned after the release paper 8 is peeled off. However, the handling of the insulating film 6 is troublesome and positioning is difficult, making workability difficult.

"Means for Solving the Problems" In order to solve the above-mentioned problems, the present invention provides an elongated cover in which an adhesive layer is applied on one side of an insulating film and a release paper is applied on the other side. A process of aligning the FPC and the coverlay film while continuously running the lay film and a long RPC in the same direction, a process of pasting both parts, and a process of attaching the coverlay film to the pasted coverlay film. The process of peeling off the release paper is performed continuously.

"Function" In the present invention, in a firm state where the coverlay film is lined with a release paper, the alignment with the PPO tj? As well as adhesion, the alignment process, adhesion process, and release paper peeling process are performed continuously without interruption.

``Example'' The embodiment of the present invention will be described below based on FIGS. 1 to 7.

First, a description will be given of the coverlay film and apparatus applied to carry out the present invention. As shown in FIG. is formed, and a release paper 12 is pasted on the other side. The release paper 12 is made of strong paper or plastic film with a thickness of about 100 to 150 μm, and is selected so that when used as the coverlay film 11, the entire film l'l is stiff and forms a plate. A thin adhesive layer 13 is formed on the surface of the release paper 12 that is in contact with the insulating film 6, and the adhesiveness between the female pattern paper 12 and the insulating film 6 is maintained. In addition, a non-adhesive, non-adhesive silicone resin coating layer 14 is formed on the surface of the release paper 12 opposite to the insulating film 6, and when this film 11 is wound into a roll as described later, The contact layer 7 and the release paper 12 are prevented from adhering to each other.

On the other hand, as shown in FIG. 1', the apparatus applied to the implementation of the present invention includes a delivery drum 15 for winding a long coverlay film 11 into a roll;
A delivery drum 17 with a length of m2 for winding a long FPCI in a roll is connected between the first delivery drum 15 and a take-up machine 16 arranged at a position spaced apart from the first delivery drum 15 in the horizontal direction. A 1f1 lifting machine 18 is provided between the second sending drum 17 and the first sending drum 15, and a pulling machine 18 is provided between the second sending drum 17 and the taking machine 16. , in order of proximity to the second delivery drum 17, one alignment machine 19, one heat pressure welding
! 20, a peeling machine 21, a heat curing machine 22, etc. are provided.

The press machine 18 is used to make holes in the coverlay film 11 corresponding to feed holes (so-called par 7 oration) used in the positioning process to be described later, and holes corresponding to the contact portions of 'IPPcl. , a support stand 23 on which the coverlay film 11 is placed, and this support stand 23
The press plate 24 is provided so as to be movable in the vertical direction so as to approach and move away from the press plate 24, and the press plate 24 is equipped with a large number of punch-like hole-drilling tools 25 projecting downward.

The positioning machine 19- is composed of two take-up rows 226 that vertically sandwich and overlap the coverlay film 11 and FPCI. A feed dog 27 is provided which engages the oration.

The heat press welding machine 20 consists of a pair of heat welders 228 that sandwich the coverlay film 11 and FPCI vertically and apply heat and pressure to adhere them to each other. The heating temperature of this heating roller 28 is the adhesion N7 of the coverlay film 11.
The temperature is set to slightly soften the heat.

The peeling machine 21 is for peeling the release paper 12 from the coverlay film 11 attached to the FPCI, and includes a winding drum 29 for winding the release paper 12 and a guide 4-2.
It consists of 30.

The heating curing machine 22 includes a tunnel-shaped heating furnace 31 and a heating furnace F-31 with an insulating film 6 attached thereto. Heat-resistant Peltoco/Bear 3 for transporting 'I'01
2 and the F with the insulating film 6 passed through the heating furnace 31
It consists of a Kunia 33 that blows air to the PCI to cool it.

In addition, in the figure, numeral 34 is a take-up roller, numeral 35 is a brake low 2, numeral 36 is an intermittent take-up roller, numeral 37
38 is a support roller that supports FPOl when peeling off the release paper 12;
Reference numeral 39 is a guide roller.

Next, to explain the coverlay forming method of the present invention using the apparatus configured as described above, a long coverlay film 11 is placed on the first delivery drum 15 with its adhesive layer 7 inside. At the same time, the long FPO is wound on the second delivery drum 17 and accumulated in a roll shape.
Wrap I with the wiring pattern 3 facing outside and store it in a roll.

On the other hand, three long guide films are prepared, and the starting end of one of them is pulled out from the take-up roller 34 to the guide roller 39 through all the devices and connected to the take-up machine 16, and the end Coverlay film 11
It is connected to the tip of the part excluding the release paper 12. In addition, the starting end of the other sheet is moved from the positioning machine 19 to the heating pressure welding machine 20 under the one sheet of guide film. The support row 238 is pulled out through the heat curing machine 22 to the internal roller 39, connected to the take-up machine 16, and the terminal end is connected to the FPCI.
Connect to the tip of. Furthermore, the starting end of the remaining sheet is placed above the guide film from the take-up row 234 to the brake row 235, the press machine 18 for hole punching, the intermittent take-up roller 36, the fixed length feed roller 37, and the positioning machine 19.
It is pulled out to the heat pressure welding machine 20 through the , and connected to the peeling machine 21 , and the terminal end is connected to the peeling paper 12 of the coverlay film 11 .

Then, from this state, the entire apparatus is driven, and the coverlay film 11 and ypcx are pulled out from both delivery drums 15 and 17 by the guidance of each guide film, and run toward the pick-up 816 from their tips. Steps from (1) to position described in detail below are sequentially and continuously performed toward the rear end.

(1) Holes are opened on the first delivery drum 15 by the process take-up roller 34.
The coverlay film 11 is continuously pulled out from the hole, and the pulled-out coverlay film 11 is intermittently picked up by the intermittent take-up roller 36, so that the coverlay film 11 is sequentially punched by a fixed length using a press and a sputtering machine. 19 onto the support stand 23, and when the coverlay film 11 is stationary, the press plate 24 is lowered to form a par 7 oration 40 and a hole 9 in the coverlay film 11.
etc. (see Figure 3).

(11) Positioning 1 process Hole punching is performed by taking the processed coverlay film 11 through the positioning machine 19, and also using the positioning machine 19 to move it from the second delivery drum 17 to the position opposite to the lower side of the coverlay film 11. Withdraw FPOI,
Coverlay film 11 par 7 ossion 40 and FPC
I par 7 oration (a perforation is drilled in the PPCI in advance with the same bit as the coverlay) 41
Insert the feed l1127 of the take-up row 5126 into the hole 9 of the coverlay film 11 and align both parts so that the hole 9 of the cover lay film 11 is correctly located at the position of the soldering part or contact part of the FPCI. They are sandwiched between the take-up rollers 26 and overlapped with each other (see Fig. 41).
.

Song) Adhesion process (temporary adhesion @) Overlapping coverlay film 1”1 and l?I
PO1 is sandwiched between the heating rollers 28 of the hot pressure welding machine 20 and heated and rolled from above and below, the adhesive layer 7 is slightly heated and softened, and both 11 and 1 are temporarily bonded (see FIG. 5).

(lψ Peeling process The discrete paper 12 of the coverlay film 11 temporarily adhered to the FPCI is peeled off from the coverlay film 11 by winding it up with the winding drum 29 of the peeling machine 21. 12 from the insulating film 6 (see FIG. 6).

(V) Heat curing process (main adhesion process) The FPCI and the insulating film 6 temporarily bonded thereto are heated by the heating curing machine 22. That is, the FPCI and the insulating film 6 are sent into the heating furnace 31 by the belt conveyor 32, and the adhesive layer 7 is cured by applying predetermined magnetism and time, and the insulating film 6 is transferred to the FPCI.
An FPC on which a coverlay 4 as shown in FIG. 7 is formed is obtained.

(1/Winding process: After being cooled by the ypcf strip 38 on which the coverlay 4 is formed, it is continuously wound up in the take-up machine 16 and accumulated in a roll shape.

In the method of forming such an FPC coverlay,
When aligning and temporarily adhering the coverlay film 11 and FPOl 1, the coverlay film 11 is in a stiff board state with the mm paper 12 not yet peeled off, so the alignment and temporary adhesion can be easily and accurately performed. can be done. Further, the elongated cover rake ilm 11 and the elongated FPOl are transferred to the first and second feed rollers 15.
．． While traveling from 17 to the pick-up machine 16, the steps from (11 to (Vl) described above are performed sequentially and continuously during the travel, so each step from (1) to tVt is the same as the first one. This is carried out in parallel between the delivery drum 15 and the take-up machine 16 at all times without interruption, so that the workability of forming the coverlay 4 can be improved.

"Effects of the Invention" As explained above, according to the present invention, the following effects can be obtained.

■ Coverlay film and IPPC! In addition to aligning and adhering them to each other, since the coverlay film is in the form of a plate, alignment and J45m can be performed smoothly and accurately.

(2) While the coverlay film and FPO are running in the same direction, the process for forming the coverlay is performed continuously during the run, so the workability of forming the coverlay can be greatly improved.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing a coverlay film and F'PC attached to a device applied to implement the present invention, and FIG. 3 to 7 are schematic cross-sectional views of a gourage film, and each shows an embodiment of the present invention in the order of steps, and each of the perspective view of FIG. FIG. 8 is a schematic sectional view showing an example of ypc, and FIG. 9 is a schematic sectional view showing an example of a coverlay used in a conventional coverlay forming method. l...FPOl 2...Base film, 3...
Wiring pattern, 4... Coverlay, 6... Insulating film, 7... Choreography layer, 11... Coverlay film, 12... Release paper, 15... First delivery drum, 16... Take-up machine, 17... Second sending drum, 18... Press machine, 19... Positioning machine, 20... Heat pressure welding machine, 21... Peeling machine, 22
...heat curing machine. Figure 2 Figure 3 Figure 4 Figure 5 Figure 7 Figure 8 Figure 9

Claims (1)

[Claims] A long flexible printed wiring board (1) and an insulating film (6) serving as a coverlay (4) for this flexible printed wiring board are coated with an adhesive layer (7) on one side and a release paper (on the other side). 12) is continuously run in the same direction with the adhesive layer of the coverlay film facing the flexible printed wiring board. A process of mutually aligning the wiring board and the coverlay film, a process of pasting the aligned flexible printed wiring board and the coverlay film, and a process of peeling off the release paper from the pasted coverlay film. A method for forming a coverlay for a flexible printed wiring board, the method being performed sequentially and continuously.